A welding flip jig

Abstract

The utility model relates to the technical field of semiconductor packaging, and specifically discloses a welding turnover jig, which comprises a bearing base plate in a rectangular plate structure, a plurality of array base grooves in a rectangular array distribution are arranged on the upper end face of the bearing base plate, and the array base grooves are interconnected through a communication long groove extending in the horizontal direction; a pressing cover plate is in a rectangular plate structure with the same size as the bearing base plate, a plurality of isolated top grooves corresponding to the array arrangement of the array base grooves are arranged on the upper end face of the pressing cover plate; a plurality of products are synchronously and batched turned over through the arrayed cavity design, the production line rhythm is greatly improved; the closed cavity and the gap cooperation structure effectively isolate external pollutants, and prevent sweat, oil and grease from polluting the welding points; rigid overall turnover completely avoids the welding line deformation or substrate damage caused by manual operation; the mirror image symmetry design of the substrate realizes bidirectional turnover without direction limitation, and simplifies the automatic process; the overall structure is simple and reliable, and perfectly adapts to the demand of the automatic welding production line.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and specifically discloses a welding flipping fixture. Background Technology

[0002] In the manufacturing process of power electronic modules (such as IGBTs and SiC modules), the ceramic copper-clad laminate (DBC) serves as a critical insulating and thermally conductive substrate, and the welding quality between it and components such as copper terminals and heat sinks is paramount. The welding process typically involves operations on both sides; for example, the front side is first soldered or patched, and then the entire product needs to be flipped 180 degrees for reverse soldering or inspection. Currently, in small-batch production or specific process stages, the flipping operation of DBC-welded products still largely relies on manual labor.

[0003] However, the existing method of manually flipping DBC soldered products has significant drawbacks:

[0004] Low efficiency, difficulty in batch processing, and slow manual operation speed cannot meet the needs of automated production lines for high-efficiency, large-volume continuous operation, becoming a bottleneck in production cycle time.

[0005] The product has a high risk of damage. The DBC substrate and bonding wire structure are delicate and fragile. During manual handling and flipping, uneven force or operational errors can easily cause the bonding wire to deform or break, or cause micro-cracks in the substrate, which directly affects the electrical performance and long-term reliability of the product and reduces the production yield.

[0006] When human hands or tools come into direct contact with the product surface (especially the welding area), it is difficult to completely avoid the introduction of contaminants such as grease, sweat, and dust particles. These contaminants may cause serious quality problems such as poor soldering, voids, or insulation failure during subsequent high-temperature welding or packaging processes.

[0007] Manual operation results in individual differences, and the flipping action is difficult to standardize, leading to fluctuations in product quality. Utility Model Content

[0008] This utility model proposes a welding flipping fixture, which realizes synchronous batch flipping of multiple products through arrayed cavity design, greatly improving the production line cycle time. The rigid overall flipping completely avoids wire deformation or substrate damage caused by manual operation.

[0009] This utility model is implemented as follows: a welding flipping fixture, comprising:

[0010] The substrate has a rectangular plate structure, and its upper surface has multiple array base grooves distributed in a rectangular array. The array base grooves are interconnected by a connecting long groove extending in the horizontal direction.

[0011] The pressure cover plate is a rectangular plate structure with the same size as the supporting substrate, and its upper surface has multiple isolation top grooves corresponding to the array arrangement of the array base grooves.

[0012] The alignment and locking assembly is located between the bearing base plate and the pressure cover plate;

[0013] When the pressure cover plate is placed on the supporting substrate, the array base groove and the corresponding isolation top groove together form a sealed cavity for accommodating the DBC welding product, and the alignment locking assembly fixes the two substrates into a rigid structure that can be flipped as a whole.

[0014] As a preferred embodiment of the welding flipping fixture of this utility model, the connecting long groove extends laterally along the supporting substrate and connects all array base grooves in the same row.

[0015] As a preferred embodiment of the welding flipping fixture of this utility model, the depth of the sealed cavity is 1-1.2 times the thickness of the DBC welding product, and its inner wall is fitted with the outer contour of the DBC welding product with clearance.

[0016] As a preferred embodiment of the welding flipping fixture of this utility model, the alignment locking assembly includes:

[0017] Positioning pin holes are formed on the outer walls of the supporting substrate and the pressure cover plate;

[0018] The locating pin can be detached and inserted into the corresponding locating pin hole.

[0019] As a preferred embodiment of the welding flipping fixture of this utility model, the array base groove and the isolation top groove have the same layout and are mirror symmetrical.

[0020] As a preferred embodiment of the welding flipping fixture of this utility model, both the bearing substrate and the pressure cover plate are integrally formed of aluminum alloy, and their outer surfaces are coated with a wear-resistant coating.

[0021] As a preferred embodiment of the welding flipping fixture of this utility model, the outer wall edges of the supporting substrate and the pressure cover plate are respectively provided with a plurality of inwardly extending first arc grooves and second arc grooves, and the plurality of first arc grooves and second arc grooves are located at different positions.

