A quick-mount structure for heat sinks of field-effect transistors in integrated circuits

Abstract

This utility model relates to the field of heat sink installation technology for field-effect transistors (FETs) in integrated circuits. It proposes a quick-installation structure for FET heat sinks in integrated circuits, including a heat sink plate. Multiple limiting plates are fixedly disposed on the top of the heat sink plate, and each limiting plate has an integrally machined fastener on its top. A FET body is mounted on the top of the heat sink plate, and a pressure plate is disposed on the top of the FET body. The limiting plates and fasteners penetrate the FET body and the pressure plate, with the fasteners positioned on top of the pressure plate. A connecting plate is fixedly disposed at one end of the pressure plate, and one end of the connecting plate is inserted into the top of the heat sink plate. In use, the FET body is installed on the top of the heat sink plate, and then the pressure plate is pressed onto the top of the FET body. The limiting plates and fasteners on the top of the heat sink plate penetrate the FET body and the pressure plate, thus fixing it in place. A second locking mechanism is then used to reinforce the structure, facilitating installation.

Description

Technical Field

[0001] This utility model relates to the field of heat sink mounting technology for field-effect transistors in integrated circuits, and more specifically, to a quick mounting structure for heat sinks of field-effect transistors in integrated circuits. Background Technology

[0002] A field-effect transistor (FET) is a semiconductor device that uses the electric field effect of the input circuit to control the current in the output circuit. FETs are unipolar transistors, meaning that almost only one type of charge carrier moves during conduction, similar to metal conduction. Compared to bipolar transistors (BPTs), FETs have advantages such as smaller size, lighter weight, and longer lifespan. They also have particularly high input circuit internal resistance, low noise, good thermal stability (because they almost exclusively utilize majority carrier conduction), strong radiation protection, and energy efficiency. FETs dominate the market. However, when installing FETs, heat sinks are required. In existing technologies, heat sinks are mostly connected to FETs using bolts, which is inconvenient and can easily damage the FET if the bolts are tightened too much. Therefore, this invention proposes a quick-installation structure for heat sinks of FETs in integrated circuits. Utility Model Content

[0003] This invention proposes a quick-installation structure for the heat sink of a field-effect transistor (FET) in an integrated circuit. This solves the problem that in related technologies, the heat sink of a FET is mostly connected to the FET with bolts, which is inconvenient to install and can easily damage the FET if the bolts are tightened too much.

[0004] The technical solution of this utility model is as follows: A quick-installation structure for a heat sink of a field-effect transistor in an integrated circuit includes a heat sink plate. Multiple limiting plates are fixedly disposed on the top of the heat sink plate. Each of the multiple limiting plates has a snap-on plate integrally machined on its top. A field-effect transistor body is mounted on the top of the heat sink plate. A pressure plate is disposed on the top of the field-effect transistor body. The limiting plates and snap-on plates penetrate the field-effect transistor body and the pressure plate. The snap-on plate is located on top of the pressure plate. A connecting plate is fixedly disposed at one end of the pressure plate, and one end of the connecting plate is inserted into the top of the heat sink plate. A reinforcing structure is disposed on the top of the heat sink plate. Limiting structures are disposed on both sides of the pressure plate.

[0005] Preferably, the reinforcing structure includes two T-shaped sliders, which are slidably installed inside the top of the heat sink. A first U-shaped plate is fixedly connected between the tops of the T-shaped sliders. A first elastic steel plate is fixedly installed on the top of the first U-shaped plate, and the first elastic steel plate is located on the top of the pressure plate. A limiting protrusion is fixedly installed at the bottom of the first elastic steel plate, and the limiting protrusion is fastened between multiple limiting plates. A pin is fixedly installed on one side of each T-shaped slider, and the pin is inserted into the interior of the connecting plate.

