A probe
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN DOUGATE TECH CO LTD
- Filing Date
- 2025-06-20
- Publication Date
- 2026-07-07
Smart Images
Figure CN224471737U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor testing technology, and specifically to a probe. Background Technology
[0002] In the semiconductor integrated circuit industry, probes are used to assist in the reliability testing of chips on wafers. Typically, one end of a certain number of probes is fixed to a circuit board, which is then connected to a testing machine. The other end of the probes contacts the probe points of each test unit on the chip wafer, thus forming a test.
[0003] During testing, the probe tip needs to be in close contact with the wafer. However, a fixed connection makes it difficult for the probe to move, making it difficult to ensure close contact. Furthermore, a hard connection can easily damage the wafer. Summary of the Invention
[0004] In view of the shortcomings of existing technologies that make it difficult to make close contact, the purpose of this utility model is to provide a probe that makes close contact.
[0005] To solve the above problems, this utility model provides the following technical solution:
[0006] A probe includes: a probe base for soldering the probe to a circuit board;
[0007] A needle used to contact the wafer of a chip;
[0008] An elastic component is disposed between the needle holder and the needle tip. After the needle tip contacts the wafer, the elastic component provides the needle tip with an elastic force that ensures tight contact with the wafer.
[0009] The bump is located on the needle holder and is used for positioning the probe and the circuit board for secondary fixation.
[0010] In some embodiments, the elastic component includes a support and an elastic element;
[0011] The support member is used for stable support of the needle hub and the needle tip, and the support member is flexible;
[0012] The elastic element is elastically deformable and is used to provide a force for the needle to make tight contact with the wafer;
[0013] When the needle contacts the wafer, the support bends and the elastic element deforms; when the needle separates from the wafer, the elastic element restores the support to its original state before bending.
[0014] In some embodiments, the support member is a straight rod.
[0015] In some embodiments, the elastic element is a wavy, curved rod.
[0016] In some embodiments, the elastic element is a wavy, curved rod.
[0017] In some embodiments, the number of elastic elements is multiple.
[0018] In some embodiments, a plurality of the elastic elements are arranged in parallel.
[0019] In some embodiments, the probe further includes a positioning element;
[0020] The positioning element is located on one side of the needle tip, and the positioning element is used to accurately position the needle tip on the circuit board.
[0021] In some embodiments, the needle holder is provided with a wavy groove, which is used to increase the soldering surface of the needle holder at the circuit board soldering position.
[0022] In some embodiments, the number of protrusions is two, located on both sides of the pin seat, and the distances from the groove position are the same.
[0023] The beneficial effects of this invention are: by applying a force to the probe to ensure close contact with the wafer through the elastic component, it can ensure close contact between the probe and the wafer, enabling stable signal transmission, and can also prevent wafer damage under the action of elastic force; and under the action of the protrusion, it can ensure the positioning accuracy of the probe and the circuit board for secondary fixation. Attached Figure Description
[0024] Figure 1 This is a perspective view of the present utility model;
[0025] Figure 2 This is a perspective view illustrating the present invention;
[0026] Figure 3 This is a schematic diagram showing the installation of some probes and the circuit board of this utility model;
[0027] Figure 4 This utility model Figure 2 Enlarged view of point A.
[0028] Figure label:
[0029] 100. Probe; 110. Needle base; 120. Needle tip; 130. Elastic component; 140. Positioning element; 150. Groove; 160. Protrusion;
[0030] 131. Supporting component; 132. Elastic component;
[0031] 200. Circuit board. Detailed Implementation
[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified.
[0034] For ease of description of the first, second, and third directions in the embodiments of this application, the first direction is the left-right direction in the figures, the second direction is the front-back direction in the figures, and the third direction is the up-down direction in the figures. The x-axis arrow direction is referred to as the "right" direction, the y-axis arrow direction as the "up" direction, and the z-axis arrow direction as the "back" direction, but these are not the sole limitations in the actual application of this application.
[0035] like Figures 1-4 As shown, this embodiment provides a probe 100, which includes a probe base 110, a probe tip 120, and an elastic component 130. The probe base 110 is used for soldering the probe 100 to the circuit board 200; the probe tip 120 is used for contacting the wafer of the chip; the elastic component 130 is disposed between the probe base 110 and the probe tip 120, and after the probe tip 120 contacts the wafer, the elastic component 130 provides the probe tip 120 with an elastic force that tightly contacts the wafer; a bump 160 is disposed on the probe base and is used for secondary positioning of the probe and the circuit board. The elastic component 130 provides a force to the probe 120 to ensure close contact with the wafer, which not only ensures close contact between the probe 120 and the wafer for stable signal transmission, but also prevents wafer damage under the elastic force. When fixing the probe to the circuit board, it needs to be fixed by soldering for the first time, and then fixed by resin coating for the second time. In order to ensure that the coating height is not too low and will affect the later use, the protrusion 160 is used to position the coating height, ensuring the positioning accuracy of the second fixation.
