Cooling device and polysilicon crushing equipment
By designing a cooling device and polycrystalline silicon crushing equipment, the problem of insufficient cooling of polycrystalline silicon was solved, achieving sufficient cooling and cleaning of the silicon pillars, improving crushing efficiency and purity, and ensuring efficient crushing of polycrystalline silicon.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN CSG INTELLIGENT EQUIP MFG CO LTD
- Filing Date
- 2025-06-12
- Publication Date
- 2026-07-14
AI Technical Summary
Polycrystalline silicon cracks due to thermal expansion and contraction during cooling, affecting the crushing effect. Insufficient cooling also results in some polycrystalline silicon not being completely cooled during transportation, affecting crushing efficiency and purity.
A cooling device was designed, including a water tank, a spray mechanism, and a conveying mechanism. The drive module controls the movement of the carrier in the liquid-cooled water to achieve sufficient cooling and cleaning of the silicon pillar. Combined with the heating, conveying, and crushing devices of the polycrystalline silicon crushing equipment, it ensures that the silicon pillar is fully cooled and cleaned during the handling process.
This process achieves thorough cooling and cleaning of polycrystalline silicon, improves crushing efficiency, ensures the purity of polycrystalline silicon, reduces surface impurities, and enhances crushing effect and purity.
Smart Images
Figure CN224486216U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of polysilicon technology, and in particular to a cooling device and a polysilicon crushing equipment. Background Technology
[0002] In related technologies, polycrystalline silicon needs to be pulverized before use. This requires high-temperature and cooling treatment of the polycrystalline silicon to facilitate subsequent pulverization operations.
[0003] In the cooling process of polycrystalline silicon, a support structure is typically used to immerse the heated polycrystalline silicon in liquid cooling water. After the polycrystalline silicon has cooled sufficiently, it is removed from the liquid cooling water for crushing. Typically, the polycrystalline silicon is heated to 450℃-500℃ and then rapidly immersed in high-purity water at room temperature for rapid cooling. Due to the physical property of thermal expansion and contraction, the polycrystalline silicon experiences drastic changes in internal stress, resulting in numerous cracks. This allows for better subsequent crushing of the silicon pillar.
[0004] However, after cooling, polysilicon needs to be transported a certain distance before being fed into the crushing device. In order to meet the requirements of continuous and efficient operation, the cooling time of polysilicon in liquid cooling water is limited, so it needs to be transported to the crushing device for crushing. As a result, when the polysilicon is fed into the crushing device, some of it may not be sufficiently cooled before being fed into the crushing device, thus affecting the crushing effect. Utility Model Content
[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a cooling device and a polycrystalline silicon crushing equipment, which can fully cool polycrystalline silicon for crushing.
[0006] In a first aspect, embodiments of this application provide a cooling device, including:
[0007] sink;
[0008] The spraying mechanism includes a spraying module located directly above the water tank.
[0009] The conveying mechanism includes a mounting frame, a first drive module, a second drive module, and a carrier. The mounting frame is disposed on one side of the water tank, the first drive module is disposed on the mounting frame, the second drive module is disposed on the first drive module, and the carrier is connected to the second drive module and located inside the water tank. The first drive module is used to drive the carrier to move up and down, and the second drive module is used to drive the carrier to move horizontally in a set direction.
[0010] The first driving module is used to drive the carrier to sink downward into the liquid-cooled water so that the silicon pillar on the carrier sinks downward into the liquid-cooled water. The second driving module is used to drive the carrier to move in the liquid-cooled water along the set direction so that the carrier moves to directly below the spray module. The first driving module is used to drive the carrier to move upward.
[0011] According to some embodiments of the present invention, the spray module is provided in multiple ways, and the multiple spray modules are sequentially arranged above the water tank along a set direction; and each spray module is provided with multiple spray heads, and the multiple spray heads are sequentially spaced along a horizontal direction perpendicular to the set direction.
[0012] According to some embodiments of the present invention, the first driving module includes:
[0013] The first sliding seat is vertically slidably mounted on the mounting bracket;
[0014] The first rack is vertically mounted on the mounting bracket;
[0015] A first driving member is fixedly disposed on the first sliding seat. The driving part of the first driving member is provided with a first gear, which meshes with the first rack.
