Ultrasonic transducer device

By introducing a cooling device into the ultrasonic transducer and supplying cooling gas to the heat exchange chamber, the problem of excessively high temperature caused by heat accumulation in the transducer was solved, achieving efficient cooling and stable output, and improving the treatment effect.

CN224484737UActive Publication Date: 2026-07-14RONGHAI SUPERSONIC MEDICINE EN

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
RONGHAI SUPERSONIC MEDICINE EN
Filing Date
2025-07-31
Publication Date
2026-07-14

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Abstract

The utility model provides a kind of ultrasonic transducer equipment, it includes transducer main body and cooling device;Transducer main body is used to generate and emit ultrasonic wave;Transducer main body inside has heat exchange cavity, and heat exchange cavity has air inlet and air outlet;Cooling device has cooling channel, and cooling channel is communicated with the air inlet of heat exchange cavity, to send cooling gas to heat exchange cavity;Cooling device includes gas pump and gas processing unit being arranged in cooling channel;Gas processing unit is used to cool gas in cooling channel, and gas pump is used to drive cooling gas to flow to heat exchange cavity.
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Description

Technical Field

[0001] This utility model belongs to the field of ultrasonic equipment technology, and specifically relates to an ultrasonic transducer device. Background Technology

[0002] High-intensity focused ultrasound (HIFU) technology uses ultrasound energy to precisely focus on target areas within human tissue, achieving therapeutic goals through thermal effects, such as tumor ablation or selective drug activation. This technology uses continuous, rather than pulsed, energy output to raise the target tissue to 60–80°C, thus achieving therapeutic effects without damaging surrounding healthy tissue. However, existing ultrasound transducers, when continuously outputting high power, experience rapid heat buildup in the emitting elements (such as piezoelectric ceramics), leading to unstable and unsustainable output, severely impacting treatment effectiveness and even interrupting treatment.

[0003] Currently, some related technical solutions propose using water-cooling devices to cool ultrasonic transducers. Specifically, the water-cooling device is used to flow cooling water behind the transmitting element in the ultrasonic transducer, so as to absorb the heat generated by the transmitting element during transmission. However, the cooling water also absorbs the ultrasonic waves generated by the transmitting element, thereby weakening the transmitting element's transmission capability. Moreover, the cooling water is prone to leakage, which can lead to short circuits when leaked. Utility Model Content

[0004] This invention provides an ultrasonic transducer device designed to prevent the ultrasonic transducer from overheating under high-power continuous output conditions, while also avoiding weakening the emission capability of the transmitting element.

[0005] To achieve the above technical objectives, this utility model provides an ultrasonic transducer device, which includes:

[0006] A transducer body for generating and emitting ultrasonic waves; the transducer body has a heat exchange cavity inside, and the heat exchange cavity has an air inlet and an air outlet.

[0007] A cooling device has a cooling channel that is connected to the air inlet of the heat exchange chamber for supplying cooling gas to the heat exchange chamber; the cooling device includes an air pump and a gas processing unit disposed in the cooling channel; the gas processing unit is used to cool the gas in the cooling channel, and the air pump is used to drive the cooling gas to flow to the heat exchange chamber.

[0008] Optionally, the cooling device further includes a gas storage device for storing gas;

[0009] The gas processing unit has an inlet end and an outlet end for cooling the gas flowing through it; the inlet end of the gas processing unit is connected to the heat exchange chamber, and the outlet end is connected to the gas storage device; the gas storage device is also connected to the inlet of the heat exchange chamber.

[0010] Alternatively, the gas storage unit is connected to the outlet of the heat exchange chamber, the inlet of the gas processing unit is connected to the gas storage unit, and the outlet is connected to the heat exchange chamber.

[0011] Optionally, the gas inlet of the gas processing unit is connected to the atmospheric environment, and the gas outlet of the gas processing unit is connected to the heat exchange chamber.

[0012] The heat exchange chamber's outlet is connected to the atmospheric environment.

[0013] Optionally, the heat exchange chamber is spherical; the air outlet of the heat exchange chamber is located at the top of the spherical crown.

[0014] The air inlet of the heat exchange chamber is located in the edge region of the spherical cap of the heat exchange chamber.