[0036] like Figure 1As shown, in this embodiment, the elastic component 130 includes a support member 131 and an elastic member 132. The support member 131 provides stable support for the needle holder 110 and the needle tip 120, and the support member 131 is bendable. The elastic member 132 is elastically deformable and provides a force for the needle tip 120 to make close contact with the wafer. When the needle tip 120 contacts the wafer, the support member 131 bends, and the elastic member 132 deforms. When the needle tip 120 separates from the wafer, the elastic member 132 restores the support member 131 to its state before bending. The support member 131 ensures the stability of the position of the needle tip 120, and the elastic force of the elastic member 132 ensures the stability of the contact. Because the support member 131 and the elastic member 132 are capable of bending deformation, they can prevent damage caused by hard contact after contacting the wafer under the action of bending deformation.
[0037] Optionally, the support member 131 is a straight rod.
[0038] Optionally, the cross-section of the straight rod can be circular, square, or other shapes, which can be selected as needed, and this application does not impose any restrictions.
[0039] Optionally, the elastic element 132 is a wavy curved rod. The wavy shape allows for better bending and elastic deformation.
[0040] like Figure 1 As shown, preferably, the wavy curved rod is an S-shaped rod.
[0041] Optionally, the number of elastic elements 132 can be multiple. The design using multiple elastic elements 132 ensures that sufficient elastic deformation force is generated.
[0042] Optionally, multiple elastic elements 132 can be arranged in parallel to ensure consistent elastic deformation force during deformation.
[0043] Preferably, the number of elastic elements 132 is three.
[0044] Preferably, the cross-section of the elastic rod 132 is the same at any position to ensure that the overall elastic deformation force of the elastic rod 132 is the same, and to prevent damage caused by uneven force on the elastic rod 132.
[0045] like Figure 1 As shown, in this embodiment, the probe 100 further includes a positioning element 140, which is disposed on one side of the needle tip 120. The positioning element 140 is used to accurately position the needle tip 120 on the circuit board 200. By using the positioning component, during the soldering process between the probe 100 and the circuit board 200, the needle tip 120 can be accurately positioned on the circuit board 200, ensuring that no deviation occurs after soldering and preventing any impact on the accuracy of subsequent testing.
[0046] like Figure 2 As shown, the probe has a length of H, a width of D, a distance of N between two adjacent elastic rods, a width of M for the elastic rod, and a thickness of S for the probe or elastic rod. The ratio of the probe's length to its width is H:D = 1:0.2~0.8; the ratio of the elastic rod's width to the distance between two adjacent elastic rods is M:N = 1:0.2~5; and the ratio of the elastic rod's width to its thickness is M:S = 1:0.5~5.
[0047] Optionally, the thickness S of the probe is between 0.02 and 0.1 mm.
[0048] Preferably, the thickness S of the probe is 0.4 mm, 0.5 mm, or 0.6 mm.
[0049] like Figure 1 As shown, in this embodiment, the pin holder 110 is provided with a wavy groove 150. The groove 150 is used to increase the soldering surface of the pin holder 110 at the soldering position on the circuit board 200. The wavy design increases the area of the end face, resulting in a larger contact area when the pin holder 110 is soldered to the circuit board 200, thus ensuring soldering stability.
[0050] Optionally, there are two protrusions 160, located on both sides of the pin seat 110, and the distance from the groove 150 is the same.
[0051] In summary, this utility model provides a probe that uses an elastic component to apply a force to the probe tip to ensure close contact with the wafer. This ensures both tight contact between the probe tip and the wafer for stable signal transmission and prevents wafer damage under the elastic force. Furthermore, the protrusion ensures accurate positioning of the probe tip and the circuit board for secondary fixation.
[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A probe, characterized in that, include: The probe socket is used for soldering the probe to the circuit board; A needle used to contact the wafer of a chip; An elastic component is disposed between the needle holder and the needle tip. After the needle tip contacts the wafer, the elastic component provides the needle tip with an elastic force that ensures tight contact with the wafer. The bump is located on the needle holder and is used for positioning the probe and the circuit board for secondary fixation.
2. The probe according to claim 1, characterized in that: The elastic component includes a support member and an elastic member; The support member is used for stable support of the needle hub and the needle tip, and the support member is flexible; The elastic element is elastically deformable and is used to provide a force for the needle to make tight contact with the wafer; When the needle contacts the wafer, the support bends and the elastic element deforms; when the needle separates from the wafer, the elastic element restores the support to its original state before bending.
3. The probe according to claim 2, characterized in that: The support member is a straight rod.
4. The probe according to claim 2, characterized in that: The elastic element is a wavy curved rod.
5. The probe according to claim 4, characterized in that: The wave-shaped curved rod can be an S-shaped rod.
6. The probe according to claim 2, characterized in that: The number of elastic elements is multiple.
7. The probe according to claim 6, characterized in that: Multiple elastic elements are arranged in parallel.
8. The probe according to claim 1, characterized in that: The probe also includes a positioning element; The positioning element is located on one side of the needle tip, and the positioning element is used to accurately position the needle tip on the circuit board.
9. The probe according to claim 1, characterized in that: The needle holder is provided with a wavy groove, which is used to increase the soldering surface of the needle holder at the circuit board soldering position.
10. The probe according to claim 9, characterized in that: There are two protrusions, located on both sides of the needle base, and they are equidistant from the groove.