Partitioned semiconductor heating refrigeration seat

Abstract

The utility model provides a partition type semiconductor heating refrigeration seat, include: seat framework subassembly and heat -generating refrigeration subassembly no.

Description

Technical Field

[0001] This utility model belongs to the field of seating equipment, and specifically relates to a partitioned semiconductor heating and cooling seat. Background Technology

[0002] A chair is a piece of furniture or equipment that supports the human body in a sitting posture. Its main function is to provide users with comfortable sitting and back support, reduce body pressure, and facilitate activities such as working, resting, and sitting. Currently, chairs often face the problem of uneven temperature regulation. Different parts of the body, such as the buttocks, waist, and back, have different temperature requirements, and existing temperature control methods mostly use overall heating or single ventilation designs, making it difficult to achieve targeted adjustments. In winter, heating systems relying on resistance wires are prone to uneven heat distribution, with some areas heating up too quickly while other areas remain insufficiently warm. This is because traditional heating elements have a fixed layout and cannot adapt to the different heat requirements of different parts of the body. In summer, ventilation systems often rely on unidirectional fan airflow, which is difficult to evenly cover the contact area, easily leading to localized stuffiness, especially after prolonged sitting. Conventional solutions include adding seat cushions in winter to enhance local warmth, but this can hinder heat conduction and affect breathability. Ventilated seat cushions used in summer may generate significant noise due to excessive fan speed, and unreasonable airflow design can limit the cooling effect to a localized area. In addition, the continuous operation of traditional heating systems can lead to energy waste, and ventilation fans may experience airflow reduction or malfunction after long-term use. These methods fail to fundamentally address the differentiated temperature needs of different parts of the body, making it difficult to achieve an efficient and human-centered temperature control experience. Therefore, a new structure is needed to solve the above-mentioned technical problems. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a partitioned semiconductor heating and cooling seat to solve the problems mentioned in the background art.

[0004] This utility model is achieved through the following technical solution: a partitioned semiconductor heating and cooling seat, comprising: a seat frame assembly and a heating and cooling assembly 1. A set of heating and cooling assembly 1 and two sets of heating and cooling assembly 2 are respectively installed on the upper surface and the front surface of the seat frame assembly. The heating and cooling assembly 1 and the heating and cooling assembly 2 have different specifications. The seat frame assembly includes a seat plate, a backrest plate, a baffle, a headrest plate 1 and a headrest plate 2. The backrest plate is integrally formed on the rear surface of the seat plate. The heating and cooling assembly 1 and the heating and cooling assembly 2 are respectively installed on the front surface of the backrest plate and the upper surface of the seat plate.

[0005] In a preferred embodiment, the heating and cooling assembly includes a conductive plate and a semiconductor. The semiconductor is mounted on the upper surface of the seat plate via a mounting plate, the conductive plate is mounted on the upper surface of the semiconductor, and the upper surface of the conductive plate is provided with aerogel insulation cotton.

[0006] In a preferred embodiment, a backrest is integrally formed on the rear edge of the upper surface of the seat panel, and a baffle is installed on the front surface of the backrest and the left and right edges of the upper surface of the seat panel, respectively. An arc-shaped headrest is integrally formed on the side surface of the backrest away from the seat panel.

[0007] In a preferred embodiment, a connecting plate is installed on the left and right surfaces of the headrest plate one, and an arc-shaped headrest plate two is installed on the side of the connecting plate away from the headrest plate one.

[0008] In a preferred embodiment, the outer surface of the seat frame assembly is covered with seat leather and seat foam by the seat panel, backrest panel, baffle, headrest panel one, and headrest panel two. The heating and cooling components one and two are installed inside the seat equipment through the seat frame assembly. In use, by installing the heating and cooling components on the seat panel and backrest panel respectively, the different temperature needs of the buttocks, legs, back, and waist can be specifically met. In summer, the buttocks and back, which are prone to heat accumulation, can be cooled quickly, and in winter, the waist and legs, which need to be kept warm, can be heated precisely.

[0009] In a preferred embodiment, the second heating and cooling component includes a second conductive plate, a second semiconductor, and aerogel insulation cotton. The second semiconductor is mounted on the front surface of the backrest through a mounting plate of the heat insulation structure, and the aerogel insulation cotton is mounted on the front surface of the second semiconductor. A control board for controlling the first and second heating and cooling components is mounted on the right side surface of the right-side baffle. In use, by setting one set of the first heating and cooling component on the upper side (seat panel) of the seat frame and two sets of the second heating and cooling component on the front side (backrest), the temperature requirements of different parts of the human body, such as the buttocks and back, can be accurately matched, and energy consumption can be reduced by independently starting and stopping the components in different zones.

