A heat dissipation cold plate for a case

Abstract

This utility model discloses a heat dissipation plate for computer chassis, relating to the technical field of heat dissipation plates for computer chassis. It includes a motherboard and an external circulating cooling mechanism. The external circulating cooling mechanism is fixedly connected inside the motherboard, and includes a spiral cooling pipe fixedly connected inside the motherboard. The inner wall of the spiral cooling pipe is fixedly coated with polytetrafluoroethylene (PTFE), and a leak-proof retaining ring is fixedly connected to the port of the spiral cooling pipe. A main sealing gasket is fixedly connected to the outer surface of the leak-proof retaining ring, and a pressure sealing ring is fixedly connected to the outer surface of the main sealing gasket. The spiral cooling pipe is made of copper and is distributed in a serpentine pattern inside the motherboard, with its inner wall coated with PTFE. Compared with existing ordinary heat dissipation plates, this heat dissipation plate for computer chassis improves heat dissipation efficiency, reduces maintenance cycles, ensures operation in extreme environments, improves equipment stability and lifespan, and enhances structural stability, deformation resistance, and compressive strength, ensuring heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chassis heat dissipation cold plate technology, specifically a heat dissipation cold plate for chassis. Background Technology

[0002] A chassis heatsink is an important heat dissipation component in a chassis cooling system. It is mainly used to help heat-generating hardware (such as CPU and GPU) inside the chassis to dissipate heat efficiently and maintain the hardware at a suitable operating temperature. Its advantages are obvious. It can provide more efficient heat dissipation capacity than traditional air coolers, especially when dealing with the heat dissipation of high-power hardware. It can effectively reduce hardware temperature, extend hardware life, and ensure stable system operation. However, chassis heatsinks also have certain limitations.

[0003] A liquid cooling plate mounting structure for chassis heat dissipation, as described in application number CN202320612244.X, includes an inlet pipe with two inlet ends; an outlet pipe with two outlet ends; and two liquid cooling plates arranged parallel and spaced apart, forming a cooling space between them for placing electronic components to be cooled. Each liquid cooling plate has a cooling channel, and each cooling channel has an inlet port communicating with the inlet end and an outlet port communicating with the outlet end. This utility model provides a liquid cooling plate mounting structure for chassis heat dissipation, featuring an inlet pipe with two inlet ends and an outlet pipe with two outlet ends, allowing simultaneous connection of two liquid cooling plates. The two parallel and spaced-apart liquid cooling plates have cooling channels symmetrically arranged along the axis of rotation, enabling uniform cooling of the electronic equipment from both sides, improving the service life of the electronic equipment, providing good cooling effect, and offering good practicality. However, the heat dissipation of the cold plate chassis is insufficient, the pipes are prone to scaling and leakage, it is difficult to adapt to extreme environments, and the cold plate is prone to deformation under load, has weak impact and vibration resistance, and affects heat dissipation.

[0004] Therefore, in view of this, we have studied and improved the existing structure to address its shortcomings and proposed a heat dissipation plate for the chassis. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation plate for a computer chassis to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation plate for a chassis, comprising a motherboard and an external circulating cooling mechanism. The external circulating cooling mechanism is fixedly connected inside the motherboard, and the external circulating cooling mechanism includes a spiral cooling pipe fixedly connected inside the motherboard. The inner wall of the spiral cooling pipe is fixedly coated with polytetrafluoroethylene, and a leak-proof retaining ring is fixedly connected to the port of the spiral cooling pipe. A main sealing gasket is fixedly connected to the outer surface of the leak-proof retaining ring, and a compression sealing ring is fixedly connected to the outer surface of the main sealing gasket.

[0007] Preferably, a top plate is provided on one side of the motherboard, and a pressure-resistant mechanism is provided inside the top plate.

