A tin paste rewarming device

Abstract

The utility model discloses a kind of tin cream back temperature devices, it is related to tin cream back temperature technical field, including back temperature device main body, placing groove and lifting material receiving mechanism, lifting material receiving mechanism includes material receiving tray, piston rod is vertically installed between material receiving tray and back temperature device main body bottom end inner wall, further including anti-toppling mechanism, anti-toppling mechanism includes swivel ring, positioning vertical pole and push part, swivel ring is communicated with placing groove corresponding, the top end of positioning vertical pole vertically goes out placing groove, the bottom end of positioning vertical pole and material receiving tray bottom end inner wall elastically slidingly connected;The utility model is set through the setting of anti-toppling mechanism, simply effect swivel ring rotates, a plurality of positioning vertical pole can be in the corresponding push part under the action of mutual approach sliding, further gather contact tin cream supported on material receiving tray, to effectively position tin cream solid, significantly improve the stability of tin cream in back temperature process.

Description

Technical Field

[0001] This utility model relates to the field of solder paste warming technology, specifically to a solder paste warming device. Background Technology

[0002] In the electronics manufacturing industry, solder paste reheating is a key process to ensure soldering quality, and the performance of solder paste reheating equipment directly affects the reheating effect and production efficiency.

[0003] In the prior art, a solder reheating device with patent number CN206028959U effectively controls the solder paste reheating time through a specific structural design and ensures that the solder paste cannot be removed during the reheating process, thus guaranteeing the stability of the reheating process to a certain extent.

[0004] However, this reheating device still has significant shortcomings. Its tray uses a storage groove structure consisting of a base and a retaining wall. In practical applications, when placing small-sized solder paste, a large gap forms between the solder paste and the retaining wall, lacking effective measures to secure the solder paste. When the device is subjected to external impacts or when the internal piston rod is raised or lowered, the lack of stable fixation makes the solder paste prone to shaking within the storage groove, and even tipping over. Once the solder paste spills, it not only contaminates the inside of the device, increasing the cost and difficulty of cleaning and maintenance, but also interferes with the heating process, causing uneven heating of the solder paste, severely affecting the reheating effect, and consequently impacting the quality of subsequent soldering processes and the reliability of electronic components. Utility Model Content

[0005] To solve the above-mentioned technical problems, a solder paste warming device is provided, which solves the problems existing in the background technology.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a solder paste warming device, comprising a warming device body, a placement slot disposed on the warming device body for placing solder paste, and a lifting and receiving mechanism located inside the warming device body for loading solder paste.

[0007] The lifting and receiving mechanism includes a receiving tray that is movable below the placement slot. A piston rod is vertically installed between the receiving tray and the inner wall of the bottom end of the main body of the reheating device. It also includes an anti-tipping mechanism to improve the stability of the solder paste during the lifting process.

[0008] The anti-tipping mechanism includes a rotating ring that rotates on the inner wall of the top of the main body of the reheating device, a plurality of positioning rods arranged around the inner side of the rotating ring, and a pushing part arranged between the rotating ring and the positioning rods. The rotating ring is connected to the placement groove. The top of the positioning rod extends vertically upward through the placement groove, and the bottom of the positioning rod is elastically slidably connected to the inner wall of the bottom of the receiving tray.

[0009] Preferably, the pushing part includes an L-shaped slide that moves below the rotating ring. A connecting piece and a pressing ball are fixed at both ends of the slide. The connecting piece slides on the positioning rod body via a slider and a groove. A fin-shaped pressing piece is fixed to the outer wall of the rotating ring. The spherical end of the pressing ball abuts against the inclined surface of the pressing piece. The slide body is also slidably fitted with a fixing seat that is fixed to the inner wall of the top of the main body of the reheating device.

[0010] Preferably, a control lever is erected above the main body of the reheating device. The bottom end of the control lever rotates and passes into the main body of the reheating device to fix a transmission gear. The transmission gear meshes with the inner tooth surface of the rotating ring.

[0011] Preferably, the control lever is fixed with a locking plate, and the end of the locking plate is threaded through a locking post. The top surface of the main body of the reheating device is provided with several fixing holes, and the bottom end of the locking post is inserted into one of the fixing holes.

