A chip box fixture for a pick and place machine

Abstract

This utility model belongs to the field of semiconductor manufacturing technology, and particularly relates to a chip box tooling for a chip mounter. It includes a substrate made of aluminum alloy through machining, with an overall substrate size ≥ 2 inches. The substrate surface is covered with a ceramic anodized layer. The top of the substrate has a cell array, each cell consisting of four independent short sides with a height ≤ 1 cm. Adjacent short sides are spaced to form an unobstructed angle. Anti-collision steps are provided at the bottom of each cell, with a depth less than the thickness of the chip material. The ceramic anodized layer comes in various colors, selected according to the loaded material. Compared with existing technologies, this utility model achieves practical effects such as wear and corrosion resistance, zero waste during cleaning, resistance to scratches and debris generation, zero errors in identifying materials without identification patterns, zero collision pins during chip mounting, and compatibility with multiple materials in one box.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, it relates to a chip box fixture for a chip mounter. Background Technology

[0002] In the semiconductor packaging industry, chip boxes are commonly used in automatic placement machines. Chip boxes are tools used in the semiconductor industry to hold packaging materials such as chips. Based on the size of the chip material, chip boxes with appropriate cell sizes are made. They are basically injection molded to a specific size. They are difficult to clean when contaminated, and scratches can easily cause unevenness and generate debris.

[0003] In addition to conventional silicon / glass chips, pick-and-place machines also produce various metal materials, each with different dimensions and appearances, resulting in significant variations. Conventional chip cassettes present limitations for current production and engineering / project development. Some chip materials are not compatible with the standard cassettes used in current pick-and-place machines, leading to numerous restrictions and impacts.

[0004] When certain materials lack a fixed and stable identification pattern on their surface, image recognition based on corner positions is typically used to automate the placement process of a pick-and-place machine. However, when such materials are placed inside the chip holder, the camera lens of the placement machine encounters various factors, including lighting and angle, which can affect the accuracy and precision of the corners and perimeter of the cell. This can lead to materials being unrecognized or having significantly higher recognition accuracy during production, hindering efficient and rapid automated operation. Furthermore, when the nozzle of a certain product is close in size to the chip or chip holder, there is a risk of the nozzle colliding with the sidewall of the cell. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a chip box tooling for a chip mounter that can solve the problem of some materials having no identifiable graphic points and can only be identified by relying on the corners.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A chip box fixture for a chip mounter includes a substrate, which is formed by machining aluminum alloy, has an overall size of ≥2 inches, and is covered with a ceramic anodized layer.

[0008] The top of the substrate has an array of cells, each cell consisting of four independent short sides, the height of which is ≤1 cm, and the interval between adjacent short sides forms an unobstructed angle.

[0009] The bottom of the cell is equipped with anti-collision steps, which are located around the bottom of the cell. The depth of the anti-collision steps is less than the height of the material.

[0010] The ceramic anodized layer comes in a variety of colors, which can be selected according to the material being loaded.

[0011] The present invention is further configured such that the angle between the inner wall of the short side and the horizontal plane is set to 85°-88°, forming a guide slope that is narrower at the top and wider at the bottom.

[0012] The present invention is further configured such that the thickness of the ceramic anodized layer is greater than 10 micrometers.

[0013] The present invention is further configured such that the length of the shorter side accounts for 40%-70% of the side length of the cell.

[0014] The present invention is further configured such that: the edge of the substrate is provided with a positioning notch, the depth of which is one-third of the substrate thickness, for precise positioning by the mounting machine fixture.

[0015] The present invention is further configured such that: a sinking groove is formed at the bottom of the substrate, a frame is formed around the sinking groove, and multiple adsorption platforms are formed inside the sinking groove. The adsorption platforms are used to cooperate with the vacuum holes on the equipment for adsorption and fixation; multiple weight reduction grooves are formed around the adsorption platforms, and the height of the adsorption platforms is less than the height of the frame.

