Chip transport shock absorbing device

Abstract

The utility model relates to chip transportation technical field, and disclose a kind of chip transportation shock absorber, including: shell body and the cover plate for closing shell body opening face, the inside of the shell body is provided with inner layer fixed structure, and inner layer fixed structure is clamped and fixed with chip tray, the inside of the shell body is also provided with shock absorber for filling the gap between inner layer fixed structure and shell body. The chip transportation shock absorber, by setting inner layer fixed structure in the inside of shell body, then using shock absorber to wrap up inner layer fixed structure, reach the purpose of shock absorption, and the clamping plate for clamping chip tray in inner layer fixed structure can be adjusted, and the clamping plate can be adjusted screw rod to clamp and fix chip tray in the inside of shell body, to adapt to the demand of different specifications chip tray, avoid the cumbersome steps of traditional trimming foam board size, improve overall use efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip transportation technology, specifically a chip transportation shock absorption device. Background Technology

[0002] Chips are susceptible to external forces such as vibration, drops, and squeezing during transportation, which can cause internal structural breakage or pin deformation. After placing the chips on a chip tray, foam boards are used to fill the gap between the chip tray and the shipping box.

[0003] However, using foam board for filling has significant limitations. In applications with different sizes of chip disks, the size of the foam board needs to be manually adjusted to achieve the effect of filling gaps and reducing shock. The overall operation is quite complicated and will affect the efficiency of chip transportation. Therefore, we propose a chip transportation shock absorption device to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a chip transport shock absorption device, which solves the problems mentioned in the background.

[0005] This utility model provides the following technical solution: a chip transport shock absorption device, comprising: an outer shell and a cover plate for closing the opening of the outer shell; an inner fixing structure is provided inside the outer shell, and a chip disk is clamped and fixed on the inner fixing structure; a shock absorption layer is also provided inside the outer shell for filling the gap between the inner fixing structure and the outer shell, and a fastening structure is also provided on the outer shell for reinforcing the tightness of the connection between it and the cover plate; the shock absorption layer includes an upper filling block and a lower filling block, the upper filling block being located above the inner fixing structure and the lower filling block being located below the inner fixing structure; the inner fixing structure includes a connecting rod and a frame integrally formed with the connecting rod, the frame being slidably connected to the outer shell through the connecting rod, a clamping plate being slidably provided on the frame, and a connecting seat being fixedly installed inside the frame; an adjusting screw is threadedly connected to the connecting seat; a ball head rod is fixedly installed at the end of the adjusting screw adjacent to the clamping plate; a spherical seat is fixedly installed on the side of the clamping plate adjacent to the adjusting screw; and the ball head rod is movably connected to the spherical seat.

[0006] Preferably, the fastening structure includes a positioning post fixedly installed on the opening of the outer shell and a boss fixedly installed on the side of the outer shell. A fixed shaft is fixedly installed on the top surface of the boss, a rotating shaft is rotatably mounted on the fixed shaft, and a nut is fixedly installed on the side wall of the inner cavity of the fixed shaft. A pressure block is fixedly installed on the upper end of the rotating shaft, and a fastening screw is threadedly connected to the pressure block. The part of the fastening screw that passes through the pressure block can be threadedly connected to the nut.

[0007] Preferably, the cover plate has four insertion holes that can mate with the positioning posts.

[0008] Preferably, the rotating shaft has a cavity inside for accommodating the fastening screw, and the upper end of the rotating shaft has an opening for the fastening screw to pass through.

[0009] Preferably, the lower filling block has a groove for sliding over the connecting rod, and the center part of the lower filling block has a hollow design.

[0010] Preferably, the end of the adjusting screw away from the ball joint is provided with a knob, and the outer surface of the knob is provided with anti-slip texture.

[0011] Preferably, the spherical seat is located at the center of the side of the clamping plate, and the central axis of the spherical seat, the central axis of the ball head rod, and the central axis of the adjusting screw are all coincident.

