A die casting device for zinc ingot production
By introducing a cooling mechanism and a preheating component into the die-casting device for zinc ingot production, the problem of unsatisfactory heating and cooling effect inside the mold was solved, and rapid preheating and cooling of zinc ingots and improved forming efficiency were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-14
AI Technical Summary
The existing die-casting equipment for zinc ingot production has unsatisfactory heating and cooling effects within the mold during zinc ingot processing, which affects the efficiency of removing finished zinc ingots and reduces the processing effect.
A cooling mechanism and a preheating assembly are employed. The cooling mechanism includes cooling pipes, a semiconductor refrigeration chip, a cooling rod, and a water pump. The cooling of the zinc ingot is accelerated by the circulation of coolant and the cooling effect of the semiconductor refrigeration chip. The preheating assembly heats the mold evenly through a heating rod and a heating plate, thereby improving the forming efficiency of the zinc ingot.
This technology enables rapid preheating and cooling of zinc ingots, improving the forming efficiency of zinc ingots and the extraction efficiency of finished products, thus enhancing the processing effect of the die-casting equipment.
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Figure CN224487641U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of zinc ingot production technology, and in particular to a die-casting device for zinc ingot production. Background Technology
[0002] Zinc ingots are refined zinc products, typically with a purity of no less than 90%, primarily produced through pyrometallurgical processes (carbon reduction of zinc oxide) or hydrometallurgical processes (electrolytic deposition). Their core applications include manufacturing die-casting alloys, battery casings, galvanized anti-corrosion coatings, and as chemical raw materials. Zinc-copper-titanium alloys and other materials can have improved mechanical properties. When using zinc ingots as raw materials to smelt and process zinc alloys, die-casting equipment is required to shape the zinc ingots.
[0003] As shown in the reference case "A die-casting device for producing zinc alloy ingots" announcement number "CN216226604U", after the die-casting table completes the die-casting workpiece, the workpiece is not under any force. At this time, the support plate can lift the workpiece through the elasticity of the spring, which facilitates the picking up of the workpiece and improves the processing efficiency. The first horizontal plate is moved by the hydraulic cylinder, and the first horizontal plate moves the die-casting table through the vertical plate, etc. At the same time, the first horizontal plate moves the sleeve at the second vertical rod through the T-shaped plate, which can make the movement of the die-casting table more stable.
[0004] According to the above reference materials, in the above device, the hydraulic cylinder drives the first horizontal plate to move downward, and the die-casting table also moves with the first horizontal plate. At the same time, the first horizontal plate drives the sleeve to move at the second vertical rod through the T-shaped plate. When the bottom of the die-casting table is in contact with the workpiece, the die-casting table can squeeze the support plate through the workpiece. However, when the device processes zinc ingots, the heating and cooling effect of the zinc ingot in the mold is not ideal, which affects the efficiency of taking out the finished zinc ingot. It is also inconvenient to quickly preheat and cool the zinc ingot, which reduces the processing effect of the die-casting device. Utility Model Content
[0005] Therefore, it is necessary to provide a die-casting device for zinc ingot production to address the problem of inconvenience in rapidly preheating and cooling zinc ingots.
[0006] The device includes two molds, one side of which is fixedly connected to a cooling box; a cooling mechanism, which can rapidly preheat and cool the device during zinc ingot die casting, is disposed on the inner wall of the mold; wherein, the cooling mechanism includes cooling pipes fixedly connected to the inner wall of the mold, the cooling pipes being evenly arranged on the inner wall of the mold, a semiconductor refrigeration chip being installed at the top of the inner wall of the cooling box, a conduction plate being fixedly connected to the bottom of the semiconductor refrigeration chip, two cooling rods being fixedly connected to the bottom of the conduction plate, one end of the cooling rods penetrating to the inner wall of the cooling box, and a preheating component being disposed on the inner wall of the mold.
[0007] In one embodiment, the cooling mechanism further includes a water pump connected to the bottom of the cooling tank, one end of which is connected to one end of a cooling pipe.
[0008] In one embodiment, the other end of the cooling pipe is connected to the top of one side of the cooling tank.
[0009] In one embodiment, a heat sink is mounted on the top of the semiconductor cooling chip.
[0010] In one embodiment, the top of the radiator extends to the outside of the cooling box.
[0011] In one embodiment, a cooling fan is mounted on the top of the heat sink.
[0012] In one embodiment, the preheating assembly includes a first heating plate fixedly connected to both sides of the inner wall of the mold, and a heating rod is installed on one side of the first heating plate.
