PCB laser drilling equipment
By employing a sealed housing and an extraction and collection device in the PCB laser drilling equipment, the problem of impurity diffusion during the cleaning process is solved, achieving efficient impurity collection and improved environmental cleanliness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAN JIN DIAN ZI ZHU HAI YOU XIAN GONG SI
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-14
AI Technical Summary
In the process of cleaning the substrate, impurities in existing PCB laser drilling equipment can easily diffuse, leading to secondary pollution and pollution of the production environment.
A PCB laser drilling device was designed, which adopts a closed shell and an extraction and collection device. Impurities are blown out by an air jet device and collected by the extraction and collection device, forming a relatively closed clean space to prevent the diffusion of impurities.
It effectively solves the problem of impurity diffusion and contamination, avoids secondary contamination caused by impurities re-attaching to the substrate, and greatly improves the cleanliness of the production environment.
Smart Images
Figure CN224488028U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB processing technology, and in particular to a PCB laser drilling device. Background Technology
[0002] PCB (Printed Circuit Board) laser drilling equipment is a specialized device that uses a high-energy laser beam to precisely drill holes in PCB substrates. With its advantages of concentrated laser beam energy, small spot diameter, high drilling accuracy, and fast processing speed, it is widely used in micro-hole processing of high-density PCBs. During the drilling operation, the operator first lays a pad on the positioning plate of the equipment. This pad protects the positioning plate from direct laser irradiation and damage. Then, the substrate to be processed is accurately placed on top of the pad, and the positioning structure of the positioning plate ensures precise positioning. After these preparations, the positioning plate, carrying the substrate, moves into the laser processing cavity of the equipment. The laser generator inside the equipment adjusts the laser wavelength according to preset drilling parameters, allowing the laser beam to precisely penetrate the substrate and complete the drilling. Simultaneously, thanks to the precise control of the laser wavelength, the laser does not penetrate the underlying pad, thus protecting both the pad and the positioning plate. After the laser drilling process is completed, the positioning plate moves to the unloading position. At this time, debris, dust, and other impurities generated during the laser drilling process will remain inside the holes and on the surface of the substrate. Operators need to manually blow away these impurities using a handheld compressed air spray gun. After cleaning, the substrate is removed from the positioning plate, completing the entire drilling process. This handheld spray gun cleaning method easily causes impurities to spread. When the handheld spray gun blows, the airflow is an open jet, and impurities inside the holes and on the surface of the substrate are blown into the surrounding environment. These blown-away impurities may not only re-adhere to the cleaned substrate, causing secondary pollution, but also have an adverse impact on the production environment around the equipment. Utility Model Content
[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a PCB laser drilling device that can prevent the diffusion of impurities during the substrate cleaning process, thereby avoiding the situation where impurities re-adhere to the substrate and cause secondary contamination.
[0004] A PCB laser drilling device according to an embodiment of the present invention includes a frame with a housing; a laser drilling device disposed on the frame and inside the housing; a positioning fixture movably connected to the frame in a front-rear direction, the positioning fixture being used to position a pad film and a substrate; a linear drive device disposed on the frame, the linear drive device being able to drive the positioning fixture to move rearward into the housing, so that the laser drilling device can perform laser drilling on the substrate on the positioning fixture; a housing disposed on the frame, the housing having a suction port; a first jet device disposed inside the housing, the first jet device being located in front of the suction port, the first jet device being used to jet downward; and a suction collection device disposed on the frame, the suction end of the suction collection device being connected to the suction port; the linear drive device being able to drive the positioning fixture forward to below the housing, so that the gas ejected by the first jet device blows out impurities in the holes on the substrate, and the suction collection device being able to suction the gas inside the housing and collect the impurities in the gas.
[0005] It has at least the following beneficial effects:
[0006] The relatively enclosed clean space formed by the shell of this PCB laser drilling equipment, in conjunction with the suction and collection device, effectively solves the problem of easy diffusion and pollution of impurities in the traditional handheld spray gun cleaning method. It concentrates the gas carrying impurities into the suction and collection device, avoiding the situation where impurities diffuse into the surrounding environment of the equipment or re-adhere to the substrate or other workpieces, causing secondary pollution, and greatly improving the cleanliness of the production environment.