[0010] After adopting the above technical solution, the beneficial effects of this utility model are as follows: 1. By setting up a seat assembly, the seat frame assembly includes a seat board, a backrest board, a baffle, a headrest board one, and a headrest board two. The backrest board is integrally formed on the rear surface of the seat board. The heating and cooling assembly one and the heating and cooling assembly two are respectively installed on the front surface of the backrest board and the upper surface of the seat board. In use, by installing the heating and cooling assemblies on the seat board and the backrest board respectively, the different temperature needs of the buttocks, legs, back, and waist can be specifically met. In summer, the buttocks and back, which are prone to heat accumulation, can be quickly cooled. In winter, the waist and legs, which need to be kept warm, can be accurately heated. Moreover, the rapid switching between cooling and heating is achieved by using semiconductor current direction control. This avoids the problem of local overcooling or overheating caused by overall temperature control, and reduces energy consumption through independent zone adjustment, allowing users to obtain a comfortable experience that fits their body needs in different seasons and different sitting postures.

[0011] 2. By setting up heating and cooling component one and heating and cooling component two, one set of heating and cooling component one and two sets of heating and cooling component two are respectively installed on the upper surface of the seat frame assembly and the front surface of the seat frame assembly. In use, by setting one set of heating and cooling component one on the upper side (seat panel) of the seat frame and two sets of heating and cooling component two on the front side (backrest panel), the temperature needs of different parts of the human body's buttocks and back can be accurately matched. By independently starting and stopping the zones, energy consumption is reduced, allowing users to obtain a comfortable temperature control experience that fits different parts of the body in various scenarios. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of a partitioned semiconductor heating and cooling seat according to the present invention.

[0014] Figure 2 This is a schematic diagram of the side structure of the seat assembly of a partitioned semiconductor heating and cooling seat according to the present invention.

[0015] Figure 3 This is a schematic diagram of the second heating and cooling component of a partitioned semiconductor heating and cooling seat according to the present invention.

[0016] In the diagram, 100 is the seat panel, 110 is the backrest panel, 120 is the connecting plate, 130 is the second headrest panel, and 140 is the first headrest panel.

[0017] 200 - Baffle, 210 - Semiconductor 1, 220 - Control Board;

[0018] 300 - Mounting plate, 310 - Semiconductor II, 320 - Aerogel insulation cotton. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1 to 3 As the first embodiment of this utility model: a partitioned semiconductor heating and cooling seat, including: a seat frame assembly and a heating and cooling assembly one, a set of heating and cooling assembly one and a set of heating and cooling assembly two are respectively installed on the upper surface and the front surface of the seat frame assembly, the heating and cooling assembly one and the heating and cooling assembly two have different specifications, the seat frame assembly includes a seat plate 100, a backrest plate 110, a baffle 200, a headrest plate one 140 and a headrest plate two 130, the backrest plate 110 is integrally formed on the rear surface of the seat plate 100, the heating and cooling assembly one and the heating and cooling assembly two are respectively installed on the front surface of the backrest plate 110 and the upper surface of the seat plate 100;

[0021] The heating and cooling assembly includes a conductive plate and a semiconductor 210. The semiconductor 210 is mounted on the upper surface of the seat plate 100 via a mounting plate 300. The conductive plate is mounted on the upper surface of the semiconductor 210. The upper surface of the conductive plate is provided with aerogel insulation cotton 320.

[0022] A backrest 110 is integrally formed on the rear edge of the upper surface of the seat panel 100. A baffle 200 is installed on the front surface of the backrest 110 and the left and right edges of the upper surface of the seat panel 100. An arc-shaped headrest 140 is integrally formed on the side surface of the backrest 110 away from the seat panel 100.

[0023] A connecting plate 120 is installed on the left and right surfaces of the headrest plate 140, and an arc-shaped headrest plate 130 is installed on the side of the connecting plate 120 away from the headrest plate 140.

[0024] In use, the user first installs one set of heating and cooling components on the upper surface of the seat panel 100, and then installs two sets of heating and cooling components on the front surface of the backrest panel 110. After installing the heating and cooling components, the user can then wrap the outer surface of the seat assembly with a sponge pad and seat leather to form a seat device. When in use, by installing the heating and cooling components on the seat panel 100 and backrest panel 110 respectively, the seat device can specifically meet the different temperature needs of the buttocks, legs, back, and waist. In summer, it can quickly cool the buttocks and back, which are prone to heat accumulation, and in winter, it can accurately heat the waist and legs, which need to be kept warm. Furthermore, by using semiconductor current direction control, it can achieve rapid switching between cooling and heating, which avoids the problem of local overcooling or overheating caused by overall temperature control, and can reduce energy consumption through independent zone adjustment, allowing users to obtain a comfortable experience that fits their body needs in different seasons and sitting postures.

