A blister clamp special for baking bubbles
By setting positioning grooves and air guide holes in the vacuum forming fixture, the problem of uneven air bubbles during screen bonding is solved, achieving uniform heating and pressurization of the screen and improving the effect of bubble removal.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TRULY OPTO ELECTRONICS
- Filing Date
- 2025-06-16
- Publication Date
- 2026-07-14
AI Technical Summary
In existing screen bonding processes, improper vacuum forming can lead to inconsistent bubble formation and bubble removal effects, affecting the bonding quality of the screen.
Design a special thermoforming fixture for bubble sealing. By setting a positioning groove, a first air guide hole and a second air guide hole on the base, ensure that the bonding module is always connected to the outside during heating and pressurization. Utilize temperature and vacuum environment to allow the bubbles to be gradually discharged, preventing stacking from affecting heating and pressurization.
It effectively eliminates air bubbles, prevents abnormally bubbled samples from flowing out, ensures uniformity and firmness of screen bonding, and improves the effect of bubble removal.
Smart Images

Figure CN224490014U_ABST