[0007] According to the PCB laser drilling equipment of this utility model embodiment, the positioning fixture is provided with a positioning groove. The depth of the positioning groove is less than the sum of the thicknesses of the pad film and the substrate. The positioning groove is used to accommodate part of the structure of the pad film and the substrate so that the upper part of the substrate extends out from the positioning groove.
[0008] According to the PCB laser drilling equipment of this utility model embodiment, the lower end of the housing is provided with a sealing ring, and the lower end of the housing can abut against the substrate on the positioning fixture through the sealing ring.
[0009] The PCB laser drilling equipment according to an embodiment of the present invention further includes a clamping device, which is disposed on the positioning fixture and is used to clamp the substrate against the inner wall of the positioning groove.
[0010] According to the PCB laser drilling equipment of this utility model embodiment, the clamping device includes a cylinder and a push plate. The cylinder body is disposed on the positioning fixture, and the piston rod of the cylinder is connected to the push plate. The cylinder can drive the push plate to move forward so that the push plate clamps the substrate against the inner sidewall of the positioning groove.
[0011] According to the PCB laser drilling equipment of this utility model embodiment, the positioning fixture is provided with a handle groove, and the handle groove is connected to the positioning groove.
[0012] The PCB laser drilling equipment according to an embodiment of the present invention further includes a second jet device, which is disposed inside the housing and located behind the suction port. The second jet device is used to jet downwards, and the linear drive device can drive the positioning fixture to move back and forth reciprocally below the housing.
[0013] According to the PCB laser drilling equipment of this utility model embodiment, the first jet device includes a plurality of first jet nozzles, which are evenly distributed on the housing in the left-right direction, and all of the plurality of first jet nozzles are used to jet downwards.
[0014] According to the PCB laser drilling equipment of this utility model embodiment, the suction and collection device includes a vacuum pump, a suction tube, and a filter. The output end of the vacuum pump is connected to the suction port through the suction tube. The filter is disposed on the suction tube. The vacuum pump is used to suction the gas inside the housing, and the filter is used to filter and collect impurities in the gas.
[0015] According to an embodiment of the PCB laser drilling equipment of the present invention, the housing is provided with an observation window.
[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:
[0018] Figure 1 This is a schematic diagram of the structure of the PCB laser drilling equipment according to an embodiment of this utility model;
[0019] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;
[0020] Figure 3 yes Figure 1 A magnified view of a section at point B in the middle;
[0021] Figure 4 This is a schematic diagram of the shell structure;
[0022] Icon labels:
[0023] Frame 100; Cover 110; Observation window 111; Housing 120; Suction port 121; Sealing ring 122;
[0024] Positioning fixture 200; positioning groove 210; handle groove 220; clamping device 230; cylinder 231; push plate 232;
[0025] First jet device 300; First jet nozzle 310;
[0026] Second jet device 400;
[0027] Linear drive unit 500;
[0028] 600-type collection and absorption device;
[0029] Substrate 10. Detailed Implementation
[0030] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0031] In the description of this utility model, the use of "first" and "second" is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features or the order of the technical features.
[0032] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.
[0033] refer to Figures 1 to 4 This utility model discloses a PCB laser drilling device, including a frame 100, a laser drilling device (not shown in the figure), a positioning fixture 200, a linear drive device 500, a housing 120, a first jet device 300, and an extraction and collection device 600 (not shown in the figure).
[0034] The frame 100 is provided with a cover 110; a laser drilling device is mounted on the frame 100 and housed inside the cover 110; a positioning fixture 200 is movably connected to the frame 100 in the front-back direction and is used to position the pad film and the substrate 10; a linear drive device 500 is mounted on the frame 100 and can drive the positioning fixture 200 to move backward into the cover 110 so that the laser drilling device can perform laser drilling on the substrate 10 on the positioning fixture 200; a housing 120 is mounted on the frame 100 and has a suction port 12. 1; The first jet device 300 is disposed inside the housing 120 and is located in front of the suction port 121. The first jet device 300 is used to jet downwards; the suction collection device 600 is disposed on the frame 100 and the suction end of the suction collection device 600 is connected to the suction port 121; the linear drive device 500 can drive the positioning fixture 200 to move forward to the bottom of the housing 120 so that the gas ejected by the first jet device 300 blows out the impurities in the holes on the substrate 10 and enables the suction collection device 600 to suck the gas in the housing 120 and collect the impurities in the gas.
