Flexible thermal insulation structure, temperature regulating device, passive thermal insulation device, Electronic device

Abstract

The utility model discloses a kind of flexible heat insulation structure, temperature regulating device, passive heat insulation device, electronic equipment, flexible heat insulation structure, including heat insulation layer and adhesive layer, adhesive layer includes thermoplastic material layer and glue layer;Thermoplastic material layer is bonded with heat insulation layer.The utility model adhesive layer has flexibility, make flexible heat insulation structure can be attached to the surface of equipment of different shape, buffer impact received;Glue layer can be directly pasted in target position, adhesive layer and heat insulation layer are bonded by high temperature, realize no glue water attachment, not only improve the firmness of attachment, also avoid the smell and health risk caused by adhesive residue brought by traditional glue water;And no glue water attachment mode is not only simple operation, also convenient for processing, suitable for large-scale production, improve production efficiency, and heat insulation layer and adhesive layer can also be tightly attached in whole domain, eliminate attachment defect, eliminate the pain point that local gap or bubble is prone to appear when traditional large-area attachment.

Description

Technical Field

[0001] This utility model belongs to the field of thermal insulation, specifically relating to a flexible thermal insulation structure, a temperature regulation device, a passive thermal insulation device, and electronic equipment. Background Technology

[0002] Currently used traditional thermal insulation materials include vacuum insulation panels and polyurethane foam insulation materials. Among these, polyurethane foam insulation materials have a relatively high thermal conductivity compared to other insulation materials. The performance of vacuum insulation panels is greatly affected by the vacuum level; when the vacuum level is insufficient, the material's thermal insulation performance deteriorates significantly and its impact resistance is weak. In addition, the above-mentioned insulation materials generally lack flexibility, resulting in gaps at corners or joints during use, which affects the thermal insulation effect and energy efficiency conversion. Utility Model Content

[0003] This invention provides a flexible thermal insulation structure, a temperature regulation device, a passive thermal insulation device, and an electronic device to address the shortcomings described in the prior art.

[0004] The technical solution adopted in this utility model is as follows:

[0005] A flexible thermal insulation structure includes a thermal insulation layer and an adhesive layer. The adhesive layer comprises a thermoplastic material layer and an adhesive layer; the thermoplastic material layer is bonded to the thermal insulation layer. The thermoplastic material layer serves as the bonding layer with the thermal insulation layer, while the adhesive layer serves as the application layer, pasted onto the target location. The adhesive layer adheres to the thermal insulation layer after hot pressing because the thermoplastic material layer penetrates into the thermal insulation layer after being heated during the hot pressing process, resulting in a stronger adhesion and preventing the adhesive layer from detaching from the surface of the thermal insulation layer. The adhesive layer, as the application layer, can be directly pasted by peeling off the release film when it needs to be pasted to the target location.

[0006] As a preferred embodiment of this utility model, the thermoplastic material layer is made of polyurethane, polyamide resin or urethane resin, and the thermoplastic material layer can be bonded to the heat insulation layer at high temperature after hot pressing.

[0007] In a preferred embodiment of this invention, the adhesive layer further includes a substrate layer located between the thermoplastic material layer and the adhesive layer. The main function of the substrate layer is heat resistance, limiting heat transfer to the thermoplastic material layer. The thermoplastic material layer, substrate layer, and adhesive layer are combined into a single unit and bonded to the insulation layer at high temperature, achieving a glue-free bonding method. Furthermore, the composite adhesive layer itself is flexible. The insulation layer, as the core component, provides thermal insulation. Preferably, the insulation layer uses materials with low thermal conductivity, a certain degree of flexibility, and is lightweight yet possesses good thermal insulation performance, effectively reducing heat transfer.

[0008] As a preferred embodiment of this utility model, an adhesive layer is provided on at least one working end face of the heat insulation layer. That is, the heat insulation layer may have an adhesive layer on only one working end face, or it may have an adhesive layer on both working end faces.

[0009] As a preferred embodiment of this invention, the adhesive layer has a release film on the side close to the glue layer. When not adhered to the target location, the adhesive layer, serving as the usable layer, has a peelable release film.

