A silicon controlled chip normal temperature and high temperature test all-in-one machine

Abstract

The utility model discloses a silicon chip normal temperature high temperature test all -in -one can be controlled, include: normal temperature test module, it includes first rack, first gantry test and handling mechanism, copper dish heating handling mechanism and first copper dish reflow conveying line, is provided with rotating classification platform on first rack, and the material discharging mechanism, normal temperature kelvin test mechanism, first chip classification picking mechanism and copper dish heating handling mechanism are arranged along rotating classification platform periphery, high temperature test module, it includes second rack, second gantry test and handling mechanism, copper dish cooling handling mechanism and second copper dish reflow conveying line, and copper dish cooling handling mechanism position corresponds copper dish heating handling mechanism, and copper dish cooling handling mechanism end is provided with second chip classification picking mechanism, and second copper dish reflow conveying line position corresponds first copper dish reflow conveying line, the utility model discloses compared with prior art, solves the normal temperature test of present controllable silicon chip, high temperature test low -yield problem.

Description

Technical Field

[0001] This utility model relates to the field of thyristor chip testing technology, and in particular to an integrated machine for testing thyristor chips at room temperature and high temperature. Background Technology

[0002] A thyristor chip is a power switching device based on a four-layer semiconductor structure. It is triggered to turn on by a control electrode signal and turned off under specific conditions, and has important applications in the field of power control.

[0003] After the silicon controlled rectifier (SCR) chip is fabricated, it needs to undergo room temperature and voltage drop (VTM / VFM) testing as well as high-temperature leakage current (IDRM / IRRM) testing. In the existing technology, the SCR chip needs to be tested separately on different equipment, resulting in low testing efficiency. Utility Model Content

[0004] The purpose of this invention is to provide an integrated machine for testing silicon controlled rectifier chips at both room temperature and high temperature, so as to solve the problem of low efficiency in the existing testing of silicon controlled rectifier chips at both room temperature and high temperature.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: A thyristor chip room temperature and high temperature testing integrated machine, comprising:

[0006] The room temperature testing module includes a first frame, a first gantry testing and handling mechanism, a copper plate heating and handling mechanism, and a first copper plate return conveyor line. A rotary sorting platform is set on the first frame. The feeding mechanism, the room temperature Kelvin testing mechanism, the first chip sorting and picking mechanism, and the copper plate heating and handling mechanism are arranged around the rotary sorting platform. A chip handling mechanism is set on one side of the feeding mechanism.

[0007] The high-temperature testing module includes a second frame, a second gantry testing and handling mechanism, a copper tray cooling and handling mechanism, and a second copper tray return conveyor line. The second frame is located on one side of the first frame. The copper tray cooling and handling mechanism is positioned corresponding to the copper tray heating and handling mechanism. A second chip sorting and picking mechanism is provided at the end of the copper tray cooling and handling mechanism. The second copper tray return conveyor line is positioned corresponding to the first copper tray return conveyor line.

[0008] As a further description of the above technical solution:

[0009] The copper disc heating and conveying mechanism includes a first copper disc placement channel, a first sliding support, a first lifting seat, and a fourth linear motor module. Four heating seats are arranged in a straight line on the first copper disc placement channel, with equal spacing between them. An array of heating elements is arranged below each heating seat. The first sliding support is slidably connected to a fourth slide rail. A first lifting cylinder is mounted on the first sliding support. The first lifting seat is slidably connected to the first sliding support and fixedly mounted on the piston rod of the first lifting cylinder. A first linkage rod is provided between two adjacent first lifting seats. The cross brace of the first sliding support is fixedly mounted on the slide table of the fourth linear motor module.

[0010] As a further description of the above technical solution:

[0011] The copper disc cooling and conveying mechanism includes a second copper disc placement channel, which includes a heat preservation seat and several cooling seats. The heat preservation seat has symmetrically arranged contact electrodes on opposite sides, and the mounting plates of the contact electrodes are fixedly installed at the output end of the drive cylinder.