[0016] According to some embodiments of the present invention, the second drive module includes:
[0017] The second sliding seat is slidably disposed on the first sliding seat along the predetermined direction;
[0018] The second rack is disposed on the first sliding seat along the predetermined direction;
[0019] The second driving member is fixedly mounted on the second sliding seat. The driving part of the second driving member is provided with a second gear, which meshes with the second rack.
[0020] According to some embodiments of the present invention, the support base is provided with a plurality of support members arranged in parallel, and each of the support members is provided with a plurality of support grooves spaced apart along the set direction, and each of the support grooves is used to place silicon pillars.
[0021] According to some embodiments of the present invention, the two sides of the bearing groove are provided with relatively unfolded guide slopes, and the guide slopes are provided with support pads for supporting the silicon pillars.
[0022] Secondly, embodiments of this application provide a polysilicon crushing device, comprising:
[0023] A heating device includes a first machine base, a conveying mechanism, and a heating mechanism, wherein the conveying mechanism is used to convey a silicon pillar to be heated, and the heating mechanism is disposed on the first machine base for heating the silicon pillar conveyed by the conveying mechanism;
[0024] The aforementioned cooling device is used to receive the silicon column output by the conveying mechanism;
[0025] The crushing device 0 is used to receive the silicon column from the cooling device and crush the silicon column.
[0026] According to some embodiments of the present invention, the conveying mechanism includes:
[0027] A first carrier is disposed on the machine platform, and the first carrier is provided with a plurality of first placement slots in sequence along its length direction;
[0028] The second carrier is disposed on the machine platform. The first carrier and the second carrier are disposed side by side. The second carrier is provided with a plurality of second placement slots in sequence along its length.
[0029] A first drive module is disposed on the machine base and is used to drive the second carrier to move along its length direction and vertical direction, so that the silicon pillar can switch positions between the first carrier and the second carrier to achieve conveying;
[0030] The second carrier is provided with a discharge section that can extend relative to the first carrier. The discharge section overlaps with the support member of the carrier seat to place the silicon pillar on the support member.
[0031] According to some embodiments of the present invention, the polycrystalline silicon crushing equipment further includes a material transfer device, which includes a second machine platform, a third carrier, and a second drive module. The second drive module is disposed on the machine platform and is used to drive the third carrier to slide along its length direction so as to overlap with the carrier component of the carrier seat. The third carrier 520 is provided with a plurality of third placement slots along its length direction for receiving silicon pillars loaded by the carrier component.
[0032] According to some embodiments of the present invention, the material transfer device further includes a fourth carrier and a third drive module. The third drive module is used to drive the fourth carrier to move up and down. The fourth carrier is provided with a plurality of fourth placement slots in sequence along its length.
[0033] The third carrier includes a feeding section and an output section, which are equidistant from each other. When the feeding section extends relative to the fourth carrier, it receives silicon pillars on the support seat, and the output section is aligned with the fourth carrier to support the silicon pillars on the fourth carrier. When the output section extends relative to the fourth carrier, it supplies the crushing device, and the feeding section is aligned with the fourth carrier to transfer the silicon pillars into the fourth carrier.
[0034] As can be seen from the above technical solutions, the embodiments of this application have the following advantages: In the feeding stage, the first driving module drives the carrier to move upward through the second driving module, and the silicon pillar to be cooled is placed on the carrier. In the cooling stage, the first driving module drives the carrier to move downward through the second driving module, and the silicon pillar on the carrier is submerged in liquid cooling water. Then, the second driving module drives the carrier to move from left to right in the liquid cooling water until the carrier moves below the spray module. In the cleaning stage, the first driving module drives the carrier to move upward through the second driving module, and the carrier and the silicon pillar on the carrier are removed from the liquid cooling water. At this time, the spray module sprays water onto the silicon pillar, thereby cleaning the silicon pillar.