[0006] Preferably, the limiting structure includes two side plates, which are fixedly installed on both sides of the pressure plate. Two second U-shaped plates are fixedly provided on the top of the heat dissipation plate. The side plates are respectively inserted into the interior of the two second U-shaped plates. A second elastic steel plate is uniformly fixed on the top of the second U-shaped plate, and one end of the second elastic steel plate is fastened to the interior of the side plate.

[0007] Preferably, the top of the heat sink is provided with a groove, and one end of the connecting plate is inserted into the groove.

[0008] Preferably, the top of the pressure plate has a through hole, through which the limiting plate and the buckle plate pass.

[0009] Preferably, the top of the heat sink is provided with a T-shaped groove, and the T-shaped slider is slidably installed inside the T-shaped groove.

[0010] Preferably, a pin hole is provided on one side of the connecting plate, and the pin is inserted into the pin hole.

[0011] Preferably, a fastening groove is provided on one side of the side plate, and one end of the second elastic steel plate is fastened inside the fastening groove.

[0012] The beneficial effects of this utility model are as follows:

[0013] This invention utilizes a heat sink, a limiting plate, a buckle plate, a pressure plate, and a limiting protrusion. In use, the field-effect transistor (FET) body is mounted on top of the heat sink, then the pressure plate is pressed onto the top of the FET body, and the buckle plate is fastened to the top of the pressure plate. Simultaneously, the side plates on both sides of the pressure plate are inserted into the interior of the second U-shaped plate. One end of the second elastic steel plate at the top of the second U-shaped plate is fastened to the interior of one side of the side plate, thus limiting the pressure plate. Then, a T-shaped slider slides the first U-shaped plate onto the top of the heat sink, with the first elastic steel plate at the top of the first U-shaped plate fastened to the top of the pressure plate. Simultaneously, a pin on one side of the T-shaped slider is inserted into the interior of the connecting plate, further limiting and fixing the pressure plate, thus facilitating installation. Attached Figure Description

[0014] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0015] Figure 1 This is a perspective view of the entire utility model;

[0016] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0017] Figure 3 This is a schematic diagram of the reinforcement structure of this utility model;

[0018] Figure 4 This utility model Figure 1 Enlarged structural diagram of section A.

[0019] In the diagram: 1. Heat sink; 2. Limiting plate; 3. Buckle plate; 4. Field effect transistor body; 5. Pressure plate; 6. Connecting plate; 7. T-shaped slider; 8. First U-shaped plate; 9. First elastic steel plate; 10. Limiting protrusion; 11. Pin; 12. Side plate; 13. Second U-shaped plate; 14. Second elastic steel plate. Detailed Implementation

[0020] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this utility model.

[0021] Example

[0022] like Figures 1-4 As shown, this embodiment proposes a quick-installation structure for a heat sink of a field-effect transistor (FET) in an integrated circuit. It includes a heat sink 1, with multiple limiting plates 2 fixedly disposed on the top of the heat sink 1. Each limiting plate 2 has a snap-on plate 3 integrally machined onto its top. A FET body 4 is mounted on the top of the heat sink 1, and a pressure plate 5 is disposed on the top of the FET body 4. The limiting plates 2 and snap-on plates 3 penetrate the FET body 4 and the pressure plate 5, with the snap-on plate 3 positioned on top of the pressure plate 5. A connecting plate 6 is fixedly disposed at one end of the pressure plate 5, and one end of the connecting plate 6 is inserted into the heat sink. Inside the top of the heat sink 1, a reinforcing structure is provided on the top of the heat sink 1, and limiting structures are provided on both sides of the pressure plate 5. In use, the field effect transistor body 4 is installed on the top of the heat sink 1, and then the pressure plate 5 is pressed on the top of the field effect transistor body 4. The bottom of the connecting plate 6 at one end of the pressure plate 5 is fastened to the top of the heat sink 1. At the same time, the limiting plate 2 and the fastening plate 3 on the top of the heat sink 1 pass through the field effect transistor body 4 and the pressure plate 5, and the fastening plate 3 is fastened to the top of the pressure plate 5, thereby fixing it. Then, it is locked a second time by the reinforcing structure, which facilitates installation.