[0025] Please see Figures 1 to 3 As a second embodiment of the present invention: based on the description in the above embodiments, further, the outer surface of the seat frame assembly is covered with seat leather and seat sponge by the seat plate 100, backrest plate 110, baffle 200, headrest plate 140 and headrest plate 230, and the heating and cooling components 1 and 2 are set inside the seat equipment through the seat frame assembly.

[0026] The second heating and cooling assembly includes a second conductive plate, a second semiconductor 310, and an aerogel insulation cotton 320. The second semiconductor 310 is mounted on the front surface of the back panel 110 through the mounting plate 300 of the heat insulation structure. The aerogel insulation cotton 320 is mounted on the front surface of the second semiconductor 310. The right side surface of the right side baffle 200 is equipped with a control plate 220 for controlling the first heating and cooling assembly and the second heating and cooling assembly.

[0027] When using the seat, the following description is based on cooling, and the principle of heating is the same. When the seat needs to be cooled, the user can activate the control panel 220 on the outer surface of the baffle 200. This activates the second heating / cooling component on the front surface of the backrest 110 and the first heating / cooling component on the upper surface of the seat panel 100. The user can activate either the first or second heating / cooling component as needed. After activation, the semiconductor 210 and the second semiconductor 310 on the upper surface of the mounting plate 300 will work. (The semiconductor can switch between cooling and heating bidirectionally by controlling the direction of the current. This characteristic is based on the Peltier effect and is a characteristic of semiconductors.) The core principle of the temperature control technology (the specific connection principle, working principle and specific structure are existing technologies and will not be elaborated here) is to use semiconductor 1 210 and semiconductor 2 310 for cooling and heating, and then control the constant temperature through the control board 220. Thus, the seat assembly is heated and cooled in a zoned semiconductor manner through heating and cooling components 1 and 2. During use, by setting one set of heating and cooling component 1 on the upper side of the seat frame (seat panel 100) and two sets of heating and cooling component 2 on the front side (backrest panel 110), the temperature needs of different parts of the human body, buttocks and back, can be accurately matched. By independently starting and stopping the zones, energy consumption is reduced, allowing users to obtain a comfortable temperature control experience that fits different parts of the body in various scenarios.

[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A zoned semiconductor heating and cooling seat, comprising: A seat frame assembly and a heating and cooling assembly, characterized in that a set of heating and cooling assembly one and two sets of heating and cooling assembly two are respectively installed on the upper surface and the front surface of the seat frame assembly. The heating and cooling assembly one and the heating and cooling assembly two have different specifications. The seat frame assembly includes a seat plate (100), a backrest plate (110), a baffle (200), a headrest plate one (140) and a headrest plate two (130). The backrest plate (110) is integrally formed on the rear surface of the seat plate (100). The heating and cooling assembly one and the heating and cooling assembly two are respectively installed on the front surface of the backrest plate (110) and the upper surface of the seat plate (100).

2. The partitioned semiconductor heating and cooling seat as described in claim 1, characterized in that: The heating and cooling assembly includes a conductive plate and a semiconductor (210). The semiconductor (210) is mounted on the upper surface of the seat plate (100) via a mounting plate (300). The conductive plate is mounted on the upper surface of the semiconductor (210). The upper surface of the conductive plate is provided with aerogel insulation cotton (320).

3. A partitioned semiconductor heating and cooling seat as described in claim 2, characterized in that: A backrest (110) is integrally formed on the rear edge of the upper surface of the seat plate (100). A baffle (200) is installed on the front surface of the backrest (110) and the left and right edges of the upper surface of the seat plate (100). An arc-shaped headrest (140) is integrally formed on the side surface of the backrest (110) away from the seat plate (100).

4. A partitioned semiconductor heating and cooling seat as described in claim 3, characterized in that: A connecting plate (120) is installed on the left and right surfaces of the headrest plate one (140), and an arc-shaped headrest plate two (130) is installed on the side of the connecting plate (120) away from the headrest plate one (140).

5. A partitioned semiconductor heating and cooling seat as described in claim 4, characterized in that: The outer surface of the seat frame assembly is covered with seat leather and seat sponge by the seat panel (100), backrest panel (110), baffle (200), headrest panel one (140) and headrest panel two (130), and the heating and cooling components one and two are installed inside the seat equipment through the seat frame assembly.

6. A partitioned semiconductor heating and cooling seat as described in claim 5, characterized in that: The second heating and cooling component includes a second conductive plate, a second semiconductor (310), and an aerogel insulation cotton (320). The second semiconductor (310) is mounted on the front surface of the backrest (110) through a mounting plate (300) of the heat insulation structure. The aerogel insulation cotton (320) is mounted on the front surface of the second semiconductor (310). A control plate (220) for controlling the first heating and cooling component and the second heating and cooling component is mounted on the right side surface of the baffle (200).

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