A semiconductor laser package apparatus

Abstract

The utility model discloses a kind of semiconductor laser packaging equipment, it is related to laser manufacturing equipment technical field, wherein, semiconductor laser packaging equipment includes: cabinet assembly, is equipped with the first space and the second space apart;Welding device, inside first space is equipped;Nitrogen protection device, inside second space is equipped, and first space is communicated by pipeline;Bearing device, inside first space is fixed, and bearing device is equipped with cavity, receiving groove and through-hole;Vacuum generating device, inside second space is equipped, and first space is communicated by pipeline to suck gas in first space, also and cavity are communicated by pipeline to make negative pressure in cavity, to make semiconductor laser in receiving groove by bearing device negative pressure adsorption.The technical scheme provided by the utility model reduces the damage of semiconductor laser packaging equipment to semiconductor laser shell in packaging process.

Description

Technical Field

[0001] This utility model relates to the field of laser manufacturing equipment technology, and in particular to a semiconductor laser packaging device. Background Technology

[0002] Semiconductor lasers, as key components in the optoelectronic field, are widely used in communications, medical, military, industrial processing and other fields. As the performance of semiconductor lasers continues to improve, the requirements for their packaging process are also becoming more and more stringent. The packaging process directly affects the lifespan, stability and reliability of the laser.

[0003] In the process of welding semiconductor lasers, existing packaging equipment typically uses fixtures to physically hold the semiconductor lasers, which can easily damage the outer casing of the semiconductor lasers. Utility Model Content

[0004] The main purpose of this invention is to provide a semiconductor laser packaging device that aims to reduce damage to the semiconductor laser housing during the packaging process.

[0005] To achieve the above objectives, the present invention provides a semiconductor laser packaging device, comprising:

[0006] The housing assembly has a separated first space and a second space;

[0007] A welding device, located inside the first space, is used for welding semiconductor lasers;

[0008] A nitrogen protection device is installed inside the second space and connected to the first space via a pipeline, used to fill the first space with nitrogen.

[0009] A support device is fixed inside the first space. The support device has a cavity, a receiving groove, and a through hole connecting the cavity and the receiving groove. The receiving groove is used to place the semiconductor laser.

[0010] A vacuum generating device is located inside the second space and is connected to the first space through a pipe to draw in gas from the first space. The vacuum generating device is also connected to the cavity through a pipe to create a negative pressure inside the cavity, so that the supporting device can adsorb the semiconductor laser in the receiving tank through the negative pressure.

[0011] In one embodiment, the supporting device is provided with a plurality of receiving slots and a plurality of cavities, wherein the plurality of receiving slots and the plurality of cavities are connected in a one-to-one correspondence; or,

[0012] The supporting device is provided with multiple receiving slots and a cavity, and the multiple receiving slots are all connected to the cavity.

[0013] In one embodiment, the supporting device includes:

[0014] The base assembly includes the cavity and the through hole; and

[0015] The limiting plate is provided with a receiving window. The limiting plate is detachably connected to the base assembly, so that the inner wall of the receiving window and the outer wall of the base assembly together surround and form the receiving groove.

[0016] In one embodiment, the base assembly is provided with a plurality of the limiting plates, and the base assembly is provided with at least one through hole corresponding to each of the receiving windows;

[0017] The plurality of limiting plates are arranged sequentially along their own length direction; and / or the plurality of limiting plates are arranged sequentially along their own width direction.

[0018] In one embodiment, the limiting plate is provided with a plurality of receiving windows.

[0019] In one embodiment, the base assembly includes:

[0020] The upper body is provided with a first groove and the through hole; and

[0021] The lower seat has a second groove, which is fitted onto the outside of the upper seat and closes the first groove to form the cavity.

[0022] In one embodiment, a partition is provided within the first groove, the partition dividing the first groove into multiple sub-grooves, and the partition has a connecting groove connecting the sub-grooves on both sides thereof; and / or,

[0023] The lower body is provided with a connector, which is connected to the vacuum generating device through a pipeline.

[0024] In one embodiment, the vacuum generating device includes:

[0025] A vacuum pump, located inside the second space and connected to the first space via a pipe, draws gas from the first space. The vacuum pump is also connected to the cavity via a pipe to create a negative pressure within the cavity, allowing the supporting device to adsorb the semiconductor laser from the receiving tank through this negative pressure.