[0015] Optionally, the heat exchange chamber may have multiple air inlets, and the multiple air inlets of the heat exchange chamber may be evenly distributed around the central axis of the spherical crown of the heat exchange chamber.

[0016] Optionally, the ultrasonic transducer device also includes:

[0017] An annular flow channel is disposed in the edge region of the spherical cap of the heat exchange cavity; the annular flow channel is disposed around the central axis of the spherical cap of the heat exchange cavity;

[0018] The air inlet of the heat exchange cavity is connected to the annular uniform flow channel; the surface of the annular uniform flow channel is provided with a plurality of uniform flow outlets, and the plurality of uniform flow outlets are connected to the interior of the heat exchange cavity.

[0019] Optionally, the transducer body includes multiple emitting elements and a backplate structure; the multiple emitting elements are arranged in an array; each emitting element has a sub-emitting surface for emitting ultrasonic waves, and each sub-emitting surface is located on one side of the transducer;

[0020] The backplate structure is located on the side of the plurality of emitting elements that is away from the sub-emitting surface, and is spaced apart from the plurality of emitting elements; the backplate structure and the plurality of emitting elements together form the heat exchange cavity.

[0021] Optionally, the ultrasonic transducer device also includes:

[0022] A support frame is disposed in the heat exchange cavity; the support frame is connected to the back plate structure and to the side of the plurality of emitting elements opposite to the sub-emitting surface;

[0023] The support frame includes a support frame body and a plurality of first air guide holes, and the plurality of first air guide holes are arranged one-to-one with the plurality of the emission elements so that the surface of the emission element is partially exposed in the heat exchange cavity;

[0024] The support frame body has multiple second air guide holes, one end of each second air guide hole is connected to the heat exchange cavity, and the other end extends to the surface of the corresponding emission unit.

[0025] Optionally, the cooling device further includes at least one temperature detection unit disposed inside the heat exchange chamber for detecting the ambient temperature inside the heat exchange chamber;

[0026] The control unit is communicatively connected to the air pump and the temperature detection unit, respectively, and is used to control the air pump to adjust the air flow rate of the heat exchange chamber according to the temperature value detected by the temperature detection unit.

[0027] The gas processing unit includes a gas cooling module for cooling the gas;

[0028] The control unit is also communicatively connected to the gas cooling module and is used to adjust the output power of the gas cooling module according to the temperature value detected by the temperature detection unit.

[0029] Optionally, the cooling device further includes at least one humidity detection unit disposed inside the heat exchange chamber for detecting the ambient humidity inside the heat exchange chamber;

[0030] The gas processing unit also includes a gas drying module for drying the gas;

[0031] The control unit is also connected in communication with the gas drying module to adjust the adsorption capacity of the gas drying module according to the temperature value detected by the temperature detection unit.

[0032] This utility model has the following beneficial effects:

[0033] The ultrasonic transducer device provided in this embodiment of the invention, by setting a heat exchange cavity inside the transducer body and setting a cooling device, can use the cooling channel in the cooling device to deliver cooling gas to the heat exchange cavity, thereby using the cooling gas to exchange heat with the transducer body and achieving the effect of cooling the transducer body. The cooling device includes an air pump and a gas processing unit set in the cooling channel. The gas processing unit is used to cool the gas in the cooling channel, and the air pump is used to drive the cooling gas to flow to the heat exchange cavity, thereby delivering cooling gas with a low temperature and a large flow rate to the heat exchange cavity, thus achieving a high cooling efficiency for the transducer body. Attached Figure Description

[0034] Figure 1 A simplified structural diagram of an ultrasonic transducer device provided in an embodiment of this utility model;

[0035] Figure 2 Another simplified structural diagram of the ultrasonic transducer device provided in this embodiment of the present invention;

[0036] Figure 3 Another simplified structural diagram of the ultrasonic transducer device provided in this embodiment of the present invention;

[0037] Figure 4 Another simplified structural diagram of the ultrasonic transducer device provided in this embodiment of the present invention;

[0038] Figure 5 A simplified structural diagram of the transducer body provided in an embodiment of this utility model;

[0039] Figure 6 A partial cross-sectional view of the top portion of the transducer body provided in an embodiment of this utility model;

[0040] Figure 7 A partial cross-sectional view of the bottom edge region of the transducer body provided in an embodiment of this utility model;

[0041] Figure 8 This is a partially enlarged view of the support frame provided in an embodiment of the present utility model. Detailed Implementation

[0042] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0043] It is understood that the specific embodiments and accompanying drawings described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0044] It is understood that, without conflict, the various embodiments of this utility model and the features thereof can be combined with each other.

