Automatic air-cooled heat dissipation mechanism and power knife tower

Abstract

The utility model relates to the technical field of power cutter tower, especially an automatic air -cooled heat abstractor and power cutter tower, including heat dissipation casing, filter component, drying component, fan, refrigeration component, temperature sensor and controller, the air inlet and the air outlet are seted up in heat dissipation casing, and the air inlet and the air outlet form the air guide channel between, filter component sets up at the air inlet, and drying component sets up at the air outlet, fan and refrigeration component all set up in the air guide channel, and refrigeration component is located fan downstream, and the controller is electric with fan, refrigeration component and temperature sensor respectively, and it can automatically adjust the heat abstracting intensity according to the working condition and temperature change, simultaneously has the dustproof function.

Description

Technical Field

[0001] This utility model relates to the technical field of power turrets, and in particular to an automatic air-cooling heat dissipation mechanism and a power turret. Background Technology

[0002] The power turret is a key component of CNC lathes. It not only performs the traditional tool indexing function of a turret but also provides rotational power to the tool through its built-in drive system, enabling complex machining operations such as turning, milling, and drilling. Because the power turret integrates drive components such as motors and gearboxes, it generates a significant amount of heat during operation. Excessive heat can lead to accelerated wear of components, decreased precision, and even damage. Therefore, an effective heat dissipation mechanism is crucial for the performance and lifespan of the power turret.

[0003] Existing cooling methods for power turrets mainly include natural cooling, forced air cooling, water cooling, and heat pipe cooling. Natural cooling has low efficiency and cannot meet the cooling requirements of high-power power turrets; forced air cooling, while improving efficiency, suffers significant performance degradation in high-temperature environments and is prone to introducing dust into the turret; water cooling offers high efficiency but is complex, costly, and carries the risk of coolant leakage; heat pipe cooling has limited cooling capacity for high-power power turrets. Therefore, there is still room for improvement in their structural design. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides an automatic air-cooling heat dissipation mechanism and a power turret that can automatically adjust the heat dissipation intensity according to the working status and temperature changes, and also has a dustproof function.

[0005] This utility model discloses an automatic air-cooled heat dissipation mechanism, comprising a heat dissipation shell, a filter assembly, a drying assembly, a fan, a cooling assembly, a temperature sensor, and a controller. The heat dissipation shell has an air inlet and an air outlet, and an air guide channel is formed between the air inlet and the air outlet. The filter assembly is located at the air inlet, and the drying assembly is located at the air outlet. The fan and the cooling assembly are both located in the air guide channel, with the cooling assembly located downstream of the fan. The controller is electrically connected to the fan, the cooling assembly, and the temperature sensor.

[0006] As a preferred embodiment of the present invention, the cooling assembly includes multiple semiconductor cooling chips, which are mounted on the side wall of the heat dissipation housing. The cold end of each semiconductor cooling chip faces the airflow channel, and the hot end is connected to a heat dissipation fin, which extends to the outside of the heat dissipation housing.

[0007] As a preferred embodiment of this utility model, the heat dissipation housing is provided with multiple partitions, which are arranged alternately along the gas flow direction to divide the air guide channel into an S-shaped channel; within the S-shaped channel, multiple semiconductor cooling chips are distributed at intervals along their paths.

[0008] As a preferred embodiment of this utility model, each corner of the S-shaped channel is provided with a spoiler, and the end of the spoiler is bent backward to form an arc-shaped blade.

[0009] As a preferred embodiment of this utility model, a water collection chamber is provided at the bottom of the heat dissipation shell, and multiple through-holes communicating with the air guide channel are provided on the water collection chamber, and at least one through-hole is provided at the bottom of each baffle.

[0010] As a preferred embodiment of the present invention, the filter assembly includes a first mounting bracket and at least one number of filter elements. The first mounting bracket is fixed on the heat dissipation housing, and the plurality of filter elements are arranged sequentially along the gas flow direction and are detachably connected to the first mounting bracket.

[0011] As a preferred embodiment of the present invention, the drying assembly includes a second mounting bracket, a drying cylinder, and a molecular sieve. The second mounting bracket is fixed on the heat dissipation shell, the drying cylinder is detachably connected to the second mounting bracket, and the molecular sieve is disposed inside the drying cylinder.

