Silicon photonic chip bonding apparatus based on automated vision processing

Abstract

The utility model discloses a kind of silicon optical chip welding devices based on automation vision processing, comprising: workbench;Material carrying module is used to carry silicon light chip to be welded;Visual welding module is set to the position above material carrying module;Mobile vision module is set to the position of one side of material carrying module, and mobile vision module is equipped with mutually independent image capture end and monitoring end;Fine adjustment limit module is set to the position of one side of mobile vision module, and fine adjustment limit module is equipped with first limit end and second limit end;First limit end extends to chip placement area and contacts with the welding part of silicon light chip to be welded, and second limit end is set to the wiring end of silicon light chip to be welded;The utility model can adopt multiple degree-of-freedom precision electric control framework and multidimensional adaptive light source system collaborative design, construct vision detection and welding process dynamic optimization real-time closed loop system, realize silicon light chip high-precision welding control.

Description

Technical Field

[0001] This utility model relates to the field of chip welding equipment, and in particular to a silicon photonic chip welding device based on automated vision processing. Background Technology

[0002] Current silicon photonics chip welding equipment suffers from structural design defects that limit process precision. Its insufficient modularity leads to the physical separation of vision processing and welding execution units, resulting in a functional disconnect between "vision and welding".

[0003] Traditional equipment uses rigid robotic arms combined with offline vision positioning, resulting in large positioning errors, low welding yield, and the need for manual intervention to adjust parameters, leading to poor automation productivity. Existing structural designs do not consider the coordination between multi-degree-of-freedom motion and optical imaging, causing the vision system to be unable to compensate for thermal deformation during welding in real time, resulting in solder joint offsets exceeding process thresholds. Furthermore, the welding precision requirements for silicon photonic chips are extremely high, but existing equipment frameworks lack a high-precision reference transfer structure, causing cumulative errors to grow exponentially during multi-axis linkage. This structural limitation makes it difficult to embed intelligent algorithms into the hardware execution layer, preventing the construction of a closed-loop system for visual feature extraction and welding parameter control, thus hindering the intelligent upgrade of heterogeneous integration processes. Utility Model Content

[0004] The main objective of this invention is to provide a silicon photonics chip welding device based on automated vision processing, thereby solving all or one of the aforementioned problems in the prior art.

[0005] To solve the above-mentioned technical problems, the present invention provides a silicon photonics chip welding device based on automated vision processing, comprising:

[0006] A workbench, and a vision welding module, a moving vision module, a fine-tuning limiting module and a material loading module installed on the workbench;

[0007] The material carrier module is installed at the edge of the workbench. The material carrier module is provided with a chip placement area, which is used to support the silicon photonic chip to be soldered.

[0008] The vision welding module is positioned above the material carrier module, and both sides of the vision welding module are connected to the worktable. The vision welding module is used to acquire visual images of the silicon photonic chip to be welded and to perform welding actions.

[0009] The mobile vision module is positioned on one side of the material carrier module and avoids the vision welding module. The mobile vision module is equipped with an independent image capture end and a monitoring end. The image capture end is used to provide supplemental lighting and acquire visual images of the chip placement area. The monitoring end is used to detect defects in the welding process of the silicon photonic chip to be welded.

[0010] The fine-tuning limiting module is located near the material carrier module on one side of the mobile vision module, and the fine-tuning limiting module is provided with a first limiting end and a second limiting end; the first limiting end extends to the chip placement area and contacts the welding part of the silicon photonic chip to be welded, and the second limiting end is provided corresponding to the wiring terminal of the silicon photonic chip to be welded.

[0011] As an improved solution, the loading module includes:

[0012] The base is horizontally positioned on the upper surface of the worktable.

[0013] The first turntable is horizontally positioned on the upper surface of the base;

[0014] The material carrier is horizontally disposed on the upper surface of the first turntable. The first turntable is used to control the material carrier to rotate about the central axis of the first turntable. The upper surface of the material carrier is provided with the chip placement area.

[0015] As an improved solution, the vision welding module includes:

[0016] A frame is disposed on the workbench above the material support section, with the top of the frame higher than the material support section, and both sides of the frame connected to the upper surface of the workbench.

