An optical communication module

Abstract

The utility model provides a kind of optical communication module, it is related to optical communication module field.The optical communication module, including circuit board, the upper surface of the circuit board is overlapped with optical communication module body, the upper surface of the circuit board is equipped with optical communication module installation slot.The optical communication module, through the cooperation of supporting leg, circuit board mounting backing plate structure and screw, reach the lower surface of circuit board is spaced, so that increase the heat dissipation effect of circuit board, through the combination between optical communication module installation slot, limit board, through -hole, mounting bracket, installation slot, optical communication module locking rod structure, moving groove, sliding guide block structure, pull block, bracing plate and rubber block, reach the optical communication module is installed simultaneously, can avoid high temperature to cause glue melt, affect the firmness of optical communication module on circuit board surface, through the setting of copper heat sink structure, increase the heat dissipation effect of optical communication module.

Description

Technical Field

[0001] This utility model relates to the field of optical communication module technology, specifically to an optical communication module. Background Technology

[0002] An optical module consists of optoelectronic devices, functional circuits, and optical interfaces. The optoelectronic devices include both transmitting and receiving parts. Simply put, the function of an optical module is to convert electrical signals into optical signals at the transmitting end, transmit them through optical fiber, and then convert the optical signals back into electrical signals at the receiving end. Optical modules are classified according to their packaging form; common types include SFP, SFP+, SFF, and Gigabit Ethernet Interface Converters (GBIC). The transmitting part works by: receiving an electrical signal of a certain bit rate, processing it through an internal driver chip, and then driving a semiconductor laser (LD) or light-emitting diode (LED) to emit a modulated optical signal at a corresponding rate. It also includes an internal automatic optical power control circuit to keep the output optical signal power stable.

[0003] The receiving section consists of an optical signal input module with a certain bit rate, which is then converted into an electrical signal by a photodetector diode. After passing through a preamplifier, it outputs an electrical signal with the corresponding bit rate. The main function of the optical transceiver module is to realize photoelectric / electro-optical conversion, including optical power control, modulation and transmission, signal detection, IV conversion, and limiting amplification decision regeneration functions. In addition, it also has functions such as anti-counterfeiting information query and TX-disable. Common types include SFP, SFF, SFP+, GBIC, XFP, and 1x9.

[0004] In addition to photoelectric conversion, optical transceiver modules integrate numerous signal processing functions, such as MUX / DEMUX, CDR, function control, performance data acquisition, and monitoring. Common optical transceiver modules include 200 / 300-pin, XENPAK, and X2 / XPAK. XFP (10 Gigabit Small Form Factor Pluggable) is a hot-swappable, protocol-independent optical transceiver used for 10Gbps Ethernet, SONET / SDH, and Fibre Channel. Small Pluggable Transceiver Modules (SFPs) are currently the most widely used. The GigacBiDi series of single-fiber bidirectional optical modules utilizes WDM technology to transmit bidirectional signals over a single fiber (point-to-point transmission, especially useful when fiber resources are limited and a single fiber is needed for bidirectional signal transmission). GigacBiDi includes SFP single-fiber bidirectional (BiDi), GBIC single-fiber bidirectional (BiDi), SFP+ single-fiber bidirectional (BiDi), XFP single-fiber bidirectional (BiDi), SFF single-fiber bidirectional (BiDi), and others. RJ45 small pluggable modules, also known as electrical modules or electrical port modules, are further divided into 2x5, 2x10, etc. according to their pin configurations. Other types include Gigabit Ethernet interface converter (GBIC) modules, Passive Optical Network (PON) (A-PON, G-PON, GE-PON) optical modules, 40Gbps high-speed optical modules, SDH transmission modules (OC3, OC12, OC48), and storage modules such as 4G and 8G.

[0005] An optical transceiver module, also known as an optical module or fiber optic module, is a crucial component in fiber optic communication systems. D / T stands for datacom / telcom. Data communication primarily includes computer video and other data communication applications. Telcom mainly includes wireless voice communication.

[0006] These products are mostly used in the backbone network of fiber optic networks.

[0007] PON stands for Passive Optical Network. These products are mainly used in access networks within fiber optic network systems. Triplex products can transmit fiber optic signals and also output analog signals. Optical modules are mainly classified as GBIC, SFP, SFP+, XFP, SFF, CFP, etc., with optical interface types including SC and LC. However, SFP, SFP+, and XFP are now more commonly used than GBIC. This is because GBIC is large and prone to failure, while the commonly used SFP is small and inexpensive. Types: Single-mode optical modules are suitable for long-distance transmission; multimode optical modules are suitable for short-distance transmission. Function: Optical modules serve as the carrier for transmission between switches and devices, offering greater efficiency and security compared to transceivers. Current optical communication modules are glued to the circuit board surface; prolonged operation in high-temperature environments can cause the glued parts to loosen, leading to the optical communication module detaching. Utility Model Content

[0008] The purpose of this invention is to provide an optical communication module that solves the problem that current optical communication modules are glued to the surface of a circuit board, which can cause the glued parts to loosen and the optical communication module to fall off during long-term high-altitude operation.

