A rapid cooling device for a stamping die

Abstract

The utility model discloses a kind of stamping die rapid cooling device, belong to cooling device technical field, including workbench, the top surface of workbench is fixedly installed with lower die holder, the upper die holder is arranged in the top of lower die holder, the top surface of lower die holder is opened with stamping groove, the bottom surface of upper die holder is installed with stamping block, the top surface of workbench further includes first cooling water tank and second cooling water tank, first cooling water tank and second cooling water tank are oppositely arranged in the two sides of lower die holder, first cooling water tank and second cooling water tank structure are same.This stamping die rapid cooling device is cooled by alternately circulating phase change material with first cooling water tank, second cooling water tank, in addition, filling paraffin phase change block in mould cooling cavity, utilize its solid-liquid phase change absorption large latent heat, effectively buffer thermal load fluctuation, compared with traditional water cooling, mould temperature control precision improves, to make refrigeration equipment start-stop frequency reduce, with the effect of energy consumption reduction.

Description

Technical Field

[0001] This utility model relates to the field of cooling device technology, specifically to a rapid cooling device for stamping dies. Background Technology

[0002] Stamping is a forming process that uses a press and dies to apply external force to sheet metal, strip, tube, and profiles, causing plastic deformation or separation to obtain workpieces (stamped parts) of the desired shape and size. Stamping and forging both belong to plastic processing (also known as pressure processing) and are collectively called forging and pressing. Stamping requires the use of stamping dies, which are special process equipment used to process materials (metal or non-metal) into parts (or semi-finished products). In hot stamping, the metal sheet is first heated, then placed between an upper die and a lower die. The upper die moves down to extrude the metal sheet into shape. Hot stamping dies generate a lot of heat during use, so water channels are generally installed inside the die to cool it down with coolant.

[0003] However, water has limited sensible heat storage capacity. When stamping at high frequency or processing high-hardness materials, the temperature of circulating water tends to rise rapidly, resulting in a significant decrease in cooling efficiency. Traditional cooling channel layouts are difficult to accurately match local hot spots in the mold, which can easily cause uneven cooling and lead to problems such as local overheating, deformation, and increased wear in the mold.

[0004] Based on this, the present invention designs a rapid cooling device for stamping dies to solve the above problems. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a rapid cooling device for stamping dies.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A rapid cooling device for stamping dies includes a worktable. A lower die holder is fixedly mounted on the top surface of the worktable, and an upper die holder is disposed above the lower die holder. A stamping groove is formed on the top surface of the lower die holder, and a stamping block is detachably connected to the bottom surface of the upper die holder. The top surface of the worktable is also equipped with:

[0008] The first cooling water tank and the second cooling water tank are arranged opposite each other on both sides of the lower mold base, and the bottom surfaces of the first cooling water tank and the second cooling water tank are fixedly connected to the worktable. The first cooling water tank and the second cooling water tank have the same structure.

[0009] A cooling device is installed on the surface of a first cooling water tank and a second cooling water tank, and the cooling device is used to cool the coolant in the first cooling water tank and the second cooling water tank.

[0010] A heat release mechanism is installed between the lower mold base, the upper mold base, the first cooling water tank, and the second cooling water tank. The heat release mechanism is used to remove heat from the interior of the lower mold base and the upper mold base.

[0011] Furthermore, the cooling device includes a heat-conducting plate. A notch is provided on one side wall of both the first and second cooling water tanks, and a heat-conducting plate is fixedly connected to the inner wall of the notch. The cooling device includes a heat-conducting plate, and heat dissipation fins are fixedly connected to the outer surface of the heat-conducting plate by thermally conductive adhesive. A mounting plate is fixedly connected to the heat dissipation surface of the heat dissipation fins. A rectangularly distributed mounting groove is provided on the surface of the mounting plate, and a cooling fan is fixedly mounted on the inner wall of the mounting groove by a bracket.

[0012] Furthermore, the heat release mechanism includes a phase-changing block, and both the lower mold base and the upper mold base have cooling chambers inside. The cooling chambers are equipped with heat-conducting pipes. The outer surfaces of the first cooling water tank and the second cooling water tank are fixedly installed with booster water pumps. Both ends of the heat-conducting pipes are connected to the output ends of the booster water pumps through conveying components. The two booster water pumps are normally in a state of one on and one off. The inner wall of the cooling chamber is filled with a phase-changing block, and the outer surface of the heat-conducting pipes is embedded in the phase-changing block.

[0013] Furthermore, the conveying component includes a connecting pipe connecting both ends of the heat-conducting pipe. The end of the connecting pipe away from the heat-conducting pipe extends through the cooling cavity to the outside of the lower mold base and the upper mold base. The surfaces of the first cooling water tank and the second cooling water tank are both connected to guide pipes. The outer surface of one end of the guide pipe is connected to the output end of the booster water pump, and the other end of the guide pipe is connected to a water delivery hose. The water delivery hose is connected to the connecting pipe.