[0012] The present invention provides a power turret, including any of the above-mentioned automatic air-cooling heat dissipation mechanisms.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. High-efficiency heat dissipation is achieved through the combined design of a fan, a thermoelectric cooler, and an S-shaped airflow channel. The fan forces airflow, and the cold end of the thermoelectric cooler directly cools the airflow through the airflow channel, while the hot end dissipates heat to the outside through the heat dissipation fins. The S-shaped airflow channel extends the contact time between the airflow and the cooling components, and together with the baffles at the corners, it enhances airflow turbulence, allowing for more complete heat exchange. This effectively meets the heat dissipation requirements of high-power power turrets, improves heat dissipation efficiency, and avoids problems such as component wear, decreased precision, and damage caused by high temperatures.

[0015] 2. The filter components at the air inlet can effectively intercept external dust, preventing dust from entering the turret and affecting equipment operation; the drying components at the air outlet use molecular sieves to dry the exhaust airflow, ensuring a dry environment inside the turret, avoiding electrical faults or component corrosion caused by moisture, and improving the stability and reliability of the power turret operation.

[0016] 3. The temperature sensor monitors the temperature of key heat-generating components inside the turret box in real time. Based on the data fed back by the temperature sensor, the controller automatically adjusts the fan speed and the cooling power of the cooling components to achieve precise heat dissipation, ensuring heat dissipation effect while reducing energy consumption at lower temperatures. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the automatic air-cooling heat dissipation mechanism of this utility model;

[0018] Figure 2 This is a schematic diagram of the automatic air-cooling heat dissipation mechanism of this utility model;

[0019] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure and connection diagram of section AA;

[0020] Figure 4 This is a schematic diagram of the structure of the power turret of this utility model;

[0021] The following are labels in the attached diagram: 1. Heat sink housing; 11. Air inlet; 12. Air outlet; 13. Air guide channel; 14. Baffle; 16. Baffle plate; 18. Water collection chamber; 19. Through port; 2. Filter assembly; 21. First mounting bracket; 22. Filter element; 3. Drying assembly; 31. Second mounting bracket; 32. Drying cylinder; 33. Molecular sieve; 4. Fan; 5. Refrigeration assembly; 51. Semiconductor refrigeration chip; 52. Heat sink fins; 6. Temperature sensor; 7. Controller. Detailed Implementation

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0024] Reference Figures 1 to 3This embodiment provides an automatic air-cooled heat dissipation mechanism, including a heat dissipation housing 1, a filter assembly 2, a drying assembly 3, a fan 4, a cooling assembly 5, a temperature sensor 6, and a controller 7. The heat dissipation housing 1 has an air inlet 11 and an air outlet 12, with a guide channel 13 forming between them to provide a path for the cooling airflow. Specifically, the filter assembly 2 is located at the air inlet 11 to filter dust, particles, and other impurities from the outside air, preventing them from entering the heat dissipation housing 1 and subsequent components and affecting equipment operation. The drying assembly 3 is located at the air outlet 12 to dry the discharged air, preventing humid air from adversely affecting the equipment. The fan 4 and the cooling assembly 5 are both located within the guide channel 13, with the cooling assembly 5 downstream of the fan 4. The fan 4 provides power to the airflow, propelling it within the guide channel 13, while the cooling assembly 5 cools the airflow to ensure that the airflow reaching the heat-generating parts achieves the desired heat dissipation effect. Temperature sensor 6 is installed at the heat-generating part and on the outside of the heat sink housing 1 to monitor the temperature of the heat-generating part and the external environment, and transmits the temperature data to controller 7. Controller 7 is electrically connected to fan 4, cooling component 5 and temperature sensor 6 respectively, and can control the working status of fan 4 and cooling component 5 based on the temperature data fed back by temperature sensor 6. During operation, temperature sensor 6 monitors the temperature in real time; if temperature sensor 6 detects that the temperature of the heat-generating part has not reached the heat dissipation threshold, it transmits the data to controller 7, and controller 7 controls fan 4 and cooling component 5 to stop running. At this time, only filter component 2 continuously filters impurities in the outside air at air inlet 11, and drying component 3 dries the small amount of exhaust gas at air outlet 12; when the outside temperature is low, and temperature sensor 6 detects that the temperature of the heat-generating part exceeds the heat dissipation threshold, it transmits a signal to controller 7, controller 7 starts fan 4, causing it to push airflow in air guide channel 13, and the airflow reaches the heat-generating part through air guide channel 13 to achieve heat dissipation. When the ambient temperature is high, and the temperature sensor 6 detects that the temperature of the heat-generating part exceeds the heat dissipation threshold, the fan 4 is activated, and the cooling component 5 is turned on to cool the airflow. The cooled airflow then reaches the heat-generating part through the air guide channel 13 to dissipate heat. In addition, by controlling the speed of the fan 4 and the power of the cooling component 5, the heat dissipation intensity can be adjusted to optimize the heat dissipation effect.

