Heating element assembly and aerosol-generating device

Abstract

The application discloses a heating element assembly and an aerosol generating device. The heating element assembly comprises: a first conductive carrier; a plurality of semiconductor assemblies arranged on the first conductive carrier, each semiconductor assembly comprising an N-type semiconductor and a P-type semiconductor, one end of the N-type semiconductor and the P-type semiconductor being connected to the surface of the first conductive carrier and each having a first contact surface; and a second conductive carrier, each second conductive carrier being connected to the N-type semiconductor and the P-type semiconductor of a corresponding semiconductor assembly, the other end of the N-type semiconductor and the P-type semiconductor being connected to the surface of the second conductive carrier and each having a second contact surface, the area of the second contact surface of at least one of the N-type semiconductor and the P-type semiconductor in the semiconductor assembly being different from the area of the first contact surface. Therefore, the application is beneficial to improving the temperature difference between the hot end and the cold end of a semiconductor refrigerator or a semiconductor heater.

Description

Technical Field

[0001] This application relates to the field of heated non-combustible aerosol generation technology, and more particularly to a heating element assembly and an aerosol generation device. Background Technology

[0002] In known semiconductor coolers or heaters, the semiconductor crystals are cubic. In this case, the first contact area between the semiconductor crystal and the hot end of the semiconductor cooler or heater is equal to the second contact area between the crystal and the cold end. However, when the semiconductor cooler or heater reaches thermal equilibrium, the temperature difference between the hot and cold ends is related to both the first and second contact areas. Having the first and second contact areas equal is detrimental to increasing the temperature difference between the hot and cold ends of the semiconductor cooler or heater. Utility Model Content

[0003] This application provides a heating element assembly and an aerosol generating device, which are beneficial for increasing the temperature difference between the hot and cold ends of a semiconductor cooler or semiconductor heater.

[0004] One embodiment of this application provides a heating element assembly, including:

[0005] First conductive carrier;

[0006] Multiple semiconductor components are disposed on the first conductive carrier. Each semiconductor component includes an N-type semiconductor and a P-type semiconductor. One end of the N-type semiconductor and the P-type semiconductor are connected to the surface of the first conductive carrier, and both have a first contact surface.

[0007] The second conductive carrier is connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor component. The other end of the N-type semiconductor and the P-type semiconductor are connected to the surface of the second conductive carrier and each has a second contact surface. In the semiconductor component, the area of ​​the second contact surface of at least one of the N-type semiconductor and the P-type semiconductor is not equal to the area of ​​the first contact surface.

[0008] In some embodiments, the N-type semiconductor and the P-type semiconductor are configured as trapezoids.

[0009] In some embodiments, the N-type semiconductor and the P-type semiconductor are configured as a frustum.

[0010] In some embodiments, at least one of the first contact surface and the second contact surface is configured as a circle, rectangle, rhombus, trapezoid, triangle or irregular shape.

[0011] In some embodiments, the heating element assembly further includes a tubular carrier defining a receiving space for receiving an aerosol-generated article, the first conductive carrier being disposed around the tubular carrier.

[0012] In some embodiments, the first conductive carrier includes a flexible circuit board, on which a positive electrode connection terminal and a negative electrode connection terminal are disposed, and a plurality of semiconductor components are connected between the positive electrode connection terminal and the negative electrode connection terminal.

[0013] In some embodiments, the heating element assembly further includes conductive leads extending along the length of the tubular carrier, wherein one conductive lead is connected to the positive terminal of the flexible circuit board, and one conductive lead is connected to the negative terminal of the flexible circuit board.

[0014] In some embodiments, the heating element assembly further includes a fixing member disposed around the second conductive carrier.

[0015] In some embodiments, the heating element assembly further includes the temperature sensor, the sensing head of which is disposed between the second conductive carrier and the fixing member.

[0016] In some embodiments, when the fixture includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor and less than or equal to the axial length of the tubular carrier.

[0017] In some embodiments, the heating element assembly further includes an isolator disposed between the second conductive carrier and the fixing member.