[0045] It is understood that, for ease of description, the accompanying drawings of this utility model only show the parts related to the embodiments of this utility model, while the parts unrelated to the embodiments of this utility model are not shown in the drawings.

[0046] It is understood that, without conflict, the functions and steps marked in the flowcharts and block diagrams of the embodiments of this utility model may occur in a different order than that marked in the accompanying drawings.

[0047] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

[0048] Please refer to Figures 1 to 4 This embodiment provides an ultrasonic transducer device, which includes a transducer body 1 and a cooling device 2.

[0049] The transducer body 1 is used to generate and emit ultrasonic waves. The transducer body 1 has a heat exchange cavity 11 with an air inlet and an air outlet. The cooling device 2 has a cooling channel that communicates with the air inlet 12 of the heat exchange cavity 11 to supply cooling gas to the heat exchange cavity 11, thereby utilizing the cooling gas to exchange heat with the transducer body 1 and cooling the transducer body 1.

[0050] The cooling device 2 includes an air pump 21 and a gas processing unit 22. The cooling device 2 includes an air pump 21 and a gas processing unit 22 disposed in a cooling channel. The gas processing unit 22 is used to cool the gas in the cooling channel. The air pump 21 is used to drive the cooling gas to flow to the heat exchange chamber 11 to increase the flow rate of the cooling gas, thereby increasing the renewal rate of the cooling gas inside the heat exchange chamber 11. This allows the flowing cooling gas to continuously exchange heat with the transducer body 1, thereby quickly removing the heat generated by the transducer body 1 during the generation and emission of ultrasound. This effectively prevents heat accumulation in the transducer body 1, thus preventing the transducer body 1 from overheating and affecting the output efficiency. Especially when the transducer body 1 is outputting ultrasound at high power, it can ensure that the transducer body 1 continuously outputs ultrasound, thereby improving treatment efficiency and enhancing treatment effect.

[0051] Furthermore, compared to the water-cooling devices used in related technologies, this embodiment proposes to use a cooling device 2 to deliver cooling gas to the heat exchange chamber 11, which is safer and does not weaken the ultrasonic waves emitted by the ultrasonic transducer. At the same time, this embodiment also uses an air pump 21 to pump high-speed airflow into the heat exchange chamber 11 to ensure heat exchange efficiency, thereby ensuring the cooling effect on the transducer body 1.

[0052] For example, the cooling device 2 also includes multiple pipes, and the air pump 21 and the gas processing unit 22 are interconnected or connected to the heat exchange chamber 11 through the pipes to form the cooling channel described above.

[0053] For example, the cooling device 2 may also include pipe adapters such as elbows and tees, through which the pipes can be connected to the air inlet 12 and air outlet 13 of the heat exchange chamber 11.

[0054] In some embodiments, the cooling device 2 further includes a gas storage device 23 for storing gas. The gas processing unit 22 has an inlet and an outlet for cooling the gas flowing through it. Figure 1 As shown, the inlet of the gas processing unit 22 is connected to the heat exchange chamber 11, and the outlet is connected to the gas storage unit 23. The gas storage unit 23 is also connected to the inlet 12 of the heat exchange chamber 11. In this way, the connected heat exchange chamber 11, gas processing unit 22, gas storage unit 23, and multiple pipes connected therein can form a closed-loop circulating cooling channel. The gas can continuously circulate in this circulating cooling channel, thereby achieving a heat exchange effect. Specifically, driven by the air pump 21, the gas flows into the gas processing unit after completing heat exchange in the heat exchange chamber 11. The gas processing unit cools the heat-exchanged gas to form cooling gas. The cooling gas flows into the gas storage unit 23 to buffer the cooling airflow. The cooling gas flows out of the gas storage unit 23 back into the heat exchange chamber 11, thereby cooling the transducer body 1 again, completing one cooling cycle.