[0026] A vacuum gauge is installed inside the first space to measure the vacuum level of the first space.

[0027] In one embodiment, the vacuum generating device further includes a filter assembly connected to the vacuum pump and the first space via a pipeline.

[0028] In one embodiment, the welding apparatus includes:

[0029] The welding head is located above the supporting device;

[0030] A vertical moving mechanism drives the welding head to move the welding head closer to or away from the supporting device;

[0031] A lateral moving mechanism, driving and connecting the vertical moving mechanism; and

[0032] The longitudinal moving mechanism drives the lateral moving mechanism.

[0033] The semiconductor laser packaging equipment of this utility model includes a housing assembly, a welding device, a nitrogen protection device, a support device, and a vacuum generator. The first space of the housing assembly is used for welding operations. The nitrogen protection device is located in a second space and connected to the first space via a pipeline to fill the first space with nitrogen, reducing oxidation and corrosion during welding and improving welding quality. The support device is fixed inside the first space and has a cavity, a receiving groove, and a through hole. The receiving groove is used to place the semiconductor laser, facilitating precise fixation and welding operations. The vacuum generator is located in the second space and connected to the first space, drawing gas from the first space to create a certain vacuum. Nitrogen is then filled in using the nitrogen protection device, ensuring the nitrogen concentration in the first space meets welding requirements. Furthermore, the vacuum generator is also connected to the cavity of the support device, creating a negative pressure within the cavity, thereby adsorbing and fixing the semiconductor laser in the receiving groove without the need for physical clamps, reducing damage to the semiconductor laser housing, and improving packaging stability and yield. The vacuum generator achieves two functions, reducing the structural complexity of the semiconductor laser packaging equipment. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0035] Figure 1 A schematic diagram of the structure of an embodiment of the semiconductor laser packaging equipment provided by this utility model;

[0036] Figure 2 A schematic diagram of the structure of the carrier device for the semiconductor laser packaging equipment provided by this utility model;

[0037] Figure 3 A cross-sectional view of the carrier device for the semiconductor laser packaging equipment provided by this utility model;

[0038] Figure 4 Exploded view of the carrier device for the semiconductor laser packaging equipment provided by this utility model;

[0039] Figure 5 A schematic diagram of the upper body of the base assembly of the semiconductor laser packaging equipment carrier device provided by this utility model.

[0040] Explanation of icon numbers:

[0041] 100. Casing assembly; 101. First space; 102. Second space;

[0042] 200. Welding device; 210. Welding head; 220. Vertical moving mechanism; 230. Lateral moving mechanism; 240. Longitudinal moving mechanism;

[0043] 300. Nitrogen protection device; 310. Nitrogen cylinder; 320. Pressure regulating valve; 330. Flow control valve;

[0044] 400, Supporting device; 401, Cavity; 402, Receiving groove; 403, Through hole; 410, Base assembly; 411, Upper seat; 4111, First groove; 4112, Partition; 4113, Connecting groove; 412, Lower seat; 4121, Second groove; 420, Limiting plate; 421, Receiving window;

[0045] 500. Vacuum generating device; 510. Vacuum pump; 520. Vacuum gauge; 530. Filter assembly.

[0046] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0047] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0048] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0049] In this utility model, unless otherwise explicitly specified and limited, the terms "connection" and "fixation" should be interpreted broadly. For example, "fixation" can mean a fixed connection, a detachable connection, or an integral part; "connection" can mean a mechanical connection or an electrical connection, a direct connection or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0050] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0051] This invention proposes a semiconductor laser packaging device.

[0052] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of a structure of an embodiment of the semiconductor laser packaging equipment provided by this utility model. Figure 2 This is a schematic diagram of the structure of the carrier device for the semiconductor laser packaging equipment provided by this utility model. Figure 3 A cross-sectional view of the carrier device for the semiconductor laser packaging equipment provided by this utility model.

[0053] In one embodiment of this utility model, the semiconductor laser packaging device includes:

[0054] The housing assembly 100 has a first space 101 and a second space 102 that are separated from each other;

[0055] The welding device 200 is located inside the first space 101 and is used for welding semiconductor lasers;

[0056] A nitrogen protection device 300 is located inside the second space 102 and is connected to the first space 101 through a pipeline. It is used to fill the first space 101 with nitrogen.