[0018] One embodiment of this application provides an aerosol generating apparatus, comprising:

[0019] The heating element assembly as described in any of the above embodiments;

[0020] A power supply component, whose positive terminal is electrically connected to the positive terminal of the first conductive carrier and whose negative terminal is electrically connected to the negative terminal of the first conductive carrier, is configured to provide current to the heating element component. When current flows through the semiconductor component, heat generated based on the Boltzmann effect is transferred from the second conductive carrier to the first conductive carrier, generating Joule heating at both ends of the first and second conductive carriers. The Joule heating generated by the second conductive carrier is also transferred to the first conductive carrier, thereby raising the temperature of the first conductive carrier to heat the aerosol to form the product.

[0021] The aforementioned heating element assembly and aerosol generating device, by having a second contact surface area that is not equal to the area of ​​the first contact surface of at least one of the N-type semiconductor and the P-type semiconductor in the semiconductor assembly, are beneficial to increasing the temperature difference between the hot and cold ends of the semiconductor cooler or semiconductor heater. Attached Figure Description

[0022] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0023] Figure 1 This is a schematic diagram of a heating element assembly provided in one embodiment;

[0024] Figure 2 yes Figure 1 A schematic diagram showing the heat composition and transfer direction of the heating element assembly;

[0025] Figure 3 This is a schematic diagram of a heating element assembly provided in another embodiment;

[0026] Figure 4 This is a schematic diagram of an N-type semiconductor and a P-type semiconductor provided in one embodiment;

[0027] Figure 5 This is a schematic diagram of an N-type semiconductor and a P-type semiconductor provided in another embodiment;

[0028] Figure 6 This is a schematic diagram of an aerosol generating apparatus provided in one embodiment. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only one regional embodiment of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0030] The terms "first," "second," and "third" used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number or order of the indicated technical features. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship or movement of the components in a certain posture (as shown in the accompanying drawings). If the posture changes, the directional indication will also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0031] In this document, the term "embodiment" means that a feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be intervening elements. When an element is referred to as being "connected to" another element, it can be directly connected to the other element, or there may be one or more intervening elements. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0033] Reference Figure 1 One embodiment of this application provides a heating element assembly 100, including a first conductive carrier, a plurality of semiconductor components 20 and a second conductive carrier 30.

[0034] In some embodiments, the first conductive carrier 10 includes a flexible circuit board with a positive terminal and a negative terminal, and a plurality of semiconductor components 20 are connected between the positive terminal and the negative terminal.

[0035] The flexible circuit board includes a body, and a positive terminal and / or a negative terminal that contact the surface of the body or are embedded in the body.

[0036] The flexible circuit board also includes conductive elements disposed on the surface of the body. Preferably, multiple semiconductor components 20 are connected in series between the positive terminal and the negative terminal via conductive elements. In one embodiment, the conductive element is a copper foil, which is a thin, continuous metal foil deposited on the substrate layer of the flexible circuit board, serving as the conductor of the flexible circuit board.

[0037] Multiple semiconductor components 20 are disposed on the first conductive carrier 10. Each semiconductor component 20 includes an N-type semiconductor 21 and a P-type semiconductor 22. One end of the N-type semiconductor 21 and the P-type semiconductor 22 is connected to the surface of the first conductive carrier 10, and both have a first contact surface 201.

[0038] One end of the N-type semiconductor 21 and one end of the P-type semiconductor 22 in the semiconductor component 20 are both electrically connected to the first conductive carrier 10. Optionally, the N-type semiconductor 21 and the P-type semiconductor 22 of the semiconductor component 20 are fixed to the first conductive carrier 10 at intervals by welding.

[0039] In one embodiment, the flexible circuit board further includes pads, which are metal contact points on the flexible circuit board used for soldering N-type semiconductor 21 and P-type semiconductor 22, also known as solder pads. One end of the N-type semiconductor 21 and one end of the P-type semiconductor 22 in the semiconductor assembly 20 are respectively soldered to the corresponding pads.