[0010] As a preferred embodiment of this utility model, the adhesive layer is composed of at least a thermoplastic material layer, a substrate layer, and an adhesive layer. It can be a simple three-layer composite structure, or it can have other functional layers added as needed; a three-layer composite structure is preferred.

[0011] As a preferred embodiment of this utility model, the substrate layer is a polymer film layer.

[0012] As a preferred embodiment of this utility model, the heat insulation layer is an aerogel foam layer, a PI aerogel layer, or an aerogel fiber felt.

[0013] This utility model also provides a temperature regulating device, including the aforementioned flexible heat insulation structure. The temperature regulating device includes storage equipment or temperature regulating equipment that uses refrigerant cooling, such as refrigerators, freezers, cold storage, refrigerated transport vehicles, and air conditioners, as well as equipment that uses electric heating or heat transfer medium heating, such as constant temperature boxes.

[0014] This utility model also provides a passive thermal insulation device, including the above-mentioned flexible thermal insulation structure, as well as containers such as thermal boxes and thermal containers that rely on thermal insulation capacity to achieve thermal insulation and cold preservation. The above-mentioned flexible thermal insulation structure can be used in these passive thermal insulation devices for passive thermal insulation between storage space and external environment.

[0015] This utility model also provides an electronic device including the aforementioned flexible heat insulation structure. The electronic devices include consumer electronics such as televisions and hair dryers, office equipment such as projectors and printers, communication equipment such as mobile phones, walkie-talkies, and base stations, and computer equipment such as desktop computers, laptops, and servers. The aforementioned flexible heat insulation structure in these electronic devices primarily functions to prevent heat transfer in a specific direction.

[0016] Beneficial effects:

[0017] This invention utilizes a flexible adhesive layer, composed of a thermoplastic material layer and an adhesive layer, or a thermoplastic material layer, a substrate layer, and an adhesive layer. This allows the flexible insulation structure to conform well to the surfaces of refrigeration equipment of various shapes and to cushion impacts. The adhesive layer and insulation layer are bonded together at high temperature, achieving a glue-free bond. This not only improves the bond's strength but also avoids the odor and health risks caused by adhesive residues from traditional glues. Furthermore, the glue-free bonding method is simple to operate, easy to process, suitable for large-scale production, and improves production efficiency. The insulation layer and adhesive layer also achieve a tight, all-area bond, eliminating bonding defects and addressing the problem of localized gaps or air bubbles that often occur in traditional large-area bonding. The insulation layer preferably uses aerogel foam, which is lightweight and has a low thermal conductivity, effectively reducing heat transfer. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a side view of Example 1.

[0020] Figure 2 This is a side view of Example 2.

[0021] Figure 3 This is the front view of Example 3.

[0022] Figure 4 This is a side view of Example 3.

[0023] Figure 5 This is a side view of Example 4. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1:

[0026] A flexible thermal insulation structure, such as Figure 1As shown, it includes a thermal insulation layer 1 and an adhesive layer 2. The thermal insulation layer 1 is an aerogel foam layer, and its thickness and shape are set according to actual needs. It mainly serves to keep the heat insulated. The aerogel foam layer has the advantages of being lightweight and having a low thermal conductivity. The thermal insulation layer 1 can also use thermal insulation materials such as PI aerogel layer or aerogel fiber felt, as long as the thermal conductivity is low and it has a certain degree of flexibility to achieve thermal insulation.

[0027] An adhesive layer 2 is provided on one working end face of the heat insulation layer 1. The adhesive layer 2 includes a thermoplastic material layer 21 and an adhesive layer 23. The thermoplastic material layer 21 is bonded to the heat insulation layer 1, and the adhesive layer 23 is provided on the end face of the thermoplastic material layer 21 away from the heat insulation layer 1.

[0028] In some embodiments, the adhesive layer 23 may be selected from pressure-sensitive adhesives or hot melt adhesives, such as acrylic pressure-sensitive adhesives, natural rubber pressure-sensitive adhesives, silicone rubber pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives, EVA adhesives, polyamide adhesives, polystyrene thermoplastic elastomers, olefin thermoplastic elastomers, etc.