[0017] The X-axis electrically controlled linear module is horizontally mounted on the top of the platform;

[0018] The Z-axis electrically controlled linear module is vertically and movably mounted on the slider of the X-axis electrically controlled linear module; the X-axis electrically controlled linear module is used to drive the Z-axis electrically controlled linear module to perform horizontal displacement along the length direction of the Z-axis electrically controlled linear module.

[0019] A dual-station welding unit is positioned between the platform and the material carrier. Vertical connecting members, which avoid the platform, are connected to both sides of the dual-station welding unit. These two vertical connecting members extend upwards and connect to the slider of the Z-axis electrically controlled linear module. The Z-axis electrically controlled linear module controls the vertical displacement of the dual-station welding unit along its length. The dual-station welding unit performs welding operations on the silicon photonic chip to be welded on the material carrier.

[0020] As an improved solution, the dual-station welding unit includes:

[0021] A connecting plate is positioned horizontally and close to the lower part of the platform, with its upper surface connected to two vertical connecting members on both sides.

[0022] The fine-tuning linear module is vertically positioned on one side of the connecting plate, corresponding to the position of the material carrying part;

[0023] A first visual camera is vertically mounted on the telescopic end of the fine-tuning linear module. The lens of the first visual camera is vertically downward, and a first light source is provided around the outer edge of the lens of the first visual camera. The fine-tuning linear module is used to control the vertical displacement of the first visual camera. The first visual camera is used to acquire visual images of the silicon photonic chip to be welded, and the first light source is used for supplementary lighting.

[0024] A pair of welding cameras are symmetrically arranged on both sides of the first vision camera, and the two welding cameras are respectively connected to the two sides of the lower surface of the connecting plate through movable mounting parts; the pair of welding cameras are used to perform the welding action on the silicon photonic chip to be welded.

[0025] As an improved solution, each of the aforementioned active mounting components includes:

[0026] A vertical mounting part is installed on the lower surface of the connecting plate;

[0027] The turntable base is installed at the bottom of the vertical mounting part;

[0028] The second turntable is vertically mounted on the turntable base facing the first vision camera; each welding camera is fixed to the corresponding second turntable via a camera mounting base; the second turntable is used to drive the corresponding welding camera to rotate about the central axis of the second turntable.

[0029] As an improved solution, the mobile vision module includes:

[0030] The Y-axis electrically controlled linear module is horizontally mounted on the upper surface of the worktable and is located between the dual-station welding unit and the material carrying part.

[0031] The first support is vertically mounted on the slider of the Y-axis electrically controlled linear module. The Y-axis electrically controlled linear module is used to drive the first support to move horizontally along the length direction of the Y-axis electrically controlled linear module.

[0032] The second vision camera is rotatably and tiltedly mounted on one side of the top of the first support base and corresponding to the position of the material carrier. The lens of the first vision camera is set towards the material carrier. A second light source is provided around the outer edge of the lens of the second vision camera. The second vision camera is used to cooperate with the first vision camera to acquire visual images of the silicon photonic chip to be welded. The second light source is used for supplementary lighting. The second vision camera is the image capture end.

[0033] As an improved solution, the mobile vision module further includes:

[0034] The fourth electrically controlled linear module is horizontally positioned on the upper surface of the worktable between the Y-axis electrically controlled linear module and the material carrier; the fourth electrically controlled linear module is inclined relative to the Y-axis electrically controlled linear module.

[0035] The second support is vertically mounted on the slider of the fourth electronically controlled linear module. The upper end of the second support extends to the position directly above the chip placement area. The fourth electronically controlled linear module is used to drive the second support to move horizontally along the length direction of the fourth electronically controlled linear module, thereby moving it closer to or away from the material carrier.

[0036] A visual monitoring module is vertically mounted on the upper end of the second support base and located directly above the chip placement area; the visual monitoring module is the monitoring end, used to detect defects in the welding action of the silicon photonic chip to be welded.

[0037] As an improved solution, the first support base and the second support base have the same structure, both including:

[0038] A horizontally set manual X-axis slide;

[0039] A Y-axis manual slide is horizontally and slidably mounted on the X-axis manual slide, the X-axis manual slide being used to control the displacement of the Y-axis manual slide on the X-axis;

[0040] A vertical part is vertically and slidably disposed on the Y-axis manual slide, the Y-axis manual slide being used to control the displacement of the vertical part on the Y-axis;

[0041] A Z-axis manual slide table is vertically mounted on one side of the vertical part;

[0042] The visual monitoring module or the second visual camera is connected to the Z-axis manual slide; the Z-axis manual slide is used to control the displacement of the visual monitoring module or the second visual camera on the Z-axis.