[0057] The support device 400 is fixed inside the first space 101. The support device 400 is provided with a cavity 401, a receiving groove 402 and a through hole 403 connecting the cavity 401 and the receiving groove 402. The receiving groove 402 is used to place a semiconductor laser.

[0058] The vacuum generator 500 is located inside the second space 102 and is connected to the first space 101 through a pipeline to draw gas from the first space 101. The vacuum generator 500 is also connected to the cavity 401 through a pipeline to create a negative pressure in the cavity 401 so that the carrier device 400 can adsorb the semiconductor laser in the receiving tank 402 through the negative pressure.

[0059] The semiconductor laser packaging equipment of this utility model includes a housing assembly 100, a welding device 200, a nitrogen protection device 300, a support device 400, and a vacuum generator 500. The first space 101 of the housing assembly 100 is used for welding operations. The nitrogen protection device 300 is located in the second space 102 and is connected to the first space 101 via a pipeline. It is used to fill the first space 101 with nitrogen, which can reduce oxidation and corrosion during the welding process and improve welding quality. The support device 400 is fixed inside the first space 101 and has a cavity 401, a receiving groove 402, and a through hole 403. The receiving groove 402 is used to place the semiconductor laser, which facilitates precise fixation of the semiconductor laser and facilitates welding operations. The vacuum generator 500 is located in the second space 102 and is connected to the first space 101. It draws gas from the first space 101 to create a certain vacuum level in the first space 101, and then uses the nitrogen protection device 300 to fill it with nitrogen, which helps ensure that the nitrogen concentration in the first space 101 meets the welding requirements. On the other hand, the vacuum generating device 500 is also connected to the cavity 401 of the supporting device 400, creating a negative pressure in the cavity 401, thereby adsorbing and fixing the semiconductor laser in the receiving groove 402 without the need for physical clamps, reducing damage to the semiconductor laser shell, and improving the stability and yield of the packaging. The vacuum generating device 500 achieves two functions, reducing the structural complexity of the semiconductor laser packaging equipment.

[0060] In one embodiment, the supporting device 400 is provided with a plurality of receiving slots 402 and a plurality of cavities 401, with the plurality of receiving slots 402 and the plurality of cavities 401 communicating in a one-to-one correspondence; or,

[0061] The support device 400 is provided with multiple receiving slots 402 and a cavity 401, and the multiple receiving slots 402 are all connected to the cavity 401.

[0062] In the embodiments of this utility model, the support device 400 is provided with a plurality of receiving slots 402 and a plurality of cavities 401. The first space 101 can hold a plurality of semiconductor lasers, thereby improving production efficiency. Each receiving slot 402 has a dedicated cavity 401 corresponding to it, so that each semiconductor laser can be fixed independently. Even if there is no semiconductor laser in some receiving slots 402, it will not affect the fixing of other semiconductor lasers.

[0063] Combination Figures 2 to 5 In an embodiment of this utility model, the support device 400 is provided with multiple receiving slots 402 and a cavity 401. The multiple receiving slots 402 are all connected to the cavity 401, and all the receiving slots 402 are connected to the same cavity 401. The vacuum generating device 500 provides negative pressure to all receiving slots 402 through a single cavity 401, thereby fixing multiple semiconductor lasers. This simplifies the structure of the support device 400, reduces the number of cavities 401, and thus reduces the complexity of negative pressure control.

[0064] In one embodiment, the support device 400 includes:

[0065] The base assembly 410 has a cavity 401 and a through hole 403; and

[0066] The limiting plate 420 is provided with a receiving window 421. The limiting plate 420 is detachably connected to the base assembly 410, so that the inner wall of the receiving window 421 and the outer wall of the base assembly 410 together form a receiving groove 402.

