Anti-interference sealed heat dissipation cabinet and electronic equipment

Abstract

This utility model relates to the field of electronic equipment technology, specifically to an anti-interference sealed heat dissipation chassis and electronic equipment. The chassis includes: a chassis shell, which is a closed sheet metal structure with an internal mounting cavity for mounting electronic components; multiple air duct modules, made of metal, with internal straight ventilation ducts inserted into the mounting cavity, and both ends respectively mounted on opposite side walls of the chassis shell; an insulating thermally conductive pad mounted on the side wall of the air duct module; and a cooling fan mounted on one side wall of the chassis shell, on the same side as one end of the air duct module. In the installed state, the heat dissipation surface of the electronic components is in contact with the insulating thermally conductive pad, providing a sealed mounting structure for the electronic equipment while enabling air cooling of the electronic components, thus simultaneously meeting the requirements of heat dissipation, waterproofing, dustproofing, and electromagnetic shielding.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, specifically to an anti-interference sealed heat dissipation chassis and electronic equipment. Background Technology

[0002] Electronic equipment enclosures are critical structures that house and protect electronic components (such as circuit boards, power supplies, and filters). Their design directly impacts the equipment's heat dissipation performance, electromagnetic compatibility, mechanical protection, ease of maintenance, and lifespan. In high-power, multi-board applications, heat dissipation is a particularly prominent issue for existing industrial electronic equipment enclosures. Traditional air-cooled enclosures typically employ open-style cooling designs or directly connect the enclosure's interior to the environment (open-type cooling structures), which struggle to meet waterproof and dustproof requirements and have limited heat dissipation efficiency, easily leading to overheating. Furthermore, neither open-style nor open-type cooling structures can form a closed shielding structure, failing to meet electromagnetic shielding requirements. Utility Model Content

[0003] To address the technical problem that existing air-cooled electronic equipment enclosures cannot simultaneously meet the requirements of heat dissipation, waterproofing, dustproofing, and electromagnetic shielding, this utility model provides an anti-interference sealed heat dissipation enclosure and electronic equipment. While providing a closed installation structure for the electronic equipment, it can also provide air cooling for electronic components, thereby simultaneously meeting the requirements of heat dissipation, waterproofing, dustproofing, and electromagnetic shielding.

[0004] This utility model is achieved through the following technical solution:

[0005] In a first aspect, this utility model provides an anti-interference sealed heat dissipation chassis, comprising: a chassis shell, which is a closed sheet metal structure with an internal mounting cavity for mounting electronic components; multiple air duct modules, made of metal, with internal straight ventilation ducts, inserted into the mounting cavity, and both ends respectively mounted on opposite side walls of the chassis shell; an insulating thermally conductive pad mounted on the side wall of the air duct module; and a cooling fan mounted on one side wall of the chassis shell, and disposed on the same side as one end of the air duct module; wherein, in the installed state, the heat dissipation surface of the electronic components is in contact with the insulating thermally conductive pad.

[0006] The anti-interference sealed heat dissipation chassis provided by this utility model includes a chassis shell, an air duct module, an insulating thermal pad, and a heat dissipation fan. The chassis shell is a closed sheet metal structure with an internal mounting cavity. Multiple air duct modules are provided, made of metal, with straight ventilation channels inside, inserted into the mounting cavity, and their two ends are respectively mounted on opposite side walls of the chassis shell. The insulating thermal pad is mounted on the side wall of the air duct module, and the heat dissipation fan is mounted on one side wall of the chassis shell and is located on the same side as one end of the air duct module.

[0007] During use, the electronic device is installed in the mounting cavity, ensuring the heat dissipation surface of the electronic component is in contact with the insulating thermal pad. The enclosed structure of the chassis provides dust and water protection for the electronic device. Simultaneously, the metal chassis provides electromagnetic shielding, ensuring sufficient anti-interference capability for the electronic equipment. When the electronic device is operating, the cooling fan is turned on. Since the cooling fan and the air duct module are located on the same side, the fan drives airflow through the direct air duct. Simultaneously, the heat generated by the electronic component is transferred to the air duct module through the insulating thermal pad. The metal air duct module dissipates the heat from the insulating thermal pad, and as air flows through the direct air duct, the heat from the air duct module is carried away by the airflow, thus achieving heat dissipation.

