A hot plate with a flow guide structure

Abstract

The utility model discloses a hot plate with flow guide structure, including wafer transmission module, heating module and hot plate cover, be provided with air inlet and exhaust port on the hot plate cover still including setting in the flow guide module of hot plate cover, the flow guide module includes flow guide ring and side stop structure, and the flow guide module cover is established in wafer outside when the hot plate cover is combined with heating module cover, the annular surface of flow guide ring is opened with a plurality of flow guide holes, the flow guide hole is toward heating module, the periphery of side stop structure is provided with a plurality of uniform flow holes, and the gas passes after the uniform flow hole and is parallel with heating plate. The scheme is through setting up the flow guide module that is composed of flow guide ring and retractable side stop structure in the hot plate cover, and is designed with flow guide hole and uniform flow hole, makes the airflow soft action wafer after dispersing through the hole, avoids the temperature uneven and chemical material depression caused by direct blowing, can balance the edge and center airflow heat simultaneously, adjusts the proportion of heat flow path, realizes wafer surface temperature uniformity.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, and more specifically, to a hot plate with a flow guiding structure. Background Technology

[0002] In coating and developing equipment, there is a heating device that heats the wafer to ensure the material on the wafer surface meets specific requirements. During heating, it is crucial to maintain a consistent temperature across the wafer surface; otherwise, poor heat treatment results and quality issues will occur.

[0003] The existing heating device includes a heating plate and a boat cover. When receiving wafers, the boat cover separates from the heating plate, the wafer is placed on the heating plate, and then the boat cover lowers to form a sealed space with the heating plate for heating the wafer. The boat cover is equipped with air intake and exhaust channels to allow air to enter and exit the sealed space during heating, thus discharging waste generated during heating. After heating is complete, the boat cover rises to deliver the wafer.

[0004] When there is no gas flow, the heat on the wafer surface is uniform when the heating plate heats the wafer. However, in the actual heating process, there is gas flow. The gas absorbs heat and carries the heat to the exhaust port, making the heat at the exhaust port higher. Consequently, the wafer temperature below the exhaust port is higher, resulting in uneven heat distribution on the wafer surface. Utility Model Content

[0005] The purpose of this invention is to provide a hot plate with a flow guiding structure to solve the technical problems existing in the background art.

[0006] This utility model provides a hot plate with a flow guiding structure, including a wafer transfer module, a heating module and a hot plate cover. The hot plate cover is provided with an air inlet and an exhaust outlet. It also includes a flow guiding module disposed inside the hot plate cover. The flow guiding module includes a flow guiding ring and a side baffle structure. When the hot plate cover and the heating module are closed, the flow guiding module covers the outside of the wafer.

[0007] The flow guide ring has several flow guide holes on its surface, which face the heating module. The side baffle structure has several flow equalization holes on its outer periphery, and the gas passes through the flow equalization holes and is parallel to the heating plate.

[0008] In a preferred embodiment, the side guard structure is retractable.

[0009] In a preferred embodiment, the side baffle structure includes a telescopic part and a flow equalization part fixed to the telescopic part, the flow equalization hole is disposed on the flow equalization part, and the flow equalization part is fixedly connected to the flow guide ring.

[0010] In a preferred embodiment, the telescopic part includes a fixed ring plate with an annular storage groove and a movable ring plate located within the annular storage groove.

[0011] In a preferred embodiment, the movable ring plate is connected to a drive device for driving the movable ring plate to extend or retract into the annular storage slot, and the drive device is installed inside the hot plate cover.

[0012] In a preferred embodiment, the diameter of the guide hole increases from the edge of the guide ring to the center of the guide ring.

[0013] In a preferred embodiment, the diameter of the guide hole is 0.5-3 mm.

[0014] In a preferred embodiment, the flow guide ring covers 1 / 3 to 1 / 2 of the wafer diameter.

[0015] In a preferred embodiment, a heat insulation layer is further disposed within the heating module, the heat insulation layer being located below the heating plate.