[0016] Compared with the shortcomings of the prior art, the beneficial effects of this utility model are as follows:

[0017] By covering the surface of the aluminum alloy substrate with a ceramic anodized layer, it achieves easy cleaning of oil, sweat, and adhesive with alcohol while being wear-resistant and shaving-free; the four independent short sides of the cell array form unobstructed corners, eliminating angle and light interference for the pick-and-place machine's material edge and corner recognition; the anti-collision step depth is less than the chip material thickness, completely isolating the risk of the nozzle colliding with the cell sidewall when the nozzle is close to the chip or chip box size; the silver or black ceramic anodized layer precisely matches the optical recognition requirements of gold / nickel plated materials; the 85°-88° guiding slope on the inner wall of the short side allows the material to automatically return to its position; the short side length accounts for 40%-70% of the side length. It balances positioning and collision prevention; the positioning notch at the edge of the substrate enables quick and accurate tooling positioning; the weight-reducing groove at the bottom reduces weight, and the four bottom edges can match the limiting points on the equipment to ensure the horizontality of the tooling, achieving horizontal and vertical alignment and improving production accuracy; ultimately achieving practical effects such as wear and corrosion resistance, cleanliness with zero scrap, resistance to scratches and no debris generation, zero errors in identifying materials without identification patterns, zero collision pins during chip mounting, and compatibility with multiple materials in one box. It is manufactured using machining with high precision, eliminating the need for mold customization like traditional injection molded chips, which can greatly reduce costs and production cycles, and its versatility makes it widely applicable. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0019] Figure 2 This is a schematic diagram of the weight reduction groove according to an embodiment of the present utility model.

[0020] 1. Substrate; 2. Unobstructed corner; 3. Short side; 4. Anti-collision step; 5. Cell array; 6. Positioning notch; 7. Sinking groove; 8. Frame; 9. Adsorption platform; 10. Weight reduction groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] Working principle: When material is placed within the unobstructed corner 2 of substrate 1, the upper-wide, lower-narrow guide slope of the short side 3 automatically corrects material offset; when the pick-and-place machine lens identifies the corners of the material, the unobstructed corner 2 avoids light reflection and angular position interference, and the ceramic anodized layer with multiple color options provides the best recognition background based on the reflective differences of different material colors; during the suction nozzle's descent to pick up the material, the depth of the anti-collision step 4 is less than the height of the material, ensuring that the nozzle is suspended in the air and does not collide with the short side 3 of the cell; when cleaning the surface of substrate 1 with alcohol or other substances to remove oil, sweat, or adhesive, the 10-micron-thick ceramic anodized layer is corrosion-resistant and leaves no marks; the length of the short side 3 accounts for 40%-70% of the side length. It not only restricts material displacement but also provides clearance, while also accommodating different sized chip materials by allowing selection of short side 3 or corner positions for limiting; the positioning notch 6 engages with the pick-and-place machine slot to achieve zero-second positioning of the substrate 1, and can identify the tooling direction; the bottom weight reduction groove 10 reduces the weight of the tooling; the four bottom borders 8 can match the limiting points on the equipment to ensure the horizontal and vertical alignment of the tooling, improving production accuracy; ultimately achieving the practical effects of wear and corrosion resistance, cleanliness with zero scrap, resistance to scratches and no debris generation, zero error recognition even for materials without identification patterns, zero collision pins during pick-and-place, and one box adapting to multiple materials.

[0024] like Figures 1 to 2 As shown,

[0025] Includes substrate 1, which is formed by machining aluminum alloy. The machining process has high precision and does not require mold customization like traditional injection molded chips, which can greatly reduce costs and production cycle. It is versatile and has strong compatibility.

[0026] The overall size of substrate 1 is ≥2 inches. The surface of substrate 1 is covered with a ceramic anodized layer with a thickness of 10 micrometers. This solves the problem of scraping the bottom and sides of the chip cell when picking up metal materials or materials with sharp corners and burrs, and makes it less likely to cause product contamination. At the same time, it solves the problem of oil stains, sweat stains or glue stains that are difficult to clean. The aluminum alloy can be cleaned with alcohol or other cleaning agents to achieve the purpose of cleaning the tool. The color of the ceramic anodized layer can also be more reasonably matched with the color of the material.

[0027] The substrate 1 has a positioning notch 6 at its edge. The depth of the positioning notch 6 is one-third of the thickness of the substrate 1. It is used for precise positioning of the tooling in the pick and place machine. The bottom of the substrate 1 has a groove 7. The frame 8 formed in the groove 7 matches the limit point on the equipment, which can ensure the horizontality of the tooling, making it horizontal and vertical, and improving production accuracy.

[0028] The settling tank 7 has four adsorption platforms 9, which are matched with the vacuum adsorption ports on the equipment to adsorb and fix the substrate 1.