[0009] Technical solution

[0010] To achieve the above objectives, this utility model provides the following technical solution: an optical communication module includes a circuit board. An optical communication module body is attached to the upper surface of the circuit board. An optical communication module mounting slot is formed on the upper surface of the circuit board. A limiting plate is engaged inside the mounting slot. The upper surface of the limiting plate is bonded to the lower surface of the optical communication module body. A mounting bracket is fixedly connected to the lower surface of the limiting plate. A through hole communicating with the inside of the optical communication module mounting slot is formed on the lower surface of the circuit board. A mounting groove is formed on the left side of the mounting bracket. An optical communication module locking rod structure is inserted into the mounting groove. A movable groove is formed on the lower surface of the circuit board. A sliding guide block structure is slidably connected inside the movable groove. The lower surface of the structure is fixedly connected to the upper surface of the optical communication module locking rod structure. The circuit board mounting pad structure is placed inside the equipment, and then the circuit board is installed by screwing the screws downwards. The optical communication module body is placed on the surface of the circuit board, and the limiting plate is inserted into the optical communication module mounting slot. At the same time, the limiting plate drives the mounting bracket through the through hole. Then, the optical communication module locking rod structure is pushed to the right, and the optical communication module locking rod structure will be inserted into the mounting slot. At the same time, the sliding guide block structure will slide along with the optical communication module locking rod structure. Finally, the support plate is inserted into the moving slot, so that the rubber block contacts the inner wall of the moving slot and the left side of the sliding guide block structure, thereby pressing the optical communication module locking rod structure, thus completing the installation of the optical communication module body.

[0011] Furthermore, the surface of the mounting bracket is inserted into the interior of the through hole.

[0012] Furthermore, a support leg is fixedly connected to the lower surface of the circuit board, and a circuit board mounting pad structure is fixedly connected to the bottom end of the support leg. Screws are connected to the internal threads of the circuit board mounting pad structure.

[0013] Furthermore, a support plate is provided inside the movable groove, and rubber blocks are fixedly connected to both the left and right sides of the support plate.

[0014] Furthermore, a pull block is fixedly connected to the lower surface of the support plate.

[0015] Furthermore, the upper surface of the locking rod structure of the optical communication module overlaps with the lower surface of the circuit board.

[0016] Furthermore, a copper heat sink structure is bonded to the upper surface of the optical communication module body.

[0017] This utility model provides an optical communication module. It has the following beneficial effects:

[0018] This optical communication module, through the combination of support legs, circuit board mounting pads, and screws, isolates the lower surface of the circuit board, thereby increasing heat dissipation. The combination of mounting slots, limiting plates, through holes, mounting brackets, mounting grooves, locking rods, moving grooves, sliding guide blocks, pull blocks, support plates, and rubber blocks facilitates the installation of the optical communication module. It also prevents the adhesive from melting due to high temperatures, which could compromise the module's stability on the circuit board. The copper heat sink structure further enhances heat dissipation, solving the problem of current optical communication modules, which are glued to the circuit board surface and prone to loosening and detachment during prolonged high-altitude operation. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This utility model Figure 1 Enlarged view of the local structure at point A in the middle.

[0021] The components include: 1. Circuit board; 2. Support leg; 3. Circuit board mounting pad structure; 4. Screw; 5. Optical communication module body; 6. Copper heat sink structure; 7. Optical communication module mounting slot; 8. Limiting plate; 9. Through hole; 10. Mounting bracket; 11. Mounting slot; 12. Optical communication module locking rod structure; 13. Moving slot; 14. Sliding guide block structure; 15. Pull block; 16. Support plate; and 17. Rubber block. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] like Figure 1-2 As shown, Embodiment 1 of this utility model provides an optical communication module, including a circuit board 1. A support leg 2 is fixedly connected to the lower surface of the circuit board 1. A circuit board mounting pad structure 3 is fixedly connected to the bottom end of the support leg 2. A screw 4 is threaded inside the circuit board mounting pad structure 3. An optical communication module body 5 is attached to the upper surface of the circuit board 1. A copper heat sink structure 6 is bonded to the upper surface of the optical communication module body 5. An optical communication module mounting slot 7 is opened on the upper surface of the circuit board 1. A limiting plate 8 is snapped into the interior of the optical communication module mounting slot 7. The upper surface of the limiting plate 8 is bonded to the lower surface of the optical communication module body 5. A mounting bracket 10 is fixedly connected to the lower surface of the limiting plate 8.

