PCB board patch welding spot rapid cooling device

Abstract

The utility model provides a kind of PCB board patch welding spot quick cooling device, it is related to PCB board patch welding technical field, including: machine body, recess is provided in machine body top, conveying belt is equipped in recess inside, shell is fixedly installed in machine body top, machine body inside and shell inside are equipped with mounting bracket, mounting bracket inside is preheating zone, welding area and cooling area.This kind of cooling device can be forced cooling to the PCB board after welding by cooling mechanism, the cooling time of welding spot is greatly shortened from reflow peak temperature to solid state, which helps to improve the mechanical strength, fatigue resistance and ductility of the welding spot, also enhances the long-term reliability of the welding spot, reduces the exposure time of the welding spot at high temperature, effectively avoids the oxidation of solder surface.

Description

Technical Field

[0001] This utility model relates to the field of PCB board surface mount soldering technology, specifically a rapid cooling device for PCB board surface mount solder joints. Background Technology

[0002] In the printed circuit board (PCB) manufacturing process, surface mount components are assembled using surface mount technology. Generally, surface mount components are mounted using reflow soldering. First, a printer applies solder paste to the pads on the PCB. Then, a pick-and-place machine presses the surface mount components onto the corresponding soldering positions on the reference cable board to adhere to the solder paste. The PCB is then conveyed through the reflow oven chamber by a conveyor. In the reflow oven chamber, the solder paste reflows in the heating zone (i.e., is heated to the melting or reflow temperature) and then cools in the cooling zone to electrically and mechanically connect the wires of the electronic components to the PCB.

[0003] Common cooling methods include natural cooling and forced air cooling. Although these methods can meet basic requirements, they still have shortcomings in pursuing higher production efficiency and higher quality soldering results. Traditional cooling methods often cause PCBs and their components to experience a long period of high temperature, increasing the possibility of solder joint oxidation and affecting the quality and reliability of the solder joints. Utility Model Content

[0004] The purpose of this application is to provide a rapid cooling device for PCB board surface mount solder joints, so as to solve the technical problem of low and uneven cooling efficiency of PCB board surface mount solder joints in the prior art.

[0005] To achieve the above objectives, the technical solution adopted in this application is: to provide a rapid cooling device for PCB board surface mount solder joints, comprising: a body, a groove on the top of the body, a conveyor belt inside the groove, a housing fixedly mounted on the top of the body, and mounting frames inside both the body and the housing, the mounting frames being divided into a preheating zone, a soldering zone and a cooling zone.

[0006] A cooling mechanism is provided in the cooling zone for cooling the solder joints of the PCB board surface mount soldering. The cooling mechanism includes: a fan duct, a fan guide, a frame, a connecting plate, copper pipes, a chiller, and a water tank.

[0007] Furthermore, a fan duct is fixedly installed at the top of the cooling zone, a wind guide shroud is fixedly connected to the bottom of the fan duct, a frame is fixedly installed between the inner walls of the fan duct, multiple connecting plates are fixedly connected to the inner wall of the frame, copper pipes are provided between the multiple connecting plates, the copper pipes are arranged in a continuous S-shape, a refrigeration unit is fixedly installed at the bottom of the machine body, a water tank is provided at the top of the refrigeration unit, and the cold air output end of the refrigeration unit is connected to the water tank.

[0008] Furthermore, a water pump is fixedly installed on one side of the water tank, the input end of the water pump is connected to the water tank, the output end of the water pump is fixedly connected to a delivery pipe, a return pipe is connected to the side of the water tank near the top, and water receiving troughs are respectively provided below the copper pipe.

[0009] Furthermore, one end of the delivery pipe is connected to the input end of each of the two copper pipes, and the return pipe is connected to the output end of each of the two copper pipes and the drain outlet of each of the two water receiving tanks.

[0010] Furthermore, the top of the air duct has multiple air holes, the inner wall of the air guide shroud is fixedly installed with turbulence plates, and the air supply fan is fixedly installed inside the air duct at a position opposite to the air holes.

[0011] Furthermore, the inner walls of the preheating zone, the welding zone, and the cooling zone are all provided with heat insulation layers, and heating devices are installed inside the preheating zone and the welding zone.