[0012] Compared with the prior art, the advantages of this utility model are as follows: by setting up an anti-tipping mechanism, the simple action of the rotating ring can be rotated, and several positioning rods can slide close together under the action of the corresponding pushing part, thereby concentrating on the solder paste carried on the receiving tray, thus effectively positioning and stabilizing the solder paste, and significantly improving the stability of the solder paste during the reheating process. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of a partial internal structure of the main body of the reheating device of this utility model;

[0015] Figure 3 This utility model Figure 2 Schematic diagram of the structure at point A in the middle.

[0016] The numbers on the map are:

[0017] 1. Main body of the reheating device; 2. Placement trough; 3. Receiving tray; 4. Piston rod; 5. Positioning rod; 6. Connecting plate; 7. Fixing seat; 8. Slide; 9. Rotary ring; 10. Extrusion plate; 11. Extrusion ball rod; 12. Locking column; 13. Control lever; 14. Transmission gear; 15. Locking plate. Detailed Implementation

[0018] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0019] Reference Figure 1 , Figure 2 and Figure 3 As shown, a solder paste warming device includes a warming device body 1, a placement slot 2 disposed on the warming device body 1 for placing solder paste, and a lifting and receiving mechanism located inside the warming device body 1 for loading solder paste.

[0020] The lifting and receiving mechanism includes a receiving tray 3 that moves below the placement trough 2, and a piston rod 4 is vertically installed between the receiving tray 3 and the inner wall of the bottom end of the main body 1 of the reheating device.

[0021] In use, the solder paste to be reheated is placed from the placement tank 2 into the main body 1 of the reheating device, where it is stably supported by the receiving tray 3. After the solder paste has been reheated, simply start the piston rod 4, and the receiving tray 3 will move the solder paste upward, allowing it to quickly extend outward from the placement tank 2 for easy manual handling.

[0022] However, the receiving tray 3 adopts a storage groove structure consisting of a base and a retaining wall. In practical applications, when placing small-sized solder paste, a large gap will be formed between the solder paste and the retaining wall, lacking effective measures to fix the solder paste.

[0023] When the device is subjected to external impact or when the internal piston rod 4 is raised or lowered, the solder paste is prone to shaking or even tipping over in the receiving tray 3 due to the lack of stable fixation.

[0024] Once solder paste spills, it will not only contaminate the inside of the main body 1 of the reheating device, increasing the cost and difficulty of cleaning and maintenance, but also interfere with the heating process, causing uneven heating of the solder paste, which will seriously affect the reheating effect, and thus affect the quality of subsequent soldering processes and the reliability of electronic components.

[0025] Therefore, referring to Figures 1-3 As shown, it is worth noting that it also includes an anti-tipping mechanism to improve the stability of solder paste during the lifting process;

[0026] The anti-tipping mechanism includes a rotating ring 9 that rotates on the inner wall of the top of the main body 1 of the reheating device, a number of positioning rods 5 arranged around the inner side of the rotating ring 9, and a pushing part arranged between the rotating ring 9 and the positioning rods 5. The rotating ring 9 is connected to the placement groove 2. The top of the positioning rod 5 extends vertically upward through the placement groove 2. The bottom of the positioning rod 5 is elastically slidably connected to the inner wall of the bottom of the receiving tray 3.

[0027] A T-shaped movable block is fixed at the bottom of the positioning pole 5, and a T-shaped movable groove that matches the T-shaped movable block is opened on the inner wall of the bottom of the receiving tray 3. A spring is fixed between the T-shaped movable block and the inner wall of one side of the T-shaped movable groove.

[0028] With the anti-tipping mechanism in place, the simple rotating ring 9 rotates, and several positioning rods 5 can slide close together under the action of the corresponding pushing part, thereby concentrating on the solder paste carried on the receiving tray 3, thus effectively positioning and stabilizing the solder paste, and significantly improving the stability of the solder paste during the reheating process.

[0029] Furthermore, referring to Figure 2 and Figure 3 As shown, it is worth noting that the pushing part includes a slide 8 that is L-shaped and movable below the rotating ring 9. The two ends of the slide 8 are respectively fixed with a connecting piece 6 and a pressing ball rod 11. The connecting piece 6 slides on the body of the positioning rod 5 through a slider and a sliding groove. The outer wall of the rotating ring 9 is fixed with a fin-shaped pressing piece 10. The spherical end of the pressing ball rod 11 abuts against the inclined surface of the pressing piece 10. The body of the slide 8 is also slidably fitted with a fixing seat 7 that is fixed to the inner wall of the top of the main body 1 of the reheating device.

