An electroformed screen stripping device
By using an electromagnetic adsorption film, the problems of creases and high costs in the peeling process of electroformed stencils were solved, achieving efficient and low-cost stencil peeling and improving peeling efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TAIZHOU NIKE MICRONAN TECHNOLOGY CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-07-14
AI Technical Summary
Existing electroformed stencils are prone to creases during the peeling process, and the use of thermal anti-adhesion films or UV anti-adhesion films has the problems of high cost and low peeling yield.
The electromagnetic adsorption film, which includes a spiral conductive coil and a transparent conductive layer, forms a conductive circuit through the electromagnetic adsorption layer and the conductive layer. The electromagnetic adsorption force is used to firmly adsorb and peel off the screen, and no creases are produced during the peeling process. The electromagnetic adsorption film can be reused.
It achieves high peeling yield while reducing costs, is easy to operate, improves peeling efficiency, and the electromagnetic adsorption membrane is reusable, reducing material consumption.
Smart Images
Figure CN224490360U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electroforming stencil stripping technology, specifically to an electroforming stencil stripping device. Background Technology
[0002] Compared to woven mesh, electroformed mesh / stencils do not have the problem of mesh knots, and their planar structure and thickness can be freely adjusted. To reduce silver paste consumption while maintaining efficiency, one feasible solution is to reduce the electroforming thickness of the mesh / stencil. However, as the thickness decreases, the difficulty of peeling the electroformed product from the mandrel to avoid creases increases dramatically. One existing solution is to use thermal anti-adhesion film or UV anti-adhesion film to assist in peeling. A size-matched anti-adhesion film is attached to the surface of the finished product, and the anti-adhesion film is peeled off together with the finished product. Then, thermal anti-adhesion or UV light irradiation is used to separate the finished product and the anti-adhesion film. However, thermal anti-adhesion requires heating the finished product, which may cause thermal deformation. In addition, due to the difference in thermal expansion coefficients between the finished product and the anti-adhesion film, areas with lower strength in the finished product may be damaged by thermal stretching of the anti-adhesion film during heating. UV anti-adhesion film cannot completely lose its adhesiveness after UV light irradiation, which leads to a low peeling yield. Furthermore, the UV anti-adhesion film and thermal anti-adhesion film cannot be reused, resulting in high consumption and high cost. Utility Model Content
[0003] The purpose of this invention is to address the shortcomings and deficiencies of existing technologies by providing an electroformed stencil peeling device that ensures the stencil does not develop creases during the peeling process. Since the electromagnetic adsorption film is reusable, it offers a high peeling yield while also providing a significant cost advantage, and the entire operation is very simple. Furthermore, because both the electromagnetic adsorption layer and the conductive layer are translucent, the stencil can be seen through the entire electromagnetic adsorption film, facilitating easy alignment of the electromagnetic adsorption film onto the stencil and improving peeling efficiency.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: it includes an electromagnetic adsorption film, a variable resistor, a switch, and a DC power supply; the electromagnetic adsorption film, the variable resistor, the switch, and the DC power supply are connected in series to form a conductive circuit; the electromagnetic adsorption film is composed of an electromagnetic adsorption layer and a conductive layer; the electromagnetic adsorption layer is laminated and stacked on the conductive layer.
[0005] The electromagnetic adsorption layer comprises:
[0006] A spiral conductive coil, wherein there are several spiral conductive coils arranged in a matrix on a first flexible substrate; a through hole is provided at the center of the inner circle of each spiral conductive coil on the first flexible substrate, and the through hole is filled with conductive metal, which is electrically connected to the inner circle of the spiral conductive coil.
[0007] The conductive wires are interwoven in a warp and weft direction and are connected to the conductive strip on all four sides. The conductive strip is disposed on the four sides of the first flexible substrate and is connected to the first lead wire, which is connected to the conductive circuit.
[0008] An insulating film covering a matrix of helical conductive coils and conductive strips;
[0009] The conductive layer includes a conductive film, which is laid on a second flexible substrate and connected to a second lead, which is connected in a conductive circuit; the upper surface of the conductive film is electrically connected to the conductive metal in each through hole.
[0010] Furthermore, the length and width of the array formed by the matrix distribution of several spiral conductive coils are equal to the length and width of the screen.
[0011] Furthermore, the outer diameter of the spiral conductive coil is less than or equal to 2 mm, the inner diameter is greater than or equal to 100 μm, the number of turns is greater than or equal to 100, and the spacing between several spiral conductive coils is 0.1-1 times the outer diameter.
[0012] Furthermore, the spiral conductive coil uses copper as the conductive material.
[0013] Furthermore, the conductive metal uses copper as the conductive material.
[0014] Furthermore, the width of the conductive strip is less than or equal to 1 mm.
[0015] Furthermore, both the first lead and the second lead are thin-film conductive wires.
[0016] Furthermore, the length and width of the electromagnetic adsorption film are larger than the size of the screen plate but do not exceed 5 mm.