[0035] As can be seen from the above, the conveying mechanism moves the silicon column in liquid-cooled water. With this setup, the silicon column is transported while the liquid-cooled water cools it sufficiently, thus ensuring the efficiency of silicon column crushing. When the cooled silicon column separates from the liquid-cooled water, the spray module cleans the surface of the silicon column, thereby preventing the surface of the silicon column from being covered with too many impurities, thus ensuring the purity of the silicon column for subsequent use. Attached Figure Description
[0036] Figure 1 This is a schematic diagram of the overall structure of the polycrystalline silicon crushing equipment according to an embodiment of the present utility model;
[0037] Figure 2 This is a schematic diagram of the cooling device according to an embodiment of the present invention;
[0038] Figure 3 This is a schematic diagram of the handling mechanism according to an embodiment of the present utility model;
[0039] Figure 4 for Figure 3 Enlarged schematic diagram of region A in the middle;
[0040] Figure 5 This is a partial structural schematic diagram of the polycrystalline silicon crushing equipment according to an embodiment of the present utility model;
[0041] Figure 6 This is a schematic diagram of the conveying mechanism according to an embodiment of the present utility model;
[0042] Figure 7 This is a schematic diagram of the structure of the first and second vehicles according to an embodiment of the present utility model;
[0043] Figure 8 This is a schematic diagram of the material transfer device according to an embodiment of the present invention.
[0044] The meanings of the reference numerals in the attached figures are as follows:
[0045] 10. Cooling device; 100. Water tank; 200. Spraying mechanism; 210. Spraying module; 211. Spray head; 300. Transporting mechanism; 310. Mounting bracket; 320. First drive module; 321. First sliding seat; 322. First rack; 323. First drive component; 330. Second drive module; 331. Second sliding seat; 332. Second rack; 333. Second drive component; 340. Bearing seat; 341. Bearing component; 342. Bearing groove; 3421. Guide slope; 3422. Support pad; 400. Heating device; 410. 420. Conveying mechanism; 421. First carrier; 430. Second carrier; 431. Second placement trough; 432. Discharge section; 440. Heating mechanism; 460. First machine base; 500. Material transfer device; 510. Second machine base; 520. Third carrier; 521. Third placement trough; 522. Feeding section; 523. Output section; 530. Second power module; 540. Fourth carrier; 541. Fourth placement trough; 550. Third power module; 600. Robotic arm; 700. Crushing device; 800. Silicon column. Detailed Implementation
[0046] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0047] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, up, down, etc., indicating the directional or positional relationship, are based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0048] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0049] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0050] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0051] The present invention will now be described in further detail with reference to the accompanying drawings.
[0052] Please see Figures 1 to 3A cooling device 10 provided in this embodiment of the present invention includes a water tank 100, a spraying mechanism 200, and a conveying mechanism 300. The spraying mechanism 200 includes a spraying module 210 located directly above the water tank 100. The conveying mechanism 300 includes a mounting frame 310, a first drive module 320, a second drive module 330, and a support base 340. The mounting frame 310 is disposed on one side of the water tank 100, the first drive module 320 is disposed on the mounting frame 310, the second drive module 330 is disposed on the first drive module 320, and the support base 340 is connected to the second drive module 330. The first drive module 320 is used to drive the support 340 to move up and down, and the second drive module 330 is used to drive the support 340 to move horizontally in a set direction. Specifically, the first drive module 320 is used to drive the support 340 to sink downward into the liquid cooling water so that the silicon pillar 800 on the support 340 sinks downward into the liquid cooling water, and the second drive module 330 is used to drive the support 340 to move in the liquid cooling water in the set direction so that the support 340 moves to directly below the spray module 210. The first drive module 320 is used to drive the support 340 to move upward.
[0053] Specifically, during the loading stage, the first drive module 320 drives the carrier 340 upward via the second drive module 330, placing the silicon pillar 800 to be cooled onto the carrier 340. During the cooling stage, the first drive module 320 drives the carrier 340 downward via the second drive module 330, submerging the silicon pillar 800 in liquid cooling water. Then, the second drive module 330 drives the carrier 340 to move from left to right in the liquid cooling water until it reaches below the spray module 210. During the cleaning stage, the first drive module 320 drives the carrier 340 upward via the second drive module 330, removing the carrier 340 and the silicon pillar 800 from the liquid cooling water. At this time, the spray module 210 sprays water onto the silicon pillar 800, thus cleaning it.