[0013] In one embodiment, two second heating plates are installed in the middle of the inner wall of the mold, and both sides of the second heating plates are fixedly connected to the two first heating plates. Beneficial effects
[0014] 1. The above-mentioned die-casting device for zinc ingot production has two cooling pipes evenly distributed in two molds, which can quickly cool the zinc ingots in the molds. The water pump works in conjunction with the cooling box to deliver coolant, which flows in the cooling pipes to cool the molds. The cooling pipes deliver the coolant to the cooling box, forming a water circulation and improving the cooling effect of the device. The cold end of the bottom of the semiconductor refrigeration chip at the top of the cooling box generates cold air, which comes into contact with the conduction plate and conducts the cold air to the cooling rod. The cooling rod can cool the cooling water in the cooling box. The heat sink comes into contact with the heat at the top of the semiconductor refrigeration chip and conducts heat. The cooling fan can improve the heat dissipation effect of the heat sink, which can quickly dissipate heat and cool the die-casting device, improving the forming efficiency of zinc ingots.
[0015] 2. When die-casting zinc ingots, two heating rods and two first heating plates are respectively set on both sides of the mold. When the heating rods are heating, the first heating plates can absorb and conduct the heat generated by the heating rods. The two second heating plates are in contact with the two first heating plates and can conduct heat to the mold, so as to heat the mold evenly and improve the preheating effect of the die-casting device. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the external structure of the present utility model;
[0018] Figure 2 This is a schematic diagram of the cooling mechanism structure of this utility model;
[0019] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle;
[0020] Figure 4 This is a partial structural diagram of the cooling mechanism of this utility model;
[0021] Figure 5 This is a schematic diagram of the preheating component structure of this utility model.
[0022] Figure label:
[0023] 100. Mold; 200. Cooling box; 300. Cooling mechanism; 310. Cooling pipe; 320. Semiconductor cooling chip; 330. Conductive plate; 340. Cooling rod; 350. Water pump; 360. Radiator; 370. Cooling fan; 380. Preheating assembly; 381. First heating plate; 382. Heating rod; 383. Second heating plate. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0025] The following is combined with Figure 1 - Figure 5 This invention describes a die-casting apparatus for zinc ingot production.
[0026] In one embodiment, a die-casting apparatus for zinc ingot production includes two molds 100, with a cooling box 200 fixedly connected to one side of each mold 100; a cooling mechanism 300, which can rapidly preheat and cool the apparatus during zinc ingot die-casting, is disposed on the inner wall of the molds 100; wherein, the cooling mechanism 300 includes cooling pipes 310 fixedly connected to the inner wall of the molds 100, the cooling pipes 310 being evenly arranged on the inner wall of the molds 100, a semiconductor cooling chip 320 being installed at the top of the inner wall of the cooling box 200, a conduction plate 330 being fixedly connected to the bottom of the semiconductor cooling chip 320, two cooling rods 340 being fixedly connected to the bottom of the conduction plate 330, one end of the cooling rods 340 penetrating into the inner wall of the cooling box 200, and a preheating assembly 380 being disposed on the inner wall of the molds 100.
[0027] It should be noted that the "DM650SM" die-casting machine consists of a mold clamping mechanism, an injection mechanism, hydraulic components, and electrical control components.
[0028] Mold closing mechanism: Drives the die-casting mold to close and open. When the mold 100 is closed, it has sufficient capacity to lock the mold 100, ensuring that the parting surface of the mold 100 will not expand during the injection filling process.
[0029] Injection mechanism: pushes the molten metal in the pressure chamber at a specified speed, and has enough energy to make it flow through the sprue and ingate in the mold 100, and then fill the cavity of the mold 100. Then, it maintains a certain pressure and transmits it to the solidifying molten metal until the die casting is formed.
[0030] Hydraulic components: provide sufficient power and energy for the operation of the die-casting machine.
[0031] Electrical control components: control the execution actions of each mechanism of the die-casting machine to operate according to a predetermined program.
[0032] When the zinc ingot is die-cast in the mold 100, the cooling mechanism 300 can cool the zinc ingot in the mold 100 through the cooling pipe 310. The coolant in the cooling pipe 310 can be cooled by the semiconductor cooling chip 320 on the cooling box 200 in conjunction with the conduction plate 330 and the cooling rod 340. When the zinc ingot is die-cast, the preheating component 380 can heat the mold 100 in conjunction with the heating rod 382, the first heating plate 381 and the second heating plate 383, thereby improving the die-casting effect of the zinc ingot without affecting the normal use of the die-casting device.
[0033] like Figure 2 , Figure 3 and Figure 4As shown, the cooling mechanism 300 also includes a water pump 350 connected to the bottom of the cooling box 200. One end of the water pump 350 is connected to one end of the cooling pipe 310, and the other end of the cooling pipe 310 is connected to the top of one side of the cooling box 200. A heat sink 360 is installed on the top of the semiconductor cooling chip 320. The top of the heat sink 360 extends to the outside of the cooling box 200, and a cooling fan 370 is installed on the top of the heat sink 360.