[0043] As an improved solution, the fine-tuning limiting module includes:

[0044] The X-axis electrically controlled slide is horizontally positioned on the worktable near the material carrying part.

[0045] The Y-axis electrically controlled slide is horizontally mounted on the X-axis electrically controlled slide, and the X-axis electrically controlled slide is used to control the displacement of the Y-axis electrically controlled slide in the X-axis direction;

[0046] A composite support is mounted on the Y-axis electrically controlled slide, which is used to control the displacement of the composite support in the Y-axis direction; one end of the composite support extends toward the material carrier, and there is a distance between the end of the composite support toward the material carrier and the material carrier;

[0047] The first limiting end and the second limiting end are respectively disposed on the upper and lower sides of the composite support. The first limiting end is inclined and its end extends to the chip placement area and contacts the welding part of the silicon photonic chip to be welded. The connecting wire of the silicon photonic chip to be welded is fixed inside the second limiting end.

[0048] As an improved solution, the composite support includes:

[0049] The first horizontal support is horizontally mounted on the Y-axis electrically controlled slide.

[0050] A vertical support portion is vertically disposed on the upper surface of the first horizontal support portion;

[0051] The Z-axis electrically controlled slide is vertically mounted on one side of the vertical support section;

[0052] The second horizontal support is vertically disposed on one side of the Z-axis electrically controlled slide. The Z-axis electrically controlled slide is used to control the displacement of the second horizontal support in the horizontal direction. The front end of the second horizontal support extends to a position close to the material carrying part.

[0053] The first limiting end and the second limiting end are respectively installed on the upper and lower sides of the second horizontal support.

[0054] The beneficial effects of this utility model are:

[0055] The silicon photonics chip welding device based on automated vision processing described in this utility model can adopt a multi-degree-of-freedom precision electronic control architecture and a multi-dimensional adaptive light source system in a collaborative design to construct a real-time closed-loop system for dynamic optimization of vision inspection and welding process, thereby achieving high-precision welding control of silicon photonics chips. Employing a modular topology architecture, the light source module has a multi-angle adjustment range, and the welding equipment also supports flexible welding position adjustment, effectively improving the welding efficiency and yield of silicon photonics chips, reducing the frequency of manual intervention, overcoming the shortcomings of existing technologies, and possessing high application value. Attached Figure Description

[0056] Figure 1 This is a three-dimensional structural schematic diagram of a silicon photonics chip welding device based on automated vision processing in an embodiment of this utility model;

[0057] Figure 2 This is a front view structural diagram of a silicon photonics chip welding device based on automated vision processing according to an embodiment of this utility model;

[0058] Figure 3 yes Figure 1 Enlarged structural diagram at point A;

[0059] Figure 4 This is a three-dimensional structural diagram of a silicon photonics chip welding device based on automated vision processing in an embodiment of this utility model, viewed from another perspective.

[0060] The components in the attached diagram are labeled as follows:

[0061] 1. Workbench; 2. Base; 3. First turntable; 4. Material support unit;

[0062] 5. Stand; 6. X-axis electrically controlled linear module; 7. Z-axis electrically controlled linear module; 701. Vertical connector; 8. Connecting plate; 9. Fine-tuning linear module; 10. First vision camera; 11. First light source unit; 12. Welding camera; 13. Vertical mounting unit; 14. Turntable base; 15. Second turntable; 1501. Camera mounting base;

[0063] 16. Y-axis electrically controlled linear module; 17. First support base; 18. Second vision camera; 19. Second light source unit;

[0064] 20. Fourth electronically controlled linear module; 21. Second support base; 22. Visual monitoring module;

[0065] 23. X-axis electrically controlled slide; 24. Y-axis electrically controlled slide; 25. First horizontal support; 26. Vertical support; 27. Z-axis electrically controlled slide; 28. Second horizontal support; 29. ​​First limiting end; 30. Second limiting end;

[0066] 31. Silicon photonic chip to be soldered; 32. Connecting wire. Detailed Implementation

[0067] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0068] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0070] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0071] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0072] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0073] Please see Figures 1-4 The embodiments of this utility model include:

[0074] A silicon photonics chip bonding apparatus based on automated vision processing includes:

[0075] Workbench 1, and a vision welding module, a moving vision module, a fine-tuning limit module and a material loading module installed on the workbench 1;

[0076] A material carrier module is installed at the edge of the workbench 1. The material carrier module has a chip placement area, which is used to hold the silicon photonic chip 31 to be welded.