[0023] The reinforcing structure includes two T-shaped sliders 7, which are slidably installed inside the top of the heat sink 1. A first U-shaped plate 8 is fixedly connected between the tops of the T-shaped sliders 7. A first elastic steel plate 9 is fixedly installed on the top of the first U-shaped plate 8, and the first elastic steel plate 9 is located on the top of the pressure plate 5. A limiting protrusion 10 is fixedly installed at the bottom of the first elastic steel plate 9, and the limiting protrusion 10 is fastened between multiple limiting plates 2. A pin 11 is fixedly installed on one side of each T-shaped slider 7, and the pin 11 is inserted into the connecting plate 6. Inside, after the pressure plate 5 is installed on top of the field-effect transistor body 4, the first U-shaped plate 8 is slidably installed on top of the heat sink 1 by the T-shaped slider 7. The first U-shaped plate 8 is slid so that it is on one side of the connecting plate 6. The first elastic steel plate 9 on the top of the first U-shaped plate 8 is fastened to the top of the pressure plate 5. The limiting protrusion 10 at the bottom of the first elastic steel plate 9 is fastened between multiple limiting plates 2. At the same time, the pin 11 on one side of the T-shaped slider 7 is inserted into the interior of the connecting plate 6, thereby further limiting and fixing the pressure plate 5.

[0024] The limiting structure includes two side plates 12, which are fixedly installed on both sides of the pressure plate 5. Two second U-shaped plates 13 are fixedly installed on the top of the heat sink 1. The side plates 12 are inserted into the interior of the two second U-shaped plates 13 respectively. A second elastic steel plate 14 is evenly fixed on the top of the second U-shaped plate 13. One end of the second elastic steel plate 14 is fastened to the interior of the side plate 12. When the pressure plate 5 is installed on the top of the field effect transistor body 4, the side plates 12 on both sides of the pressure plate 5 will be inserted into the interior of the second U-shaped plates 13. One end of the second elastic steel plate 14 on the top of the second U-shaped plate 13 is fastened to the interior of one side of the side plate 12, thereby limiting the pressure plate 5.

[0025] The top of the heat sink 1 has a groove, and one end of the connecting plate 6 is inserted into the groove. The connecting plate 6 is fastened to the groove to limit the pressure plate 5. The top of the pressure plate 5 has a through hole, through which the limiting plate 2 and the fastening plate 3 pass. The limiting plate 2 and the fastening plate 3 pass through the pressure plate 5, so that the pressure plate 5 is installed on the top of the field effect transistor body 4 for easy installation. The top of the heat sink 1 has a T-shaped slide groove, and the T-shaped slider 7 is slidably installed inside the T-shaped slide groove. The first U-shaped plate 8 is slidably installed on the top of the heat sink 1 through the T-shaped slider 7. One side of the connecting plate 6 has a pin hole, and the pin 11 is inserted into the pin hole. The pin 11 is inserted into the interior of the connecting plate 6 to further limit the connection plate 6. One side of the side plate 12 has a fastening groove, and one end of the second elastic steel plate 14 is fastened into the fastening groove. The second elastic steel plate 14 is fastened to the side plate 12 to limit the pressure plate 5.

[0026] In this embodiment, during use, the field-effect transistor body 4 is mounted on top of the heat sink 1, and then the pressure plate 5 is pressed onto the top of the field-effect transistor body 4. The bottom of the connecting plate 6 at one end of the pressure plate 5 is fastened to the top of the heat sink 1. At the same time, the limiting plate 2 and the fastening plate 3 at the top of the heat sink 1 pass through the field-effect transistor body 4 and the pressure plate 5, and the fastening plate 3 is fastened to the top of the pressure plate 5, thereby fixing it. Meanwhile, the side plates 12 on both sides of the pressure plate 5 are inserted into the interior of the second U-shaped plate 13, and one end of the second elastic steel plate 14 at the top of the second U-shaped plate 13 is fastened. Inside one side of the side plate 12, the pressure plate 5 is limited. Then, the first U-shaped plate 8 is slidably installed on the top of the heat sink 1 by the T-shaped slider 7. The first U-shaped plate 8 is slid so that it is on the side of the connecting plate 6. The first elastic steel plate 9 at the top of the first U-shaped plate 8 is fastened to the top of the pressure plate 5. The limiting protrusion 10 at the bottom of the first elastic steel plate 9 is fastened between multiple limiting plates 2. At the same time, the pin 11 on one side of the T-shaped slider 7 is inserted into the interior of the connecting plate 6, thereby further limiting and fixing the pressure plate 5, thus facilitating installation.