[0067] Reference Figures 2 to 4In this embodiment of the invention, the support device 400 includes a base assembly 410 and a limiting plate 420. The base assembly 410 has a cavity 401 and a through hole 403. The limiting plate 420 has a receiving window 421. The position and size of the receiving window 421 correspond to the shape design of the semiconductor laser. The limiting plate 420 and the base assembly 410 are detachably connected together by screws, clips, or other means. By designing the support device 400 in a split manner, limiting plates 420 with different shapes of receiving windows 421 can be designed according to different models of semiconductor lasers, improving the versatility and flexibility of the support device 400, thereby enabling the packaging equipment to adapt to the packaging requirements of various semiconductor lasers. Specifically, in this embodiment, the inner wall of the receiving window 421 is also provided with an elastic pad. On the one hand, this improves the airtightness between the receiving groove 402 and the semiconductor laser, ensuring reliable negative pressure adsorption. On the other hand, the elastic pad is relatively soft, separating the rigid limiting plate 420 from the semiconductor laser, further reducing damage to the semiconductor laser caused by the packaging equipment.

[0068] In one embodiment, the base assembly 410 is provided with a plurality of limiting plates 420, and the base assembly 410 is provided with at least one through hole 403 corresponding to each receiving window 421.

[0069] Among them, multiple limiting plates 420 are arranged sequentially along their own length direction; and / or, multiple limiting plates 420 are arranged sequentially along their own width direction.

[0070] Reference Figure 2 and Figure 4 In this embodiment of the invention, multiple limiting plates 420 are installed on the base assembly 410. Each limiting plate 420 has a receiving window 421 for placing semiconductor lasers, enabling the carrier device 400 to simultaneously fix multiple lasers, improving production efficiency and making it suitable for batch packaging. The limiting plates 420 can be arranged sequentially along the length direction to form one or more rows of receiving slots 402; or they can be arranged sequentially along the width direction to form one or more rows of receiving slots 402. The arrangement along the length and width directions makes the space above the base assembly 410 more efficient, maximizing the number of receiving slots 402; and the arrangement is neat and easy to manage, making the placement and removal of the limiting plates 420 more orderly and facilitating the disassembly and replacement of the limiting plates 420.

[0071] In one embodiment, the limiting plate 420 is provided with a plurality of receiving windows 421.

[0072] Reference Figure 2 and Figure 4In this embodiment of the invention, the limiting plate 420 is provided with multiple receiving windows 421, allowing a single limiting plate 420 to hold multiple semiconductor lasers, further improving production efficiency. The design of multiple receiving windows 421 enables the limiting plate 420 to improve space utilization. For example, for larger semiconductor lasers, the limiting plate 420 can be provided with two receiving windows 421; for smaller semiconductor lasers, the limiting plate 420 can be provided with three receiving windows 421, adapting to semiconductor lasers of different sizes or types. Only the size or position of the windows needs to be adjusted, increasing the applicability of the equipment.

[0073] In one embodiment, the base assembly 410 includes:

[0074] The upper body 411 is provided with a first groove 4111 and a through hole 403; and

[0075] The lower seat 412 is provided with a second groove 4121. The lower seat 412 is sleeved on the outside of the upper seat 411 through the second groove 4121 and closes the first groove 4111 to form a cavity 401.

[0076] Reference Figures 2 to 4 In an embodiment of this utility model, the base assembly 410 includes an upper body 411 and a lower body 412. The upper body 411 has a first groove 4111, and the lower body 412 has a second groove 4121. The first groove 4111 is fastened into the second groove 4121, so that the lower body 412 is fitted onto the outside of the upper body 411 through the second groove 4121 and closes the first groove 4111, forming a cavity 401 with the upper body 411. The combination of the upper and lower bodies 412 reduces the manufacturing difficulty of the cavity 401; in addition, the lower body 412 fitted onto the outside of the upper body 411 helps to improve the sealing performance of the cavity 401, prevents external gas from entering, and ensures the stability of the negative pressure environment.

[0077] In one embodiment, a partition 4112 is provided within the first groove 4111, dividing the first groove 4111 into multiple sub-grooves. The partition 4112 is provided with a connecting groove 4113 connecting the sub-grooves on both sides of itself; and / or,

[0078] The lower body 412 is equipped with a connector, which is connected to the vacuum generator 500 through a pipeline.

[0079] Reference Figure 3 and Figure 5In this embodiment of the invention, a partition plate 4112 is provided inside the first groove 4111. The partition plate 4112 supports the inside of the first groove 4111, which helps to improve the strength and rigidity of the first groove 4111, reduce the possibility of deformation or damage to the supporting device 400, and also helps to improve the stability when supporting multiple semiconductor lasers. The partition plate 4112 is also provided with a connecting groove 4113 to ensure the uniformity of air pressure in each sub-groove.