[0008] Preferably, the reinforced compression-resistant mechanism includes a metal mesh frame fixedly connected to the inner surface of the top plate, and the outer surface of the metal mesh frame is fixedly connected with reinforcing ribs, and the outer surface of the reinforcing ribs is provided with support columns.

[0009] Preferably, a base plate is provided on one side of the motherboard, and a magnetic positioning layer is fixedly connected to one side of both the base plate and the top plate.

[0010] Preferably, a double-layer mounting block is provided on one side of the base plate, and a single-layer mounting block is provided on one side of the top plate.

[0011] Preferably, the inner surface of the motherboard has a mounting hole, and a rubber pad is fixedly connected to the inner wall of the mounting hole.

[0012] Preferably, the outer surface of the motherboard is threaded with washer bolts, and a groove is provided on one side of both the bottom plate and the top plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. This utility model provides continuous and stable cooling for the internal equipment of the chassis through the setting of an external circulation cooling mechanism. The spiral cooling pipe made of copper can quickly absorb the heat conducted by the motherboard. When the external coolant flows in the pipe, the serpentine structure extends the heat exchange path, thereby improving the heat dissipation efficiency. The polytetrafluoroethylene coating on the inner wall of the pipe not only reduces the flow resistance of the coolant, but also prevents the adhesion of scale and impurities, so that the flow rate attenuation rate after long-term use of the pipe is controlled within a suitable range, reducing the maintenance frequency. In terms of sealing performance, the three-level sealing design at both ends of the cooling pipe forms multiple protections. The three-level sealing works together to control the leakage rate. While being compatible with various coolants, it can resist the risk of sealing failure caused by internal vibration and temperature fluctuations of the chassis. The overall design of this mechanism enables the heat dissipation plate to work stably in extreme environments. The continuous circulation of coolant keeps the internal temperature of the chassis within a normal range, significantly improving the operational stability and service life of the equipment.

[0015] 2. This utility model ensures the structural stability of the cold plate under complex working conditions by strengthening the anti-compression mechanism. The low-carbon steel metal mesh skeleton can evenly distribute the pressure on the top plate to the entire plane, avoiding indentation caused by local stress concentration. The reinforcing ribs welded at the cross-sections of the skeleton and the mesh skeleton form a composite support system of "mesh + rib". When the cold plate is subjected to vertical load, the reinforcing ribs can transmit the impact force along the axial direction, which improves the deformation resistance of the top plate. The support column can directly bear the stacking pressure of the top of the chassis. In conjunction with the mesh skeleton and reinforcing ribs, the overall compressive strength of the cold plate is improved, which can withstand the bumps and impacts during transportation and the vibration loads during long-term use. The synergistic effect of this mechanism not only enhances the structural rigidity of the top plate, but also reduces the impact of external vibration on the motherboard and cooling system, ensuring that the heat dissipation efficiency is not affected by structural deformation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the novel structure of the external circulation cooling mechanism 2 in this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the reinforced compression-resistant mechanism 4 of this utility model;

[0019] Figure 4 This is a schematic diagram of the overall partial structure of this utility model.