[0012] As a further description of the above technical solution:

[0013] The feeding mechanism includes a first linear motor module, a support frame, a material tray placement platform, a first slide rail, and a pressure plate. The support frame is fixedly installed on the mover of the first linear motor module. The first slide rail is provided on the support frame. The material tray placement platform is slidably connected to the support frame. One end of the material tray placement platform is connected to a slider on the first slide rail. The material tray is placed on the material tray placement platform. The pressure plate is fixedly installed at the output end of the pressing cylinder and extends above the material tray.

[0014] As a further description of the above technical solution:

[0015] The chip handling mechanism includes a first X-axis module, a first Z-axis cylinder, and a first suction cup. The first Z-axis cylinder is fixedly mounted on the slider of the first X-axis module, and the first suction cup is fixedly mounted on the output end of the first Z-axis cylinder.

[0016] As a further description of the above technical solution:

[0017] The first chip sorting and picking mechanism includes a first pallet handling robot, a pallet positioning frame, and an electric cylinder. The bottom of the pallet positioning frame is equipped with a lifting plate, and the pallet positioning frame is fixedly installed on the piston rod of the electric cylinder. The first pallet is placed on the lifting plate.

[0018] As a further description of the above technical solution:

[0019] The first gantry testing and handling mechanism includes a first X-axis linear module, a first Y-axis linear module, and a second Y-axis linear module. The first X-axis linear module is a dual-moving linear module. The first Y-axis linear module is fixedly mounted on the first moving part of the first X-axis linear module. The first Y-axis linear module is provided with a first copper disc clamping assembly and a first material handling module. The first Y-axis linear module is a dual-moving linear module. The first copper disc clamping assembly is fixedly mounted on the third moving part of the first Y-axis linear module. The first material handling module is fixedly mounted on the fourth moving part of the first Y-axis linear module. The second Y-axis linear module is fixedly mounted on the second moving part of the first X-axis linear module. The second Y-axis linear module is provided with a second material handling module.

[0020] As a further description of the above technical solution:

[0021] The second gantry testing and handling mechanism includes a third material handling module, a second X-axis linear module, a third Y-axis linear module, a second copper disk clamping assembly, and a fourth material handling module. The third material handling module includes a high-temperature testing probe.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0023] 1. In this utility model, the integrated room temperature and high temperature testing machine integrates room temperature Kelvin testing, high temperature testing, and chip sorting and picking functions. Furthermore, the copper trays carrying the chips can be recycled through a first copper tray return conveyor line and a second copper tray return conveyor line, achieving cyclic operation. The integrated room temperature and high temperature testing machine only requires manual feeding and unloading of materials onto the trays, automating the testing and sorting of thyristor chips. This high-efficiency and fast system saves labor costs and improves production efficiency.

[0024] 2. In this utility model, the ambient temperature test module and the high temperature test module are effectively integrated together in the ambient temperature and high temperature test integrated machine, which improves the efficiency of testing and classifying thyristor chips. At the same time, the ambient temperature test module and the high temperature test module also have a certain degree of independence and can be separated, which is convenient for disassembly and maintenance. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of an integrated machine for testing silicon controlled rectifier chips at both room temperature and high temperature. Figure 1 .

[0027] Figure 2 This is a schematic diagram of the structure of an integrated machine for testing silicon controlled rectifier chips at both room temperature and high temperature. Figure 2 .

[0028] Figure 3 This is a schematic diagram of the structure of an integrated machine for testing silicon controlled rectifier chips at both room temperature and high temperature. Figure 3 .

[0029] Figure 4 This is a top-view structural diagram of an integrated machine for testing silicon controlled rectifier chips at both room and high temperatures.

[0030] Figure 5 This is a structural breakdown diagram of an integrated machine for testing silicon controlled rectifier chips at both room temperature and high temperature.