[0054] Understandably, the conveying mechanism 300 moves the silicon column 800 in liquid-cooled water. With this setup, the silicon column 800 is conveyed while the liquid-cooled water provides sufficient cooling. When the cooled silicon column 800 separates from the liquid-cooled water, the spray module 210 cleans the surface of the silicon column, thereby preventing the surface of the silicon column 800 from being covered with too many impurities, thus ensuring the purity of the silicon column 800 for subsequent use.
[0055] In some embodiments, please refer to Figures 2 to 3Multiple spray modules 210 are provided, and the multiple spray modules 210 are sequentially arranged above the water tank 100 along the transport mechanism 300, with the set direction being the horizontal transport direction of the support seat 340; at the same time, the silicon pillars 800 are also arranged sequentially along the set direction. It can be seen that with the above arrangement, the spray modules 210 can fully cover the upper side of the silicon pillars 800, thereby thoroughly cleaning the silicon pillars 800.
[0056] Furthermore, each of the spray modules 210 is provided with a plurality of spray heads 211, which are arranged sequentially at intervals along a horizontal direction perpendicular to the set direction; at the same time, each silicon pillar 800 is also usually placed in a horizontal direction perpendicular to the set direction. Thus, the spray heads 211 of each spray module 210 can further clean the silicon pillar 800, thereby reducing the impurities covering the surface of the silicon pillar 800.
[0057] In some embodiments, please refer to Figures 2 to 3 The first drive module 320 includes a first sliding seat 321, a first rack 322, and a first drive member 323. The first sliding seat 321 is vertically slidably mounted on the mounting frame 310, for example, by using a guide rail assembly. The first rack 322 is vertically mounted on the mounting frame 310. The first drive member 323 can be a servo motor, fixedly mounted on the first sliding seat 321. The drive portion of the first drive member 323 has a first gear that meshes with the first rack 322. In practical applications, the first drive member 323 drives the first gear to rotate, and the first gear meshes with the first rack 322. This causes the first gear to roll up and down along the first rack 322, thereby moving the support seat 340 up and down along the mounting frame 310. This allows the silicon pillar 800 on the support seat 340 to be submerged in liquid cooling water, or for the silicon pillar 800 in the liquid cooling water to be removed.
[0058] In other possible embodiments, the first drive module 320 may also adopt a motor, a lead screw lifting mechanism, or a cylinder or other drive structure.
[0059] In some embodiments, please refer to Figures 2 to 3The second drive module 330 includes a second sliding seat 331, a second rack 332, and a second drive member 333. The second sliding seat 331 is horizontally slidably mounted on the first sliding seat 321, for example, by using a guide rail assembly. The second rack 332 is horizontally mounted on the second sliding seat 331. The second drive member 333 can be a servo motor, fixedly mounted on the second sliding seat 331. The drive portion of the second drive member 333 has a second gear that meshes with the second rack 332. In practical applications, the second drive member 333 drives the second gear to rotate, and the second gear meshes with the second rack 332. This causes the second gear to roll horizontally along the second rack 332, thereby causing the support seat 340 to move horizontally along the mounting frame 310. This allows the silicon pillar 800 on the support seat 340 to move from left to right in the liquid cooling water, ensuring sufficient cooling of the silicon pillar 800.
[0060] In some embodiments, please refer to Figures 3 to 4 The support base 340 is provided with a plurality of support members 341 arranged in parallel. Each support member 341 is provided with a plurality of support grooves 342 spaced apart along the set direction. Each support groove 342 is used to place silicon pillars 800. As shown in the figure, there are seven support members 341, which are arranged at intervals along a horizontal direction perpendicular to the set direction. Each support member 341 is provided with three support grooves 342 spaced apart along the set direction. Therefore, in specific applications, each silicon pillar 800 is placed in the placement groove of each support member 341 at the same time, and three silicon pillars 800 can be placed on the support base 340.
[0061] Understandably, by employing the aforementioned placement method, the support 341 can stably support each silicon pillar 800, preventing it from falling off during the movement of the liquid cooling water. The support 341s are spaced apart, ensuring sufficient contact between the liquid cooling water and the silicon pillars 800, thus providing uniform cooling.