[0035] Understandably, when drilling is required on the substrate 10, the worker first places the pad and the substrate 10 to be processed sequentially on the positioning fixture 200. The positioning structure of the positioning fixture 200 ensures that the pad and the substrate 10 are precisely aligned. Then, the worker starts the equipment, and the linear drive 500 drives the positioning fixture 200 backward until it is fully inside the housing 110 on the frame 100. Next, the laser drilling device located inside the housing 110 begins operation, performing laser drilling on the substrate 10 on the positioning fixture 200 according to preset drilling parameters, forming the required hole structure on the substrate 10. The housing 110 provides a relatively enclosed space for laser drilling, reducing the initial diffusion of impurities to the outside during the drilling process. After the laser drilling operation is completed, the linear drive 500 drives the positioning fixture 200 forward. As the positioning fixture 200 moves forward, it gradually enters the area below the upper housing 120 of the frame 100. Simultaneously, the first jet device 300 inside the housing 120 begins operation, jetting downwards. The ejected gas directly acts on the surface and holes of the substrate 10, blowing out residual impurities from the holes. At the same time, the suction and collection device 600, connected to the suction port 121 of the housing 120, is activated. The suction and collection device 600 draws gas from the housing 120 through the suction port 121. Since the first jet device 300 is located in front of the suction port 121, the movement of the positioning fixture 200 causes the substrate 10 to pass through the jetting area. The ejected gas, carrying impurities, forms a directional airflow within the housing 120. During the gas suction process, the suction and collection device 600 collects the impurities within the gas. The relatively enclosed cleaning space formed by the housing 120 in the PCB laser drilling equipment, in conjunction with the suction and collection device 600, effectively solves the problem of easy diffusion and pollution of impurities in the traditional handheld spray gun cleaning method. It concentrates the gas carrying impurities into the suction and collection device 600, avoiding the situation where impurities diffuse to the surrounding environment of the equipment or re-attach to the substrate 10 and other workpieces, causing secondary pollution, and greatly improving the cleanliness of the production environment.
[0036] It should be noted that, in this embodiment of the utility model, substrate 10 refers to a PCB substrate.
[0037] In this embodiment of the invention, the laser drilling device includes a laser generator, an image recognition module, and a multi-axis drive mechanism. When the positioning fixture 200 moves the substrate 10 to the drilling area within the housing 110, the image recognition module is activated. The industrial camera in the image recognition module acquires images of the substrate 10 surface, and the image analysis unit in the image recognition module quickly identifies the actual position of the substrate 10. Based on the position information fed back by the image recognition module and combined with preset drilling path data, the multi-axis drive mechanism drives the laser generator to move in the left-right and front-back directions, aligning the laser emission port with the initial drilling position of the substrate 10. Simultaneously, the multi-axis drive mechanism adjusts the laser beam focal length by moving in the up-down direction, ensuring that the laser beam forms a high-energy spot with a precise diameter on the surface of the substrate 10, enabling the laser emitted by the laser generator to drill holes in the substrate 10. This laser drilling device is a common setup in the field of PCB drilling technology and will not be described further here.
[0038] In this embodiment of the invention, the PCB laser drilling equipment further includes two slide rails parallel to the front-back direction and two sliders. Both slide rails are mounted on the frame 100, and both sliders are mounted on the positioning fixture 200. The two sliders are slidably connected to the two slide rails, allowing the positioning fixture 200 to move back and forth. In this embodiment of the invention, the output end of the linear drive device 500 is connected to the positioning fixture 200. The linear drive device 500 can be a common servo motor ball screw type linear drive device 500, or it can be a common servo motor synchronous belt type linear drive device 500; further details are omitted here.
