Automatic desludging cleaning tank arrangement
By designing an automatic adhesive residue removal cleaning tank device, combined with a lifting component and an ultrasonic generator, the problems of insufficient pure ultrasonic cleaning and blind spots in high-pressure rinsing are solved. This achieves efficient removal of deep micropores and carbonized resin, avoids damage to components and nozzles, and is suitable for cleaning circuit boards of different thicknesses.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JUXIN XIANGRUI MACHINERY EQUIPMENT CO LTD
- Filing Date
- 2025-08-01
- Publication Date
- 2026-07-14
AI Technical Summary
In existing technologies, pure ultrasonic cleaning is insufficient for removing deep micropores and carbonized resins. High-frequency vibrations can easily damage precision components. Independent high-pressure rinsing has blind spots in water flow coverage, and fixed nozzles cannot be adapted to circuit boards of different thicknesses, resulting in the rinsing distance being too close and damaging the solder pads. Therefore, it is impossible to integrate ultrasonic and high-pressure rinsing equipment into one unit.
An automatic adhesive residue removal cleaning tank device was designed, which combines a lifting component and an ultrasonic generator. The lifting component drives the nozzle to descend and combines it with ultrasonic cleaning to adapt to circuit boards of different thicknesses. The ultrasonic generator generates ultrasonic waves to clean the circuit boards, thus solving the above-mentioned problems.
It achieves efficient removal of deep micropores and carbonized resin, avoids damage to precision components, adapts to the cleaning needs of circuit boards of different thicknesses, avoids damage to solder pads by the nozzle, and realizes the integration of ultrasonic and high-pressure rinsing equipment.
Smart Images

Figure CN224487005U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of adhesive residue removal technology for circuit boards, and in particular to an automatic adhesive residue removal cleaning tank device. Background Technology
[0002] As electronic products become increasingly high-density, the problem of cleaning up adhesive residue generated during the PCB drilling process is becoming more and more prominent.
[0003] Traditional cleaning technologies are mainly divided into two categories: pure ultrasonic cleaning mainly relies on cavitation effect to remove adhesive residue, but it is not effective at removing deep micropores and carbonized resin, and high-frequency vibration can easily damage precision components; independent high-pressure rinsing mainly uses directional jet water to physically scour, but there are blind spots in water flow coverage, and fixed nozzles cannot be adapted to circuit boards of different thicknesses, resulting in damage to solder pads when the rinsing distance is too close, thus making it impossible to integrate ultrasonic and high-pressure rinsing equipment into one unit. Utility Model Content
[0004] This utility model provides an automatic cleaning tank device for removing adhesive residue. It can solve the problems of pure ultrasonic cleaning, which mainly relies on cavitation effect to remove adhesive residue, but has insufficient removal rate for deep micropores and carbonized resin, and high-frequency vibration can easily damage precision components; independent high-pressure rinsing mainly uses directional jet water flow for physical rinsing, but there are blind spots in water flow coverage, and fixed nozzles cannot be adapted to circuit boards of different thicknesses, resulting in damage to solder pads when the rinsing distance is too close, thus making it impossible to integrate ultrasonic and high-pressure rinsing equipment into one unit.
[0005] This utility model provides an automatic cleaning tank device for removing adhesive residue, including:
[0006] A cleaning tank device includes a cleaning tank body, a circulation tank, a pump body, a hose, a support pipe, a support frame, and a circulation pipe. The circulation tank is located on one side of the cleaning tank body, the pump body is located inside the circulation tank, the support frame is located inside the cleaning tank body, the hose is connected to the support pipe, and the circulation pipe is located at the connection between the cleaning tank body and the circulation tank.
[0007] The lifting assembly is located at the upper end of the support frame, including a winding motor fixed at the upper end of the support frame, and a winding reel is provided at the output end of the winding motor. A connecting rope is wound around the outside of the winding reel, and a support slide is connected to both ends of the connecting rope. A guide wheel is provided at the corner of the support frame.
[0008] An ultrasonic generator is installed on one side of the main body of the cleaning tank. A mounting bracket is installed on the inner side of the support frame, and a transducer is installed on the upper end of the mounting bracket.
[0009] In an embodiment of the automatic adhesive residue removal cleaning tank device of this utility model, the main body of the cleaning tank and the circulation tank are connected by a circulation pipe, and the pump body and the circulation tank are connected by bolts.
[0010] In an embodiment of the automatic adhesive residue removal cleaning tank device of this utility model, the output end of the pump body is connected to the support pipe through a flexible hose, the bottom of the support pipe is connected to a connecting pipe, and a number of nozzles are arranged on the inner side of the connecting pipe.
[0011] In an embodiment of the automatic glue removal cleaning tank device of this utility model, the support frame is fixedly connected to the main body of the cleaning tank, the winding motor is connected to the support frame by bolts, and the output end of the winding motor is fixedly connected to the winding reel.