[0040] Each second conductive carrier 30 is connected to the N-type semiconductor 21 and P-type semiconductor 22 of the corresponding semiconductor component 20. The other end of the N-type semiconductor 21 and P-type semiconductor 22 is connected to the surface of the second conductive carrier 30 and each has a second contact surface 202. In the semiconductor component 20, the area of ​​the second contact surface 202 of at least one of the N-type semiconductor 21 and P-type semiconductor 22 is not equal to the area of ​​the first contact surface 201.

[0041] One end of the N-type semiconductor 21 and one end of the P-type semiconductor 22 in the semiconductor component 20 are electrically connected to the first conductive carrier 10, and the other ends of the N-type semiconductor 21 and the P-type semiconductor 22 in the semiconductor component 20 are electrically connected through a second conductive carrier 30. In one embodiment, the second conductive carrier 30 includes a copper sheet. The N-type semiconductor 21 and the P-type semiconductor 22 in the semiconductor component 20 are electrically connected through the copper sheet.

[0042] In some embodiments, the heating element assembly 100 further includes a tubular carrier 40 defining a receiving space 401 for receiving an aerosol-generated article, and a first conductive carrier 10 is disposed around the tubular carrier 40.

[0043] The first conductive carrier 10 is arranged around the tubular carrier 40, which is suitable for transferring heat to the tubular carrier 40.

[0044] The first conductive carrier 10 is disposed in close contact with the tubular carrier 40, so the tubular carrier 40 can support the first conductive carrier 10 and maintain the first conductive carrier 10 in a preset shape. The outer surface of the tubular carrier 40 and / or the surface of the first conductive carrier 10 facing the tubular carrier 40 can be coated with adhesive, so that the first conductive carrier 10 can be fixed to the tubular carrier 40 by adhesive.

[0045] The first conductive carrier 10 is bendable. In one embodiment, the first conductive carrier 10 is bent close to the outer surface of the tubular carrier 40. Preferably, the first conductive carrier 10 is closed around the tubular carrier 40. In this case, ignoring the thickness of the first conductive carrier 10, the area of ​​the side surface of the first conductive carrier 10 where the semiconductor component 20 is disposed is equal to the area of ​​the outer surface of the tubular carrier 40. The temperature field of the side surface of the first conductive carrier 10 where the semiconductor component 20 is disposed can be correspondingly conducted to the inner surface of the tubular carrier 40, and heat is transferred through the contact between the inner surface of the tubular carrier 40 and the aerosol generating article. Alternatively, the gap between the inner surface of the tubular carrier 40 and the aerosol generating article is used to heat the air flowing through the gap through the heat of the inner surface of the tubular carrier 40, thereby heating the aerosol generating article through the heated air. As an example, the gap is no greater than 0.5 mm, preferably no greater than 0.15 mm. In one embodiment, after the first conductive carrier 10 is bent close to the outer surface of the tubular carrier 40, its two ends are not closed.

[0046] The containment space 401 extends radially along the receiving direction of the aerosol-generated product.

[0047] In one embodiment, the diameter of the receiving space 401 is equal to 7.5 mm. The diameter of the receiving space 401 is slightly larger than the diameter of the aerosol-generating article, which facilitates the smooth insertion of the aerosol-generating article into the receiving space 401. Alternatively, the diameter of the receiving space 401 is slightly smaller than the diameter of the aerosol-generating article, and the aerosol-generating article is fixed in the receiving space 401 by an interference fit to prevent the aerosol-generating article from shaking or even falling off.

[0048] When the aerosol-generating article is received, the aerosol-generating article placed in the receiving space 401 is at least in contact with the tubular carrier 40. The tubular carrier 40 is a heat conductor, which can absorb heat from the first conductive carrier 10 and transfer at least a portion of the absorbed heat to the aerosol-generating article.

[0049] The tubular carrier 40 has a thermal conductivity greater than or equal to 10 W / (m·K). Suitable tubular carriers 40 include, but are not limited to, at least one or more of the following: metal, graphite, graphene, diamond, silicon carbide, aluminum nitride, or thermally conductive polymers. The metals include, but are not limited to, one or more of the following: silver, copper, gold, aluminum, tungsten, zinc, molybdenum, nickel, iron, platinum, ferrite, alloys, or stainless steel. The thermally conductive polymers include, but are not limited to, thermally conductive silicone or thermally conductive grease. By giving the tubular carrier 40 a high thermal conductivity, the efficiency of heat transfer from the heat pipe to the aerosol generation product is improved.