[0008] The air duct within the air duct module has a straight-through structure, which ensures smooth and rapid airflow, avoids the heat island effect, and thus ensures the stability of electronic equipment operation.

[0009] In summary, the anti-interference sealed heat dissipation enclosure provided by this utility model not only provides a closed installation structure for electronic equipment, but also enables air cooling of electronic components, thereby simultaneously meeting the protection requirements of heat dissipation, waterproofing, dustproofing and electromagnetic shielding of electronic equipment.

[0010] In an optional embodiment of this application, the chassis housing includes: a mounting box, which is a hollow metal shell with openings at both ends; a cover plate, which seals over the upper opening of the mounting box; and a bottom cover, which seals over the lower opening of the mounting box, so as to facilitate the installation of electronic devices in the mounting box while also facilitating the maintenance and replacement of electronic devices in the mounting box.

[0011] In an optional embodiment of this application, a sealing strip is further included, which is used to seal the gap between the cover plate and the mounting housing and the gap between the bottom cover and the mounting housing, so as to ensure the sealing performance of the mounting housing and provide the IP protection level of the electronic device.

[0012] In an optional embodiment of this application, the sealing strip includes a square body, and the top of the square body is provided with two semi-circular protrusions. The two semi-circular protrusions are concentrically arranged to facilitate the installation of the sealing strip while ensuring that the sealing strip can fit tightly with the corresponding sheet metal.

[0013] In an optional embodiment of this application, a clearance cavity is provided in the middle of the square main body, so that the sealing strip has sufficient deformation space to avoid the sealing strip shifting during the assembly of the chassis housing and affecting the sealing effect.

[0014] In an optional embodiment of this application, the air duct module is provided with a plurality of straight ventilation ducts in the middle, and the plurality of straight ventilation ducts are spaced apart along the height direction of the air duct module to ensure that the air duct module has sufficient ventilation capacity.

[0015] In an optional embodiment of this application, a plurality of heat dissipation fins are arranged in parallel at intervals within the straight ventilation duct.

[0016] In one optional embodiment of this application, the air duct module is a box structure, which facilitates the processing and manufacturing of the air duct module, and the side wall of the air duct module is equipped with heat pipes, which can increase the heat conduction and heat dissipation efficiency of the air duct module.

[0017] In an optional embodiment of this application, the air duct module is welded to the chassis housing, and sealing rings are provided at both ends of the air duct module. The sealing rings are used to seal the gap between the air duct module and the chassis housing, so as to seal the inner cavity of the chassis housing while ensuring the installation stability of the air duct module.

[0018] Secondly, this utility model provides an electronic device comprising multiple circuit boards, which are installed within the aforementioned anti-interference sealed heat dissipation chassis. The installation of the circuit boards within the chassis provides heat dissipation, waterproofing, dustproofing, and electromagnetic shielding protection, ensuring the electronic device has sufficient IP protection rating and adequate anti-interference capability.

[0019] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0020] 1. The anti-interference sealed heat dissipation chassis provided by this utility model includes a chassis shell, an air duct module, an insulating thermal pad, and a heat dissipation fan. The chassis shell is a closed sheet metal structure with an internal mounting cavity. Multiple air duct modules are provided, made of metal, with internal straight ventilation channels, inserted into the mounting cavity, and their two ends are respectively installed on opposite side walls of the chassis shell. The insulating thermal pad is installed on the side wall of the air duct module. The heat dissipation fan is installed on one side wall of the chassis shell and is located on the same side as one end of the air duct module. It can provide dustproof, waterproof, and electromagnetic shielding protection for electronic devices. The heat dissipation fan drives airflow through the straight ventilation channels, and the airflow carries away the heat generated by the electronic devices during operation, thereby achieving heat dissipation. Therefore, this utility model can provide a closed mounting structure for electronic devices while providing air cooling for electronic components, thus simultaneously meeting the requirements of heat dissipation, waterproofing, dustproofing, and electromagnetic shielding.