[0055] Alternatively, in other embodiments, such as Figure 2As shown, the gas storage unit 23 is connected to the outlet 13 of the heat exchange chamber 11, and the inlet of the gas processing unit 22 is connected to the gas storage unit 23, while the outlet is connected to the heat exchange chamber 11. Thus, the connected heat exchange chamber 11, gas storage unit 23, gas processing unit 22, and the multiple pipes connected therein can form a closed-loop circulating cooling channel. Gas can continuously circulate within this channel, achieving a heat exchange effect. Specifically, driven by the air pump 21, after heat exchange in the heat exchange chamber 11, the gas flows into the gas storage unit 23. The gas storage unit 23 buffers the heat-exchanged gas, and then the gas flows from the gas storage unit 23 into the gas processing unit 22 to cool the gas and form cooling gas. The cooling gas flows out of the gas processing unit 22 back into the heat exchange chamber 11, thereby cooling the transducer body 1 again, completing one cooling cycle.

[0056] The cooling device 2 proposed in this embodiment can realize the circulation of gas in the circulating cooling channel without exchanging media with the outside, thereby avoiding the introduction of pollutants into the circulating cooling channel. As a result, the cooling device 2 has very low requirements for the external environment and can be applied to a wide range of application scenarios.

[0057] It should be noted that, as Figures 1 to 3 As shown, since the air pump 21 is used to drive the gas flow inside the cooling channel, the air pump 21 can be set at any position in the cooling channel, such as between the gas storage 23 and the gas processing unit 22, between the heat exchange chamber 11 and the gas storage 23, or between the heat exchange chamber 11 and the gas processing unit 22.

[0058] For example, the gas processing unit 22 may include a cooling pipe and a liquid cooling pipe surrounding the outer periphery of the cooling pipe, so as to cool the gas inside the cooling pipe by means of the liquid cooling pipe to form a cooling gas.

[0059] For example, the cooling gas can be air, nitrogen, or an inert gas.

[0060] Alternatively, in other embodiments, such as Figure 4 As shown, the inlet of the gas processing unit 22 is connected to the atmospheric environment, and the outlet of the gas processing unit 22 is connected to the heat exchange chamber 11, so that the air is cooled by the gas processing unit 22 before being delivered to the heat exchange chamber 11, that is, the air is used as the cooling gas. The outlet 13 of the heat exchange chamber 11 is connected to the atmospheric environment, so that the cooling gas that has completed heat exchange inside the heat exchange chamber 11 is directly discharged to the atmospheric environment.

[0061] It should be noted that if air is used as the cooling gas, the air in the atmospheric environment where the ultrasonic transducer is used should be as clean and dry as possible to avoid blockage of the cooling channel and to avoid short circuits caused by excessive humidity of the cooling gas.

[0062] In some embodiments, such as Figure 5 As shown, the transducer body 1 includes multiple emitting elements and a backplate structure 14. The multiple emitting elements are arranged in an array; each emitting element has a sub-emitting surface for emitting ultrasonic waves, and each sub-emitting surface is located on one side of the transducer to collectively form the ultrasonic emitting surface of the transducer body 1. The backplate structure 14 is located on one side of the back ion emitting surface of the multiple emitting elements and is spaced apart from the multiple emitting elements; the backplate structure 14 and the multiple emitting elements together form a heat exchange cavity 11. Specifically, the backplate structure 14 is sealed to the multiple emitting elements to make the heat exchange cavity 11 a sealed cavity.

[0063] For example, the transmitting unit is a piezoelectric ceramic sheet, which can emit ultrasonic waves when driven by a high-frequency AC signal.

[0064] For example, the ultrasonic transducer also includes a printed circuit board for coupling a drive signal to the transmitting unit to drive the transmitting unit to emit ultrasonic waves. The printed circuit board may be disposed in the heat exchange cavity 11 and attached to the surface of the back plate structure 14 facing the transmitting element; or, the printed circuit board may serve as the back plate structure 14.