[0050] The heating element assembly 100 may further include a temperature detector. The probe of the temperature detector is connected to the tubular carrier 40 to detect the temperature of the tubular carrier 40. Simultaneously, the temperature detector is electrically connected to a controller on a circuit board to transmit the detected temperature information of the tubular carrier 40 to the controller. The controller can adjust the current or voltage supplied to the heating element assembly 100 by the power supply component based on this temperature information, thereby regulating the temperature of the tubular carrier 40 to ensure sufficient heating of the aerosol-generating product and prevent the aerosol-generating product from burning. The temperature detector can be a thermocouple or a thermistor; no limitation is made to the temperature detector used here.

[0051] The thickness of the tubular carrier 40 can be less than or equal to 0.2 mm to reduce the heat consumption of the tubular carrier 40 itself, so that more of the heat transferred from the first conductive carrier 10 to the tubular carrier 40 can be transferred to the aerosol generating product by the tubular carrier 40, thereby improving the heat utilization rate.

[0052] In some embodiments, the tubular carrier 40 may be omitted. In this case, the inner wall surface of the first conductive carrier 10 defines at least a portion of the boundary of the receiving space 401. Alternatively, at least a portion of the first conductive carrier 10 is configured to be tubular, such that when receiving an aerosol-generating article, at least a portion of the aerosol-generating article is surrounded by the tubular first conductive carrier 10.

[0053] In other embodiments, at least a portion of the first conductive carrier 10 contacts the side surface of the aerosol-generating article to increase the heat transfer efficiency between the first conductive carrier 10 and the side surface of the aerosol-generating article through direct contact, thereby helping to reduce losses.

[0054] Based on the above embodiments, the heating element assembly 100 further includes conductive leads 50 extending along the length of the tubular carrier 40, wherein one conductive lead 50 is connected to the positive terminal of the flexible circuit board, and another conductive lead 50 is connected to the negative terminal of the flexible circuit board.

[0055] The other end of the conductive lead 50 extends along the axial direction of the tubular carrier 40 and is used to connect the positive (+) and negative (-) terminals of the power supply assembly.

[0056] according to Figure 1 As shown, the heating element assembly 100 also includes:

[0057] The fastener 60 is arranged around the second conductive carrier 30.

[0058] In one embodiment, the fastener 60 comprises a PI membrane or aerogel.

[0059] Temperature sensor 70, the sensing head 71 of temperature sensor 70 is disposed between the second conductive carrier 30 and the fixing member 60.

[0060] The fixing member 60 is used to fix the temperature sensor 70 at the corresponding position on the second conductive carrier 30, so that the temperature sensor 70 detects the temperature of the heat supply end (cold end) of the heating element assembly 100. It is understood that the fixing member 60 is not limited to the manner provided in this embodiment.

[0061] like Figure 1 As shown, the temperature sensor 70 also includes a lead 72, which is electrically connected to the sensing head 71. The lead 72 is also electrically connected to the main control board, and is used to output the data collected by the sensing head 71 to the main control board for processing.

[0062] Preferably, when the fixture 60 includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor 70 and less than or equal to the axial length of the tubular carrier 40.

[0063] The axial length of the PI film is greater than or equal to the axial length of the temperature sensor 70, which can fix the temperature sensor 70. In addition, the axial length of the PI film is less than or equal to the axial length of the tubular carrier 40, which can reduce the heat absorbed by the PI film and improve the accuracy of the detection results of the temperature sensor 70.

[0064] The isolator 80 is disposed between the second conductive carrier 30 and the fixing member 60.

[0065] In one embodiment, the separator 80 includes a PI film.

[0066] The PI film provides electrical isolation, effectively preventing short circuits between the second conductive carrier 30 and the temperature sensor 70, thus improving the safety of the heating element assembly 100. It is understood that the insulating element 80 is not limited to the configuration provided in this embodiment.