[0077] The vision welding module is positioned above the material carrier module, and its two sides are connected to the worktable 1. The vision welding module is used to acquire visual images of the silicon photonic chip 31 to be welded and to perform welding actions.

[0078] The mobile vision module is positioned on one side of the material carrier module and avoids the vision welding module. The mobile vision module is equipped with an independent image capture end and a monitoring end. The image capture end is used to provide supplementary lighting and acquire visual images of the chip placement area. The monitoring end is used to detect defects in the welding process of the silicon photonic chip 31 to be welded.

[0079] The fine-tuning limiting module is located near the material carrier module on one side of the moving vision module, and the fine-tuning limiting module is provided with a first limiting end 29 and a second limiting end 30; the first limiting end 29 extends to the chip placement area and contacts the welding part of the silicon photonic chip 31 to be welded, and the second limiting end 30 is provided corresponding to the wiring terminal of the silicon photonic chip 31 to be welded.

[0080] The following is a detailed description of the structure and function of each module:

[0081] Specifically, the material carrier module includes: a base 2, horizontally disposed on the upper surface of the worktable 1; a first turntable 3, horizontally disposed on the upper surface of the base 2; and a material carrier 4, horizontally disposed on the upper surface of the first turntable 3. The first turntable 3 is used to control the material carrier 4 to rotate around the central axis of the first turntable 3. The upper surface of the material carrier 4 is provided with a chip placement area. Through the design of the first turntable 3, the position of the silicon photonic chip 31 to be welded can be finely adjusted, thereby improving the welding accuracy and flexibility.

[0082] Specifically, the vision welding module includes: a frame 5, positioned on the worktable 1 above the material support section 4, with the top of the frame 5 higher than the material support section 4, and both sides of the frame 5 extending downwards to connect with the upper surface of the worktable 1; an X-axis electrically controlled linear module 6, horizontally positioned on the top of the frame 5; a Z-axis electrically controlled linear module 7, vertically and movably positioned on the slider of the X-axis electrically controlled linear module 6; the X-axis electrically controlled linear module 6 is used to drive the Z-axis electrically controlled linear module 7 to perform horizontal displacement along the length direction of the Z-axis electrically controlled linear module 7; both the X-axis electrically controlled linear module 6 and the Z-axis electrically controlled linear module 7 can be conventional motor-driven linear modules; and a dual-station welding unit, positioned on the worktable. The position between the frame 5 and the material carrier 4, and the two sides of the dual-station welding unit are respectively connected to the vertical connecting parts 701 provided on the clearance frame 5. The two vertical connecting parts 701 extend upward and are connected to the slider of the Z-axis electrically controlled linear module 7. The Z-axis electrically controlled linear module 7 is used to control the vertical displacement of the dual-station welding unit along the length direction of the Z-axis electrically controlled linear module 7. The dual-station welding unit is used to perform welding action on the silicon photonic chip 31 to be welded on the material carrier 4. Under the drive of the Z-axis electrically controlled linear module 7 and the X-axis electrically controlled linear module 6, the dual-station welding unit can flexibly and accurately align the part to be welded of the silicon photonic chip 31 to be welded and complete the welding work.