[0031] Figure 6 for Figure 5 A magnified view of a portion of point A in the middle.

[0032] Figure 7 This is a schematic diagram of the first gantry testing and handling mechanism in a silicon controlled rectifier chip room temperature and high temperature integrated testing machine.

[0033] Figure 8 This is a schematic diagram of the second gantry testing and handling mechanism in a silicon controlled rectifier chip room temperature and high temperature testing integrated machine.

[0034] Figure 9 This is a schematic diagram of the rotating sorting platform in a silicon controlled rectifier chip room temperature and high temperature testing integrated machine.

[0035] Figure 10 This is a schematic diagram of the feeding mechanism in a silicon controlled rectifier chip room temperature and high temperature integrated testing machine.

[0036] Figure 11 This is a schematic diagram of the chip handling mechanism in a silicon controlled rectifier chip room temperature and high temperature integrated machine.

[0037] Figure 12 This is a schematic diagram of the first chip sorting and picking mechanism in a silicon controlled rectifier chip room temperature and high temperature testing integrated machine.

[0038] Figure 13 This is a schematic diagram of the copper plate heating and conveying mechanism in a silicon controlled rectifier chip room temperature and high temperature testing integrated machine.

[0039] Figure 14 for Figure 13 A magnified view of a section at point B in the middle.

[0040] Figure 15 This is a schematic diagram of the copper disk heating and conveying mechanism in a silicon controlled rectifier chip room temperature and high temperature integrated machine. Figure 1 .

[0041] Figure 16 This is a schematic diagram of the copper disk heating and conveying mechanism in a silicon controlled rectifier chip room temperature and high temperature integrated machine. Figure 2 .

[0042] Legend:

[0043] 1. First frame; 11. Rotary sorting platform; 12. Feeding mechanism; 121. First linear motor module; 122. Support frame; 123. Tray placement platform; 124. First slide rail; 125. Tablet press; 1251. Pressing cylinder; 13. Room temperature Kelvin testing mechanism; 14. First chip sorting and picking mechanism; 141. First pallet handling robot; 142. Pallet positioning frame; 143. Electric cylinder; 15. Chip handling mechanism; 151. First X-axis module; 152. First Z-axis cylinder; 153. First suction cup; 18. Locking block; 19. Machine cover; 191. Cover plate;

[0044] 2. First gantry testing and handling mechanism; 21. First X-axis linear module; 22. First Y-axis linear module; 221. First copper disk clamping assembly; 222. First material handling module; 23. Second Y-axis linear module; 231. Second material handling module;

[0045] 3. Copper disc heating and conveying mechanism; 31. First copper disc placement channel; 311. Heating seat; 312. Heating element; 32. First sliding support seat; 321. First lifting cylinder; 33. First lifting seat; 34. Fourth linear motor module; 35. Fourth slide rail; 36. First linkage rod;

[0046] 4. First copper tray return conveyor line;

[0047] 5. Second rack;

[0048] 6. Second gantry testing and handling mechanism; 61. Third material handling module; 62. Second X-axis linear module; 63. Third Y-axis linear module; 64. Second copper disc clamping assembly;

[0049] 7. Copper tray cooling and conveying mechanism; 71. Second chip sorting and picking mechanism; 72. Second copper tray placement channel; 721. Insulation base; 722. Contact electrode; 723. Drive cylinder; 724. Cooling base;

[0050] 8. Second copper tray return conveyor line;

[0051] 9. Material tray; 91. First tray; 92. Copper tray. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0053] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0054] Example 1

[0055] Please see Figure 1-16 This utility model provides a technical solution: a silicon controlled rectifier chip room temperature and high temperature testing integrated machine, comprising:

[0056] The room temperature testing module includes a first frame 1, a first gantry testing and handling mechanism 2, a copper plate heating and handling mechanism 3, and a first copper plate return conveyor line 4. A rotary sorting platform 11 is provided on the first frame 1. A feeding mechanism 12, a room temperature Kelvin testing mechanism 13, a first chip sorting and picking mechanism 14, and a copper plate heating and handling mechanism 3 are arranged around the rotary sorting platform 11. A chip handling mechanism 15 is provided on one side of the feeding mechanism 12.