[0067] Please see Figure 2 The heat composition of the heating element assembly 100 includes: stored heat Qh, Bolte heat Qpi, hot-end Joule heat Qrh, cold-end Joule heat Qrc, radiant heat Qk, transfer heat Qj, Joule heat Qn, and Joule heat Qp.

[0068] The stored heat Qh is the heat stored in the tubular carrier 40.

[0069] The Boller heat Qpi is the heat generated based on the Boller effect and can be calculated using the Boller formula. The Boller formula is: Qpi = |Πn – Πp| * I, where Qpi is the heat, Πn and Πp are the Boller coefficients of the N-type semiconductor 21 and P-type semiconductor 22 respectively, and I is the magnitude of the current supplied by the power supply component 200 to the heating element component 100, which is equal to the current flowing through the N-type semiconductor 21 and P-type semiconductor 22 of the semiconductor component 20.

[0070] The hot-end Joule heat Qrh is the Joule heat generated by the contact impedance and line impedance of the first conductive carrier 10.

[0071] The cold-end Joule heat Qrc is the Joule heat generated by the contact impedance and line impedance of the second conductive carrier 30.

[0072] The radiant heat Qk is the heat radiated by the first conductive carrier 10 to the second conductive carrier 30.

[0073] The heat transfer Qj is the heat transferred by the first conductive carrier 10 through the N-type semiconductor 21, the P-type semiconductor 22 and the air.

[0074] The Joule heat Qn is the Joule heat generated by the N-type semiconductor 21 itself.

[0075] The Joule heat Qp is the Joule heat generated by the P-type semiconductor 22 itself.

[0076] The relationship between stored heat Qh and other heat is as follows:

[0077] Qh= Qpi+Qrh (Equation 1)

[0078] When thermal equilibrium is reached, the heat transfer direction of the heating element assembly 100 is as follows: Bolte heat Qpi is transferred unidirectionally from the outside to the inside, radiant heat Qk, conductive heat Qj, Joule heat Qn and Joule heat Qp are transferred unidirectionally from the inside to the outside, and hot-end Joule heat Qrh and cold-end Joule heat Qrc are transferred bidirectionally.

[0079] The cold and hot ends of the heating element assembly 100 maintain a constant temperature difference, as shown in the following formula:

[0080] Qpi= Qp+Qn+Qk+Qj+Qrc (Equation 2)

[0081] Since the impedance of N-type semiconductor 21 and P-type semiconductor 22 is extremely low, the Joule heating Qn and Joule heating Qp generated by them can be ignored, and Equation 2 can be simplified to:

[0082] Qpi=Qk+Qj+Qrc (Equation 3)

[0083] Radiant heat Where σ is the radiation heat coefficient, A is the radiation area, T1 is the cold end temperature, and T2 is the hot end temperature. When thermal equilibrium is reached, the radiation heat Qk is constant.

[0084] The heat transfer is Qj = KΔT, where K is the heat transfer coefficient and ΔT is the temperature difference between the cold and hot ends.

[0085] It is known that when thermal equilibrium is reached, the temperature difference between the cold and hot ends depends on the Joule heat Qrh of the hot end, the Joule heat Qrc of the cold end, and the heat transfer Qj. Obviously, the Joule heat Qrh of the hot end is related to the area of ​​the first contact surface 201 where one end of the N-type semiconductor 21 and the P-type semiconductor 22 is connected to the surface of the first conductive carrier 10, and the Joule heat Qrc of the cold end is related to the area of ​​the second contact surface 202 where the other end of the N-type semiconductor 21 and the P-type semiconductor 22 is connected to the surface of the second conductive carrier 30. The heat transfer Qj depends on the temperature difference ΔT between the cold and hot ends. The temperature difference ΔT between the cold and hot ends is related to both the first contact surface 201 and the second contact surface 202. Therefore, changing the first contact surface 201 and the second contact surface 202 can adjust the temperature difference to achieve thermal equilibrium between the cold and hot ends.

[0086] In a preferred embodiment, in the semiconductor component 20, the area of ​​the second contact surface 202 of the N-type semiconductor 21 and the P-type semiconductor 22 is not equal to the area of ​​the first contact surface 201.