[0083] As one embodiment of this utility model, the dual-station welding unit includes: a connecting plate 8, horizontally positioned near the lower part of the frame 5, with its upper surface connected to two vertical connecting parts 701 on the left and right sides respectively; a fine-tuning linear module 9, vertically positioned on one side of the connecting plate 8 corresponding to the material carrying part 4; a first vision camera 10, vertically mounted on the telescopic end of the fine-tuning linear module 9, with the lens of the first vision camera 10 facing vertically downwards, and an annular first light source part 11 surrounding the outer edge of the lens of the first vision camera 10; the fine-tuning linear module 9 is used to control the vertical displacement of the first vision camera 10; the first vision camera 10 is an industrial inspection camera used to acquire visual images of the silicon photonic chip 31 to be welded, and the first light source part 11 is used for supplementary lighting; a pair of welding cameras 12, symmetrically positioned on both sides of the first vision camera 10, and the two welding cameras 12 are respectively connected to the lower surface of the connecting plate 8 via movable mounting parts; the pair of welding cameras 12 are used to perform welding actions on the silicon photonic chip 31 to be welded.

[0084] In one embodiment of this utility model, each movable mounting component includes: a vertical mounting part 13, mounted on the lower surface of the connecting plate 8; a turntable base 14, mounted on the bottom of the vertical mounting part 13; and a second turntable 15, vertically mounted on the turntable base 14 facing the first vision camera 10. Each welding camera 12 is fixed to the corresponding second turntable 15 via a camera mounting base 1501. The second turntable 15 is used to drive the corresponding welding camera 12 to rotate around the central axis of the second turntable 15. Under the action of the second turntable 15, the welding camera 12 can also flexibly complete the corresponding welding work.

[0085] Specifically, the mobile vision module includes: a Y-axis electrically controlled linear module 16, horizontally positioned on the upper surface of the worktable 1 and located between the dual-station welding unit and the material carrier 4; the Y-axis electrically controlled linear module 16 also adopts an existing motor-driven linear module; a first support base 17, vertically mounted on the slider of the Y-axis electrically controlled linear module 16, the Y-axis electrically controlled linear module 16 being used to drive the first support base 17 to move horizontally along the length direction of the Y-axis electrically controlled linear module 16; and a second vision camera 18, rotatably and obliquely mounted on one side of the top of the first support base 17 and corresponding to the position of the material carrier 4, with the lens of the first vision camera 18 facing the material carrier. 4. The second vision camera 18 has a ring-shaped second light source 19 surrounding the outer edge of its lens. The second vision camera 18 is used in conjunction with the first vision camera 10 to acquire visual images of the silicon photonic chip 31 to be welded, thereby obtaining an image of the silicon photonic chip 31 to be welded over a wide area. The second light source 19 is used for supplementary lighting. The second vision camera 18 is an image capture end and also adopts an industrial inspection camera. The fourth electrically controlled linear module 20 is horizontally set on the upper surface of the worktable 1, located between the Y-axis electrically controlled linear module 16 and the material carrier 4. The fourth electrically controlled linear module 20 is inclined relative to the Y-axis electrically controlled linear module 16. The fourth electrically controlled linear module 20 also adopts an existing motor-driven linear module; the second support base 21 is vertically mounted on the slider of the fourth electrically controlled linear module 20, and the upper end of the second support base 21 extends to the position directly above the chip placement area; the fourth electrically controlled linear module 20 is used to drive the second support base 21 to move horizontally along the length direction of the fourth electrically controlled linear module 20, thereby moving it closer to or away from the material carrier part 4; the vision monitoring module 22 is vertically mounted on the upper end of the second support base 21 and is located directly above the chip placement area; the vision monitoring module 22 is a monitoring end used for the welding action of the silicon photonic chip 31 to be welded and for defect detection of the welded silicon photonic chip. The detection and vision monitoring module 22 uses an industrial camera. In the initial stage of operation of this device, the Y-axis electrically controlled linear module 16 moves the first vision camera 10 away from the material carrier module, the fourth electrically controlled linear module 20 moves the vision monitoring module 22 away from the material carrier module, and the X-axis electrically controlled linear module 6 and the Z-axis electrically controlled linear module 7 also move the dual-station welding unit away from the material carrier module. After the silicon photonic chip 31 to be welded is loaded onto the material carrier module, the above-mentioned linear modules drive the corresponding functional modules to perform work alignment with the silicon photonic chip 31 to be welded. The above-mentioned vision modules use captured 2D images or 3D depth images to assist each linear module in coordinate positioning and alignment during movement.

