PFA collecting box based on semiconductor high-temperature welding forming process

Abstract

The utility model discloses a PFA collecting box based on semiconductor high temperature resistance welding forming process, and the utility model relates to welding technical field, include: base, clamp jaw group, hot melt plate, first power mechanism, spacing telescopic link, second power mechanism, the edge of two box bodies is pasted the upper and lower surface of hot melt plate, and the edge of two box bodies is hot melt to carry out hot melt to two box bodies edge pasting, and the edge of comparative box body is coated with adhesive, and the adhesive is solidified to reduce time, and telescopic claw is along four surface clamping box body, and telescopic claw can hold the box body of multiple sizes after expansion, and the adaptability of equipment is improved.

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