[0065] In some embodiments, such as Figure 5 As shown, the heat exchange chamber 11 is spherical, and correspondingly, the backplate structure 14 is also spherical. The ultrasonic wave emitting surface of the heat exchange chamber 11 is also spherical, making it suitable for treating curved parts of the patient's body, such as the head. Specifically, the term "spherical crown" as used herein refers to the curved surface shape remaining after a sphere is truncated by a plane, which is the bottom surface of the spherical crown. Correspondingly, the apex of the spherical crown is the point furthest from the bottom surface, and the central axis of the spherical crown is a straight line passing through the apex of the spherical crown and perpendicular to the bottom surface.

[0066] like Figure 5 and Figure 6 As shown, the outlet 13 of the heat exchange chamber 11 is located at the top of the spherical crown of the heat exchange chamber 11. The inlet 12 of the heat exchange chamber 11 is located at the bottom edge of the spherical crown of the heat exchange chamber 11, so that the cooling gas can flow from the edge of the heat exchange chamber 11 to the top, thereby allowing the cooling gas flow to cover multiple emission elements along the axial direction of the spherical crown.

[0067] Furthermore, in some embodiments, such as Figure 5As shown, the heat exchange cavity 11 has multiple air inlets 12, and these multiple air inlets are evenly distributed around the central axis of the spherical crown of the heat exchange cavity 11. This allows multiple airflows to converge from the bottom edge region of the spherical crown to the top end region of the spherical crown, and allows the airflows in the heat exchange cavity 11 to be evenly distributed along the circumference of the spherical crown. This results in a uniform distribution of the airflow field inside the heat exchange cavity 11 in the circumferential direction, thereby ensuring that each emitting element can come into contact with the cooling gas and thus ensuring that none of the emitting elements overheat.

[0068] It is easy to understand that if the heat exchange cavity 11 has only one air inlet, the airflow in the region near the air inlet of the heat exchange cavity 11 will be much greater than the airflow in the region far from the air inlet. This may result in some of the multiple emitting elements being adequately cooled, while others are not adequately cooled.

[0069] It should be noted that the number, size, and distribution density of the air inlets can be arranged according to actual needs. For example, there can be two air inlets, which can be arranged opposite each other in the edge area of ​​the spherical crown.

[0070] In some embodiments, such as Figure 5 and Figure 7 As shown, the ultrasonic transducer device also includes an annular flow equalization channel 3. The annular flow equalization channel 3 is disposed in the edge region of the spherical cap of the heat exchange cavity 11, and is arranged around the central axis of the spherical cap of the heat exchange cavity 11; specifically, the annular flow equalization channel 3 can be arranged along the bottom edge of the spherical cap of the heat exchange cavity 11. The air inlet 12 of the heat exchange cavity 11 is connected to the annular flow equalization channel 3. Multiple uniform flow outlets are distributed on the surface of the annular flow equalization channel 3, and these outlets are connected to the interior of the heat exchange cavity 11. This utilizes the annular flow equalization channel 3 to ensure uniform airflow, allowing the airflow to converge from the bottom edge region of the spherical cap to the end of the top region of the spherical cap, and ensuring that the airflow in the heat exchange cavity 11 is uniformly distributed circumferentially along the spherical cap. This results in a uniform circumferential distribution of the airflow field inside the heat exchange cavity 11, which can meet the cooling requirements of large-size ultrasonic transducer devices.

[0071] For example, the cross-sectional area of ​​the annular ventilation slot should be as large as possible to reduce the resistance to the flow of the medium.

[0072] In some embodiments, such as Figure 5 As shown, the ultrasonic transducer device also includes a support frame 4, which is disposed in the heat exchange chamber 11. The support frame 4 is connected to the backplate structure 14 and to one side of the back ion emission surface of multiple emission elements to fix the multiple emission elements. Figure 8As shown, the support frame 4 includes a support frame body 41 and a plurality of first air guide holes 42. The plurality of first air guide holes 42 are arranged one-to-one with a plurality of emitting elements, so that the back surface of the emitting element is partially exposed in the heat exchange chamber 11, thereby ensuring that the surface of the emitting element can directly contact the cooling gas, thus improving the heat exchange efficiency between each emitting element and the cooling gas, and further improving the cooling effect on the emitting element. Specifically, the plurality of first air guide holes 42 are distributed at intervals in the support frame body 41, so that the support frame body 41 as a whole has a mesh structure with multiple holes.