[0027] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A quick-installation structure for a heat sink of a field-effect transistor in an integrated circuit, characterized in that, The device includes a heat sink (1), a plurality of limiting plates (2) are fixedly provided on the top of the heat sink (1), and a buckle plate (3) is integrally processed on the top of each of the limiting plates (2). A field-effect transistor body (4) is installed on the top of the heat sink (1), and a pressure plate (5) is provided on the top of the field-effect transistor body (4). The limiting plates (2) and buckles (3) penetrate through the field-effect transistor body (4) and the pressure plate (5). The buckle plate (3) is located on the top of the pressure plate (5). A connecting plate (6) is fixedly provided on one end of the pressure plate (5), and one end of the connecting plate (6) is inserted into the top of the heat sink (1). A reinforcing structure is provided on the top of the heat sink (1), and limiting structures are provided on both sides of the pressure plate (5).

2. A heat sink quick mounting structure for field effect transistors in an integrated circuit according to claim 1, wherein The reinforcement structure includes two T-shaped sliders (7), which are slidably installed inside the top of the heat sink (1). A first U-shaped plate (8) is fixedly connected between the tops of the T-shaped sliders (7). A first elastic steel plate (9) is fixedly installed on the top of the first U-shaped plate (8), and the first elastic steel plate (9) is located on the top of the pressure plate (5). A limiting protrusion (10) is fixedly installed at the bottom of the first elastic steel plate (9), and the limiting protrusion (10) is fastened between multiple limiting plates (2). A pin (11) is fixedly installed on one side of each T-shaped slider (7), and the pin (11) is inserted into the interior of the connecting plate (6).

3. The heat sink quick mounting structure for field effect transistors in an integrated circuit according to claim 1, wherein The limiting structure includes two side plates (12), which are fixedly installed on both sides of the pressure plate (5). Two second U-shaped plates (13) are fixedly installed on the top of the heat dissipation plate (1). The side plates (12) are inserted into the interior of the two second U-shaped plates (13). A second elastic steel plate (14) is evenly fixed on the top of the second U-shaped plate (13). One end of the second elastic steel plate (14) is fastened to the interior of the side plate (12).

4. The heat sink quick mounting structure for field effect transistors in an integrated circuit according to claim 1, wherein The top of the heat sink (1) has a groove, and one end of the connecting plate (6) is inserted into the groove.

5. The heat sink quick mounting structure for field effect transistors in an integrated circuit according to claim 1, wherein The pressure plate (5) has a through hole at its top, through which the limiting plate (2) and the buckle plate (3) pass.

6. The heat sink quick mounting structure for field effect transistors in an integrated circuit according to claim 2, wherein The top of the heat sink (1) is provided with a T-shaped groove, and the T-shaped slider (7) is slidably installed inside the T-shaped groove.

7. The quick-installation structure for a heat sink of a field-effect transistor in an integrated circuit according to claim 2, characterized in that, A pin hole is provided on one side of the connecting plate (6), and the pin (11) is inserted into the pin hole.

8. The quick-installation structure for a heat sink of a field-effect transistor in an integrated circuit according to claim 3, characterized in that, A snap-fit ​​groove is provided on one side of the side plate (12), and one end of the second elastic steel plate (14) is snapped into the snap-fit ​​groove.

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