[0086] In one embodiment of this utility model, the first support base 17 and the second support base 21 have the same structure, both including: a horizontally arranged X-axis manual slide; a horizontally and slidably arranged Y-axis manual slide on the X-axis manual slide, the X-axis manual slide being used to control the displacement of the Y-axis manual slide on the X-axis; a vertically and slidably arranged vertical part on the Y-axis manual slide, the Y-axis manual slide being used to control the displacement of the vertical part on the Y-axis; a Z-axis manual slide vertically mounted on one side of the vertical part; the visual monitoring module 22 or the second visual camera 18 are respectively connected to the Z-axis manual slide; the Z-axis manual slide is used to control the displacement of the visual monitoring module 22 or the second visual camera 18 on the Z-axis; the above-mentioned X-axis manual slide, Z-axis manual slide and Y-axis manual slide can also be designed as electric slides, but in this embodiment, in order to reduce the position interference of the electronic control module, manual slides are used, and the sliding trajectory of the above-mentioned slides is relatively short, only used for high-precision position fine adjustment, thereby further increasing the precision of this device.

[0087] Specifically, the fine-tuning limit module includes: an X-axis electrically controlled slide 23, horizontally positioned on the worktable 1 near the material carrier 4; a Y-axis electrically controlled slide 24, horizontally positioned on the X-axis electrically controlled slide 23, the X-axis electrically controlled slide 23 being used to control the displacement of the Y-axis electrically controlled slide 24 in the X-axis direction; the X-axis electrically controlled slide 23 and the Y-axis electrically controlled slide 24 are responsible for fine-tuning the position; and a composite support unit, mounted on the Y-axis electrically controlled slide 24, the Y-axis electrically controlled slide 24 being used to control the displacement of the composite support unit in the Y-axis direction. One end of the composite support extends toward the material carrier 4, and there is a distance between the end of the composite support toward the material carrier 4 and the material carrier 4; the first limiting end 29 and the second limiting end 30 are respectively disposed on the upper and lower sides of the composite support; the first limiting end 29 is inclined, and the end of the first limiting end 29 extends to the chip placement area and contacts the welding part of the silicon photonic chip 31 to be welded; the connecting line 32 of the silicon photonic chip 31 to be welded is fixed inside the second limiting end 30.

[0088] As one embodiment of this utility model, the composite support part includes: a first horizontal support part 25, horizontally disposed on a Y-axis electrically controlled slide 24; a vertical support part 26, vertically disposed on the upper surface of the first horizontal support part 25; a Z-axis electrically controlled slide 27, vertically disposed on one side of the vertical support part 26; a second horizontal support part 28, vertically disposed on one side of the Z-axis electrically controlled slide 27, the Z-axis electrically controlled slide 27 being used for fine-tuning control of the displacement of the second horizontal support part 28 in the horizontal direction, the front end of the second horizontal support part 28 extending to a position close to the material carrying part 4; a first limiting end 29 and a second limiting end 30 respectively installed on the upper and lower sides of the second horizontal support part 28; wherein, the first limiting end 29 is an electric gripper, the gripping end of the electric gripper gripping an inclined gripper extending to the silicon photonic chip 31 to be welded; the second limiting end 30 is a limiting seat with a fixing groove for the connecting line 32.

[0089] In summary, this utility model adopts a multi-degree-of-freedom precision electronic control architecture and a multi-dimensional adaptive light source system in a collaborative design to construct a real-time closed-loop system for visual inspection and dynamic optimization of welding processes.

[0090] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structure made using the contents of this utility model specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A silicon photonics chip welding device based on automated vision processing, characterized in that, include: Workbench (1), and a vision welding module, a moving vision module, a fine-tuning limit module and a material loading module installed on the workbench (1); The material carrier module is installed at the edge of the workbench (1). The material carrier module is provided with a chip placement area, which is used to support the silicon photonic chip (31) to be welded. The visual welding module is positioned above the material carrier module, and both sides of the visual welding module are connected to the worktable (1). The visual welding module is used to acquire visual images of the silicon photonic chip (31) to be welded and to perform welding actions. The mobile vision module is positioned on one side of the material carrier module and avoids the vision welding module. The mobile vision module is equipped with an independent image capture end and a monitoring end. The image capture end is used to provide supplementary lighting and acquire visual images of the chip placement area. The monitoring end is used to detect defects in the welding action of the silicon photonic chip (31) to be welded. The fine-tuning limiting module is located near the material loading module on one side of the mobile vision module, and the fine-tuning limiting module is provided with a first limiting end (29) and a second limiting end (30); the first limiting end (29) extends to the chip placement area and contacts the welding part of the silicon photonic chip (31) to be welded, and the second limiting end (30) is provided corresponding to the wiring terminal of the silicon photonic chip (31) to be welded.