[0080] In an embodiment of this utility model, the lower seat 412 is provided with an air extraction port, through which multiple sub-slots extract air. A connector is provided at the air extraction port, which facilitates connection to pipelines and then to a vacuum generator. When the vacuum generator 500 is started, the air in the cavity 401 is extracted from the air extraction port through the connector and pipelines, forming a negative pressure environment.

[0081] In one embodiment, the vacuum generating device 500 includes:

[0082] Vacuum pump 510, located inside the second space 102, is connected to the first space 101 via a pipe to draw gas from the first space 101. Vacuum pump 510 is also connected to cavity 401 via a pipe to create a negative pressure within cavity 401, allowing the carrier device 400 to adsorb the semiconductor laser within the receiving tank 402 under the influence of the negative pressure.

[0083] Vacuum gauge 520 is located inside the first space 101 and is used to measure the vacuum level of the first space 101.

[0084] Reference Figure 1 In this embodiment of the invention, the vacuum generating device 500 includes a vacuum pump 510 and a vacuum gauge 520. The vacuum pump 510 is located inside the second space 102 and is connected to the first space 101 through a pipeline to draw gas from the first space 101. It is also connected to the cavity 401 through another pipeline to create a negative pressure within the cavity 401. The vacuum gauge 520 is installed inside the first space 101 to measure the vacuum level. By monitoring the vacuum level of the vacuum gauge 520, the vacuum level of the first space 101 can be precisely controlled, thereby precisely controlling the nitrogen concentration after nitrogen is introduced into the first space 101, thus improving welding quality.

[0085] In one embodiment, the vacuum generating device 500 further includes a filter assembly 530, which is connected to the vacuum pump 510 and the first space 101 via a pipeline.

[0086] Reference Figure 1In this embodiment of the invention, the filter assembly 530 is located in the pipeline between the vacuum pump 510 and the first space 101. It is used to filter out impurities and particulate matter in the gas drawn from the first space 101 by the vacuum pump 510. This protects the vacuum pump 510 from contamination and extends its service life; it also prevents pipeline blockage and ensures the pumping efficiency of the vacuum pump 510. Specifically, in this embodiment, the filter assembly 530 includes a fiber filter and an ionization filter. The fiber filter's mesh is made of glass fiber, polyester fiber, etc., and can capture tiny particles. The ionization filter uses an electric field to charge the particulate matter in the gas, and then captures the particulate matter through the electric field force, resulting in high filtration accuracy.

[0087] In one embodiment, the welding apparatus 200 includes:

[0088] Welding head 210 is located above the bearing device 400;

[0089] The vertical moving mechanism 220 drives the connecting welding head 210 to move the welding head 210 closer to or away from the bearing device 400;

[0090] The lateral moving mechanism 230 drives the vertical moving mechanism 220; and

[0091] The longitudinal moving mechanism 240 drives and connects to the lateral moving mechanism 230.

[0092] Reference Figure 1 In an embodiment of this utility model, the welding device 200 includes a welding head 210, a vertical moving mechanism 220, a horizontal moving structure, and a longitudinal moving mechanism 240. The vertical moving mechanism 220 drives the welding head 210 to move in the vertical direction and adjusts the vertical distance between the welding head 210 and the semiconductor laser. The horizontal moving mechanism 230 is connected to the vertical moving mechanism 220, enabling the welding head 210 to move in the horizontal direction. The longitudinal moving mechanism 240 is connected to the horizontal moving mechanism 230 and is used to control the welding head 210 to move in another horizontal direction (a direction perpendicular to the moving direction of the horizontal moving mechanism 230), thereby enabling the welding head 210 to move and be positioned in three-dimensional space. This allows the welding device 200 to adapt to welding requirements at different locations and improves the flexibility of welding. Specifically, in this embodiment, one side wall of the housing assembly 100 is provided with an operating port that can be opened and closed. The semiconductor laser is picked up and put in through the operating port. The moving direction of the longitudinal moving mechanism 240 is configured to be close to or away from the operating port, so as to avoid the lateral moving mechanism 230, the vertical moving mechanism 220, the welding head 210, etc. from blocking the operating port and the supporting device 400.