[0062] In some embodiments, the support groove 342 has relatively unfolded guide slopes 3421 on both sides, or in other words, the support groove 342 is generally V-shaped. It is understood that by adopting the above-described structural form, the support groove 342 can flexibly accommodate silicon pillars 800 of various diameters; moreover, the placement opening of the support groove 342 is relatively large, thus allowing the silicon pillars 800 to be conveniently placed in the support groove 342, or conveniently removed from the support groove 342.
[0063] This application discloses a polycrystalline silicon crushing device. Please refer to [link / reference]. Figure 1 and Figure 5The device includes a heating device 400, the aforementioned cooling device 10, and a crushing device 700. The heating device 400 includes a first machine base 460, a conveying mechanism 410, and a heating mechanism 440. The conveying mechanism 410 is used to convey the silicon pillar 800 to be heated, and the heating mechanism 440 is disposed on the first machine base 460 to heat the silicon pillar 800 conveyed by the conveying mechanism 410. The cooling device 10 is used to receive the silicon pillar 800 output by the conveying mechanism 410 and cool it. The crushing device 700 is used to receive the silicon pillar 800 output by the cooling device 10 and crush the silicon pillar 800.
[0064] Understandably, the polycrystalline silicon crushing equipment employs the aforementioned heating device 400 and cooling device 10. During the conveying process of the silicon column 800 by the conveying mechanism 410, the handling mechanism 300 moves the silicon column 800 in liquid cooling water. This configuration ensures that the silicon column 800 is adequately cooled by the liquid cooling water while being handled. When the cooled silicon column 800 separates from the liquid cooling water, the spray module 210 cleans the surface of the silicon column, thus preventing excessive impurities from covering its surface and ensuring the purity of the silicon column 800. Therefore, before being fed into the crushing device 700, the silicon column 800 undergoes sufficient heating, cooling, and cleaning, allowing the crushing device 700 to thoroughly crush the silicon column 800 and reduce impurities in the crushed silicon material.
[0065] In some embodiments, please refer to Figure 1 , Figure 6 and Figure 7 The conveying mechanism 410 includes a first carrier 420, a second carrier 430, and a first power module. The first carrier 420 is mounted on a machine base and has multiple first placement slots 421 arranged sequentially along its length, i.e., extending horizontally. The second carrier 430 is mounted on the first machine base 460, with the first carrier 420 and the second carrier 430 arranged side by side. The second carrier 430 has multiple second placement slots 431 arranged sequentially along its length. The first power module is mounted on the first machine base 460 and is used to drive the second carrier 430 to move along its length and vertically, so that the silicon pillar 800 can switch positions between the first carrier 420 and the second carrier 430 to achieve conveying.
[0066] In practical application, the second carrier 430 mainly consists of four stages. In the first stage, the first power module drives the second carrier 430 to move upward, and the second carrier 430 lifts the silicon pillar 800 upward through the second placement slot, separating the silicon pillar 800 from the first placement slot. In the second stage, the first power module drives the second carrier 430 to move to the right a distance X, thereby moving the lifted silicon pillar 800 to the right a distance X. In the third stage, the first power module drives the second carrier 430 to move downward, and the second carrier 430 places the lifted silicon pillar 800 downward into the first placement slot until the second placement slot separates from the silicon pillar 800. In the fourth stage, the first power module drives the second carrier 430 to move to the left a distance X, returning to the position of the first stage, and repeating the steps from the first stage to the fourth stage. Thus, the second carrier 430 sequentially transports the silicon pillar 800 from left to right. With this configuration, the second carrier 430 can move back and forth in the left, right, up, and down directions, thereby providing better transport for the silicon pillar 800 and ensuring that the heating device 400 can better heat the silicon pillar 800, so as to facilitate the subsequent crushing process of the silicon pillar 800.
[0067] Furthermore, the second carrier 430 is provided with a discharge section 432 that can extend relative to the first carrier 420. The discharge section 432 overlaps with the carrier member 341 of the carrier 340 so as to place the silicon pillar 800 on the carrier member 341.
[0068] Specifically, the first driving component 323 drives the carrier 340 to move upward to a set height, at which point the carrier 340 is approximately close to the height of the second carrier 341. The first power module drives the second carrier 430 to move to the right, and the discharge section 432 of the second carrier 430 extends into the gap between adjacent first carriers 341, thereby transporting the silicon pillar 800 directly above the carrier 341. Then, the first power module drives the second carrier 430 to move downward, and the second carrier 430 places the silicon pillar 800 onto the carrier 341. Finally, the first power module drives the second carrier 430 to retract towards the first carrier 420, separating the second carrier 430 from the carrier 341, allowing the conveying mechanism 300 to immerse the placed silicon pillar 800 in liquid cooling water for cooling.