[0021] 2. The electronic device provided by this utility model has its circuit board installed in the aforementioned anti-interference sealed heat dissipation chassis, which can provide heat dissipation, waterproofing, dustproofing and electromagnetic shielding protection for the circuit board, ensuring that the electronic device has sufficient IP (dustproof and waterproof) protection level and sufficient anti-interference capability. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this utility model and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] In the attached diagram:

[0024] Figure 1 This is an exploded structural diagram of an electronic device provided in an embodiment of this application;

[0025] Figure 2 This is a three-dimensional cross-sectional structural diagram of an electronic device provided in an embodiment of this application;

[0026] Figure 3 A three-dimensional cross-sectional view of the electronic device provided in this application after removing the cover plate and bottom cover;

[0027] Figure 4 This is a schematic diagram of the structure of the sealing strip provided in the embodiments of this application;

[0028] Figure 5 A schematic diagram of the assembly structure of the air duct module provided in an embodiment of this application;

[0029] Figure 6 This is a schematic diagram of the installation process of the air duct module provided in the embodiments of this application.

[0030] The attached figures include reference numerals and their corresponding component names:

[0031] 10-Chassis housing, 11-Mounting cavity, 12-Mounting enclosure, 13-Cover plate, 14-Bottom cover, 15-Handle, 16-Mounting panel, 20-Air duct module, 21-Straight air duct, 22-Heat dissipation fins, 23-Air duct enclosure, 24-Air duct cover plate, 30-Insulating thermal pad, 40-Sealing strip, 41-Square main body, 42-Semi-circular convex ridge, 43-Avoidance cavity, 50-Board, 51-Filter assembly, 60-Cooling fan, 61-Fan cover plate. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0034] It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0035] In the description of the embodiments of this application, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in when in use, or the orientation or positional relationship that is commonly understood by those skilled in the art. It is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0036] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] Example 1

[0038] Combination Figures 1-6This embodiment provides an anti-interference sealed heat dissipation chassis, including: a chassis shell 10, which is a closed sheet metal structure with an internal mounting cavity 11 for mounting electronic components; multiple air duct modules 20, made of metal, with internal straight ventilation ducts 21, inserted into the mounting cavity 11, and both ends respectively mounted on opposite side walls of the chassis shell 10; an insulating thermal pad 30 mounted on the side wall of the air duct module 20; and a cooling fan 60 mounted on one side wall of the chassis shell 10, and on the same side as one end of the air duct module 20; wherein, in the installed state, the heat dissipation surface of the electronic components is in contact with the insulating thermal pad 30.

[0039] In this embodiment, the chassis housing 10 includes: a mounting box 12, which is a hollow metal shell with openings at both ends; a cover plate 13, which seals over the upper opening of the mounting box 12; and a bottom cover 14, which seals over the lower opening of the mounting box 12. This facilitates the manufacturing and processing of the chassis housing 10, as well as the installation of electronic components inside the mounting box 12, and also facilitates the maintenance and replacement of electronic devices inside the mounting box 12.

[0040] Understandably, as an outer casing component, the chassis 10 needs to provide adequate sun protection and protection against downward views. Therefore, the sheet metal material of the chassis 10 usually requires painting treatment (such as spraying brownish-green protective paint). Typically, a handle 15 is installed on the top of the chassis 10 to provide portability. At the same time, a mounting panel 16 is provided on one side of the chassis 10 to avoid installing corresponding plugs and operation buttons, etc.

[0041] For typical operating environments, a waterproof and breathable valve is also installed on the top of the chassis housing 10. For example, it is necessary to ensure normal operation at altitudes below 3000m (53Kpa air pressure). In specific implementation cases, the breathable valve has an IP67 protection rating, a hydrostatic pressure resistance of ≥100mbar for 30min, and a water temperature resistance of -40℃ to +125℃.

[0042] It should be understood that the chassis of electronic devices are mostly made of waterproof aluminum alloy, and waterproof seals are provided at the corresponding interfaces. Therefore, this embodiment also includes a sealing strip 40, which is used to seal the gap between the cover plate 13 and the mounting housing 12, as well as the gap between the bottom cover 14 and the mounting housing 12, to ensure the sealing performance of the mounting housing 12 and provide the IP protection rating of the electronic device.

[0043] Combination Figure 4The sealing strip 40 includes a square body 41, and the top of the square body 41 is provided with two semi-circular protrusions 42. The two semi-circular protrusions 42 are concentrically arranged to facilitate the installation of the sealing strip 40 while ensuring that the sealing strip 40 can fit tightly with the corresponding sheet metal.