[0016] The beneficial effects of this utility model's technical solution are:

[0017] This solution incorporates a flow-guiding module consisting of a flow-guiding ring and a retractable side baffle structure within the hot plate cover. Combined with the design of flow-guiding holes and flow-equalizing holes, the airflow is dispersed through the holes and then gently acts on the wafer, avoiding temperature unevenness and chemical indentation caused by direct blowing. At the same time, it can balance the heat of the airflow at the edge and center, adjust the heat flow path ratio, and achieve uniform temperature on the wafer surface. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a hot plate structure in the prior art.

[0019] Figure 2 This is a schematic diagram of the hot plate structure of this utility model.

[0020] Figure 3 This is a schematic diagram showing the hot plate cover of this utility model when opened.

[0021] Figure 4 This is a schematic diagram of the flow guiding module and the hot plate cover of this utility model.

[0022] Figure 5 This is a schematic diagram of the flow guiding module of this utility model.

[0023] Explanation of reference numerals in the attached drawings: 1. Wafer transfer module; 2. Heating module; 3. Hot plate cover; 4. Transfer arm; 5. Pin; 6. Motor; 7. Support column; 8. Heating plate; 9. Air inlet; 10. Exhaust port; 11. Flow guiding module; 12. Flow guiding ring; 13. Side baffle structure; 14. Flow equalization section; 15. Fixed ring plate; 16. Moving ring plate; 17. Drive device; 18. Flow guiding hole; 19. Flow equalization hole; 20. Heat insulation layer; 21. Wafer. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical applications of the present invention, and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for a particular purpose.

[0025] like Figure 1 The diagram shows an existing hot plate structure, which includes a wafer transfer module 1, a hot plate cover 3, and a heating module 2. The wafer transfer module 1 includes a transfer arm 4, pins 5, and a motor 6; the hot plate cover module includes a hot plate cover 3 housing, an air inlet 9, and an exhaust outlet 10; the heating module 2 includes a support column 7, a heating plate 8 (heat core), pins 5, and a motor 6.

[0026] During operation, the external robotic arm delivers the wafer 21 to the transfer arm 4, which then places the wafer 21 onto the hot plate support column 7. The heating plate 8 begins heating, while air enters through the air inlet 9 and exits through the exhaust port 10.

[0027] The external robotic arm delivers wafer 21 to transfer arm 4 in the following manner: pin 5 rises, the external robotic arm places wafer 21 on pin 5 and exits; pin 5 descends, causing wafer 21 to descend, thereby placing wafer 21 on transfer arm 4.

[0028] The conveying arm 4 delivers the wafer 21 onto the hot plate support column 7 in the following manner: the pin 5 rises, the conveying arm 4 moves toward the hot plate 8, places the wafer 21 on the pin 5, and then exits the range of the hot plate 8; the pin 5 descends, causing the wafer 21 to descend, thereby placing the wafer 21 onto the hot plate support column 7.

[0029] The purpose of air intake 9 for air intake and exhaust 10 for air exhaust is as follows: The surface of wafer 21 is coated with chemical substances, such as photoresist. When wafer 21 is heated, some of these chemical substances will volatilize. If they are not removed in time, they will condense in the heating chamber and on the back of wafer 21, causing contamination. Therefore, it is necessary to use fresh air to remove these chemical substances.

[0030] When fresh air enters around the hot plate, the air temperature is at room temperature and blows directly onto the wafer 21, which causes the temperature of the part of the wafer 21 in contact with the fresh air to drop, resulting in uneven surface temperature of the wafer 21. Furthermore, the direct blowing will affect the chemical substances on the surface of the wafer 21, such as causing dents in the directly blown area.

[0031] When the heating plate 8 heats the wafer 21, the heat is mainly dissipated in two directions: one is by following the airflow and being discharged by the exhaust port 10; the other is by diffusing downwards.