[0012] In the automatic adhesive residue removal cleaning tank device according to one embodiment of the present invention, both ends of the connecting rope are fixedly connected to the support slide, and an auxiliary wheel is installed on the inner side of the support slide, and the auxiliary wheel is in contact with the support frame.
[0013] In the automatic adhesive residue removal cleaning tank device of one embodiment of this utility model, the number of guide wheels is two sets and they are symmetrically distributed, and the guide wheels are in contact with the connecting rope.
[0014] In an embodiment of the automatic adhesive residue removal cleaning tank device of this utility model, the ultrasonic generator is electrically connected to the mounting frame, and the mounting frame consists of several groups arranged in an array.
[0015] In the automatic adhesive residue removal cleaning tank device of one embodiment of this utility model, the transducer is connected to the support frame by bolts, and the transducer is connected to the mounting frame by bolts.
[0016] The technical solutions provided in this application embodiment can include the following beneficial effects: This application designs an automatic cleaning tank device for removing adhesive residue, which can solve the problem that pure ultrasonic cleaning mainly relies on cavitation effect to remove adhesive residue, but the removal rate of deep micropores and carbonized resin is insufficient, and high-frequency vibration can easily damage precision components; independent high-pressure rinsing mainly uses directional jet water flow for physical rinsing, but there are blind spots in water flow coverage, and fixed nozzles cannot be adapted to circuit boards of different thicknesses, resulting in damage to solder pads when the rinsing distance is too close, thus failing to integrate ultrasonic and high-pressure rinsing equipment into one.
[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the structure of an automatic adhesive residue removal cleaning tank device provided in an embodiment of this application;
[0020] Figure 2 yes Figure 1 Another perspective structural schematic diagram of the automatic glue residue removal cleaning tank device;
[0021] Figure 3 yes Figure 1 A partial structural diagram of an automatic adhesive residue removal cleaning tank device;
[0022] Figure 4 yes Figure 3 A magnified view of point A in the middle. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0024] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0025] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0026] like Figures 1 to 4 As shown, this application provides an automatic cleaning tank device for removing adhesive residue, including: a cleaning tank device 100, including a cleaning tank body 10, a circulation tank 20, a pump body 30, a hose 40, a support pipe 50, a support frame 60 and a circulation pipe 90. The circulation tank 20 is located on one side of the cleaning tank body 10, the pump body 30 is located inside the circulation tank 20, the support frame 60 is located inside the cleaning tank body 10, the hose 40 is connected to the support pipe 50, and the circulation pipe 90 is located at the connection between the cleaning tank body 10 and the circulation tank 20. The lifting assembly 70 is located at the upper end of the support frame 60, including a winding motor 71 fixed to the upper end of the support frame 60, and a winding reel 72 is provided at the output end of the winding motor 71. A connecting rope 73 is wound around the outside of the winding reel 72, and the two ends of the connecting rope 73 are connected to the support slide 75. A guide wheel 74 is provided at the corner of the support frame 60. The ultrasonic generator 80 is located on one side of the main body 10 of the cleaning tank. A mounting frame 82 is installed on the inner side of the support frame 60, and a transducer 81 is installed at the upper end of the mounting frame 82.
[0027] After adopting the above technical solutions, since the lifting component 70 is set at the upper end of the support frame 60 and the ultrasonic generator 80 is set on one side of the main body 10 of the cleaning tank, when cleaning the circuit board, the lifting component 70 can drive the support tube 50 and the nozzle 52 to descend and clean it. At the same time, the ultrasonic generator 80 and the transducer 81 can perform ultrasonic cleaning on the circuit board. This can solve the problem that pure ultrasonic cleaning mainly relies on cavitation effect to remove adhesive residue, but the removal rate of deep micropores and carbonized resin is insufficient, and high-frequency vibration can easily damage precision components. Independent high-pressure rinsing mainly uses directional jet water flow to physically scour, but there are blind spots in water flow coverage, and the fixed nozzle cannot be adapted to circuit boards of different thicknesses, resulting in damage to the solder pads when the rinsing distance is too close. Therefore, it is impossible to integrate ultrasonic and high-pressure rinsing equipment into one unit.
[0028] It should be noted that when cleaning the circuit board, the circuit board is placed in the middle of the main body 10 of the cleaning tank and clamped by the pre-installed clamping assembly. Then, the cleaning fluid inside the circulation tank 20 is circulated through the hose 40, support pipe 50 and connecting pipe 51 by the pump body 30. Finally, the circuit board is rinsed by the nozzle 52. At the same time, the output end of the winding motor 71 drives the winding reel 72 to rotate, so that the connecting rope 73 is wound up. Then, the two sets of support slides 75 are driven to descend along the outside of the guide wheel 74. At the same time, the support slides 75 drive the auxiliary wheel to roll along the support frame 60, thereby driving the support pipe 50, connecting pipe 51 and nozzle 52 to descend. Circuit boards at different heights can be cleaned. When the cleaning fluid reaches a certain height, the ultrasonic generator 80 is activated. Under the support of the mounting frame 82, the transducer 81 generates ultrasonic waves, thereby cleaning the circuit board.