[0029] The thermoplastic material layer is preferably a polyurethane layer, a polyamide resin layer, or a urethane resin layer. It can also be selected from polyimide resin, polystyrene resin, polyethylene resin, polyester resin, acrylic rubber, methacrylate resin, polyetherimide resin, phenoxy resin, polycarbonate resin, polyphenylene ether resin, modified polyphenylene ether resin, acrylic resin, polyvinyl butyral resin, polyvinyl acetal resin, polyphenylene sulfide, and polyethylene terephthalate. This embodiment uses a polyurethane thermoplastic material layer as an example.

[0030] When the adhesive layer 2 is not bonded to the heat insulation layer 1, both the thermoplastic material layer 21 and the adhesive layer 23 are provided with release films. After the release film on the thermoplastic material layer 21 is removed, it is bonded to the heat insulation layer. After hot pressing, it will adhere to the heat insulation layer 1. Because the thermoplastic material layer 21 will penetrate into the heat insulation layer 1 after being heated in the hot pressing process, the adhesion is more firm, which can prevent the adhesive layer 2 from detaching from the surface of the heat insulation layer 1. The adhesive layer 23 is used as a working layer. When it needs to be pasted to the target position, the release film of the adhesive layer 23 can be removed and pasted directly.

[0031] Example 2:

[0032] A flexible thermal insulation structure, such as Figure 2 As shown, an adhesive layer 2 is provided on both working end faces of the heat insulation layer 1, and the rest is the same as in Example 1.

[0033] Example 3:

[0034] A flexible thermal insulation structure, such as Figure 3 and 4As shown, it includes a thermal insulation layer 1 and an adhesive layer 2. The thermal insulation layer 1 is an aerogel foam layer, and its thickness and shape are set according to actual needs. It mainly serves to keep the heat insulated. The aerogel foam layer has the advantages of being lightweight and having a low thermal conductivity. The thermal insulation layer 1 can also use thermal insulation materials such as PI aerogel layer or aerogel fiber felt, as long as the thermal conductivity is low and it has a certain degree of flexibility to achieve thermal insulation.

[0035] An adhesive layer 2 is provided on both working ends of the heat insulation layer 1. The adhesive layer 2 includes a thermoplastic material layer 21, a substrate layer 22 and an adhesive layer 23. The substrate layer 22 is located between the thermoplastic material layer 21 and the adhesive layer 23.

[0036] The substrate layer 22 is a polymer film layer. Specifically, the polymer film layer can be selected from polyethylene terephthalate (PET), polysulfone (PS), polyethersulfone (PES), polyamide (PI), polypropylene (PP), polyethylene (PE), polyvinylidene fluoride (PVDF), polyvinyl chloride (PVC), polydimethylsiloxane (PDMS), polymethyl methacrylate (PMMA), polyurethane (PU), polyethylene glycol (PEG), polyvinyl alcohol (PVA), polytrimethylsilane propyne (PTMSP), polycarbonate (PC), polyphenylene sulfide (PPS), polyetherimide (PEI), polyimide (PI), polyolefins (such as polyacrylonitrile, polyvinyl alcohol), polytetrafluoroethylene (PTFE), etc. In this embodiment, PET polymer film is used as the substrate layer 22 for example.

[0037] The thermoplastic material layer is preferably a polyurethane layer, a polyamide resin layer, or a urethane resin layer. This embodiment uses a polyurethane layer as an example.

[0038] The thermoplastic material layer 21 serves as a bonding layer with the aerogel foam layer; the substrate layer 22 serves as a heat-resistant substrate, which can block the heat transfer from the acrylic adhesive layer to the polyurethane layer; and the substrate layer 22 can be a PET layer, a PEN layer or a PI layer. In this embodiment, a PET layer is used as an example for demonstration.

[0039] The adhesive layer 23 serves as the application layer and can be directly applied to the target location. Under high temperature conditions, the thermoplastic material layer 21 and the aerogel foam layer adhere together directly without the use of glue. The adhesion is firm and easy to operate. Compared with traditional materials, the joints are more continuous and there is no temperature leakage or energy loss.