[0032] When there is no gas flow, the heating plate 8 heats the wafer 21, and the surface of the wafer 21 is uniformly heated. However, when there is gas flow, the gas absorbs heat and the gas flow carries the heat to the exhaust port 10, resulting in higher heat at the exhaust port 10. Consequently, the temperature of the wafer 21 below the exhaust port 10 is also higher, causing uneven heat distribution on the surface of the wafer 21.

[0033] Heat diffuses downwards, causing the ambient temperature at the location of pin 5 and motor 6 to rise, making motor 6 operate outside its suitable temperature range, thus resulting in a higher failure rate.

[0034] like Figures 2-5 As shown, a hot plate with a flow guiding structure provided by this utility model includes a wafer transfer module 1, a heating module 2, and a hot plate cover 3. The hot plate cover 3 is provided with an air inlet 9 and an exhaust outlet 10. It also includes a flow guiding module 11 disposed inside the hot plate cover 3. The flow guiding module 11 includes a flow guiding ring 12 and a retractable side baffle structure 13. The flow guiding ring 12 and the side baffle structure 13 form a hollow cover structure. The flow guiding ring 12 has a plurality of flow guiding holes 18 on its annular surface, and the flow guiding holes 18 face the heating module 2. The side baffle structure 13 has a plurality of flow equalization holes 19 on its outer periphery. The flow equalization holes 19 are parallel to the heating plate 8, and the gas passes through the flow equalization holes and is parallel to the heating plate.

[0035] In the above scheme, when the hot plate cover 3 is closed with the heating module 2, the airflow guiding module forms a closed space, and the airflow guiding ring 12 and the side baffle structure 13 jointly restrict the airflow path. The airflow introduced by the air inlet 9 needs to enter the heating area through the airflow guiding hole 18 of the airflow guiding ring 12 and the flow equalization hole 19 of the side baffle structure 13, so that the airflow is dispersed through the holes when entering the heating area, forming a gentle airflow, avoiding direct impact on the wafer 21, which could cause a sudden drop in temperature or surface chemical substance depression, thus providing a stable airflow environment for heating the wafer 21.

[0036] Meanwhile, when the heating module 2 is operating, the heat flow at the edge of the covered wafer 21 has two paths: one is through the guide ring 12 to the exhaust port 10; the other is directly to the exhaust port 10. Existing technology mentions that heat accumulates at the exhaust port 10, resulting in higher temperatures on the wafer 21 below the exhaust port 10. This solution addresses this by using the first heat flow path. When heat passes through the guide ring 12, the guide ring 12 obstructs it, causing some heat to accumulate between the guide ring 12 and the wafer 21, thus raising the temperature of the corresponding area of ​​the wafer 21. By controlling the proportion of heat flow paths, the surface temperature of the wafer 21 can be made more uniform.

[0037] The side baffle structure 13 includes a telescopic part and a flow equalization part 14 fixed to the telescopic part. The flow equalization hole 19 is disposed on the flow equalization part 14, and the flow equalization part 14 is fixedly connected to the flow guide ring 12. The telescopic part can extend and retract, thereby adjusting the overall height of the flow guide module. When it is necessary to place or remove the wafer 21, the telescopic part retracts; during heating, the telescopic part extends, and the flow equalization part 14 descends to a suitable position, forming a closed space with the flow guide ring 12. By adjusting the height of the cover, it adapts to the needs of different operating stages, ensuring a stable airflow path during heating, avoiding structural interference during non-heating stages, and ensuring that the side airflow does not blow directly onto the wafer 21.

[0038] The telescopic part includes a fixed ring plate 15 with an annular storage groove and a movable ring plate 16 located within the annular storage groove. A drive device 17 for driving the movable ring plate 16 to extend or retract into the annular storage groove is connected to the movable ring plate 16, and the drive device 17 is installed inside the hot plate cover 3.