[0039] refer to Figure 2The positioning fixture 200 has a positioning groove 210, the depth of which is less than the sum of the thicknesses of the pad film and the substrate 10. The positioning groove 210 is used to accommodate part of the structure of the pad film and the substrate 10, so that the upper part of the substrate 10 extends out of the positioning groove 210. The lower end of the housing 120 is provided with a sealing ring 122, and the lower end of the housing 120 can abut against the substrate 10 on the positioning fixture 200 through the sealing ring 122. It can be understood that after laser drilling is completed, the linear drive device 500 drives the positioning fixture 200 to move forward, preparing to enter the cleaning process. Since the depth of the positioning groove 210 on the positioning fixture 200 is less than the sum of the thicknesses of the pad film and the substrate 10, the upper part of the substrate 10 always extends out of the positioning groove 210. When the positioning fixture 200 moves to below the housing 120, the sealing ring 122 at the lower end of the housing 120 can just abut against the upper surface of the substrate 10. On the one hand, the positioning groove 210 provides stable accommodation and positioning for part of the structure of the pad film and the substrate 10, effectively preventing the substrate 10 from shifting even during movement, and ensuring the precise relative position of the substrate 10 with the first jet device 300 and the suction port 121 during cleaning. On the other hand, the flexible contact between the sealing ring 122 and the substrate 10, combined with the protruding design of the substrate 10, allows the upper surface of the housing 120 and the substrate 10 to quickly form a closed cleaning space, preventing impurities blown away by the first jet device 300 from spreading to the external environment and reducing the risk of secondary pollution from the source. Furthermore, the protruding structure on the upper part of the substrate 10 ensures that the gas can directly act on the impurities in the hole, and also provides a reliable contact carrier for the sealing ring 122, enabling the sealing ring 122 to seal the gap between the substrate 10 and the housing 120, preventing impurities from spreading from the gap between the housing 120 and the substrate 10.
[0040] It should be explained that, in this embodiment of the invention, the length of the housing 120 in the left-right direction is equal to the length of the substrate 10 in the left-right direction, and the perforation area of the substrate 10 is concentrated in its central region, meaning that no perforations are made in the edge region of the substrate 10. Specifically, the lower end of the housing 120 abuts against the edge region of the substrate 10 through the sealing ring 122. In this embodiment of the invention, the sealing ring 122 has a circular cross-section. During the forward movement of the positioning fixture 200, the substrate 10 on the positioning fixture 200 can first squeeze the side of the sealing ring 122, causing the sealing ring 122 to deform. As the positioning fixture 200 moves, the substrate 10 on the positioning fixture 200 can move below the sealing ring 122, so that the lower end of the housing 120 can abut against the surface of the substrate 10 through the sealing ring 122.
[0041] refer to Figure 2The PCB laser drilling equipment also includes a clamping device 230, which is mounted on the positioning fixture 200. The clamping device 230 is used to clamp the substrate 10 against the inner wall of the positioning groove 210. The clamping device 230 includes a cylinder 231 and a push plate 232. The cylinder body of the cylinder 231 is mounted on the positioning fixture 200, and the piston rod of the cylinder 231 is connected to the push plate 232. The cylinder 231 can drive the push plate 232 to move forward, so that the push plate 232 clamps the substrate 10 against the inner wall of the positioning groove 210. It can be understood that in the preparation stage before laser drilling, the worker lays a pad film in the positioning groove 210 of the positioning fixture 200, and then places the substrate 10 to be drilled on top of the pad film, ensuring that part of the structure of the substrate 10 is embedded in the positioning groove 210. Next, the clamping device 230 is activated, and the piston rod of the cylinder 231, located on the positioning fixture 200, extends forward, driving the push plate 232 connected to the end of the piston rod to move forward synchronously. During the movement, the push plate 232 contacts the side of the substrate 10 and continuously applies a pushing force, ultimately clamping the substrate 10 against the inner wall of the positioning groove 210, completing the fixing operation of the substrate 10. Throughout the laser drilling and cleaning process, the clamping device 230 remains in a clamping state until the cleaning process is completed. After the cleaning process is completed, the linear drive device 500 drives the positioning fixture 200 to move backward and disengage from under the housing 120, the piston rod of the cylinder 231 retracts, driving the push plate 232 to return to its original position, releasing the clamping force on the substrate 10, so that the worker can remove the drilled and cleaned substrate 10 from the positioning groove 210.