[0069] In some embodiments, please refer to Figure 5 and Figure 8The polycrystalline silicon crushing equipment also includes a material transfer device 500, which receives the washed silicon pillars 800 and conveys them to the required position. Specifically, the material transfer device 500 includes a second platform 510, a third carrier 520, and a second power module 530. The third carrier 520 is slidably disposed on the second platform 510 in the left-right direction. The second power module 530 is disposed on the second platform 510 and is used to drive the third carrier 520 to slide along its length direction. The second carrier 520 slides left and right to coincide with the carrier member 341 of the carrier seat 340. The third carrier 520 is provided with a plurality of third placement slots 521 along its length direction for receiving the silicon pillars 800 loaded on the carrier member 341.
[0070] Specifically, when the first power module drives the carrier 340 upward to a set height, the height of the carrier 340 is basically the same as the height of the third carrier 520. Then, the second power module 530 drives the third carrier 520 to move towards the carrier 340, and the third carrier 520 moves to the gap between adjacent carriers 341, that is, below the silicon pillar 800 on the carrier 340. At this time, the first drive module 320 drives the carrier 340 downward, and the carrier 340 places the silicon pillar 800 into the third placement slot 521 of the third carrier 520. Finally, the second power module 530 drives the third carrier 520 to move away from the carrier 340, thereby conveying the cooled silicon pillar 800 to the required position, where the external robot 600 grabs the silicon pillar 800 and puts it into the crushing device 700 to crush the silicon pillar 800.
[0071] Furthermore, the material transfer device 500 also includes a fourth carrier 540 and a third power module 550. The fourth carrier 540 is slidably disposed on the second machine base 510 along its length direction, that is, it can slide in the left and right directions. The third power module 550 is used to drive the fourth carrier 540 to move up and down. The fourth carrier 540 is provided with a plurality of fourth placement slots 541 in sequence along its length direction. The third carrier 520 includes a feeding section 522 and an output section 523, which are equidistant from each other. When the feeding section 522 extends relative to the fourth carrier 540, it receives the silicon pillar 800 on the support seat 340, and the output section 523 is aligned with the fourth carrier 540 to support the silicon pillar 800 on the fourth carrier 540. When the output section 523 extends relative to the fourth carrier 540, it supplies the crushing device 700, and the feeding section 522 is aligned with the fourth carrier 540 to transfer the silicon pillar 800 into the fourth carrier 540.
[0072] In practical applications, when the feeding section 522 of the third carrier 520 receives the silicon pillar 800 carried on the carrier 341, the third power module 550 drives the fourth carrier 540 to move downwards. The fourth carrier 540 places the silicon pillar 800 onto the third carrier 520. At this time, the output section 523 holds the silicon pillar 800. Then, the second power module 530 drives the third carrier 520 to move away from the carrier 340, and the output section 523 transports the silicon pillar 800 to the required position for the external robot 600 to grasp. At this time, the feeding section 522 of the third carrier 520 is aligned with the fourth carrier 540, and the third power module 550 drives the fourth carrier 540 to move upwards, thereby supporting the silicon pillar 800 on the third carrier 520. Finally, the second power module 530 drives the carrier to move towards the support 340, and the feeding section 522 moves again to the position of the support 340 to receive the silicon pillar 800 on the support 340; at the same time, the output section 523 is aligned with the fourth carrier 540, so that it can again support the silicon pillar 800 on the fourth carrier 540 to transport it to the required position. As can be seen from the above, the third carrier 520 and the fourth carrier 540 cooperate to gradually transport the silicon pillar 800 on the support 340 to the required position for the external robot arm 600 to grasp.
[0073] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.