[0025] As a preferred embodiment of the above technical solution, the cooling assembly 5 includes multiple thermoelectric coolers 51. The multiple thermoelectric coolers 51 are mounted on the side wall of the heat dissipation housing 1, with the cold end of each thermoelectric cooler 51 facing the airflow channel 13 to cool the airflow within the airflow channel 13; the hot end of each thermoelectric cooler 51 is connected to a heat dissipation fin 52, which extends to the outside of the heat dissipation housing 1 to increase the contact area with the outside air and accelerate the dissipation of heat from the hot end.

[0026] Multiple baffles 14 are disposed inside the heat dissipation housing 1. The baffles 14 are arranged alternately along the gas flow direction, dividing the air guide channel 13 into S-shaped channels to extend the airflow path within the air guide channel 13 and increase the contact time between the airflow and the cooling component 5, thereby improving the cooling effect. Furthermore, within the S-shaped channels, multiple semiconductor cooling chips 51 are distributed at intervals along their paths, enabling multiple cooling of the airflow and further enhancing the heat dissipation effect.

[0027] To enhance heat exchange, a baffle 16 is installed at each corner of the S-shaped channel. The ends of the baffle 16 are bent backward to form arc-shaped blades. By installing the baffle 16, when the airflow passes through the corner of the S-shaped channel, the baffle 16 can disrupt the airflow direction, causing turbulence within the air guide channel 13. This increases the contact area between the airflow and the cold end of the semiconductor cooling chip 51 and the inner wall of the air guide channel 13, thus carrying away more heat.

[0028] During the cooling process, water vapor in the airflow within the air guide channel 13 condenses into water droplets at the cold end of the semiconductor cooling chip 51. These droplets drip off under gravity, hence the inclusion of a water collection chamber 18 at the bottom of the heat sink housing 1. The water collection chamber 18 has multiple through-holes 19 communicating with the air guide channel 13, and each baffle 16 also has at least one through-hole 19 at its bottom. Due to the baffles 16 and the through-holes 19, water droplets flow into the water collection chamber 18 along the baffles 16, preventing water droplets from accumulating in the air guide channel 13 and affecting the normal operation of the heat dissipation mechanism. It is understood that a drain pipe and drain valve are provided at the bottom of the water collection chamber 18. When the water in the water collection chamber 18 reaches a certain amount, it can be drained through the drain pipe and drain valve, ensuring the continuous and effective operation of the heat dissipation mechanism.

[0029] To address the need for filtering impurities in external air, the filter assembly 2 includes a first mounting bracket 21 and at least one number of filter elements 22. The first mounting bracket 21 is fixed to the heat sink housing 1 by welding or fastener connection. The multiple filter elements 22 are arranged sequentially along the gas flow direction and are detachably connected to the first mounting bracket 21. In practical applications, filter elements 22 with different filtration precisions, such as pre-filters and medium-efficiency filters, can be selected according to the degree of external air pollution and the usage requirements of the turret. Through combination installation, multi-stage filtration of air can be achieved, blocking dust, particles, and other impurities from entering the turret. After the filter elements 22 have been used for a period of time, they can be removed from the first mounting bracket 21 for cleaning or replacement, facilitating maintenance.