[0020] In the diagram: 1. Main board; 2. External circulation cooling mechanism; 201. Spiral cooling pipe; 202. PTFE coating; 203. Leak-proof retaining ring; 204. Main sealing gasket; 205. Press-fit sealing ring; 3. Top plate; 4. Reinforced pressure-resistant mechanism; 401. Metal mesh skeleton; 402. Reinforcing rib; 403. Support column; 5. Base plate; 6. Magnetic positioning layer; 7. Double-layer mounting block; 8. Single-layer mounting block; 9. Mounting hole; 10. Rubber gasket; 11. Gasket bolt; 12. Groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1-2As shown, a heat dissipation plate for a computer chassis includes a motherboard 1 and an external circulating cooling mechanism 2. The external circulating cooling mechanism 2 is fixedly connected inside the motherboard 1, and the external circulating cooling mechanism 2 includes a spiral cooling pipe 201 fixedly connected inside the motherboard 1. The inner wall of the spiral cooling pipe 201 is fixedly connected with a polytetrafluoroethylene coating 202, and a leak-proof retaining ring 203 is fixedly connected to the port of the spiral cooling pipe 201. A main sealing gasket 204 is fixedly connected to the outer surface of the leak-proof retaining ring 203, and the outer surface of the main sealing gasket 204... The surface is fixedly connected with a pressure sealing ring 205. The spiral cooling pipe 201 is made of copper and is distributed in a serpentine shape inside the motherboard 1. Its inner wall is covered with a polytetrafluoroethylene coating 202, which is resistant to coolant corrosion and has a low coefficient of friction. It has extremely low surface tension, is non-stick, and scale is difficult to adhere to. External coolant can be delivered to both ends. The two ends are embedded with nitrile rubber anti-leakage rings 203. The outer ring main sealing gasket 204 is made of silicone and is sequentially attached to the pressure sealing ring 205 to achieve a three-level seal with a low leakage rate and is compatible with a variety of coolants.

[0023] like Figure 3 As shown, a heat dissipation plate for a chassis is provided with a top plate 3 on one side of the motherboard 1, and a reinforced pressure-resistant mechanism 4 is provided inside the top plate 3. The reinforced pressure-resistant mechanism 4 includes a metal mesh skeleton 401 fixedly connected to the inner surface of the top plate 3, and reinforcing ribs 402 fixedly connected to the outer surface of the metal mesh skeleton 401. Support columns 403 are provided on the outer surface of the reinforcing ribs 402. The metal mesh skeleton 401 is made of low carbon steel and is distributed in a honeycomb pattern on the inner surface of the top plate 3. Reinforcing ribs 402 are provided at its crisscrossing points, and support columns 403 are vertically welded to the outer surface of the metal mesh skeleton 401. This improves the compressive strength of the top plate 3, increases its resistance to deformation, and enables it to withstand large gravity loads and impact vibrations.

[0024] Furthermore, a base plate 5 is provided on one side of the main board 1, and magnetic positioning layers 6 are fixedly connected to one side of both the base plate 5 and the top plate 3. A double-layer mounting block 7 is provided on one side of the base plate 5, and a single-layer mounting block 8 is provided on one side of the top plate 3. The front and rear sides of the main board 1 correspond to the base plate 5 and the top plate 3 respectively. Magnetic positioning layers 6 are embedded in the outer walls of both sides of the three. A double-layer mounting block 7 protrudes from one side of the base plate 5, and a single-layer mounting block 8 is recessed on the corresponding side of the top plate 3. The two are connected by a tenon and mortise structure and cooperate with the magnetic positioning layer 6 to assist in pre-alignment, thereby improving the efficiency of disassembly and assembly.

[0025] Furthermore, the inner surface of the motherboard 1 is provided with mounting holes 9, and the inner wall of the mounting holes 9 is fixedly connected with rubber pads 10. The outer surface of the motherboard 1 is threaded with washer bolts 11, and the bottom plate 5 and the top plate 3 are both provided with grooves 12 on one side. The inner surface of the motherboard 1 is provided with mounting holes 9 along the edge, and the inner wall of the holes is adhered with rubber pads 10 to prevent the washer bolts 11 from loosening. The washer bolts 11 on the outer surface of the motherboard 1 pass through the mounting holes 9 and engage with the threaded holes provided in the double-layer mounting block 7 and the single-layer mounting block 8. The grooves 12 on one side of the bottom plate 5 and the top plate 3 are arc-shaped structures with radii that are adapted to the spiral cooling pipe 201. The grooves 12 ensure that the spiral cooling pipe 201 fits firmly.