[0044] Furthermore, the square main body 41 is provided with an avoidance cavity 43 in the middle, so that the sealing strip 40 has enough deformation space to avoid the sealing strip 40 shifting during the assembly of the chassis housing 10 and affecting the sealing effect.

[0045] In a specific implementation example, the mounting panel 16 and the right side panel of the chassis are milled with mounting grooves (3.3mm x 2.4mm), into which the M-shaped double-peak sealing strip (3.3mm high, 30%-40% compression) provided in this embodiment is embedded. The strip is then bonded with conductive adhesive (model K-818-10g) and secured to the frame with M3 stainless steel screws to ensure the waterproof and sealing performance of the chassis.

[0046] It is understood that the air duct module 20 is provided with multiple straight ventilation ducts 21 in the middle, and the multiple straight ventilation ducts 21 are spaced apart along the height direction of the air duct module 20 to ensure that the air duct module 20 has sufficient ventilation capacity.

[0047] Meanwhile, multiple heat dissipation fins 22 are arranged parallel to each other in the straight ventilation duct 21.

[0048] Combination Figure 5 The air duct module 20 has a box structure. In this embodiment, the air duct module 20 includes an air duct box 23, and an air duct cover 24 is provided on one side of the air duct box 23. The air duct cover 24 is connected and fixed to the air duct box 23 by screws, and a sealing ring is provided between the air duct cover 24 and the air duct box 23 to facilitate the processing and manufacturing of the air duct module 20. In addition, heat pipes are installed on the side wall of the air duct module 20, which can increase the heat conduction and heat dissipation efficiency of the air duct module 20.

[0049] Combination Figure 6 The air duct module 20 is welded to the chassis housing 10, and sealing rings are provided at both ends of the air duct module 20. The sealing rings are used to seal the gap between the air duct module 20 and the chassis housing 10, so as to seal the inner cavity of the chassis housing 10 while ensuring the installation stability of the air duct module 20.

[0050] Specifically, in this embodiment, the air duct module 20 and the mounting box 12 are welded into a whole by brazing and laser welding. An O-ring sealing strip 40 is embedded inside the end of the air duct module 20, and then it is fastened by screws (M2x4).

[0051] Combination Figure 2 and Figure 3 The number of air duct modules 20 and cooling fans 60 is determined based on the dimensions of the chassis 10 and the number of circuit boards 50 to be installed within it. In this embodiment, three air duct modules 20 are provided, and nine (60×60×25) cooling fans 60 are installed on the right side panel of the chassis 10, corresponding to the respective air duct modules 20. The cooling fans 60 are completely exposed, using axial flow fans with an IP68 waterproof rating, and are fitted with fan covers 61. The fan covers 61 have air outlets, and the left side of the chassis 10 has an air inlet, forming a cooling air duct for exhaust cooling. The internal modules conduct heat through the air ducts, and forced air cooling removes the heat from the chassis.

[0052] In summary, the anti-interference sealed heat dissipation chassis provided in this embodiment includes a chassis shell 10, an air duct module 20, an insulating thermal pad 30, and a cooling fan 60. The chassis shell 10 is a closed sheet metal structure with an internal mounting cavity 11. Multiple air duct modules 20 are provided, made of metal, with internal straight ventilation channels 21, inserted into the mounting cavity 11, and their two ends are respectively mounted on opposite side walls of the chassis shell 10. The insulating thermal pad 30 is mounted on the side wall of the air duct module 20, and the cooling fan 60 is mounted on one side wall of the chassis shell 10 and is located on the same side as one end of the air duct module 20.

[0053] In use, the electronic device is installed in the mounting cavity 11, so that the heat dissipation surface of the electronic device is in contact with the insulating thermal pad 30. Since the chassis shell 10 is a closed structure, it can provide dust and water protection for the electronic device. At the same time, the chassis shell 10 is made of metal, which can provide electromagnetic shielding protection for the electronic device, ensuring that the electronic device has sufficient anti-interference capability. When the electronic device is working, the cooling fan 60 is turned on. Since the cooling fan 60 is set on the same side as one end of the air duct module 20, the cooling fan 60 drives the air to flow through the direct ventilation duct 21. At the same time, the heat generated by the electronic device during operation is transferred to the air duct module 20 through the insulating thermal pad 30. The air duct module 20 is made of metal and can conduct heat away from the insulating thermal pad 30. Thus, when the air flows through the direct ventilation duct 21, the heat of the air duct module 20 is carried away by the airflow, thereby achieving the function of heat dissipation.