[0057] The high-temperature testing module includes a second frame 5, a second gantry testing and handling mechanism 6, a copper tray cooling and handling mechanism 7, and a second copper tray return conveyor line 8. The second frame 5 is located on one side of the first frame 1. The position of the copper tray cooling and handling mechanism 7 corresponds to the position of the copper tray heating and handling mechanism 3. A second chip sorting and picking mechanism 71 is provided at the end of the copper tray cooling and handling mechanism 7. The position of the second copper tray return conveyor line 8 corresponds to the position of the first copper tray return conveyor line 4. The structure and function of the second chip sorting and picking mechanism 71 are the same as those of the first chip sorting and picking mechanism 14. A dual-station design can be achieved by setting two second chip sorting and picking mechanisms 71 at the end of the copper tray cooling and handling mechanism 7, thereby improving the chip sorting and unloading efficiency.

[0058] The copper disc heating and conveying mechanism 3 includes a first copper disc placement channel 31, a first sliding support 32, a first lifting seat 33, and a fourth linear motor module 34. The first copper disc placement channel 31 is provided with four heating seats 311 arranged in a straight line. The four heating seats 311 are equidistant from each other. Heating plates 312 are arranged in an array below the heating seats 311. The first sliding support 32 is slidably connected to the fourth slide rail 35. The first lifting cylinder 321 is provided on the first sliding support 32. The first lifting seat 33 is slidably connected to the first sliding support 32 and is fixedly installed on the piston rod of the first lifting cylinder 321. A first linkage rod 36 is provided between two adjacent first lifting seats 33. The cross brace of the first sliding support 32 is fixedly installed on the slide table of the fourth linear motor module 34.

[0059] The copper tray heating and handling mechanism 3 is used to heat the chip products on the copper tray 92 and handle the copper tray. The four-station heating effectively ensures that the chip can be tested quickly and stably at the required temperature.

[0060] Each heating pad 311 is provided with an array of heating elements 312 below it. The thermal conductivity of copper ensures rapid and stable heating. Each heating element 312 is equipped with a temperature control switch, which can finely adjust the temperature of different areas of each copper plate to ensure that the temperature difference of different chip products on the copper plate does not exceed the required limit.

[0061] When the copper disk 92 is moved, the first lifting cylinder 321 first lifts the first lifting seat 33. The positioning pin at the end of the first lifting seat 33 is inserted into the through hole at the inner corner of the copper disk 92, lifting the copper disk 92 away from the heating seat 311. Then, the fourth linear motor module 34 drives several first sliding support seats 32 to slide forward synchronously, so that the copper disk 92 moves to the next heating seat 311 or the next workstation. After that, the first lifting seat 33 moves down, placing the copper disk 92 back on the first copper disk placement channel 31. After the first lifting seat 33 is removed from the copper disk 92, the fourth linear motor module 34 drives the first sliding support seats 32 to reset. The servo motor controls the movement of the copper disk, ensuring the accuracy of the copper disk's position and ensuring that each chip is placed at an equal distance.

[0062] The copper plate cooling and conveying mechanism 7 includes a second copper plate placement channel 72, which includes a heat preservation seat 721 and several cooling seats 724. The heat preservation seat 721 has symmetrically arranged contact electrodes 722 on one opposite side. The mounting plate of the contact electrodes 722 is fixedly installed at the output end of the drive cylinder 723.

[0063] The copper plate cooling and conveying mechanism 7 is otherwise the same as the copper plate heating and conveying mechanism 3, except that the second copper plate placement channel 72 is different from the first copper plate placement channel 31.