[0017] Furthermore, both the first flexible substrate and the second flexible substrate are made of transparent plastic material, such as PP or PE plastic film, with a thickness of 50-100μm.
[0018] Furthermore, the conductive film is a transparent conductive film, such as an ITO film, and its thickness is less than or equal to 2 μm.
[0019] Compared with the prior art, the advantages of this utility model are as follows: This utility model provides an electroforming screen peeling device that can ensure that the screen will not produce creases during the peeling process; since the electromagnetic adsorption film can be reused, it can provide a high peeling yield while also having a high cost advantage, and the whole operation process is also very simple; in addition, since both the electromagnetic adsorption layer and the conductive layer are transparent, the screen can be seen through the entire electromagnetic adsorption film, which makes it easy to align the electromagnetic adsorption film onto the screen and improve the peeling efficiency. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of this utility model.
[0021] Figure 2 This is a schematic diagram of the installation position of the electromagnetic adsorption film for peeling off the screen in this utility model.
[0022] Figure 3 This is a cross-sectional view of the electromagnetic adsorption membrane in this utility model.
[0023] Figure 4 This is a schematic diagram of the conductive layer in this utility model.
[0024] Figure 5 This is a schematic diagram of the electromagnetic adsorption layer in this utility model.
[0025] Figure 6 yes Figure 5 Enlarged view of section A.
[0026] Figure 7 This is a partial axial cross-sectional view of the spiral conductive coil and the first flexible substrate in this utility model.
[0027] Explanation of reference numerals in the attached figures:
[0028] 1. Electromagnetic adsorption film; 2. Variable resistor; 3. Switch; 4. DC power supply; 5. Electromagnetic adsorption layer; 5. First flexible substrate; 5-1. Through hole; 5-1-1. Spiral conductive coil; 5-2. Insulating film; 5-3. Conductive metal; 5-4. Conductive wire; 5-5. Conductive strip; 5-6. First lead; 5-7. Conductive layer; 6. Second flexible substrate; 6-1. Conductive film; 6-2. Second lead; 6-3. Screen; 7. Core mold; 8. Detailed Implementation
[0029] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. The preferred embodiments described are only examples. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0030] like Figures 1-7As shown, this specific embodiment adopts the following technical solution: It includes an electromagnetic adsorption film 1, a variable resistor 2, a switch 3, and a DC power supply 4; the electromagnetic adsorption film 1, the variable resistor 2, the switch 3, and the DC power supply 4 are connected in series to form a conductive circuit. The DC power supply 4 provides current to the electromagnetic adsorption film 1, and the variable resistor 2 is used to control the magnitude of the current. Under the condition that current flows through the electromagnetic adsorption film 1, the electromagnetic adsorption film 1 has a magnetic force controlled by the variable resistor 2; the length and width of the electromagnetic adsorption film 1 are larger than the size of the screen 7 but do not exceed 5mm; the electromagnetic adsorption film 1 is composed of an electromagnetic adsorption layer 5 and a conductive layer 6; the electromagnetic adsorption layer 5 is laminated and stacked on the conductive layer 6;
[0031] The electromagnetic adsorption layer 5 comprises:
[0032] A spiral conductive coil 5-2, wherein the spiral conductive coil 5-2 is made of copper as the conductive material, and there are several of them, which are matrixed on the first flexible substrate 5-1, and the length and width of the array formed by the matrix distribution are equal to the length and width of the screen 7; the first flexible substrate 5-1 is made of transparent plastic material, such as PP or PE plastic film, with a thickness of 50-100μm; a through hole 5-1-1 is opened at the center of the inner circle of each spiral conductive coil 5-2 on the first flexible substrate 5-1, and the diameter of the through hole 5-1-1 can be designed to be the same as the inner circle diameter. The through hole 5-1-1 is filled with conductive metal 5-4, which is made of copper as the conductive material, and the conductive metal 5-4 is electrically connected to the inner circle of the spiral conductive coil 5-2; the outer circle of the spiral conductive coil 5-2 is less than or equal to 2mm, the inner circle is greater than or equal to 100μm, the number of turns is greater than or equal to 100, and the spacing between several spiral conductive coils 5-2 is 0.1-1 times the outer circle diameter;
[0033] Conductive wires 5-5 are interwoven in a warp and weft direction and are connected to conductive strips 5-6 on all four sides. The conductive strips 5-6 are disposed on the four sides of the first flexible substrate 5-1 and are connected to the first lead wire 5-7. The width of the conductive strip 5-6 is less than or equal to 1 mm. The first lead wire 5-7 is a thin film conductive wire and is connected in the conductive circuit.
[0034] An insulating film 5-3 covers a plurality of helical conductive coils 5-2 arranged in a matrix and a conductive strip 5-6.