[0087] according to Figure 1 As shown, the areas of the second contact surfaces 202 of the N-type semiconductor 21 and the P-type semiconductor 22 are equal, the areas of the first contact surfaces 201 of the N-type semiconductor 21 and the P-type semiconductor 22 are equal, and the area of ​​the first contact surface 201 is greater than the area of ​​the second contact surface 202.

[0088] according to Figure 3 As shown, the areas of the second contact surfaces 202 of the N-type semiconductor 21 and the P-type semiconductor 22 are equal, the areas of the first contact surfaces 201 of the N-type semiconductor 21 and the P-type semiconductor 22 are equal, and the area of ​​the first contact surface 201 is smaller than the area of ​​the second contact surface 202.

[0089] by Figure 3 Taking this as an example, the area of ​​the first contact surface 201 is larger than the area of ​​the second contact surface 202. Compared to the cubic N-type semiconductor 21 and P-type semiconductor 22, the area of ​​the first contact surface 201 of the N-type semiconductor 21 and P-type semiconductor 22 is smaller, resulting in increased contact resistance and increased Joule heat Qrh at the hot end. Conversely, the area of ​​the second contact surface 201 of the N-type semiconductor 21 and P-type semiconductor 22 is larger, resulting in decreased contact resistance and decreased Joule heat Qrc at the cold end. The combined effect of the increased Joule heat Qrh at the hot end and the decreased Joule heat Qrc at the cold end improves the temperature difference for thermal equilibrium at both ends. By changing the direction of the current... Figure 1It can also achieve the purpose of increasing the temperature difference for thermal balance at both ends of the hot and cold sides, which will not be elaborated here.

[0090] Please see Figure 4 The N-type semiconductor 21 and the P-type semiconductor 22 are configured as trapezoids.

[0091] As an example, the upper surface of the trapezoid is used to connect with the surface of the first conductive carrier 10, and this surface serves as the first contact surface 201; the opposite lower surface of the trapezoid is used to connect with the surface of the second conductive carrier 30, and this surface serves as the second contact surface 202, wherein the area of ​​the first contact surface 201 is smaller than the area of ​​the second contact surface 202. As another example, the upper surface of the trapezoid is used to connect with the surface of the second conductive carrier 30, and this surface serves as the second contact surface 202; the opposite lower surface of the trapezoid is used to connect with the surface of the first conductive carrier 10, and this surface serves as the first contact surface 201, wherein the area of ​​the second contact surface 202 is smaller than the area of ​​the first contact surface 201.

[0092] Please see Figure 5 The N-type semiconductor 21 and the P-type semiconductor 22 are configured as frustums.

[0093] As an example, the upper surface of the frustum is used to connect with the surface of the first conductive carrier 10, and this surface serves as the first contact surface 201; the lower surface opposite the frustum is used to connect with the surface of the second conductive carrier 30, and this surface serves as the second contact surface 202, wherein the area of ​​the first contact surface 201 is smaller than the area of ​​the second contact surface 202. As another example, the upper surface of the frustum is used to connect with the surface of the second conductive carrier 30, and this surface serves as the second contact surface 202; the lower surface opposite the frustum is used to connect with the surface of the first conductive carrier 10, and this surface serves as the first contact surface 201, wherein the area of ​​the second contact surface 202 is smaller than the area of ​​the first contact surface 201.

[0094] At least one of the first contact surface 201 and the second contact surface 202 is configured as a circle, rectangle, rhombus, trapezoid, triangle or irregular shape.

[0095] That is, the shapes of the first contact surface 201 and the second contact surface 202 can be the same or different, and the areas of the first contact surface 201 and the second contact surface 202 are not equal, all of which are within the scope of protection of this application.

[0096] The heating element assembly provided in this application embodiment has the advantage of increasing the temperature difference between the hot and cold ends of the semiconductor cooler or semiconductor heater by having the area of ​​the second contact surface of at least one of the N-type semiconductor and the P-type semiconductor in the semiconductor assembly not equal to the area of ​​the first contact surface.