[0014] Furthermore, a stabilizing pipe is connected between the water delivery hose and the connecting pipe, and the surface of the stabilizing pipe is fixedly connected to the side walls of the lower mold base and the upper mold base.

[0015] Furthermore, the heat pipes have a multi-bend S-shaped structure and are closely arranged inside the cooling cavity.

[0016] Furthermore, the cooling chamber inside the lower die holder is close to the bottom of the stamping groove, and the cooling chamber inside the upper die holder is close to the top of the stamping block.

[0017] Furthermore, both the first and second cooling water tanks have water inlets on their top surfaces, and water plugs are inserted into the inner walls of the water inlets.

[0018] Compared with the prior art, the advantages of this utility model are as follows: This rapid cooling device for stamping dies combines phase change material with the first cooling water tank and the second cooling water tank for alternating and circulating cooling. In addition, the mold cooling cavity is filled with paraffin phase change blocks, which absorb a large amount of latent heat by solid-liquid phase change, effectively buffering heat load fluctuations. Compared with traditional water cooling, the mold temperature control accuracy is improved, thereby reducing the start-up and shutdown frequency of the cooling equipment and achieving the effect of reducing energy consumption. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a perspective view of the overall structure of a rapid cooling device for stamping dies according to the present invention;

[0021] Figure 2 This is a rear-view perspective view of a rapid cooling device for stamping dies according to the present invention.

[0022] Figure 3 This is a three-dimensional cross-sectional view of the cooling chamber of a rapid cooling device for stamping dies according to this utility model.

[0023] Figure 4 This is a three-dimensional side sectional view of the upper die base of a rapid cooling device for stamping dies according to the present invention.

[0024] Figure 5 This is a three-dimensional cross-sectional view of the phase block of a rapid cooling device for stamping dies according to this utility model.

[0025] Figure 6 This is a three-dimensional structural view of the first cooling water tank of a rapid cooling device for stamping dies according to this utility model.

[0026] The labels in the diagram represent:

[0027] 1. Workbench; 2. Lower mold base; 3. Upper mold base; 4. Stamping groove; 5. Stamping block; 6. First cooling water tank; 7. Second cooling water tank; 8. Cooling chamber; 9. Heat conduction pipe; 10. Connecting pipe; 11. Stabilizing pipe; 12. Water supply hose; 13. Guide pipe; 14. Booster water pump; 15. Phase change block; 16. Notch; 17. Heat conduction plate; 18. Heat dissipation fins; 19. Mounting plate; 20. Mounting groove; 21. Cooling fan. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0029] In some embodiments, please refer to the accompanying drawings. Figures 1-6 A rapid cooling device for stamping dies includes a worktable 1, a lower die holder 2 fixedly mounted on the top surface of the worktable 1, an upper die holder 3 disposed above the lower die holder 2, a stamping groove 4 formed on the top surface of the lower die holder 2, and a stamping block 5 detachably connected to the bottom surface of the upper die holder 3. The top surface of the worktable 1 also includes:

[0030] The first cooling water tank 6 and the second cooling water tank 7 are arranged opposite each other on both sides of the lower mold base 2. The first cooling water tank 6 and the second cooling water tank 7 have the same structure.

[0031] A cooling device is installed on the surface of the first cooling water tank 6 and the second cooling water tank 7, and the cooling device is used to cool the coolant in the first cooling water tank 6 and the second cooling water tank 7.

[0032] The heat release mechanism is installed between the lower mold base 2, the upper mold base 3, the first cooling water tank 6, and the second cooling water tank 7. The heat release mechanism is used to remove the internal heat of the lower mold base 2 and the upper mold base 3.

[0033] Both the first cooling water tank 6 and the second cooling water tank 7 have water inlets on their top surfaces, and water plugs are inserted into the inner walls of the water inlets to replenish coolant to the first cooling water tank 6 and the second cooling water tank 7.

[0034] In this embodiment of the utility model, the cooling device includes a heat-conducting plate 17. A notch 16 is provided on one side wall of the first cooling water tank 6 and the second cooling water tank 7, and the heat-conducting plate 17 is fixedly connected to the inner wall of the notch 16. The cooling device includes a heat-conducting plate 17, and heat dissipation fins 18 are fixedly connected to the outer surface of the heat-conducting plate 17 by thermally conductive adhesive. A mounting plate 19 is fixedly connected to the heat dissipation surface of the heat dissipation fins 18. A rectangularly distributed mounting groove 20 is provided on the surface of the mounting plate 19. A cooling fan 21 is fixedly installed on the inner wall of the mounting groove 20 by a bracket with a bearing. By setting one side of the first cooling water tank 6 and the second cooling water tank 7 to be open, the heat-conducting plate 17 in the cooling device can be fixed at the opening and directly contact the water inside the first cooling water tank 6 and the second cooling water tank 7 to quickly dissipate heat.