[0073] like Figure 8 As shown, the support frame body 41 has a plurality of second air guide holes 43. One end of each second air guide hole 43 is connected to the heat exchange chamber 11, and the other end extends to the surface of the corresponding emitting unit. That is, the two ends of the second air guide hole 43 are respectively opened on the opposite two sides of the support frame body 41, so as to further increase the contact area between the back surface of the emitting element and the cooling gas by using the second air guide hole 43, thereby further improving the cooling effect on the emitting element.

[0074] like Figure 8 As shown, the support frame body 41 has multiple third air guide holes 44. The two ends of the third air guide holes 44 are respectively connected to two adjacent first air guide holes 42, so that the cooling gas can flow between the multiple first air guide holes 42, thereby avoiding the support frame body 41 from obstructing the flow of cooling gas, and thus ensuring that each transmitting element can fully contact the cooling gas.

[0075] In some embodiments, the cooling device 2 further includes a control unit and at least one temperature detection unit. The temperature detection units are all disposed inside the heat exchange chamber 11 and are used to detect the ambient temperature inside the heat exchange chamber 11. The control unit is communicatively connected to the air pump 21 and the temperature detection units, respectively, and is used to control the air pump 21 to adjust the air flow rate of the heat exchange chamber 11 according to the temperature value detected by the temperature detection units. This is to increase the cooling gas flow rate when the temperature inside the heat exchange chamber 11 is too high, thereby reducing the temperature of the heat exchange chamber 11, and to decrease the cooling gas flow rate when the temperature inside the heat exchange chamber 11 is too low, so as to avoid excessive energy consumption of the air pump 21 due to excessively low cooling gas flow rate.

[0076] Furthermore, the gas processing unit 22 includes a gas cooling module for cooling the gas. The control unit is also communicatively connected to the gas cooling module and adjusts the output power of the gas cooling module based on the temperature value detected by the temperature detection unit to adjust the cooling gas temperature. This allows for increasing the output power of the gas cooling module when the temperature inside the heat exchange chamber 11 is too high, thereby lowering the temperature of the heat exchange chamber 11, and decreasing the output power of the gas cooling module when the temperature inside the heat exchange chamber 11 is too low, to avoid wasting cooling energy.

[0077] Furthermore, in some embodiments, the cooling device 2 further includes at least one humidity detection unit disposed inside the heat exchange chamber 11 for detecting the ambient humidity inside the heat exchange chamber 11. The gas processing unit 22 also includes a gas drying module for drying the gas to prevent high humidity cooling gas from affecting the performance of the transmitting element and to reduce the short-circuit risk of the transmitting element.

[0078] The control unit is also connected to the gas drying module to adjust the adsorption capacity of the gas drying module according to the temperature value detected by the temperature detection unit, so as to reduce the humidity inside the heat exchange chamber 11 in a timely manner when the humidity inside the heat exchange chamber 11 is too high.

[0079] For example, the gas drying module can be an adsorption-type drying module to avoid raising the temperature of the cooling gas. Furthermore, the gas drying module can include multiple adsorption modules with different adsorption capacities, and the control unit can control the amount of water vapor adsorbed by the drying module by switching between different adsorption modules.

[0080] For example, the temperature detection unit and the humidity detection unit can be integrated into one unit, that is, a temperature and humidity sensor can be used to realize the temperature detection function and the humidity detection function.

[0081] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. An ultrasonic transducer device, characterized in that, include: A transducer body for generating and emitting ultrasonic waves; the transducer body has a heat exchange cavity inside, and the heat exchange cavity has an air inlet and an air outlet. A cooling device has a cooling channel that is connected to the air inlet of the heat exchange chamber for supplying cooling gas to the heat exchange chamber; the cooling device includes an air pump and a gas processing unit disposed in the cooling channel; the gas processing unit is used to cool the gas in the cooling channel, and the air pump is used to drive the cooling gas to flow to the heat exchange chamber.