[0030] When the simple rotating ring 9 rotates, the extrusion plate 10 continues to abut against the spherical end of the extrusion rod 11 along with the rotation of the rotating ring 9. In this way, the slide 8 and the extrusion rod 11 are subjected to force to pull the positioning rod 5, so that several positioning rods 5 move away from each other and increase the distance between them, so as to facilitate the placement of solder paste inside the receiving tray 3.

[0031] During this process, the T-shaped movable block synchronously positions the upright rod 5 within the T-shaped movable groove and stretches the spring to deform. When the rotating ring 9 is reversed, causing the extrusion plate 10 to reduce the extrusion of the spherical end of the extrusion rod 11, the T-shaped movable block can quickly carry the positioning upright rod 5 back to its original position under the elastic force of the spring, so that several positioning upright rods 5 are in close contact with the solder paste, thus assisting in positioning the solder paste.

[0032] Furthermore, referring to Figure 3 As shown, it is worth noting that a control lever 13 is erected above the main body 1 of the reheating device. The bottom end of the control lever 13 rotates and passes into the main body 1 of the reheating device and fixes the transmission gear 14. The transmission gear 14 meshes with the inner tooth surface of the rotating ring 9.

[0033] The rotary control lever 13 and the transmission gear 14 continuously mesh with the inner tooth surface of the rotating ring 9, thereby providing rotational power to the rotating ring 9.

[0034] Furthermore, referring to Figure 2 As shown, it is worth noting that the lever 13 is fixed with a locking plate 15, and the end of the locking plate 15 is threaded through a locking post 12. The top surface of the main body 1 of the reheating device is provided with several fixing holes, and the bottom end of the locking post 12 is inserted into one of the fixing holes.

[0035] After rotating the rotating ring 9 to reset the positioning rod 5 to the state of contact with the solder paste, immediately insert the knob locking pin 12 into the fixing hole to lock the control rod 13 and the rotating ring 9, thus ensuring the stability of the positioning rod 5 when in contact with the solder paste.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A solder paste warming device, comprising a warming device body (1), a placement slot (2) disposed on the warming device body (1) for placing solder paste, and a lifting and receiving mechanism located inside the warming device body (1) for loading solder paste; The lifting and receiving mechanism includes a receiving tray (3) movable below the placement groove (2), and a piston rod (4) is vertically installed between the receiving tray (3) and the inner wall of the bottom end of the main body (1) of the reheating device. The mechanism is characterized in that... It also includes an anti-tipping mechanism to improve the stability of solder paste during lifting; The anti-tipping mechanism includes a rotating ring (9) that rotates on the inner wall of the top of the main body (1) of the reheating device, a plurality of positioning rods (5) arranged around the inner side of the rotating ring (9), and a pushing part arranged between the rotating ring (9) and the positioning rods (5). The rotating ring (9) is connected to the placement groove (2) in a corresponding manner. The top of the positioning rod (5) extends vertically upward through the placement groove (2), and the bottom end of the positioning rod (5) is elastically slidably connected to the inner wall of the bottom end of the receiving tray (3).

2. The solder paste warming device according to claim 1, characterized in that, The pushing part includes a slide (8) that moves in an L-shape below the rotating ring (9). The two ends of the slide (8) are respectively fixed with a connecting piece (6) and a pressing rod (11). The connecting piece (6) slides on the body of the positioning rod (5) through a slider and a groove. The outer wall of the rotating ring (9) is fixed with a fin-shaped pressing piece (10). The spherical end of the pressing rod (11) abuts against the inclined surface of the pressing piece (10). The body of the slide (8) is also slidably fitted with a fixing seat (7) that is fixed to the inner wall of the top of the main body (1) of the reheating device.

3. The solder paste warming device according to claim 2, characterized in that, A control lever (13) is erected above the main body (1) of the reheating device. The bottom end of the control lever (13) rotates and passes into the main body (1) of the reheating device and fixes the transmission gear (14). The transmission gear (14) meshes with the inner tooth surface of the rotating ring (9).

4. The solder paste warming device according to claim 3, characterized in that, The control lever (13) has a locking plate (15) fixed to its body. The end of the locking plate (15) is threaded through a locking pin (12). The top surface of the main body (1) of the reheating device is provided with several fixing holes. The bottom end of the locking pin (12) is inserted into one of the fixing holes.

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