[0030] To prevent damage from humid gases, the drying assembly 3 includes a second mounting bracket 31, a drying cylinder 32, and a molecular sieve 33. The second mounting bracket 31 is fixed to the heat dissipation housing 1 by welding or fasteners. The drying cylinder 32 is detachably connected to the second mounting bracket 31, and the molecular sieve 33 is disposed inside the drying cylinder 32. During the heat dissipation process, the airflow after refrigeration may contain a certain amount of water vapor. When the airflow passes through the drying cylinder 32, the molecular sieve 33 can adsorb the water vapor in the airflow, thus drying the airflow. When the molecular sieve 33 reaches saturation with adsorbed water vapor, the drying cylinder 32 can be removed from the second mounting bracket 31 for regeneration or replacement of the molecular sieve 33, ensuring the drying effect of the drying assembly 3.

[0031] A type of power turret, reference Figure 4 Automatic air-cooled heat dissipation mechanisms, including any of the above, achieve advantages such as high processing precision, stable and durable operation, and strong adaptability through intelligent and efficient heat dissipation, all-round protection, and modular design.

[0032] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An automatic air-cooled heat dissipation mechanism, characterized in that, The device includes a heat dissipation housing (1), a filter assembly (2), a drying assembly (3), a fan (4), a cooling assembly (5), a temperature sensor (6), and a controller (7). The heat dissipation housing (1) has an air inlet (11) and an air outlet (12), and a guide channel (13) is formed between the air inlet (11) and the air outlet (12). The filter assembly (2) is located at the air inlet (11), and the drying assembly (3) is located at the air outlet (12). The fan (4) and the cooling assembly (5) are both located in the guide channel (13), and the cooling assembly (5) is located downstream of the fan (4). The controller (7) is electrically connected to the fan (4), the cooling assembly (5), and the temperature sensor (6).

2. The automatic air-cooling heat dissipation mechanism as described in claim 1, characterized in that, The cooling assembly (5) includes a plurality of semiconductor cooling chips (51), which are mounted on the side wall of the heat dissipation housing (1). The cold end of each semiconductor cooling chip (51) faces the air guide channel (13), and the hot end is connected to a heat dissipation fin (52). The heat dissipation fin (52) extends to the outside of the heat dissipation housing (1).

3. The automatic air-cooling heat dissipation mechanism as described in claim 2, characterized in that, The heat dissipation housing (1) is provided with multiple partitions (14), which are arranged alternately along the gas flow direction to divide the air guide channel (13) into an S-shaped channel; within the S-shaped channel, multiple semiconductor cooling chips (51) are distributed at intervals along their paths.

4. The automatic air-cooling heat dissipation mechanism as described in claim 3, characterized in that, Each corner of the S-shaped channel is provided with a spoiler (16), and the end of the spoiler (16) is bent backward to form an arc-shaped blade.

5. The automatic air-cooling heat dissipation mechanism as described in claim 4, characterized in that, The bottom of the heat dissipation housing (1) is provided with a water collection chamber (18), and the water collection chamber (18) is provided with a plurality of through ports (19) communicating with the air guide channel (13), and each of the baffles (16) is provided with at least one through port (19) at its bottom.

6. The automatic air-cooling heat dissipation mechanism as described in claim 1, characterized in that, The filter assembly (2) includes a first mounting bracket (21) and at least a number of filter elements (22). The first mounting bracket (21) is fixed on the heat dissipation housing (1), and the plurality of filter elements (22) are arranged sequentially along the gas flow direction and are detachably connected to the first mounting bracket (21).

7. The automatic air-cooling heat dissipation mechanism as described in claim 1, characterized in that, The drying assembly (3) includes a second mounting bracket (31), a drying cylinder (32) and a molecular sieve (33). The second mounting bracket (31) is fixed on the heat dissipation housing (1). The drying cylinder (32) is detachably connected to the second mounting bracket (31). The molecular sieve (33) is disposed inside the drying cylinder (32).

8. A power turret, characterized in that, Includes the automatic air-cooling heat dissipation mechanism described in any one of claims 1-7.

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