2. The silicon photonics chip welding apparatus based on automated vision processing according to claim 1, characterized in that: The material loading module includes: The base (2) is horizontally positioned on the upper surface of the workbench (1); The first turntable (3) is horizontally positioned on the upper surface of the base (2); The material carrier (4) is horizontally disposed on the upper surface of the first turntable (3). The first turntable (3) is used to control the material carrier (4) to rotate around the central axis of the first turntable (3). The upper surface of the material carrier (4) is provided with the chip placement area.

3. The silicon photonics chip welding apparatus based on automated vision processing according to claim 2, characterized in that: The vision welding module includes: A frame (5) is set on the workbench (1) above the material support part (4). The top of the frame (5) is higher than the material support part (4). The two sides of the frame (5) are connected to the upper surface of the workbench (1). The X-axis electrically controlled linear module (6) is horizontally mounted on the top of the platform (5); The Z-axis electrically controlled linear module (7) is vertically and movably mounted on the slider of the X-axis electrically controlled linear module (6); the X-axis electrically controlled linear module (6) is used to drive the Z-axis electrically controlled linear module (7) to perform horizontal displacement along the length direction of the Z-axis electrically controlled linear module (7); A dual-station welding unit is positioned between the platform (5) and the material carrier (4), and vertical connectors (701) that avoid the platform (5) are connected to both sides of the dual-station welding unit. The two vertical connectors (701) extend upward and are connected to the slider of the Z-axis electrically controlled linear module (7). The Z-axis electrically controlled linear module (7) is used to control the dual-station welding unit to perform vertical displacement along the length direction of the Z-axis electrically controlled linear module (7). The dual-station welding unit is used to perform welding operations on the silicon photonic chip (31) to be welded on the material carrier (4).

4. The silicon photonics chip welding apparatus based on automated vision processing according to claim 3, characterized in that: The dual-station welding unit includes: A connecting plate (8) is positioned horizontally and close to the lower part of the platform (5), and the two sides of the upper surface of the connecting plate (8) are respectively connected to the two vertical connecting pieces (701); The fine-tuning linear module (9) is vertically set on one side of the connecting plate (8) and corresponds to the position of the material carrying part (4); A first visual camera (10) is vertically mounted on the telescopic end of the fine-tuning linear module (9). The lens of the first visual camera (10) is vertically downward. A first light source (11) is provided around the outer edge of the lens of the first visual camera (10). The fine-tuning linear module (9) is used to control the vertical displacement of the first visual camera (10). The first visual camera (10) is used to acquire visual images of the silicon photonic chip (31) to be welded. The first light source (11) is used for supplementary lighting. A pair of welding cameras (12) are symmetrically arranged on both sides of the first vision camera (10), and the two welding cameras (12) are respectively connected to the lower surface of the connecting plate (8) on both sides through movable mounting parts; the pair of welding cameras (12) are respectively used to perform the welding action on the silicon photonic chip (31) to be welded.

5. The silicon photonics chip welding apparatus based on automated vision processing according to claim 4, characterized in that: Each of the aforementioned active mounting components includes: A vertical mounting part (13) is installed on the lower surface of the connecting plate (8); A turntable base (14) is installed at the bottom of the vertical mounting part (13); The second turntable (15) is vertically mounted on the turntable base (14) facing the first vision camera (10); each welding camera (12) is fixed to the corresponding second turntable (15) by a camera mounting base (1501); the second turntable (15) is used to drive the corresponding welding camera (12) to rotate around the central axis of the second turntable (15).