Claims
1. A cooling device, characterized in that, include: sink; The spraying mechanism includes a spraying module located directly above the water tank. The conveying mechanism includes a mounting frame, a first drive module, a second drive module, and a carrier. The mounting frame is disposed on one side of the water tank, the first drive module is disposed on the mounting frame, the second drive module is disposed on the first drive module, and the carrier is connected to the second drive module and located inside the water tank. The first drive module is used to drive the carrier to move up and down, and the second drive module is used to drive the carrier to move horizontally in a set direction. The first driving module is used to drive the carrier to sink downward into the liquid-cooled water so that the silicon pillar on the carrier sinks downward into the liquid-cooled water. The second driving module is used to drive the carrier to move in the liquid-cooled water along the set direction so that the carrier moves to directly below the spray module. The first driving module is used to drive the carrier to move upward.
2. The cooling device according to claim 1, characterized in that, The spray module is provided in multiple units, and the multiple spray modules are arranged sequentially above the water tank along the set direction; and each spray module is provided with multiple spray heads, and the multiple spray heads are arranged sequentially at intervals along a horizontal direction perpendicular to the set direction.
3. The cooling device according to claim 2, characterized in that, The first drive module includes: The first sliding seat is vertically slidably mounted on the mounting bracket; The first rack is vertically mounted on the mounting bracket; A first driving member is fixedly disposed on the first sliding seat. The driving part of the first driving member is provided with a first gear, which meshes with the first rack.
4. The cooling device according to claim 3, characterized in that, The second drive module includes: The second sliding seat is slidably disposed on the first sliding seat along the predetermined direction; The second rack is disposed on the first sliding seat along the predetermined direction; The second driving member is fixedly mounted on the second sliding seat. The driving part of the second driving member is provided with a second gear, which meshes with the second rack.
5. The cooling device according to claim 1, characterized in that, The support base is provided with multiple support members arranged in parallel, and each of the support members is provided with multiple support grooves spaced apart along the set direction. Each support groove is used to place silicon pillars.
6. The cooling device according to claim 5, characterized in that, The bearing groove has relatively unfolded guide slopes on both sides, and the guide slopes are provided with support pads for supporting the silicon pillars.
7. A polycrystalline silicon crushing device, characterized in that, include: A heating device includes a first machine base, a conveying mechanism, and a heating mechanism, wherein the conveying mechanism is used to convey a silicon pillar to be heated, and the heating mechanism is disposed on the first machine base for heating the silicon pillar conveyed by the conveying mechanism; The cooling device according to any one of claims 1 to 6 is used to receive the silicon column output by the conveying mechanism; A crushing device is used to receive the silicon column from the cooling device and crush the silicon column.
8. The polycrystalline silicon crushing equipment according to claim 7, characterized in that, The conveying mechanism includes: A first carrier is disposed on the first machine platform, and the first carrier is provided with a plurality of first placement slots in sequence along its length direction; The second carrier is disposed on the first machine platform. The first carrier and the second carrier are arranged side by side. The second carrier is provided with a plurality of second placement slots along its length. A first power module is disposed on the first machine base and is used to drive the second carrier to move along its length direction and vertical direction, so that the silicon pillar can switch positions between the first carrier and the second carrier to achieve transportation; The second carrier is provided with a discharge section that can extend relative to the first carrier. The discharge section overlaps with the support member of the carrier seat to place the silicon pillar on the support member.
9. The polycrystalline silicon crushing equipment according to claim 7, characterized in that, The polysilicon crushing equipment also includes a material transfer device, which includes a second machine platform, a third carrier, and a second power module. The second power module is disposed on the machine platform and is used to drive the third carrier to slide along its length so as to overlap with the carrier component of the carrier seat. The third carrier is provided with a plurality of third placement slots along its length for receiving silicon pillars loaded by the carrier component.
10. The polycrystalline silicon crushing equipment according to claim 9, characterized in that, The material transfer device also includes a fourth carrier and a third power module. The third power module is used to drive the fourth carrier to move up and down. The fourth carrier is provided with a plurality of fourth placement slots along its length. The third carrier includes a feeding section and an output section, which are equidistant from each other. When the feeding section extends relative to the fourth carrier, it receives silicon pillars on the support seat, and the output section is aligned with the fourth carrier to support the silicon pillars on the fourth carrier. When the output section extends relative to the fourth carrier, it supplies the crushing device, and the feeding section is aligned with the fourth carrier to transfer the silicon pillars into the fourth carrier.