A precision grinding device for a diamond single crystal wafer

By using an intelligent control system with pressure sensors and laser rangefinders, combined with a multi-stage transmission structure, the problems of uneven pressure and single movement mode in traditional grinding devices have been solved. This has enabled precise pressure control and efficient grinding of diamond single crystal substrates, improving grinding accuracy and efficiency.

CN224464424UActive Publication Date: 2026-07-07GAOXIN (HENAN) SEMICON CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GAOXIN (HENAN) SEMICON CO LTD
Filing Date
2025-05-16
Publication Date
2026-07-07

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    Figure CN224464424U_ABST
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Abstract

The utility model belongs to the field of grinding equipment especially diamond single crystal wafer precision grinding device, including the box, the top fixed mounting of box has the workstation, the fixed mounting of baffle is in the box, the bottom fixed mounting of baffle has the fixing frame, installs the drive motor on the fixing frame, installs the drive shaft on the output shaft of drive motor, and the drive shaft extends to the top of workstation and fixed mounting has the grinding disc, the top of workstation is set up and has moved the hole, and the mobile seat of moved hole is slidably installed, and the mobile seat one side is slidably installed and has the lifting plate, and the mobile seat is equipped with the drive mechanism for the lifting plate lifting, and the bottom of lifting plate is installed and has pressure sensor. The utility model design is reasonable, and the grinding pressure accurate control is realized through pressure sensor, laser range finder and controller cooperation, and the wafer reciprocating movement is driven with the help of multistage transmission structure, thereby effectively improving grinding accuracy and production efficiency.
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