2. The ultrasonic transducer device according to claim 1, characterized in that, The cooling device also includes a gas storage device for storing gas; The gas processing unit has an inlet end and an outlet end for cooling the gas flowing through it; the inlet end of the gas processing unit is connected to the heat exchange chamber, and the outlet end is connected to the gas storage device; the gas storage device is also connected to the inlet of the heat exchange chamber. Alternatively, the gas storage unit is connected to the outlet of the heat exchange chamber, the inlet of the gas processing unit is connected to the gas storage unit, and the outlet is connected to the heat exchange chamber.

3. The ultrasonic transducer device according to claim 1, characterized in that, The gas processing unit has its inlet end connected to the atmospheric environment and its outlet end connected to the heat exchange chamber. The heat exchange chamber's outlet is connected to the atmospheric environment.

4. The ultrasonic transducer device according to claim 1, characterized in that, The heat exchange chamber is shaped like a spherical crown; the air outlet of the heat exchange chamber is located at the top of the spherical crown. The air inlet of the heat exchange chamber is located in the edge region of the spherical cap of the heat exchange chamber.

5. The ultrasonic transducer device according to claim 4, characterized in that, The heat exchange chamber has multiple air inlets, and these multiple air inlets are evenly distributed around the central axis of the spherical crown of the heat exchange chamber.

6. The ultrasonic transducer device according to claim 4, characterized in that, Also includes: An annular flow channel is disposed in the spherical edge region of the heat exchange cavity; The annular uniform flow channel is arranged around the central axis of the spherical cap of the heat exchange cavity; The air inlet of the heat exchange cavity is connected to the annular uniform flow channel; the surface of the annular uniform flow channel is provided with a plurality of uniform flow outlets, and the plurality of uniform flow outlets are connected to the interior of the heat exchange cavity.

7. The ultrasonic transducer device according to claim 1, characterized in that, The transducer body includes multiple emitting elements and a backplate structure; the multiple emitting elements are arranged in an array; each emitting element has a sub-emitting surface for emitting ultrasonic waves, and each sub-emitting surface is located on one side of the transducer; The backplate structure is located on the side of the plurality of emitting elements that is away from the sub-emitting surface, and is spaced apart from the plurality of emitting elements; the backplate structure and the plurality of emitting elements together form the heat exchange cavity.

8. The ultrasonic transducer device according to claim 7, characterized in that, Also includes: A support frame is disposed in the heat exchange cavity; the support frame is connected to the back plate structure and to the side of the plurality of emitting elements opposite to the sub-emitting surface; The support frame includes a support frame body and a plurality of first air guide holes, and the surface of each of the emitting elements is partially exposed in the heat exchange cavity through the first air guide holes; The support frame body is provided with a plurality of second air guide holes and a plurality of third air guide holes. One end of each second air guide hole is connected to the heat exchange cavity, and the other end extends to the surface of the corresponding emission unit. Each of the third air guide holes is connected at both ends to the two adjacent first air guide holes.

9. The ultrasonic transducer device according to claim 1, characterized in that, The cooling device further includes at least one temperature detection unit disposed inside the heat exchange cavity, used to detect the ambient temperature inside the heat exchange cavity; The control unit is communicatively connected to the air pump and the temperature detection unit, respectively, and is used to control the air pump to adjust the air flow rate of the heat exchange chamber according to the temperature value detected by the temperature detection unit. The gas processing unit includes a gas cooling module for cooling the gas; The control unit is also communicatively connected to the gas cooling module and is used to adjust the output power of the gas cooling module according to the temperature value detected by the temperature detection unit.

10. The ultrasonic transducer device according to claim 9, characterized in that, The cooling device further includes at least one humidity detection unit, which is disposed inside the heat exchange cavity and is used to detect the ambient humidity inside the heat exchange cavity; The gas processing unit also includes a gas drying module for drying the gas; The control unit is also communicatively connected to the gas drying module and is used to adjust the adsorption capacity of the gas drying module according to the temperature value detected by the temperature detection unit.