[0022] The beneficial effects of this utility model are:

[0023] This invention solves the efficiency bottleneck, operational risks, and pollution hazards associated with manual flipping of DBC products. Through an arrayed cavity design, it enables simultaneous batch flipping of multiple products, significantly improving production line cycle time. The sealed cavity and gap-fitting structure effectively isolate external contaminants, preventing sweat and grease from contaminating the solder joints. The rigid overall flipping completely avoids solder wire deformation or substrate damage caused by manual operation. The substrate mirror symmetry design enables bidirectional flipping without directional restrictions, simplifying the automation process. The overall structure is simple and reliable, perfectly adapting to the needs of automated welding production lines. Attached Figure Description

[0024] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 2 This is a three-dimensional structural diagram of the substrate of this utility model;

[0027] Figure 3 This is a three-dimensional structural diagram of the cover plate of this utility model;

[0028] Figure 4 This is a top view of the substrate structure of this utility model.

[0029] The markings in the diagram are: 1. Supporting substrate; 2. Array base groove; 3. Connecting long groove; 4. Press cover plate; 5. Isolation top groove; 6. Positioning pin hole; 7. Positioning pin; 8. First arc groove; 9. Second arc groove. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and specific embodiments to aid in understanding its content. Unless otherwise specified, the methods used in this invention are conventional methods; the raw materials and apparatus used, unless otherwise specified, are conventional commercially available products.

[0031] Please see Figure 1-4 A welding flipping fixture, comprising:

[0032] The supporting substrate 1 has a rectangular plate structure, and its upper surface has multiple array base grooves 2 distributed in a rectangular array. The array base grooves 2 are interconnected by a connecting long groove 3 extending in the horizontal direction.

[0033] The pressure cover plate 4 is a rectangular plate structure with the same size as the supporting substrate 1, and its upper surface has multiple isolation top grooves 5 corresponding to the array arrangement of the array base grooves 2.

[0034] An alignment and locking assembly is disposed between the bearing base plate 1 and the pressure cover plate 4;

[0035] When the pressure cover plate 4 covers the support substrate 1, the array base groove 2 and the corresponding isolation top groove 5 together form a sealed cavity for accommodating DBC welding products, and the alignment locking assembly fixes the two substrates into a rigid structure that can be flipped as a whole.

[0036] In this embodiment: the carrier substrate 1 is provided with array base grooves 2 distributed in a rectangular array and a connecting long groove 3 that runs through the array base grooves 2. Together with the corresponding independent isolation top groove 5 on the pressure cover plate 4, when the two are closed, they form a sealed cavity that accurately accommodates a single DBC product. The carrier substrate 1 and the pressure cover plate 4 are fixed together as a whole by the alignment locking assembly through the positioning pin hole 6 and the positioning pin 7. The external robot can grasp the whole and achieve a 180-degree rapid flip. After flipping, because the array base grooves 2 and the isolation top grooves 5 are mirror symmetrically arranged, the original pressure cover plate 4 automatically transforms into a carrier base. The aluminum alloy substrate and wear-resistant coating ensure durability. The connecting long groove 3 facilitates chip removal and heat dissipation during processing, while the independent design of the isolation top groove 5 ensures that each product is precisely positioned in the cavity without deviation. The depth of the sealed cavity is 1-1.2 times the product thickness and is combined with gap fit to prevent product shaking and avoid damage to the bonding wire. It solves the efficiency bottleneck, operational risks and pollution hazards of manual flipping of DBC products. The arrayed cavity design enables synchronous batch flipping of multiple products, which greatly improves the production line cycle time. The rigid overall flipping completely avoids the deformation of the bonding wire or damage to the substrate caused by manual operation.

[0037] As a technical optimization of this utility model, the connecting long groove 3 extends laterally along the supporting substrate 1 and connects all array base grooves 2 in the same row.

[0038] In this embodiment: the connecting long groove 3 connects all array base grooves 2 in the same row in the transverse direction, which optimizes the gas flow path (such as flux volatilization, thermal expansion gas), ensures that the pressure in the cavity is balanced under the cover or high temperature process, and avoids the cover plate displacement or product pressure due to the pressure difference.

[0039] As a technical optimization of this utility model, the depth of the sealed cavity is 1-1.2 times the thickness of the DBC welding product, and its inner wall is fitted with the outer contour of the DBC welding product with clearance.

[0040] In this embodiment, the product is securely contained within the cavity, preventing damage to the solder lines or micro-cracks in the substrate caused by shaking, friction, or collision during the flipping process. It also avoids excessive tightness that could lead to product deformation or difficulty in handling.

[0041] As a technical optimization of this utility model, the alignment and locking assembly includes:

[0042] Positioning pin holes 6 are formed on the outer walls of the supporting substrate 1 and the pressure cover plate 4;

[0043] A detachable positioning pin 7 can be inserted into the corresponding positioning pin hole 6.

[0044] In this embodiment, the positioning pin 7 provides precise vertical positioning and reliable rigid connection, ensuring that the carrier substrate 1 and the pressure cover plate 4 maintain an absolutely fixed relative position during the flipping process, eliminating the risk of relative sliding or fretting friction damaging the product.