6. The silicon photonics chip welding apparatus based on automated vision processing according to claim 5, characterized in that: The mobile vision module includes: The Y-axis electrically controlled linear module (16) is horizontally set on the upper surface of the worktable (1) and located between the dual-station welding unit and the material carrying part (4); The first support base (17) is vertically mounted on the slider of the Y-axis electrically controlled linear module (16). The Y-axis electrically controlled linear module (16) is used to drive the first support base (17) to move horizontally along the length direction of the Y-axis electrically controlled linear module (16). The second vision camera (18) is rotatably and tiltedly mounted on one side of the top of the first support base (17) and corresponding to the position of the material carrier (4). The lens of the first vision camera (10) is set facing the material carrier (4). A second light source (19) is provided around the outer edge of the lens of the second vision camera (18). The second vision camera (18) is used to cooperate with the first vision camera (10) to acquire visual images of the silicon photonic chip (31) to be welded. The second light source (19) is used for supplementary lighting. The second vision camera (18) is the image capture end.

7. The silicon photonics chip welding apparatus based on automated vision processing according to claim 6, characterized in that: The mobile vision module also includes: The fourth electrically controlled linear module (20) is horizontally positioned on the upper surface of the worktable (1) between the Y-axis electrically controlled linear module (16) and the material carrier (4); the fourth electrically controlled linear module (20) is inclined relative to the Y-axis electrically controlled linear module (16); The second support base (21) is vertically mounted on the slider of the fourth electronically controlled linear module (20). The upper end of the second support base (21) extends to the position directly above the chip placement area. The fourth electronically controlled linear module (20) is used to drive the second support base (21) to move horizontally along the length direction of the fourth electronically controlled linear module (20), thereby moving closer to or away from the material carrier (4). The visual monitoring module (22) is vertically installed on the upper end of the second support base (21) and located directly above the chip placement area; the visual monitoring module (22) is the monitoring end, used to detect defects in the welding action of the silicon photonic chip (31) to be welded.

8. The silicon photonics chip welding apparatus based on automated vision processing according to claim 7, characterized in that: The first support base (17) and the second support base (21) have the same structure, both including: A horizontally set manual X-axis slide; A Y-axis manual slide is horizontally and slidably mounted on the X-axis manual slide, the X-axis manual slide being used to control the displacement of the Y-axis manual slide on the X-axis; A vertical part is vertically and slidably disposed on the Y-axis manual slide, the Y-axis manual slide being used to control the displacement of the vertical part on the Y-axis; A Z-axis manual slide table is vertically mounted on one side of the vertical part; The visual monitoring module (22) or the second visual camera (18) is connected to the Z-axis manual slide; the Z-axis manual slide is used to control the displacement of the visual monitoring module (22) or the second visual camera (18) on the Z-axis.

9. The silicon photonics chip welding apparatus based on automated vision processing according to claim 8, characterized in that: The fine-tuning limiting module includes: The X-axis electrically controlled slide (23) is horizontally positioned on the worktable (1) near the material carrying part (4); The Y-axis electrically controlled slide (24) is horizontally mounted on the X-axis electrically controlled slide (23), and the X-axis electrically controlled slide (23) is used to control the displacement of the Y-axis electrically controlled slide (24) in the X-axis direction; A composite support is mounted on the Y-axis electrically controlled slide (24), which is used to control the displacement of the composite support in the Y-axis direction; one end of the composite support extends toward the material carrier (4), and there is a distance between the end of the composite support toward the material carrier (4) and the material carrier (4); The first limiting end (29) and the second limiting end (30) are respectively disposed on the upper and lower sides of the composite support. The first limiting end (29) is inclined and the end of the first limiting end (29) extends to the chip placement area and contacts the welding part of the silicon photonic chip (31) to be welded. The connecting line of the silicon photonic chip (31) to be welded is fixed inside the second limiting end (30).

10. The silicon photonics chip welding apparatus based on automated vision processing according to claim 9, characterized in that: The composite support includes: The first horizontal support (25) is horizontally mounted on the Y-axis electrically controlled slide (24); A vertical support part (26) is vertically disposed on the upper surface of the first horizontal support part (25); The Z-axis electrically controlled slide (27) is vertically arranged on one side of the vertical support part (26); The second horizontal support (28) is vertically arranged on one side of the Z-axis electrically controlled slide (27). The Z-axis electrically controlled slide (27) is used to control the displacement of the second horizontal support (28) in the horizontal direction. The front end of the second horizontal support (28) extends to a position close to the material carrying part (4). The first limiting end (29) and the second limiting end (30) are respectively installed on the upper and lower sides of the second horizontal support (28).

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