[0012] The beneficial effects of this utility model are:

[0013] The advantages of this invention are that the cooling mechanism can quickly and efficiently cool the PCB board after soldering, which greatly shortens the cooling time of the solder joint from the reflow peak temperature to the solid state. This helps to improve the mechanical strength, fatigue resistance and ductility of the solder joint, and also enhances the long-term reliability of the solder joint. It also reduces the exposure time of the solder joint at high temperature and effectively avoids oxidation of the solder surface. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a cross-sectional view of the overall structure of this utility model.

[0017] Figure 3 This is a schematic diagram of the frame structure of this utility model.

[0018] Figure 4 This is a schematic diagram of the turbulence plate structure of this utility model.

[0019] Figure 5 For the present utility model Figure 2Enlarged view of point A in the middle.

[0020] The following are the labeling elements in the figure:

[0021] 1. Body; 11. Groove; 12. Conveyor belt; 13. Shell; 14. Mounting frame; 15. Preheating zone; 16. Welding zone; 17. Cooling zone; 2. Air duct; 21. Air guide shroud; 22. Frame; 23. Connecting plate; 24. Copper pipe; 25. Refrigeration unit; 26. Water tank; 27. Water pump; 28. Conveying pipe; 29. ​​Return pipe; 210. Water receiving tank; 3. Air vent; 31. Turbulence plate; 32. Power fan; 4. Insulation layer; 41. Heating device. Detailed Implementation

[0022] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0023] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0024] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0026] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments. Example 1

[0027] As attached Figures 1 to 5The PCB board surface mount solder joint rapid cooling device shown includes: a body 1, a groove 11 on the top of the body 1, a conveyor belt 12 inside the groove 11, a housing 13 fixedly mounted on the top of the body 1, mounting frames 14 inside both the body 1 and the housing 13, the mounting frames 14 being divided into a preheating zone 15, a soldering zone 16 and a cooling zone 17, and a cooling mechanism located in the cooling zone 17 for cooling the solder joints of the PCB board surface mount soldering.

[0028] First, solder paste is applied to the pads on the printed circuit board using a printing press. Then, a pick-and-place machine presses the surface mount components onto the corresponding soldering positions on the reference cable board to adhere to the solder paste. The PCB board is then conveyed into the machine body 1 via conveyor belt 12. The PCB board first enters the preheating zone 15 for preheating, and then enters the soldering zone 16 for heating to melt the solder paste and form electrical connections between the components. Subsequently, it enters the cooling zone 17 where a cooling mechanism rapidly cools the solder joints to form a reliable connection and prevents oxidation of the solder joints.

[0029] Based on Embodiment 1, the solution in Embodiment 1 will be further described in detail below with reference to the specific working method, such as... Figure 3 , Figure 4 and Figure 5 As shown below, see details for further description;

[0030] The cooling system includes: a fan duct 2, an air guide shroud 21, a frame 22, connecting plates 23, copper pipes 24, a chiller 25, and a water tank 26. The fan duct 2 is fixedly installed at the top of the cooling zone 17, and the air guide shroud 21 is fixedly connected to the bottom of the fan duct 2. A frame 22 is fixedly installed between the inner walls of the fan duct 2, and multiple connecting plates 23 are fixedly connected to the inner wall of the frame 22. Copper pipes 24 are arranged between the multiple connecting plates 23 in a continuous S-shape. The chiller 25 is fixedly installed at the bottom of the unit 1, and a water tank 26 is located at the top of the chiller 25. The cooling output of the refrigeration unit 25 is connected to the water tank 26. A water pump 27 is fixedly installed on one side of the water tank 26. The input end of the water pump 27 is connected to the water tank 26. The output end of the water pump 27 is fixedly connected to the delivery pipe 28. A return pipe 29 is connected to the side of the water tank 26 near the top. There are water receiving tanks 210 below the copper pipes 24. One end of the delivery pipe 28 is connected to the input end of the two copper pipes 24 respectively. The return pipe 29 is connected to the output end of the two copper pipes 24 and the drain outlet of the two water receiving tanks 210 respectively.

[0031] Specifically: Before processing, the refrigeration unit 25 is started to cool the water in the water tank 26, lowering the water temperature. After the water pump 27 starts, it draws out the cold water from inside the water tank 26 and delivers it to the upper and lower sets of copper pipes 24 through the delivery pipe 28. The cold water flows in the copper pipes 24 and then flows back into the water tank 26 through the return pipe 29. The water droplets condensed on the surface of the copper pipes 24 fall into the water receiving tank 210. The upper water receiving tank 210 is located in the air guide shroud 21 and connected to its inner wall. The lower water receiving tank 210... 10 is located in the air duct 2 and connected to its inner wall. Water droplets are collected through the water collection tank 210 and returned to the water tank 26 through the return pipe 29. Air ducts are left on both sides of the water collection tank 210 for airflow. The airflow enters the air duct 2 and flows between the copper pipes 24. The airflow is cooled by contact with the copper pipes 24 to form cold air. The cold air enters the air guide shroud 21 and is blown out from the air guide shroud 21. The cold air cools the upper and lower surfaces of the PCB board, so that the solder joints are cooled quickly.