[0040] The adhesive layer 2 can be composed of only three layers: thermoplastic material layer 21, substrate layer 22 and adhesive layer 23. Alternatively, new structural layers can be added as needed. In this embodiment, only three layers are used as an example.

[0041] The composite adhesive layer 2 has excellent flexibility. Even after being combined with aerogel foam, the overall flexibility remains very good, allowing the flexible thermal insulation structure to fit the surface of equipment of different shapes and to buffer the impact, thus extending the service life of the equipment.

[0042] During preparation, aerogel foam and adhesive layer 2 are prepared separately. When the adhesive layer 2 exists independently, release films are provided on both the thermoplastic material layer 21 and the adhesive layer 23. When it is combined with aerogel foam, the release film is removed. The release film of adhesive layer 23 is removed when it is to be used.

[0043] Example 4:

[0044] A flexible thermal insulation structure, such as Figure 5 As shown, the difference from Embodiment 4 is that the adhesive layer 2 is provided only on one working end face of the heat insulation layer 1.

[0045] The flexible thermal insulation structure in the above embodiments can be used for thermal insulation of temperature control devices, such as refrigerators, freezers, cold storage, cold chain transport vehicles, air conditioners and other storage equipment or temperature control equipment that uses refrigerant cooling, as well as constant temperature boxes and other equipment that uses electric heating or heat medium heating, as well as insulated boxes, insulated boxes and other containers that rely on thermal insulation capacity to achieve thermal insulation and cold preservation. The flexible thermal insulation structure is used for thermal insulation between the storage space of these thermal insulation devices and the external environment, or for thermal insulation of the refrigerant pipeline of air conditioning equipment.

[0046] The aforementioned flexible insulation structure can also be used for the insulation of passive insulation devices, such as insulated boxes and containers that rely on insulation capacity to achieve heat preservation and cold preservation. In these passive insulation devices, the aforementioned flexible insulation structure can be used for passive insulation between storage space and the external environment.

[0047] The aforementioned flexible thermal insulation structures can also be used for thermal insulation of electronic devices, such as household appliances like televisions and hair dryers, office equipment like projectors and printers, communication equipment like mobile phones, walkie-talkies, and base stations, as well as computer equipment like desktop computers, laptops, and servers. In these electronic devices, the flexible thermal insulation structures primarily function to prevent heat transfer in a specific direction and can be used for thermal protection of critical components.

[0048] In this specification, the terms "an embodiment," "example," "specific example," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0049] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A flexible thermal insulation structure, comprising a thermal insulation layer (1) and an adhesive layer (2), characterized in that: The adhesive layer (2) includes a thermoplastic material layer (21) and an adhesive layer (23); the thermoplastic material layer (21) is bonded to the heat insulation layer (1).

2. The flexible thermal insulation structure according to claim 1, characterized in that: The adhesive layer (2) further includes a substrate layer (22), which is located between the thermoplastic material layer (21) and the adhesive layer (23).

3. The flexible thermal insulation structure according to claim 1, characterized in that: An adhesive layer (2) is provided on at least one working end face of the insulation layer (1).

4. The flexible thermal insulation structure according to claim 3, characterized in that: The adhesive layer (2) has a release film on the side close to the adhesive layer (23).

5. The flexible thermal insulation structure according to claim 1, characterized in that: The thermoplastic material layer (21) is a polyurethane layer, a polyamide resin layer, or a urethane resin layer.

6. The flexible thermal insulation structure according to claim 2, characterized in that: The substrate layer (22) is a polymer film layer.

7. The flexible thermal insulation structure according to claim 1 or 2, characterized in that: The heat insulation layer (1) is an aerogel foam layer, a PI aerogel layer, or an aerogel fiber felt.

8. A temperature regulating device, characterized in that, Includes the flexible thermal insulation structure as described in any one of claims 1-7.

9. A passive thermal insulation device, characterized in that, Includes the flexible thermal insulation structure as described in any one of claims 1-7.

10. An electronic device, characterized in that, Includes the flexible thermal insulation structure as described in any one of claims 1-7.

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