[0026] Working principle: When using the heat dissipation plate of this chassis, firstly, the spiral cooling pipe 201 of the external circulating cooling mechanism 2 is installed in the preset position of the motherboard 1. After the external coolant is connected, the polytetrafluoroethylene coating 202 on the inner wall of the spiral cooling pipe 201 reduces scale adhesion. The anti-leakage ring 203, the main sealing gasket 204 and the pressure sealing ring 205 seal the interface in sequence to prevent coolant leakage. At the same time, in the reinforcing and anti-compression mechanism 4 in the top plate 3, the metal mesh skeleton 401, the reinforcing ribs 402 and the support column 403 combine to enhance the structural strength, preparing for subsequent assembly. Then, through the magnetic positioning layers 6 on both sides of the motherboard 1, the bottom plate 5 and the top plate 3 are respectively attached to the front and rear sides of the motherboard 1, so that the double-layer mounting block 7 and the single-layer mounting block 7 are attached to the motherboard 1. Block 8 is precisely aligned and engaged. Next, the gasket bolt 11 is passed through the mounting hole 9 of the motherboard 1. The rubber gasket 10 inside the mounting hole 9 reduces the loosening of the gasket bolt 11. The gasket bolt 11 passes through the threaded hole inside the double-layer mounting block 7 and the single-layer mounting block 8 to complete the initial fixation. The groove 12 is adapted to the shape of the spiral cooling pipe 201 to ensure that the spiral cooling pipe 201 is stably fitted. Finally, the external circulation system is started, and the coolant flows in the spiral cooling pipe 201. It removes heat through heat exchange with the motherboard 1, strengthens the pressure-resistant mechanism 4 to resist the internal pressure of the chassis, and ensures that all sealing components continue to prevent leakage. After the heat dissipation work is completed, the gasket bolt 11 can be loosened to disassemble each component for maintenance. This is the working principle of the heat dissipation plate of this chassis.

Claims

1. A heat dissipation plate for a computer chassis, comprising a motherboard (1) and an external circulating cooling mechanism (2), characterized in that, An external circulating cooling mechanism (2) is fixedly connected inside the motherboard (1), and the external circulating cooling mechanism (2) includes a spiral cooling pipe (201) fixedly connected inside the motherboard (1). The inner wall of the spiral cooling pipe (201) is fixedly connected with a polytetrafluoroethylene coating (202), and a leak-proof ring (203) is fixedly connected at the port of the spiral cooling pipe (201). A main sealing gasket (204) is fixedly connected to the outer surface of the leak-proof ring (203), and a compression sealing ring (205) is fixedly connected to the outer surface of the main sealing gasket (204).

2. The heat dissipation plate for a chassis according to claim 1, characterized in that, The main board (1) has a top plate (3) on one side, and the top plate (3) has a reinforced pressure-resistant mechanism (4) inside.

3. A heat dissipation plate for a chassis according to claim 2, characterized in that, The reinforced compression-resistant mechanism (4) includes a metal mesh frame (401) fixedly connected to the inner surface of the top plate (3), and a reinforcing rib (402) is fixedly connected to the outer surface of the metal mesh frame (401), and a support column (403) is provided on the outer surface of the reinforcing rib (402).

4. A heat dissipation plate for a chassis according to claim 1, characterized in that, A base plate (5) is provided on one side of the main board (1), and a magnetic positioning layer (6) is fixedly connected to one side of both the base plate (5) and the top plate (3).

5. A heat dissipation plate for a chassis according to claim 4, characterized in that, A double-layer mounting block (7) is provided on one side of the base plate (5), and a single-layer mounting block (8) is provided on one side of the top plate (3).

6. A heat dissipation plate for a chassis according to claim 1, characterized in that, The motherboard (1) has an installation hole (9) on its inner surface, and a rubber pad (10) is fixedly connected to the inner wall of the installation hole (9).

7. A heat dissipation plate for a chassis according to claim 1, characterized in that, The outer surface of the main board (1) is threaded with a washer bolt (11), and a groove (12) is provided on one side of both the bottom plate (5) and the top plate (3).

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