[0064] Similarly, the copper plate cooling and conveying mechanism 7 is provided with a second sliding support and a second lifting seat. The second sliding support is slidably connected to the fourth slide rail 35, and the second lifting seat is connected to the first lifting seat 33 through the second linkage rod. The second lifting seats are connected to each other through the third linkage rod, so as to realize the synchronous conveying of the second lifting seat and the first lifting seat 33.

[0065] The copper disk cooling and conveying mechanism 7 performs high-temperature testing at the insulation seat 721 of the second copper disk placement channel 72. A heating element is installed below the insulation seat 721, and the third material handling module 61 is correspondingly installed above the insulation seat 721. The second support seats on both sides of the copper disk achieve four-point positioning during the high-temperature test of the copper disk through positioning pins, ensuring the consistency of the test values ​​of different chips on the copper disk at high temperatures.

[0066] The insulation seat 721 of the high-temperature insulation test area of ​​the copper plate, combined with the first copper plate placement channel 31, realizes five-station heating, ensuring rapid heating of the copper plate and accurate temperature control.

[0067] When performing high-temperature leakage current (IDRM / IRRM) testing, a high-temperature test probe 611 is used to test each chip from above, and the lower contact electrode 722 is pushed by the drive cylinder 723 to contact the copper disk 92, so as to achieve a test method in which four points on both sides (with the copper disk as one electrode) are simultaneously contacted for testing.

[0068] A water cooler is installed below the cooling seat 724. After the high-temperature test, the copper plate is moved to the cooling seat 724 for cooling. The three-station water cooling can effectively and quickly reduce the temperature of the copper plate to a controllable temperature.

[0069] The first chip sorting and picking mechanism 14 includes a first pallet handling robot 141, a pallet positioning frame 142 and an electric cylinder 143. The bottom of the pallet positioning frame 142 is provided with a lifting plate. The pallet positioning frame 142 is fixedly installed on the piston rod of the electric cylinder 143. The first pallet 91 is placed on the lifting plate.

[0070] Below the first pallet handling robot 141 are two pallet positioning frames 142, one for empty pallets and the other for full pallets. After the first empty pallet 91 at the top of the empty pallet area is filled with 1800V products, it is moved to the full pallet area by the first pallet handling robot 141. In the full pallet area, the electric cylinder 143 lowers the lifting pallet via a piston rod, facilitating the placement of the next pallet, effectively saving manual loading and unloading time. The first pallet handling robot 141 employs a four-position suction method, which is fast, stable, and provides precise positioning, thus improving efficiency.

[0071] The first gantry testing and handling mechanism 2 includes a first X-axis linear module 21, a first Y-axis linear module 22, and a second Y-axis linear module 23. The first X-axis linear module 21 is a dual-moving linear module. The first Y-axis linear module 22 is fixedly installed on the first moving part of the first X-axis linear module 21. The first Y-axis linear module 22 is provided with a first copper disk clamping assembly 221 and a first material picking module 222. The first Y-axis linear module 22 is a dual-moving linear module. The first copper disk clamping assembly 221 is fixedly installed on the third moving part of the first Y-axis linear module 22. The first material picking module 222 is fixedly installed on the fourth moving part of the first Y-axis linear module 22. The second Y-axis linear module 23 is fixedly installed on the second moving part of the first X-axis linear module 21. The second Y-axis linear module 23 is provided with a second material picking module 231.

[0072] The first copper disk clamping assembly 221 moves along the Z-axis via a cylinder, clamps the copper disk 92 via pneumatic grippers, and moves along the XY-axis via the first X-axis linear module 21 and the first Y-axis linear module 22, placing the empty copper disk 92 on the first copper disk return conveyor line 4 onto the copper disk heating and conveying mechanism 3.

[0073] The first material handling module 222 moves along the Z-axis via a cylinder, and uses a suction cup to pick up 1800V products and NG products after room temperature Kelvin testing on the rotating sorting platform 11. It also moves along the X and Y axes via the first X-axis linear module 21 and the first Y-axis linear module 22 to sort 1800V products and exclude NG products.