[0093] Among them, the vertical moving mechanism 220, the horizontal moving mechanism 230, and the longitudinal moving mechanism 240 can all adopt structural forms such as lead screw and nut mechanism, linear motor, and gear and rack mechanism to achieve linear movement.

[0094] Reference Figure 1 In one embodiment, the nitrogen protection device 300 includes a nitrogen cylinder 310, a pressure regulating valve 320, and a flow control valve 330. The nitrogen cylinder 310 is a container for storing high-pressure nitrogen. The pressure regulating valve 320 and the flow control valve 330 are disposed on the pipeline between the nitrogen cylinder 310 and the first space 101. The flow control valve 330 is used to regulate the flow rate of nitrogen to ensure that the nitrogen concentration in the first space 101 reaches the required level. The pressure regulating valve 320 is used to regulate the pressure of nitrogen to match the pressure requirements of the first space 101.

[0095] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A semiconductor laser packaging device, characterized in that, include: The housing assembly has a separated first space and a second space; A welding device, located inside the first space, is used for welding semiconductor lasers; A nitrogen protection device is installed inside the second space and connected to the first space via a pipeline, used to fill the first space with nitrogen. A support device is fixed inside the first space. The support device has a cavity, a receiving groove, and a through hole connecting the cavity and the receiving groove. The receiving groove is used to place the semiconductor laser. A vacuum generating device is located inside the second space and is connected to the first space through a pipe to draw in gas from the first space. The vacuum generating device is also connected to the cavity through a pipe to create a negative pressure inside the cavity, so that the supporting device can adsorb the semiconductor laser in the receiving tank through the negative pressure.

2. The semiconductor laser packaging equipment as described in claim 1, characterized in that, The supporting device is provided with multiple receiving slots and multiple cavities, and the multiple receiving slots and multiple cavities are connected in a one-to-one correspondence; or... The supporting device is provided with multiple receiving slots and a cavity, and the multiple receiving slots are all connected to the cavity.

3. The semiconductor laser packaging equipment as described in claim 1, characterized in that, The supporting device includes: The base assembly includes the cavity and the through hole; and The limiting plate is provided with a receiving window. The limiting plate is detachably connected to the base assembly, so that the inner wall of the receiving window and the outer wall of the base assembly together surround and form the receiving groove.

4. The semiconductor laser packaging equipment as described in claim 3, characterized in that, The base assembly is provided with a plurality of the limiting plates, and the base assembly is provided with at least one through hole corresponding to each of the receiving windows; The plurality of limiting plates are arranged sequentially along their own length direction; and / or the plurality of limiting plates are arranged sequentially along their own width direction.

5. The semiconductor laser packaging equipment as described in claim 3, characterized in that, The limiting plate is provided with multiple receiving windows.

6. The semiconductor laser packaging equipment as described in claim 3, characterized in that, The base assembly includes: The upper body is provided with a first groove and the through hole; and The lower seat has a second groove, which is fitted onto the outside of the upper seat and closes the first groove to form the cavity.

7. The semiconductor laser packaging equipment as described in claim 6, characterized in that, The first groove is provided with a partition, which divides the first groove into multiple sub-grooves. The partition is provided with a connecting groove that connects the sub-grooves on both sides of itself; and / or, The lower body is provided with a connector, which is connected to the vacuum generating device through a pipeline.

8. The semiconductor laser packaging equipment as described in claim 1, characterized in that, The vacuum generating device includes: A vacuum pump, located inside the second space and connected to the first space via a pipe, draws gas from the first space. The vacuum pump is also connected to the cavity via a pipe to create a negative pressure within the cavity, allowing the supporting device to adsorb the semiconductor laser from the receiving tank through this negative pressure. A vacuum gauge is installed inside the first space to measure the vacuum level of the first space.

9. The semiconductor laser packaging equipment as described in claim 8, characterized in that, The vacuum generating device also includes a filter assembly, which is connected to the vacuum pump and the first space via a pipeline.

10. The semiconductor laser packaging equipment as described in claim 1, characterized in that, The welding apparatus includes: The welding head is located above the supporting device; A vertical moving mechanism drives the welding head to move the welding head closer to or away from the supporting device; A lateral moving mechanism, driving and connecting the vertical moving mechanism; and The longitudinal moving mechanism drives the lateral moving mechanism.

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