[0035] In this embodiment of the invention, the heat release mechanism includes a phase-changing block 15. Cooling chambers 8 are provided inside both the lower mold base 2 and the upper mold base 3. Heat-conducting pipes 9 are installed inside the cooling chambers 8. Booster pumps 14 are fixedly installed on the outer surfaces of the first cooling water tank 6 and the second cooling water tank 7. Both ends of the heat-conducting pipes 9 are connected to the output ends of the booster pumps 14 via conveying components. The two booster pumps 14 are normally in a one-on-one-off state. The inner wall of the cooling chamber 8 is filled with the phase-changing block 15. The outer surface of the heat-conducting pipes 9 is embedded in the phase-changing block 15. The phase-changing block 15 is made of paraffin wax and occupies 75% of the volume of the cooling chamber 8 when it is solid. [The remaining text appears to be incomplete and requires further context.] When heat is generated, the phase-changing block 15 undergoes a phase change and becomes liquid. At this time, the booster water pump 14 on the surface of the first cooling water tank 6 or the second cooling water tank 7 is driven to allow cooling water to enter the heat conduction pipe 9. When the inside of the heat conduction pipe 9 is filled with cold water, the heat of the liquid phase-changing block 15 is carried away and gradually forms a solid. The cooling water with heat will then enter the first cooling water tank 6 or the second cooling water tank 7 where the booster water pump 14 is not turned on. Subsequently, the cooling device can be driven to cool the first cooling water tank 6 and the second cooling water tank 7 which contain hot water. The cooling cavity 8 inside the lower mold base 2 is close to the bottom of the stamping groove 4, and the cooling cavity 8 inside the upper mold base 3 is close to the top of the stamping block 5.

[0036] In one embodiment of this utility model, the conveying component includes a connecting pipe 10 that connects both ends of a heat-conducting pipe 9. The end of the connecting pipe 10 away from the heat-conducting pipe 9 extends through the cooling cavity 8 to the outside of the lower mold base 2 and the upper mold base 3. A guide pipe 13 is inserted into the surface of both the first cooling water tank 6 and the second cooling water tank 7. The outer surface of one end of the guide pipe 13 is connected to the output end of the booster water pump 14. The other end of the guide pipe 13 is connected to a water supply hose 12. The water supply hose 12 is connected to the connecting pipe 10. The water supply hose 12 and the guide pipe 13 on the same side are Y-shaped. The water supply hose 12 is designed as a hose so that cold water can be smoothly delivered during the stamping process of the lower mold base 2 and the upper mold base 3, maintaining stable support and flexibility as it moves up and down with the upper mold base 3. A reserved hole is opened at the point where the connecting pipe 10 passes through the lower mold base 2 and the upper mold base 3. A sealing ring is provided at the contact part between the connecting pipe 10 and the reserved hole to prevent liquid from flowing out of the cooling cavity 8.

[0037] In some embodiments, such as Figure 2-5 As shown, in a preferred embodiment of the present invention, a stabilizing pipe 11 is connected between the water supply hose 12 and the connecting pipe 10. The surface of the stabilizing pipe 11 is fixedly connected to the side walls of the lower mold base 2 and the upper mold base 3. By setting the stabilizing pipe 11, the part of the water supply hose 12 connected to the connecting pipe 10 can have an enhanced stability effect, avoiding shaking during use.

[0038] In this embodiment of the utility model, the heat pipe 9 has a multi-bend S-shaped structure and is closely arranged inside the cooling cavity 8. By setting the heat pipe 9 to be a multi-bend S-shaped structure closely arranged inside the cooling cavity 8, each bend of the pipe can contact the phase block 15, thereby improving the efficiency of heat removal when the phase block 15 is a liquid.

[0039] When the device is in use, the press drives the upper die holder 3 to move downwards, and the stamping block 5 contacts and extrudes the sheet metal in the stamping groove 4. During this process, the lower die holder 2 and the upper die holder 3 generate a large amount of heat due to friction and material deformation. The phase-changing block 15 in the cooling chamber 8 begins to absorb heat and gradually melts into a liquid state, buffering the rapid rise in the mold temperature. At this time, one of the booster water pumps 14 is activated, and the cold water in the first cooling water tank 6 enters the heat conduction pipe 9 through the guide pipe 13, water delivery hose 12, and connecting pipe 10. In the multi-bend S-shaped pipeline, it fully exchanges heat with the liquid phase-changing block 15, carrying away the heat from the mold. After absorbing heat, the hot water flows into the second cooling water tank 7 through another pipe. While the first cooling water tank 6 provides cooling for the mold, the cooling device on the surface of the second cooling water tank 7 is activated. The heat conduction plate 17 conducts the heat of the hot water in the tank to the heat dissipation fins 18. The cooling fan 21 accelerates the airflow and quickly reduces the water temperature in the second cooling water tank 7. When the water temperature in the second cooling water tank 7 drops to close to the initial temperature, the booster pump 14 switches to working mode. The second cooling water tank 7 provides cold water to the mold, and the first cooling water tank 6 dissipates heat. This cycle repeats continuously to cool the mold.