[0027] In the second embodiment of this utility model, the surface of the mounting bracket 10 is inserted into the through hole 9. The lower surface of the circuit board 1 has a through hole 9 that communicates with the interior of the optical communication module mounting slot 7. A mounting slot 11 is provided on the left side of the mounting bracket 10. An optical communication module locking rod structure 12 is inserted into the mounting slot 11. The upper surface of the optical communication module locking rod structure 12 overlaps with the lower surface of the circuit board 1. A moving slot 13 is provided on the lower surface of the circuit board 1. A support plate 16 is provided inside the moving slot 13. Rubber blocks 17 are fixedly connected to both sides of the support plate 16. A pull block 15 is fixedly connected to the lower surface of the support plate 16. A sliding guide block structure 14 is slidably connected inside the moving slot 13. The lower surface of the sliding guide block structure 14 is fixedly connected to the upper surface of the optical communication module locking rod structure 12. Support legs are used to connect the sliding guide block structure 14 to the mounting bracket 10. 2. The cooperation of the circuit board mounting pad structure 3 and screws 4 isolates the lower surface of the circuit board 1, thereby increasing the heat dissipation effect of the circuit board 1. The combination of the optical communication module mounting slot 7, limiting plate 8, through hole 9, mounting bracket 10, mounting groove 11, optical communication module locking rod structure 12, moving groove 13, sliding guide block structure 14, pull block 15, support plate 16 and rubber block 17 facilitates the installation of the optical communication module. At the same time, it can prevent the glue from melting due to high temperature, which would affect the firmness of the optical communication module on the surface of the circuit board 1. The copper heat sink structure 6 increases the heat dissipation effect of the optical communication module. This solves the problem that the current optical communication module is glued to the surface of the circuit board 1, which will cause the glued parts to loosen and the optical communication module to fall off during long-term high-temperature operation.

[0028] Working principle: The circuit board mounting pad structure 3 is placed inside the equipment, and then the screw 4 is screwed down to install the circuit board 1. The optical communication module body 5 is placed on the surface of the circuit board 1, and the limiting plate 8 is inserted into the optical communication module mounting slot 7. At the same time, the limiting plate 8 drives the mounting bracket 10 through the through hole 9. Then, the optical communication module locking rod structure 12 is pushed to the right, and the optical communication module locking rod structure 12 will be inserted into the mounting slot 11. At the same time, the sliding guide block structure 14 will slide along with the optical communication module locking rod structure 12. Finally, the support plate 16 is inserted into the moving slot 13, so that the rubber block 17 contacts the inner wall of the moving slot 13 and the left side of the sliding guide block structure 14, thereby pressing the optical communication module locking rod structure 12, thus completing the installation of the optical communication module body 5.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An optical communication module, comprising a circuit board (1), characterized in that: The upper surface of the circuit board (1) is covered with the optical communication module body (5). The upper surface of the circuit board (1) is provided with an optical communication module mounting slot (7). The optical communication module mounting slot (7) is fitted with a limiting plate (8). The upper surface of the limiting plate (8) is bonded to the lower surface of the optical communication module body (5). The lower surface of the limiting plate (8) is fixedly connected with a mounting bracket (10). The lower surface of the circuit board (1) is provided with a through hole (9) that communicates with the interior of the optical communication module mounting slot (7). The left side of the mounting bracket (10) is provided with a mounting groove (11). The interior of the mounting groove (11) is fitted with an optical communication module locking rod structure (12). The lower surface of the circuit board (1) is provided with a moving groove (13). The interior of the moving groove (13) is slidably connected with a sliding guide block structure (14). The lower surface of the sliding guide block structure (14) is fixedly connected to the upper surface of the optical communication module locking rod structure (12).

2. The optical communication module according to claim 1, characterized in that: The surface of the mounting bracket (10) is inserted into the interior of the through hole (9).

3. The optical communication module according to claim 1, characterized in that: The lower surface of the circuit board (1) is fixedly connected to a support leg (2), and the bottom end of the support leg (2) is fixedly connected to a circuit board mounting pad structure (3). The circuit board mounting pad structure (3) is internally threaded with screws (4).

4. An optical communication module according to claim 1, characterized in that: The inside of the moving groove (13) is provided with a support plate (16), and rubber blocks (17) are fixedly connected to both the left and right sides of the support plate (16).

5. An optical communication module according to claim 4, characterized in that: A pull block (15) is fixedly connected to the lower surface of the support plate (16).

6. An optical communication module according to claim 1, characterized in that: The upper surface of the optical communication module locking rod structure (12) overlaps with the lower surface of the circuit board (1).

7. An optical communication module according to claim 1, characterized in that: The upper surface of the optical communication module body (5) is bonded with a copper heat sink structure (6).

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