[0074] The second material handling module 231 moves along the Z-axis via a cylinder, and uses a suction cup to pick up 1600V products that have undergone room temperature Kelvin testing on the rotating sorting platform 11. It then moves along the XY axis via the first X-axis linear module 21 and the first Y-axis linear module 22, placing the 1600V products onto the empty copper disk 92 of the copper disk heating and conveying mechanism 3 for subsequent high-temperature testing.

[0075] The second gantry testing and handling mechanism 6 includes a third material handling module 61, a second X-axis linear module 62, a third Y-axis linear module 63, a second copper disk clamping assembly 64, and a fourth material handling module. The third material handling module 61 includes a high-temperature testing probe 611. The third Y-axis linear module 63 is fixedly mounted on the mover of the second X-axis linear module 62. The third Y-axis linear module 63 is a dual-motor linear module, with the two movers used to drive the second copper disk clamping assembly 64 and the fourth material handling module, respectively.

[0076] The fourth picking module has the same structure as the first picking module 222. It is used to place the chips that have passed the high-temperature test on the copper tray 92 into the second chip sorting and picking mechanism 71 to realize chip sorting, unloading and packaging.

[0077] The second copper disk clamping assembly 64 has the same structure as the first copper disk clamping assembly 221 and is used to transport the copper disk 92 above the copper disk cooling and transporting mechanism 7 to be placed on the second copper disk return conveying line 8.

[0078] The structure and working principle of the third picking module 61 are basically the same as those of the second picking module 231. The difference is that the third picking module 61 uses a high-temperature test probe 611 to perform spot testing on the chip on the copper disk cooling and conveying mechanism 7. In addition, the third picking module 61 can pick up the chip and move it along the Z-axis, and move it along the XY axis through the X-axis linear module and the Y-axis linear module to exclude NG products that fail the high-temperature test to the collection box on one side of the second frame 5.

[0079] Working Principle: The integrated room temperature and high temperature testing machine combines room temperature Kelvin testing, high temperature testing, and chip sorting and picking functions. The copper trays carrying the chips can be recycled via the first copper tray return conveyor line 4 and the second copper tray return conveyor line 8, achieving cyclic operation. The integrated room temperature and high temperature testing machine only requires manual loading and unloading of materials onto the trays, automating the testing and sorting of thyristor chips. This high-efficiency and fast system saves labor costs and improves production efficiency.

[0080] Example 2

[0081] Based on the above embodiments, this embodiment further improves upon the following technical solutions: The feeding mechanism 12 includes a first linear motor module 121, a support frame 122, a tray placement platform 123, a first slide rail 124, and a pressing plate 125. The support frame 122 is fixedly installed on the mover of the first linear motor module 121. The first slide rail 124 is provided on the support frame 122. The tray placement platform 123 is slidably connected to the support frame 122. One end of the tray placement platform 123 is connected to the slider on the first slide rail 124. The tray 9 is placed on the tray placement platform 123. The pressing plate 125 is fixedly installed at the output end of the pressing cylinder 1251 and extends above the tray 9.

[0082] The thyristor chips are placed in the material tray 9 for loading. The material tray 9 is manually placed on the material tray placement platform 123. The material tray placement platform 123 moves the material tray 9 in the XY direction through the first linear motor module 121 and the first slide rail 124, so that the material tray moves to align the position of each chip with the reference position, so that the chip handling mechanism 15 can pick up and transport the chips to the rotary sorting platform 11. The material tray placement platform 123 can be equipped with photoelectric sensors to detect whether the material tray 9 is short of material.

[0083] The pressing sheet 125 is L-shaped. On one hand, the pressing sheet 125 outlines the reference position. On the other hand, when picking up the chip, the pressing sheet 125 is driven downward by the pressing cylinder 1251 to press down the adjacent chips of the chip being picked up, preventing the entire tray from being sucked away. The pressing sheet 125 is a plastic sheet with elastic deformation capability and elastic pressing.