[0040] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A rapid cooling device for stamping dies, comprising a workbench (1), a lower die holder (2) fixedly mounted on the top surface of the workbench (1), an upper die holder (3) disposed above the lower die holder (2), a stamping groove (4) formed on the top surface of the lower die holder (2), and a stamping block (5) detachably connected to the bottom surface of the upper die holder (3), characterized in that: The top surface of the workbench (1) is also equipped with: The first cooling water tank (6) and the second cooling water tank (7) are arranged opposite to each other on both sides of the lower mold base (2), and the bottom surfaces of the first cooling water tank (6) and the second cooling water tank (7) are fixedly connected to the worktable (1). The first cooling water tank (6) and the second cooling water tank (7) have the same structure. A cooling device is installed on the surface of a first cooling water tank (6) and a second cooling water tank (7), and the cooling device is used to cool the coolant in the first cooling water tank (6) and the second cooling water tank (7); A heat release mechanism is installed between the lower mold base (2), the upper mold base (3), the first cooling water tank (6), and the second cooling water tank (7). The heat release mechanism is used to remove heat from the lower mold base (2) and the upper mold base (3).

2. The rapid cooling device for stamping dies according to claim 1, characterized in that, The cooling device includes a heat-conducting plate (17). A notch (16) is provided on one side wall of the first cooling water tank (6) and the second cooling water tank (7), and the heat-conducting plate (17) is fixedly connected to the inner wall of the notch (16). The cooling device includes a heat-conducting plate (17). A heat dissipation fin (18) is fixedly connected to the outer surface of the heat-conducting plate (17) by thermal adhesive. A mounting plate (19) is fixedly connected to the heat dissipation surface of the heat dissipation fin (18). A rectangular mounting groove (20) is provided on the surface of the mounting plate (19). A cooling fan (21) is fixedly installed on the inner wall of the mounting groove (20) by a bracket.

3. The rapid cooling device for stamping dies according to claim 1, characterized in that, The heat release mechanism includes a phase-changing block (15). Cooling chambers (8) are provided inside both the lower mold base (2) and the upper mold base (3). A heat-conducting pipe (9) is provided inside the cooling chamber (8). A booster water pump (14) is fixedly installed on the outer surface of the first cooling water tank (6) and the second cooling water tank (7). Both ends of the heat-conducting pipe (9) are connected to the output end of the booster water pump (14) through a conveying component. The two booster water pumps (14) are normally in a state of one on and one off. The inner wall of the cooling chamber (8) is filled with the phase-changing block (15). The outer surface of the heat-conducting pipe (9) is embedded in the phase-changing block (15).

4. The rapid cooling device for stamping dies according to claim 3, characterized in that, The conveying component includes a connecting pipe (10) that connects both ends of a heat-conducting pipe (9). The end of the connecting pipe (10) away from the heat-conducting pipe (9) extends through the cooling cavity (8) to the outside of the lower mold base (2) and the upper mold base (3). The surfaces of the first cooling water tank (6) and the second cooling water tank (7) are both connected to a guide pipe (13). The outer surface of one end of the guide pipe (13) is connected to the output end of the booster water pump (14). The other end of the guide pipe (13) is connected to a water delivery hose (12). The water delivery hose (12) is connected to the connecting pipe (10).

5. The rapid cooling device for stamping dies according to claim 4, characterized in that, A stabilizing pipe (11) is connected between the water delivery hose (12) and the connecting pipe (10), and the surface of the stabilizing pipe (11) is fixedly connected to the side wall of the lower mold base (2) and the upper mold base (3).

6. The rapid cooling device for stamping dies according to claim 3, characterized in that, The heat pipe (9) has a multi-bend S-shaped structure and is closely arranged inside the cooling cavity (8).

7. The rapid cooling device for stamping dies according to claim 3, characterized in that, The cooling chamber (8) inside the lower die holder (2) is close to the bottom of the stamping groove (4), and the cooling chamber (8) inside the upper die holder (3) is close to the top of the stamping block (5).

8. The rapid cooling device for stamping dies according to claim 1, characterized in that, The top surfaces of the first cooling water tank (6) and the second cooling water tank (7) are provided with water inlets, and water inlets are provided with water plugs inserted into the inner walls of the water inlets.

Images