[0042] refer to Figure 2 The positioning fixture 200 is provided with a handle groove 220, which communicates with the positioning groove 210. It is understood that after the substrate 10 completes the cleaning process, the positioning fixture 200 moves backward from the bottom of the housing 120, and the worker can directly reach into the edge of the positioning groove 210 through the handle groove 220 to easily contact the side of the substrate 10. The handle groove 220 provides a point of force application, allowing the worker to grasp the edge of the substrate 10 and remove it from the positioning groove 210, thereby improving the convenience of the worker in removing the substrate.
[0043] refer to Figure 1 and Figure 4The PCB laser drilling equipment also includes a second jet device 400, which is located inside the housing 120 and behind the suction port 121. The second jet device 400 is used to jet downwards. The linear drive device 500 can drive the positioning fixture 200 to move back and forth under the housing 120. It is understood that after drilling, the linear drive device 500 drives the positioning fixture 200 forward to below the housing 120. Inside the housing 120, the first jet device 300 in front of the suction port 121 and the second jet device 400 behind it simultaneously jet downwards. During the reciprocating movement of the positioning fixture 200 under the housing 120, the gas blown out by the first jet device 300 and the second jet device 400 can completely cover the surface of the substrate 10, allowing impurities in the holes on the substrate 10 to be blown out. At the same time, the suction and collection device 600 continuously suctions the gas inside the housing 120 through the suction port 121, collecting the blown-out impurities in a timely manner. The first jet device 300 and the second jet device 400, which are set up in front and behind, work together with the reciprocating movement of the positioning fixture 200 to form multiple rounds and multiple angles of blowing on the surface and holes of the substrate 10, avoiding the cleaning blind spots of a single jet. Meanwhile, the suction and collection device 600 simultaneously suctions to ensure that the impurities are completely collected, effectively improving the comprehensiveness and thoroughness of the cleaning of the substrate 10, and further reducing the risk of impurity residue and secondary pollution.
[0044] refer to Figure 4 The first jet device 300 includes multiple first jet nozzles 310, which are evenly distributed on the housing 120 in a left-right direction. All the first jet nozzles 310 are used for downward jetting. In this embodiment of the invention, the first jet device 300 also includes a first air pump, a diverter valve, and multiple first air pipes. The first air pump is mounted on the frame 100. The input end of the diverter valve is connected to the output end of the first air pump. One end of each of the multiple first air pipes is connected to the output end of the diverter valve, and the other end of each first air pipe is connected to the multiple first jet nozzles 310. The multiple first jet nozzles 310 are evenly distributed on the housing 120 in a left-right direction. After the first air pump is started, it generates compressed gas, which is evenly distributed to the multiple first jet nozzles 310 by the diverter valve, ultimately achieving downward jetting through the first jet nozzles 310. It is understood that the multiple first jet nozzles 310 evenly distributed along the left-right direction can ensure that the ejected gas uniformly covers the surface of the substrate 10, ensuring that impurities inside the holes and on the surface of the substrate 10 can be effectively blown away, thus improving the uniformity and comprehensiveness of cleaning. In this embodiment of the present invention, the second jet device 400 has the same structure as the first jet device 300, and will not be described further here.
[0045] In this embodiment of the invention, the suction and collection device 600 includes a vacuum pump, a suction pipe, and a filter. The output end of the vacuum pump is connected to the suction port 121 via the suction pipe. The filter is installed on the suction pipe. The vacuum pump is used to suction gas inside the housing 120, and the filter is used to filter and collect impurities in the gas. It is understood that the vacuum pump is activated when the positioning fixture 200, carrying the substrate 10, moves below the housing 120 for a cleaning process. The vacuum pump is connected to the suction port 121 of the housing 120 via the suction pipe. Under the suction action of the vacuum pump, the gas inside the housing 120 is continuously suctioned, causing the gas carrying impurities to enter the suction pipe through the suction port 121. As the gas carrying impurities flows within the suction pipe, the filter installed on the suction pipe filters the gas. Debris, dust, and other impurities in the gas are intercepted and collected by the filter. The filtered clean gas continues to enter the vacuum pump through the suction pipe and is finally discharged by the vacuum pump. Throughout the cleaning process, the vacuum pump continuously provides a stable negative pressure, ensuring a directional airflow within the housing 120. Impurities are carried by the airflow into the suction pipe and are effectively intercepted by the filter, achieving centralized collection of impurities and purified gas discharge. The filter can be a common bag filter.