[0034] In this embodiment, when the zinc ingot die casting is completed, the cooling pipe 310 is installed inside the mold 100. The water pump 350 can transport the coolant in the cooling tank 200 to the cooling pipe 310. The coolant flows in the cooling pipe 310 to dissipate heat and cool the mold 100 and the zinc ingot, accelerating the forming of the zinc ingot. When the cooling pipe 310 transports the heat-absorbing coolant to the cooling tank 200, the bottom end of the semiconductor refrigeration chip 320 generates cold air. The bottom end of the semiconductor refrigeration chip 320 contacts the conduction plate 330 and the cooling rod 340 to cool the cooling water in the cooling tank 200. The cooling fan 370 and the radiator 360 can dissipate heat from the hot end of the top of the semiconductor refrigeration chip 320, which can quickly cool the die casting device and improve the forming efficiency of the zinc ingot.
[0035] like Figure 5 As shown, the preheating assembly 380 includes a first heating plate 381 fixedly connected to both sides of the inner wall of the mold 100, a heating rod 382 installed on one side of the first heating plate 381, and two second heating plates 383 installed in the middle of the inner wall of the mold 100. Both sides of the second heating plate 383 are fixedly connected to the two first heating plates 381.
[0036] In this embodiment, when the zinc ingot is die-cast, the heating rod 382 is energized and heated. The first heating plate 381 is in contact with the heating rod 382, which can collect and conduct the heat emitted by the heating rod 382. The first heating plate 381 is in contact with the second heating plate 383, which can conduct the heat. The zinc ingot in the mold 100 is heated evenly, and the mold 100 can be preheated quickly, thereby improving the die-casting effect of the zinc ingot.
[0037] Working principle: Two molds 100 are connected together, and zinc ingots are conveyed through the injection tank. The heating rod 382 is energized and heated by the electrical control unit. The heat generated by the heating rod 382 is absorbed and concentrated by the first heating plate 381, and then transferred to the second heating plate 383, heating the zinc ingots inside the mold 100. After the zinc ingot injection is completed, the electrical control unit drives the water pump 350 to transport coolant from the cooling tank 200 to the cooling pipe 310. The coolant flowing inside the cooling pipe 310 absorbs the heat from the mold 100 and the zinc ingot. The coolant is then transported to the cooling box 200. When the electric control unit powers the semiconductor refrigeration chip 320, the bottom of the semiconductor refrigeration chip 320 generates cold air, which, in conjunction with the cooling rods 340 on both sides of the conduction plate 330, transports the cold air to the cooling box 200 to cool the coolant. The electric control unit drives the cooling fan 370 to move, which, in conjunction with the heat sink 360, dissipates heat from the hot end of the semiconductor refrigeration chip 320.
[0038] It should be noted that the semiconductor cooling chip 320, water pump 350, cooling fan 370, and heating rod 382 mentioned above are all devices with relatively mature existing technology. The specific model can be selected according to actual needs. At the same time, the semiconductor cooling chip 320, water pump 350, cooling fan 370, and heating rod 382 can be powered by the built-in power supply or by the mains power. The specific power supply method should be selected according to the situation, and will not be elaborated here.
[0039] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A die-casting apparatus for zinc ingot production, characterized in that, include: Two molds (100), one side of which is fixedly connected to a cooling box (200); A cooling mechanism (300) is provided on the inner wall of the mold (100) to rapidly preheat and cool the device during zinc ingot die casting. The cooling mechanism (300) includes a cooling pipe (310) fixedly connected to the inner wall of the mold (100). The cooling pipe (310) is evenly arranged on the inner wall of the mold (100). A semiconductor refrigeration chip (320) is installed at the top of the inner wall of the cooling box (200). A conduction plate (330) is fixedly connected to the bottom of the semiconductor refrigeration chip (320). Two cooling rods (340) are fixedly connected to the bottom of the conduction plate (330). One end of the cooling rod (340) extends through the inner wall of the cooling box (200). A preheating component (380) is provided on the inner wall of the mold (100).
2. The die-casting apparatus for zinc ingot production according to claim 1, characterized in that, The cooling mechanism (300) also includes a water pump (350) connected to the bottom of the cooling tank (200), one end of which is connected to one end of the cooling pipe (310).
3. The die-casting apparatus for zinc ingot production according to claim 1, characterized in that, The other end of the cooling pipe (310) is connected to the top of one side of the cooling box (200).
4. The die-casting apparatus for zinc ingot production according to claim 1, characterized in that, A heat sink (360) is mounted on the top of the semiconductor cooling chip (320).
5. The die-casting apparatus for zinc ingot production according to claim 4, characterized in that, The top of the radiator (360) extends to the outside of the cooling box (200).
6. The die-casting apparatus for zinc ingot production according to claim 4, characterized in that, A cooling fan (370) is mounted on the top of the radiator (360).
7. The die-casting apparatus for zinc ingot production according to claim 1, characterized in that, The preheating component (380) includes a first heating plate (381) fixedly connected to both sides of the inner wall of the mold (100), and a heating rod (382) is installed on one side of the first heating plate (381).
8. The die-casting apparatus for zinc ingot production according to claim 7, characterized in that, Two second heating plates (383) are installed in the middle of the inner wall of the mold (100), and both sides of the second heating plates (383) are fixedly connected to the two first heating plates (381).