[0084] Example 3

[0085] Based on the above embodiments, this embodiment further improves upon the following technical solution: the chip handling mechanism 15 includes a first X-axis module 151, a first Z-axis cylinder 152, and a first suction cup 153. The first Z-axis cylinder 152 is fixedly mounted on the slider of the first X-axis module 151, and the first suction cup 153 is fixedly mounted on the output end of the first Z-axis cylinder 152.

[0086] The chip handling mechanism 15 uses the first suction cup 153 to pick up the chip at the reference position, and uses the first Z-axis cylinder 152 to move upward and the first X-axis module 151 to move horizontally, thereby placing the chip on the station of the rotary sorting platform 11.

[0087] The chip on the rotating sorting platform at station 11 is rotated to the room temperature Kelvin testing chamber at station 13 for room temperature testing. The room temperature and voltage drop (VTM / VFM) tests are performed using Kelvin testing, with three probes at the top and two probes at the bottom. The two probes at the bottom contact the small copper block supporting the chip, and the three probes at the top include the gate electrode (G).

[0088] After the collected chip products are subjected to room temperature Kelvin testing, the tested products are classified. Products with 1600V are sent to the next station, while products with 1800V and NG are picked out. 1800V products are placed in the first tray 91 for retesting, while NG products are placed in the defective box.

[0089] Example 4

[0090] This embodiment further improves upon the above embodiment by providing the following technical solution: a locking block 18 is provided on the first frame 1, and a plug-in block corresponding to the locking block 18 is provided on the second frame 5. The combination of the room temperature test module and the high temperature test module is guided by the plugging and splicing of the locking block 18 on the first frame 1 and the plug-in block on the second frame 5, ensuring the coordination of the first copper disk return conveyor line 4, the second copper disk return conveyor line 8, and the copper disk cooling and conveying mechanism 7 and the copper disk heating and conveying mechanism 3.

[0091] The room temperature and high temperature testing integrated machine effectively combines the room temperature testing module and the high temperature testing module, improving the efficiency of testing and classifying thyristor chips. At the same time, the room temperature testing module and the high temperature testing module also have a certain degree of independence and can be separated for easy disassembly and maintenance.

[0092] Example 5

[0093] This embodiment further improves upon the above embodiments by providing the following technical solution: a cover 19 is provided on the first frame 1, and a rotatable cover plate 191 is provided on the cover 19. The copper disc heating and conveying mechanism 3 requires high-temperature heating, and the cover 19 improves the operational safety of the equipment.

[0094] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A thyristor chip room temperature and high temperature testing integrated machine, characterized in that, include: The room temperature testing module includes a first frame, a first gantry testing and handling mechanism, a copper disk heating and handling mechanism, and a first copper disk return conveyor line. A rotary sorting platform is provided on the first frame. The feeding mechanism, the room temperature Kelvin testing mechanism, the first chip sorting and picking mechanism, and the copper disk heating and handling mechanism are arranged circumferentially along the rotary sorting platform. A chip handling mechanism is provided on one side of the feeding mechanism. The high-temperature testing module includes a second frame, a second gantry testing and handling mechanism, a copper tray cooling and handling mechanism, and a second copper tray return conveyor line. The second frame is located on one side of the first frame. The copper tray cooling and handling mechanism is positioned corresponding to the copper tray heating and handling mechanism. A second chip sorting and picking mechanism is provided at the end of the copper tray cooling and handling mechanism. The second copper tray return conveyor line is positioned corresponding to the first copper tray return conveyor line.