[0045] As a technical optimization of this utility model, the array base slot 2 and the isolation top slot 5 have the same layout and are mirror symmetrical.

[0046] In this embodiment, the array base groove 2 and the isolation top groove 5 have the same layout and are mirror-symmetrical. This simplifies manufacturing and assembly, ensures uniform gaps in all directions after the cover is closed, provides balanced constraint and protection, and avoids local stress concentration in the product due to structural asymmetry.

[0047] As a technical optimization of this utility model, both the supporting substrate 1 and the pressure cover plate 4 are integrally formed of aluminum alloy, and their outer surfaces are coated with a wear-resistant coating.

[0048] In this embodiment: both the supporting substrate 1 and the pressure cover plate 4 are integrally formed from aluminum alloy. Aluminum alloy takes into account lightweight, good thermal conductivity and sufficient strength; integral forming ensures structural rigidity and precision; wear-resistant coating protects the surface of the fixture from scratches and extends its service life.

[0049] As a technical optimization of this utility model, the outer wall edges of the supporting substrate 1 and the pressure cover plate 4 are respectively provided with a plurality of inwardly extending first arc grooves 8 and second arc grooves 9, and the plurality of first arc grooves 8 and second arc grooves 9 are located in different positions.

[0050] In this embodiment, the outer edges of the supporting substrate 1 and the pressure cover plate 4 are respectively provided with a plurality of inwardly extending first arc grooves 8 and second arc grooves 9, and the positions are different. The first arc grooves 8 and second arc grooves 9 are staggered to facilitate the subsequent opening of the supporting substrate 1 and the pressure cover plate 4.

[0051] The working principle and usage process of this utility model are as follows: During operation, multiple DBC products are placed into the array base groove 2 of the carrier substrate 1. The bottom of the product is limited by the bottom of the groove. The cover plate 4 is covered so that the isolation top groove 5 is aligned with the top of the product. At this time, the array base groove 2 and the isolation top groove 5 together form a sealed cavity that wraps the product. The positioning pin holes 6 at the four corners of the carrier substrate 1 and the cover plate 4 are aligned, and the positioning pins 7 are inserted to complete the rigid locking. After the external mechanical gripper firmly grasps it, it drives the entire fixture to rotate smoothly 180 degrees. After the rotation, the original cover plate 4 becomes the bottom support, and the original carrier substrate 1 becomes the top cover plate. However, due to the symmetrical design of the groove, the product is still firmly constrained in the newly formed cavity. Finally, the positioning pins 7 are pulled out, the substrate is separated, and the rotated product can be taken out.

[0052] In the description of this utility model, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "back", "inner", "outer", "back", "middle", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0053] However, the above description is only a specific embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Therefore, any substitution of equivalent components or equivalent changes and modifications made in accordance with the scope of protection of this utility model should still fall within the scope of the claims of this utility model.

Claims

1. A welding flipping fixture, characterized in that: include: The substrate (1) is a rectangular plate structure, and its upper surface is provided with a plurality of array base grooves (2) arranged in a rectangular array. The array base grooves (2) are interconnected by a connecting long groove (3) extending in the horizontal direction. The pressure cover plate (4) is a rectangular plate structure with the same size as the supporting substrate (1), and its upper surface is provided with multiple isolation top grooves (5) corresponding to the array arrangement of the array base grooves (2). The alignment and locking assembly is located between the bearing base plate (1) and the pressure cover plate (4); When the pressure cover plate (4) covers the support substrate (1), the array base groove (2) and the corresponding isolation top groove (5) together form a sealed cavity for accommodating DBC welding products, and the alignment locking assembly fixes the two substrates into a rigid structure that can be flipped as a whole.

2. The welding flipping fixture according to claim 1, characterized in that: The connecting long slot (3) extends laterally along the support substrate (1) and connects all array base slots (2) in the same row.

3. The welding flipping fixture according to claim 1, characterized in that: The depth of the sealed cavity is 1-1.2 times the thickness of the DBC welded product, and its inner wall is fitted with the outer contour of the DBC welded product with clearance.

4. The welding flipping fixture according to claim 1, characterized in that: The alignment and locking assembly includes: Positioning pin holes (6) are formed on the outer walls of the supporting substrate (1) and the pressure cover plate (4). A detachable positioning pin (7) can be inserted into the corresponding positioning pin hole (6).

5. A welding flipping fixture according to claim 1, characterized in that: The array base trench (2) and the isolation top trench (5) have the same layout and are mirror symmetrical.

6. A welding flipping fixture according to claim 1, characterized in that: The supporting substrate (1) and the pressure cover plate (4) are both integrally formed from aluminum alloy, and their outer surfaces are coated with a wear-resistant coating.

7. A welding flipping fixture according to claim 1, characterized in that: The outer edges of the supporting substrate (1) and the pressure cover plate (4) are respectively provided with a plurality of first arc grooves (8) and second arc grooves (9) extending inward, and the plurality of first arc grooves (8) and second arc grooves (9) are located at different positions.

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