[0029] The depth of the positioning notch 6 is set to one-third of the thickness of the substrate 1 to achieve precise positioning of the orientation when placing the tooling. The depth of the weight reduction groove 10 is set to two-thirds of the thickness of the substrate to reduce the overall weight of the substrate 1.

[0030] The substrate 1 has a cell array 5, and the length of the short side 3 is 40%-70% of the side length, which can accurately limit the horizontal displacement of the material, reduce the offset of the patch, and achieve both anti-collision and positioning through dual-parameter collaboration. It is compatible with material size differences, eliminates the blind spot of recognition, and shortens the line change adaptation time by 40%, achieving the dual advantages of cost efficiency with zero collision pins and high precision.

[0031] Each cell is enclosed by four independent short sides 3, with a height of ≤1cm. Adjacent short sides 3 form an unobstructed corner 2. When placing chip materials, they can be limited by a single short side 3 or by the corner, thus achieving positional and angular positioning of chips of different sizes. The purpose of the design of the short sides 3 and the unobstructed corner 2 is to accurately identify and position chips and materials without standard identification patterns by relying on the edges and corners of the materials. At the same time, it also takes into account the option of using either the short sides 3 or the corner positions to limit the chip materials of different sizes.

[0032] The angle between the inner wall of short side 3 and the horizontal plane is set to 85°-88°, forming a guide slope that is narrow at the top and narrow at the bottom. The four independent short sides 3 ensure that the material corners are unobstructed and can be identified. The guide slope enables the material to slide in accurately by its own weight, and the offset correction time is less than 0.5 seconds. The short sides 3 are spaced to form a suction nozzle avoidance channel, completely eliminating the risk of collision.

[0033] Anti-collision steps 4 are installed at the bottom of the cell. The anti-collision steps 4 are located around the bottom of the cell. The depth of the anti-collision steps 4 is less than the height of the material. The ceramic anodized layer has a variety of colors, which are selected according to the loaded material. The colors of the ceramic anodized layer include, but are not limited to, silver-white, black, gray and golden yellow. The color is selected according to the material to be identified. The silver anodized color can not only identify gold materials, but is also compatible with other colored materials. The black color is suitable for identifying nickel-plated materials.

[0034] The anti-collision step, with a depth of 4m less than the material height, forms a physical isolation barrier, ensuring the nozzle remains suspended with zero collisions; the silver oxide layer is suitable for recognizing gold-plated materials, while the black oxide layer captures the reflection of nickel-plated materials, eliminating recognition errors; the dual design works together to prevent equipment damage and material scrap.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip box tool of a chip mounter, comprising a base plate (1), characterized in that: The substrate (1) is formed by machining aluminum alloy, the overall size of the substrate (1) is ≥2 inches, and the surface of the substrate (1) is covered with a ceramic anodized layer. The top of the substrate (1) is provided with a cell array (5), each cell is surrounded by four independent short sides (3), the height of the short sides (3) is ≤1 cm, the adjacent short sides (3) are spaced to form an unobstructed angle (2), and the bottom of the cell is provided with anti-collision steps (4), the anti-collision steps (4) are provided around the bottom of the cell, and the depth of the anti-collision steps (4) is < the height of the material; The ceramic anodized layer comes in a variety of colors, which can be selected according to the material being loaded.

2. The chip magazine tooling for a chip mounter according to claim 1, wherein: The angle between the inner wall of the short side (3) and the horizontal plane is set to 85°-88°, forming a guide slope that is narrow at the top and wide at the bottom.

3. The chip magazine tooling for a chip mounter according to claim 1, wherein: The thickness of the ceramic anodized layer is set to >10 micrometers.

4. The chip magazine tooling for a chip mounter according to claim 1, wherein: The length of the short side (3) accounts for 40%-70% of the side length of the cell.

5. The chip magazine tooling for a chip mounter as claimed in claim 1, wherein: The substrate (1) has a positioning notch (6) at its edge. The depth of the positioning notch (6) is one-third of the thickness of the substrate (1) so that the mounting machine tooling can be accurately positioned.

6. The chip magazine tooling for a chip mounter as claimed in claim 1, wherein: The substrate (1) has a sink (7) at the bottom, and a frame (8) is provided around the sink (7). Multiple adsorption platforms (9) are provided inside the sink (7). The adsorption platforms (9) are used to cooperate with the vacuum holes on the equipment for adsorption and fixation. Multiple weight reduction grooves (10) are provided around the adsorption platforms (9). The height of the adsorption platforms (9) is less than the height of the frame (8).

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