2. The integrated machine for testing silicon controlled rectifier chips at room temperature and high temperature according to claim 1, characterized in that, The copper disc heating and conveying mechanism includes a first copper disc placement channel, a first sliding support, a first lifting seat, and a fourth linear motor module. Four heating seats are arranged in a straight line on the first copper disc placement channel, with the four heating seats equidistant from each other. An array of heating elements is arranged below each heating seat. The first sliding support is slidably connected to a fourth slide rail. A first lifting cylinder is mounted on the first sliding support. The first lifting seat is slidably connected to the first sliding support and is fixedly mounted on the piston rod of the first lifting cylinder. A first linkage rod is provided between two adjacent first lifting seats. The cross brace of the first sliding support is fixedly mounted on the slide table of the fourth linear motor module.

3. The integrated testing machine for room temperature and high temperature of thyristor chips according to claim 1, characterized in that, The copper disc cooling and conveying mechanism includes a second copper disc placement channel, which includes a heat preservation seat and several cooling seats. The heat preservation seat has symmetrically arranged contact electrodes on opposite sides, and the mounting plate of the contact electrodes is fixedly installed at the output end of the drive cylinder.

4. The integrated machine for testing silicon controlled rectifier chips at room temperature and high temperature according to claim 1, characterized in that, The feeding mechanism includes a first linear motor module, a support frame, a material tray placement platform, a first slide rail, and a pressure plate. The support frame is fixedly installed on the mover of the first linear motor module. The first slide rail is provided on the support frame. The material tray placement platform is slidably connected to the support frame. One end of the material tray placement platform is connected to a slider on the first slide rail. The material tray is placed on the material tray placement platform. The pressure plate is fixedly installed at the output end of the pressing cylinder and extends above the material tray.

5. The integrated testing machine for room temperature and high temperature of thyristor chips according to claim 1, characterized in that, The chip handling mechanism includes a first X-axis module, a first Z-axis cylinder, and a first suction cup. The first Z-axis cylinder is fixedly mounted on the slider of the first X-axis module, and the first suction cup is fixedly mounted on the output end of the first Z-axis cylinder.

6. The integrated machine for testing silicon controlled rectifier chips at room temperature and high temperature according to claim 1, characterized in that, The first chip sorting and picking mechanism includes a first pallet handling robot, a pallet positioning frame, and an electric cylinder. The bottom of the pallet positioning frame is provided with a lifting plate. The pallet positioning frame is fixedly installed on the piston rod of the electric cylinder. The first pallet is placed on the lifting plate.

7. The integrated machine for testing silicon controlled rectifier chips at room temperature and high temperature according to claim 1, characterized in that, The first gantry testing and handling mechanism includes a first X-axis linear module, a first Y-axis linear module, and a second Y-axis linear module. The first X-axis linear module is a dual-moving linear module. The first Y-axis linear module is fixedly mounted on the first moving part of the first X-axis linear module. The first Y-axis linear module is provided with a first copper disc clamping assembly and a first material handling module. The first Y-axis linear module is a dual-moving linear module. The first copper disc clamping assembly is fixedly mounted on the third moving part of the first Y-axis linear module. The first material handling module is fixedly mounted on the fourth moving part of the first Y-axis linear module. The second Y-axis linear module is fixedly mounted on the second moving part of the first X-axis linear module. The second Y-axis linear module is provided with a second material handling module.

8. The integrated machine for testing silicon controlled rectifier chips at room temperature and high temperature according to claim 1, characterized in that, The second gantry testing and handling mechanism includes a third material handling module, a second X-axis linear module, a third Y-axis linear module, a second copper disk clamping assembly, and a fourth material handling module. The third material handling module includes a high-temperature testing probe.

9. The integrated machine for testing silicon controlled rectifier chips at room temperature and high temperature according to claim 1, characterized in that, The first frame is provided with a locking block, and the second frame is provided with a plug-in block whose position corresponds to the locking block.

10. The integrated machine for testing silicon controlled rectifier chips at room temperature and high temperature according to claim 1, characterized in that, The first frame is equipped with a cover, and the cover is equipped with a rotatable and openable cover plate.

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