[0039] In the above scheme, the movable ring plate 16 can slide and extend within the annular storage groove. After receiving the control signal, the drive device 17 (such as a motor or cylinder) pushes or pulls the movable ring plate 16 to move within the annular storage groove, thereby realizing the height adjustment of the side guard structure 13.

[0040] The diameter of the guide hole 18 increases from the edge of the guide ring 12 to the center of the guide ring 12. The diameter of the guide hole 18 is 0.5-3mm. The design of a smaller diameter at the edge and a larger diameter at the center allows the airflow to gradually increase from the edge to the center. Because the edge region is close to the exhaust port 10, heat is easily lost, and the smaller diameter reduces the cooling effect of the airflow on the edge; the larger diameter in the center region allows for gas flow, balancing the overall heat distribution.

[0041] The flow guide ring 12 covers 1 / 3 to 1 / 2 of the diameter of the wafer 21. The flow guide ring 12 covers the outer area of ​​the wafer 21, controls the airflow path in this area, and makes the heat evenly distributed within the coverage area. At the same time, it forms a heat compensation mechanism with the edge area to avoid heat concentration near the exhaust port 10.

[0042] The heating plate in this design also includes a heat insulation layer 20 disposed within the heating module, located below the heating plate 8. The heat insulation layer 20 is made of high-temperature resistant insulating material, which blocks the heat from diffusing downward from the heating plate 8, reducing heat transfer to components such as the pins 5 and motor 6 below.

[0043] This solution incorporates a flow-guiding module consisting of a flow-guiding ring and a retractable side baffle structure within the hot plate cover. Combined with the design of flow-guiding holes and flow-equalizing holes, the airflow is dispersed through the holes and then gently acts on the wafer, avoiding temperature unevenness and chemical indentation caused by direct blowing. At the same time, it can balance the heat of the airflow at the edge and center, adjust the heat flow path ratio, and achieve uniform temperature on the wafer surface.

[0044] Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of this utility model without creative effort should fall within the protection scope of this utility model. Structures, devices, and operating methods not specifically described and explained in this utility model, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A hot plate with a flow guiding structure, comprising a wafer transfer module, a heating module, and a hot plate cover, wherein the hot plate cover is provided with an air inlet and an air outlet, characterized in that: It also includes a flow guiding module disposed inside the hot plate cover. The flow guiding module includes a flow guiding ring and a side baffle structure. When the hot plate cover is closed with the heating module, the flow guiding module covers the outside of the wafer. The flow guide ring has several flow guide holes on its surface, which face the heating module. The side baffle structure has several flow equalization holes on its outer periphery, and the gas passes through the flow equalization holes and is parallel to the heating plate.

2. The hot plate with a flow guide structure according to claim 1, characterized in that: The side guard structure is retractable.

3. The hot plate with flow guiding structure according to claim 2, characterized in that: The side baffle structure includes a telescopic part and a flow equalization part fixed to the telescopic part. The flow equalization hole is disposed on the flow equalization part, and the flow equalization part is fixedly connected to the flow guide ring.

4. The hot plate with flow guiding structure according to claim 3, characterized in that: The telescopic part includes a fixed ring plate with an annular storage groove and a movable ring plate located inside the annular storage groove.

5. The hot plate with flow guiding structure according to claim 4, characterized in that: The movable ring plate is connected to a drive device for driving the movable ring plate to extend or retract into the annular storage slot, and the drive device is installed inside the hot plate cover.

6. The hot plate with flow guiding structure according to claim 1, characterized in that: The diameter of the guide hole increases from the edge of the guide ring to the center of the guide ring.

7. The hot plate with flow guiding structure according to claim 6, characterized in that: The diameter of the guide hole is 0.5-3mm.

8. A hot plate with a flow guiding structure according to claim 1, characterized in that: The flow guide ring covers 1 / 3 to 1 / 2 of the wafer diameter.

9. The heat plate with flow guide structure according to claim 1, characterized in that: It also includes a heat insulation layer disposed within the heating module, the heat insulation layer being located below the heating plate.

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