[0035] The conductive layer 6 comprises:
[0036] The conductive film 6-2 is a transparent conductive film, such as an ITO film, with a thickness of less than or equal to 2 μm. The conductive film 6-2 is laid on the second flexible substrate 6-1 and is connected to the second lead 6-3. The second lead 6-3 is a thin-film conductive wire and is connected in the conductive circuit. The upper surface of the conductive film 6-2 is electrically connected to the conductive metal 5-4 in each through hole 5-1-1. The second flexible substrate 6-1 is made of transparent plastic material, such as PP or PE plastic film, with a thickness of 50-100 μm.
[0037] When using this invention, use a blade to separate one corner of the screen 7 from the core mold 8. Lay the electromagnetic adsorption film 1 symmetrically on the screen 7. Turn on switch 3. The electromagnetic adsorption film 1 has magnetic attraction. Since each spiral conductive coil 5-2 has more than or equal to 100 turns, the entire electromagnetic adsorption film 1 has a strong and uniform magnetic attraction, which can firmly adsorb the screen 7. After turning on switch 3, peel the screen 7, along with the electromagnetic adsorption film 1, from the separated corner along the diagonal from the core mold 8. After peeling, turn off switch 3. The magnetic force of the electromagnetic adsorption film 1 disappears, and the screen 7 can be transferred from the electromagnetic adsorption film 1.
[0038] Compared with the prior art, the beneficial effects of this utility model are:
[0039] Throughout the peeling process, the screen is supported by the electromagnetic adsorption film. Since the thickness of the electromagnetic adsorption film exceeds 100um, the electromagnetic adsorption film itself will not produce creases during the peeling process, thus ensuring that the screen will not produce creases during the peeling process.
[0040] Since electromagnetic adsorption membranes can be reused, they offer high peeling yields, significant cost advantages, and a simple operation process.
[0041] Since both the electromagnetic adsorption layer and the conductive layer are transparent, the screen can be seen through the entire electromagnetic adsorption film, making it easy to align the electromagnetic adsorption film onto the screen and improving the peeling efficiency.
[0042] For those skilled in the art, modifications can be made to the technical solutions described in the foregoing embodiments, and equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A device for peeling off electroformed stencils, characterized in that: It comprises an electromagnetic adsorption membrane (1), a variable resistor (2), a switch (3), and a DC power supply (4); the electromagnetic adsorption membrane (1), the variable resistor (2), the switch (3), and the DC power supply (4) are connected in series to form a conductive circuit; the electromagnetic adsorption membrane (1) is composed of an electromagnetic adsorption layer (5) and a conductive layer (6); the electromagnetic adsorption layer (5) is laminated on the conductive layer (6); the electromagnetic adsorption layer (5) comprises: A spiral conductive coil (5-2) is provided, and there are several spiral conductive coils (5-2) arranged in a matrix on a first flexible substrate (5-1). A through hole (5-1-1) is provided at the center of the inner circle of each spiral conductive coil (5-2) on the first flexible substrate (5-1). The through hole (5-1-1) is filled with conductive metal (5-4), and the conductive metal (5-4) is electrically connected to the inner circle of the spiral conductive coil (5-2). Conductive wires (5-5) are interwoven in a warp and weft direction and are connected to conductive strips (5-6) on all four sides. The conductive strips (5-6) are disposed on the four sides of the first flexible substrate (5-1) and are connected to the first lead wire (5-7). The first lead wire (5-7) is connected in the conductive circuit. An insulating film (5-3) covers a plurality of helical conductive coils (5-2) and a conductive strip (5-6) arranged in a matrix. The conductive layer (6) includes a conductive film (6-2), which is laid on the second flexible substrate (6-1) and connected to a second lead (6-3), which is connected in the conductive circuit; the upper surface of the conductive film (6-2) is electrically connected to the conductive metal (5-4) in each through hole (5-1-1).
2. The electroforming stencil stripping device according to claim 1, characterized in that: The length and width of the array formed by the matrix distribution of several spiral conductive coils (5-2) are equal to the length and width of the screen (7).
3. The electroforming stencil stripping device according to claim 1, characterized in that: The outer diameter of the spiral conductive coil (5-2) is less than or equal to 2 mm, the inner diameter is greater than or equal to 100 μm, the number of turns is greater than or equal to 100, and the spacing between several spiral conductive coils (5-2) is 0.1-1 times the outer diameter.
4. The electroforming stencil peeling device according to claim 1, characterized in that: The width of the conductive strip (5-6) is less than or equal to 1 mm.
5. The electroforming stencil stripping device according to claim 1, characterized in that: The length and width of the electromagnetic adsorption film (1) are larger than the size of the screen and do not exceed 5 mm.
6. The electroforming stencil peeling device according to claim 1, characterized in that: The thickness of both the first flexible substrate (5-1) and the second flexible substrate (6-1) is 50-100 μm.
7. The electroforming stencil stripping device according to claim 1, characterized in that: The thickness of the conductive film (6-2) is less than or equal to 2 μm.