[0097] Reference Figure 6One embodiment of this application provides an aerosol generating apparatus 1, comprising:

[0098] Heating element assembly 100 as described in any of the above embodiments.

[0099] The power supply component 200 has its positive terminal electrically connected to the positive terminal of the first conductive carrier 10 and its negative terminal electrically connected to the negative terminal of the first conductive carrier 10. The power supply component 200 is configured to provide current to the heating element component 100. When current flows through the semiconductor component 20, heat generated based on the Boltzmann effect is transferred from the second conductive carrier 30 to the first conductive carrier 10. Joule heating is generated at both ends of the first conductive carrier 10 and the second conductive carrier 30, and the Joule heating generated by the second conductive carrier 30 is also transferred to the first conductive carrier 10, thereby raising the temperature of the first conductive carrier 10 to heat the aerosol to form the product.

[0100] It should be noted that the preferred embodiments of this application are given in the specification and accompanying drawings, but are not limited to the embodiments described in this specification. Furthermore, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heating element assembly, characterized in that, include: First conductive carrier; Multiple semiconductor components are disposed on the first conductive carrier. Each semiconductor component includes an N-type semiconductor and a P-type semiconductor. One end of the N-type semiconductor and the P-type semiconductor are connected to the surface of the first conductive carrier, and both have a first contact surface. The second conductive carrier is connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor component. The other end of the N-type semiconductor and the P-type semiconductor are connected to the surface of the second conductive carrier and each has a second contact surface. In the semiconductor component, the area of ​​the second contact surface of at least one of the N-type semiconductor and the P-type semiconductor is not equal to the area of ​​the first contact surface.

2. The heating element assembly as described in claim 1, characterized in that, The N-type semiconductor and the P-type semiconductor are configured as a trapezoid.

3. The heating element assembly as described in claim 1, characterized in that, The N-type semiconductor and the P-type semiconductor are configured as a frustum.

4. The heating element assembly as described in claim 1, characterized in that, At least one of the first contact surface and the second contact surface is configured as a circle, rectangle, rhombus, trapezoid, triangle or irregular shape.

5. The heating element assembly as described in claim 1, characterized in that, The heating element assembly further includes a tubular carrier defining a receiving space for receiving aerosol-generated articles, wherein the first conductive carrier is disposed around the tubular carrier.

6. The heating element assembly as described in claim 5, characterized in that, The first conductive carrier includes a flexible circuit board, on which a positive electrode connection terminal and a negative electrode connection terminal are provided, and a plurality of semiconductor components are connected between the positive electrode connection terminal and the negative electrode connection terminal.

7. The heating element assembly as claimed in claim 6, characterized in that, The heating element assembly also includes conductive leads extending along the length of the tubular carrier, wherein one conductive lead is connected to the positive terminal of the flexible circuit board and the other conductive lead is connected to the negative terminal of the flexible circuit board.

8. The heating element assembly as described in claim 5, characterized in that, The heating element assembly also includes a fixing member arranged around the second conductive carrier.

9. The heating element assembly as claimed in claim 8, characterized in that, The heating element assembly also includes a temperature sensor, the sensing head of which is disposed between the second conductive carrier and the fixing member.

10. The heating element assembly as claimed in claim 9, characterized in that, When the fixture includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor and less than or equal to the axial length of the tubular carrier.

11. The heating element assembly as claimed in claim 8, characterized in that, The heating element assembly further includes an isolation element disposed between the second conductive carrier and the fixing element.

12. An aerosol generating device, characterized in that, include: The heating element assembly as described in any one of claims 1-11; A power supply component, whose positive terminal is electrically connected to the positive terminal of the first conductive carrier and whose negative terminal is electrically connected to the negative terminal of the first conductive carrier, is configured to provide current to the heating element component. When current flows through the semiconductor component, heat generated based on the Boltzmann effect is transferred from the second conductive carrier to the first conductive carrier, generating Joule heating at both ends of the first and second conductive carriers. The Joule heating generated by the second conductive carrier is also transferred to the first conductive carrier, thereby raising the temperature of the first conductive carrier to heat the aerosol to form the product.

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