[0032] In a preferred embodiment, the top of the air duct 2 is provided with multiple air holes 3, and turbulence plates 31 are fixedly installed on the inner wall of the air guide shroud 21. Fans 32 are fixedly installed inside the air duct 2 at positions opposite to the air holes 3.

[0033] Furthermore, after the fan 32 is started, it generates airflow. External air is drawn in through the gap between the air guide shroud 21 and the inner wall of the cooling zone 17, and then enters the air duct 2 through the air hole 3 and is transported into the air guide shroud 21. The laminar flow state is broken by the turbulence plate 31, so that the airflow is more evenly distributed on the PCB board surface.

[0034] In a preferred embodiment, heat insulation layers 4 are provided on the inner walls of the preheating zone 15, the welding zone 16 and the cooling zone 17, and heating devices 41 are installed inside the preheating zone 15 and the welding zone 16.

[0035] Furthermore, the heat insulation layer 4 is used for heat insulation, and the PCB board with the components mounted is preheated and soldered by the heating device 41.

[0036] All electrical components mentioned in the text are electrically connected to the main controller and power supply. The main controller can be a conventional known device such as a computer that performs control functions, and the existing publicly available power connection technologies are not described in detail in the text.

[0037] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A rapid cooling device for PCB board surface mount solder joints, characterized in that, include: The machine body (1) has a groove (11) on the top and a conveyor belt (12) inside the groove (11). A shell (13) is fixedly installed on the top of the machine body (1). Both the machine body (1) and the shell (13) are equipped with mounting brackets (14). The mounting brackets (14) are divided into a preheating zone (15), a welding zone (16), and a cooling zone (17). The cooling mechanism is located in the cooling zone (17) and is used to cool the solder joints of the PCB board surface mount soldering. The cooling mechanism includes: air duct (2), air guide hood (21), frame (22), connecting plate (23), copper pipe (24), refrigerator (25) and water tank (26).

2. The rapid cooling device for PCB board surface mount solder joints according to claim 1, characterized in that, A fan duct (2) is fixedly installed at the top of the cooling zone (17). A wind guide hood (21) is fixedly connected to the bottom of the fan duct (2). A frame (22) is fixedly installed between the inner walls of the fan duct (2). Multiple connecting plates (23) are fixedly connected to the inner wall of the frame (22). Copper pipes (24) are provided between the multiple connecting plates (23). The copper pipes (24) are arranged in a continuous S-structure. A refrigerator (25) is fixedly installed at the bottom of the body (1). A water tank (26) is provided at the top of the refrigerator (25). The cold air output end of the refrigerator (25) is connected to the water tank (26).

3. The rapid cooling device for PCB board surface mount solder joints according to claim 2, characterized in that, A water pump (27) is fixedly installed on one side of the water tank (26). The input end of the water pump (27) is connected to the water tank (26). The output end of the water pump (27) is fixedly connected to a delivery pipe (28). A return pipe (29) is connected to the side of the water tank (26) near the top. A water receiving trough (210) is provided below the copper pipe (24).

4. The rapid cooling device for PCB board surface mount solder joints according to claim 3, characterized in that, One end of the delivery pipe (28) is connected to the input end of the two copper pipes (24), and the return pipe (29) is connected to the output end of the two copper pipes (24) and the drain outlet of the two water receiving tanks (210).

5. The rapid cooling device for PCB board surface mount solder joints according to claim 1, characterized in that, The top of the air duct (2) is provided with multiple air holes (3), and turbulence plates (31) are fixedly installed on the inner wall of the air guide shroud (21). Air blowers (32) are fixedly installed inside the air duct (2) at positions opposite to the air holes (3).

6. The rapid cooling device for PCB board surface mount solder joints according to claim 1, characterized in that, The inner walls of the preheating zone (15), the welding zone (16) and the cooling zone (17) are all provided with heat insulation layers (4), and heating devices (41) are installed inside the preheating zone (15) and the welding zone (16).

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