A copper clip structure and copper strip for use in medium- and high-power devices
By employing a two-pair connecting rib design in the copper clip structure, the problem of insufficient support in the packaging of medium and high power devices by traditional copper clips is solved, realizing the stability and reliability of the copper clips, and making them suitable for applications of medium and high power devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NIXI SEMICON TECH (SHANGHAI) CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-07-03
AI Technical Summary
Traditional copper clip structures are difficult to provide sufficient support strength in the packaging of medium and high power devices, which makes large copper clips prone to twisting and deformation during transportation and processing.
The design employs two pairs of connecting ribs. The first pair of connecting ribs extends along the X direction and connects to the outer frame, while the second pair of connecting ribs extends along the Y direction to form a cross-shaped fixation. This increases the copper clip area and provides sufficient support, preventing the copper clip from tilting, twisting, and deforming during transportation and processing.
The increased support strength of the copper clip ensures its stability during transportation and processing, preventing twisting and deformation of the copper clip and meeting the application requirements of medium and high power devices.
Smart Images

Figure CN224460588U_ABST