[0046] refer to Figure 1 The housing 110 is equipped with an observation window 111. Understandably, during the laser drilling process, workers can observe the drilling status of the substrate 10 and the operation of the positioning fixture 200 in real time through the observation window 111 without opening the housing 110. This facilitates timely detection of any abnormalities that may occur during the drilling process, allowing for rapid intervention and reducing the production of defective products. Simultaneously, while ensuring the housing 110's airtightness, the observation window 111 provides convenience for daily inspection and maintenance of the equipment. It allows for preliminary checks of the laser drilling device's operating status without disassembling the housing 110, reducing operational risks and preventing impurities from entering due to frequent opening of the housing 110.
[0047] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0048] Of course, this utility model is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.
Claims
1. A PCB laser drilling device, characterized in that, include: The frame (100) is equipped with a cover (110); A laser drilling device is mounted on the frame (100) and is located inside the housing (110); A positioning fixture (200) is movably connected to the frame (100) in the front-back direction, and the positioning fixture (200) is used to position the pad film and the substrate (10). A linear drive device (500) is provided on the frame (100). The linear drive device (500) can drive the positioning fixture (200) to move backward into the cover (110) so that the laser drilling device can perform laser drilling on the substrate (10) on the positioning fixture (200). A housing (120) is provided on the frame (100), and a suction port (121) is provided on the housing (120). A first jet device (300) is disposed inside the housing (120). The first jet device (300) is located in front of the suction port (121) and is used to jet downwards. A suction collection device (600) is provided on the frame (100), and the suction end of the suction collection device (600) is connected to the suction port (121). The linear drive device (500) can drive the positioning fixture (200) forward to below the housing (120) so that the gas ejected by the first jet device (300) blows out the impurities in the holes on the substrate (10) and enables the suction and collection device (600) to suction the gas in the housing (120) and collect the impurities in the gas.
2. The PCB laser drilling equipment according to claim 1, characterized in that: The positioning fixture (200) is provided with a positioning groove (210), the depth of which is less than the sum of the thicknesses of the pad film and the substrate (10). The positioning groove (210) is used to accommodate part of the structure of the pad film and the substrate (10) so that the upper part of the substrate (10) extends out from the positioning groove (210).
3. The PCB laser drilling equipment according to claim 2, characterized in that: The lower end of the housing (120) is provided with a sealing ring (122), and the lower end of the housing (120) can abut against the base plate (10) on the positioning fixture (200) through the sealing ring (122).
4. The PCB laser drilling equipment according to claim 2, characterized in that: It also includes a clamping device (230), which is disposed on the positioning fixture (200) and is used to clamp the substrate (10) against the inner wall of the positioning groove (210).
5. The PCB laser drilling equipment according to claim 4, characterized in that: The clamping device (230) includes a cylinder (231) and a push plate (232). The cylinder body of the cylinder (231) is mounted on the positioning fixture (200). The piston rod of the cylinder (231) is connected to the push plate (232). The cylinder (231) can drive the push plate (232) to move forward so that the push plate (232) clamps the base plate (10) against the inner wall of the positioning groove (210).
6. The PCB laser drilling equipment according to claim 2, characterized in that: The positioning fixture (200) is provided with a handle groove (220), which is connected to the positioning groove (210).
7. The PCB laser drilling equipment according to claim 1, characterized in that: It also includes a second jet device (400), which is disposed inside the housing (120) and located behind the suction port (121). The second jet device (400) is used to jet downwards. The linear drive device (500) can drive the positioning fixture (200) to move back and forth under the housing (120).
8. The PCB laser drilling equipment according to claim 1, characterized in that: The first jet device (300) includes a plurality of first jet nozzles (310), which are evenly distributed on the housing (120) in the left-right direction, and each of the plurality of first jet nozzles (310) is used to jet downwards.
9. The PCB laser drilling equipment according to claim 1, characterized in that: The suction and collection device (600) includes a vacuum pump, a suction pipe and a filter. The output end of the vacuum pump is connected to the suction port (121) through the suction pipe. The filter is installed on the suction pipe. The vacuum pump is used to suction the gas inside the housing (120) and the filter is used to filter and collect impurities in the gas.
10. The PCB laser drilling equipment according to claim 1, characterized in that: The cover (110) is provided with an observation window (111).