[0029] In an optional embodiment, the cleaning tank body 10 and the circulation tank 20 are connected by a circulation pipe 90, and the pump body 30 is connected to the circulation tank 20 by bolts, so that the cleaning liquid inside the cleaning tank body 10 can be introduced into the circulation tank 20. At the same time, a filter screen is installed on the side of the cleaning tank body 10 near the circulation pipe 90.
[0030] In an optional embodiment, the output end of the pump body 30 is connected to the support pipe 50 via a hose 40. The bottom of the support pipe 50 is connected to a connecting pipe 51, and a number of nozzles 52 are provided on the inner side of the connecting pipe 51. The cleaning fluid can be drawn in through the circulation tank 20 and then sprayed out through the nozzles 52.
[0031] In an optional embodiment, the support frame 60 is fixedly connected to the main body 10 of the cleaning tank, and the winding motor 71 is connected to the support frame 60 by bolts, which facilitates the installation of the winding motor 71. The output end of the winding motor 71 is fixedly connected to the winding reel 72, which is conducive to driving the winding reel 72 to rotate, so as to wind and unwind the connecting rope 73, and further drive the support slide 75 and the support tube 50 to rise and fall.
[0032] In an optional embodiment, both ends of the connecting rope 73 are fixedly connected to the support slide 75. An auxiliary wheel is installed on the inner side of the support slide 75, and the auxiliary wheel is in contact with the support frame 60. During the winding of the connecting rope 73, the two sets of support slides 75 can be driven to rise and fall simultaneously, thereby driving the support tube 50 to adjust its height.
[0033] In one optional embodiment, there are two sets of guide wheels 74 that are symmetrically distributed. The guide wheels 74 are in contact with the connecting rope 73, which can provide auxiliary support during the winding process of the connecting rope 73.
[0034] In one optional embodiment, the ultrasonic generator 80 is electrically connected to the mounting bracket 82, which consists of several groups arranged in an array to release ultrasonic waves for cleaning the circuit board.
[0035] In an optional embodiment, the mounting bracket 82 is connected to the support bracket 60 by bolts, and the transducer 81 is connected to the mounting bracket 82 by bolts, which facilitates the equidistant installation of the transducer 81 and enables subsequent circuit board cleaning operations.
[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0037] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0038] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0039] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0040] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. An automatic cleaning tank device for removing adhesive residue, characterized in that, include: A cleaning tank device includes a cleaning tank body, a circulation tank, a pump body, a hose, a support pipe, a support frame, and a circulation pipe. The circulation tank is located on one side of the cleaning tank body, the pump body is located inside the circulation tank, the support frame is located inside the cleaning tank body, the hose is connected to the support pipe, and the circulation pipe is located at the connection between the cleaning tank body and the circulation tank. The lifting assembly is located at the upper end of the support frame, including a winding motor fixed at the upper end of the support frame, and a winding reel is provided at the output end of the winding motor. A connecting rope is wound around the outside of the winding reel, and a support slide is connected to both ends of the connecting rope. A guide wheel is provided at the corner of the support frame. An ultrasonic generator is installed on one side of the main body of the cleaning tank. A mounting bracket is installed on the inner side of the support frame, and a transducer is installed on the upper end of the mounting bracket.
2. The automatic adhesive residue removal cleaning tank device according to claim 1, characterized in that, The main body of the cleaning tank is connected to the circulation tank through a circulation pipe, and the pump body is connected to the circulation tank through bolts.
3. The automatic adhesive residue removal cleaning tank device according to claim 1, characterized in that, The output end of the pump body is connected to the support pipe via a flexible hose. The bottom of the support pipe is connected to a connecting pipe, and several sets of nozzles are provided on the inner side of the connecting pipe.
4. The automatic adhesive residue removal cleaning tank device according to claim 1, characterized in that, The support frame is fixedly connected to the main body of the cleaning tank, the winding motor is connected to the support frame by bolts, and the output end of the winding motor is fixedly connected to the winding reel.
5. The automatic adhesive residue removal cleaning tank device according to claim 1, characterized in that, Both ends of the connecting rope are fixedly connected to the support slide, and an auxiliary wheel is installed on the inner side of the support slide, and the auxiliary wheel is in contact with the support frame.
6. The automatic adhesive residue removal cleaning tank device according to claim 1, characterized in that, The guide wheels are in two sets and are symmetrically distributed, and the guide wheels are in contact with the connecting rope.
7. The automatic adhesive residue removal cleaning tank device according to claim 1, characterized in that, The ultrasonic generator is electrically connected to the mounting bracket, and the mounting bracket consists of several groups arranged in an array.
8. The automatic adhesive residue removal cleaning tank device according to claim 1, characterized in that, The transducer is connected to the support frame by bolts, and the transducer is also connected to the mounting frame by bolts.