[0054] The air duct in the air duct module 20 has a straight-through structure, which can ensure smooth and rapid airflow, avoid the heat island effect, and thus ensure the stability of electronic equipment operation.

[0055] In summary, the anti-interference sealed heat dissipation chassis provided in this embodiment not only provides a closed installation structure for electronic equipment, but also enables air cooling of electronic components, thereby simultaneously meeting the protection requirements of heat dissipation, waterproofing, dustproofing and electromagnetic shielding of electronic equipment.

[0056] Example 2

[0057] Combination Figure 1-3 and Figure 6 This embodiment provides an electronic device, including multiple boards 50, which are installed in the anti-interference sealed heat dissipation chassis described in Embodiment 1.

[0058] It is understandable that most internal components of existing electronic devices are installed inside the chassis in the form of circuit boards 50 (with circuit boards and corresponding slots for the circuit boards 50). Similarly, for electronic devices equipped with filter components 51, the corresponding filter components 51 are also installed inside the chassis housing 10. The circuit boards 50 and other electronic components are installed in the anti-interference sealed heat dissipation chassis described in Embodiment 1, which provides heat dissipation, waterproofing, dustproofing, and electromagnetic shielding protection for these components, ensuring that the electronic device has sufficient IP protection level and sufficient anti-interference capability.

[0059] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. An anti-interference sealed heat dissipation chassis, characterized in that, include: The chassis housing (10) is a closed sheet metal structure with an internal mounting cavity (11) for mounting electronic components; Multiple air duct modules (20) are provided. They are made of metal and have straight air ducts (21) inside. They are inserted into the mounting cavity (11) and their two ends are respectively installed on opposite side walls of the chassis housing (10). An insulating thermally conductive pad (30) is installed on the side wall of the air duct module (20); A cooling fan (60) is installed on one side wall of the chassis housing (10) and is set on the same side as one end of the air duct module (20); In the installed state, the heat dissipation surface of the electronic device is in contact with the insulating thermal pad (30).

2. The anti-interference sealed heat dissipation chassis according to claim 1, characterized in that, The chassis housing (10) includes: The mounting box (12) is a hollow metal shell with openings at both ends; A cover plate (13) is provided to seal the opening at the upper end of the mounting box (12); The bottom cover (14) and the sealing cover are located at the lower end opening of the mounting box (12).

3. The anti-interference sealed heat dissipation chassis according to claim 2, characterized in that, It also includes a sealing strip (40) for sealing the gap between the cover plate (13) and the mounting box (12) and the gap between the bottom cover (14) and the mounting box (12).

4. The anti-interference sealed heat dissipation chassis according to claim 3, characterized in that, The sealing strip (40) includes a square body (41), and the top of the square body (41) is provided with two semi-circular protrusions (42), which are concentrically arranged.

5. The anti-interference sealed heat dissipation chassis according to claim 4, characterized in that, An avoidance cavity (43) is provided in the middle of the square main body (41).

6. The anti-interference sealed heat dissipation chassis according to claim 1, characterized in that, The air duct module (20) is provided with a plurality of straight air ducts (21) in the middle, and the plurality of straight air ducts (21) are spaced apart along the height direction of the air duct module (20).

7. The anti-interference sealed heat dissipation chassis according to claim 1, characterized in that, Multiple heat dissipation fins (22) are arranged in parallel at intervals within the straight ventilation duct (21).

8. The anti-interference sealed heat dissipation chassis according to any one of claims 1 to 7, characterized in that, The air duct module (20) is a box structure, and heat pipes are installed on the side wall of the air duct module (20).

9. The anti-interference sealed heat dissipation chassis according to any one of claims 1 to 7, characterized in that, The air duct module (20) is welded to the chassis housing (10), and both ends of the air duct module (20) are provided with sealing rings, which are used to seal the gap between the air duct module (20) and the chassis housing (10).

10. An electronic device, characterized in that, It includes multiple boards (50), and the multiple boards (50) are installed in the anti-interference sealed heat dissipation chassis as described in any one of claims 1 to 9.

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