[0012] Preferably, the connecting seat is designed as a strip structure, and a gap is provided between the connecting seat and the side wall of the frame to facilitate the user to rotate the adjusting screw.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. This chip transport shock absorption device achieves shock absorption by setting an inner fixing structure inside the outer shell and then wrapping the inner fixing structure with a shock-absorbing layer. Furthermore, the clamping plate in the inner fixing structure used to hold the chip disk can be adjusted. The clamping plate can work with the adjusting screw to clamp and fix the chip disk inside the outer shell to meet the needs of chip disks of different specifications, avoiding the cumbersome steps of traditionally adjusting the size of foam boards and improving the overall efficiency of use.

[0015] 2. The chip transport shock absorption device has a sliding connection between the inner fixing structure and the outer shell. The outer shell uses a fastening structure to fix the cover plate. The position of the pressure block in the fastening structure can also be adjusted so that the user can fully unfold the whole structure and replace the upper and lower filling blocks used for shock absorption. This makes the whole device reusable and reduces transportation costs. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is an exploded view of the overall structure of this utility model;

[0018] Figure 3 This is a cross-sectional schematic diagram of the fastening structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the inner layer fixing structure of this utility model;

[0020] Figure 5 This is a schematic diagram of the ball joint structure of this utility model.

[0021] In the diagram: 1. Outer shell; 2. Cover plate; 3. Fastening structure; 31. Pressure block; 32. Positioning post; 33. Rotating shaft; 34. Fixed shaft; 35. Boss; 36. Nut; 37. Fastening screw; 4. Shock-absorbing layer; 41. Upper filler block; 42. Lower filler block; 5. Inner layer fixing structure; 51. Connecting rod; 52. Frame; 53. Clamping plate; 54. Connecting seat; 55. Adjusting screw; 56. Ball head rod; 57. Ball seat; 6. Chip disk. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-5 A chip transport shock absorption device includes: an outer shell 1 and a cover plate 2 for closing the opening of the outer shell 1. An inner fixing structure 5 is provided inside the outer shell 1, and a chip disk 6 is clamped and fixed on the inner fixing structure 5. A shock absorption layer 4 is also provided inside the outer shell 1 for filling the gap between the inner fixing structure 5 and the outer shell 1. A fastening structure 3 is also provided on the outer shell 1 for strengthening the connection between it and the cover plate 2.

[0024] The shock-absorbing layer 4 includes an upper filling block 41 and a lower filling block 42. The upper filling block 41 is located above the inner fixing structure 5, and the lower filling block 42 is located below the inner fixing structure 5. The lower filling block 42 has a groove for sliding over the connecting rod 51, and the center part of the lower filling block 42 is hollowed out. The end of the adjusting screw 55 away from the ball head rod 56 is provided with a knob. The outer surface of the knob is provided with anti-slip texture. The ball seat 57 is located at the center of the side of the clamping plate 53, and the central axis of the ball seat 57, the central axis of the ball head rod 56, and the central axis of the adjusting screw 55 are all coincident. The connecting seat 54 has a strip structure design, and a gap is provided between the connecting seat 54 and the side wall of the frame 52 to facilitate the user to rotate the adjusting screw 55, making it convenient for the user to operate.

[0025] The inner fixing structure 5 includes a connecting rod 51 and a frame 52 integrally formed with the connecting rod 51. The frame 52 is slidably connected to the outer shell 1 through the connecting rod 51. A clamping plate 53 is slidably arranged on the frame 52, and a connecting seat 54 is fixedly installed inside the frame 52. An adjusting screw 55 is threadedly connected to the connecting seat 54. A ball head rod 56 is fixedly installed at the end of the adjusting screw 55 adjacent to the clamping plate 53. A ball seat 57 is fixedly installed on the side of the clamping plate 53 adjacent to the adjusting screw 55. The ball head rod 56 is movably connected to the ball seat 57. The user can use the inner fixing structure 5 to adjust the chip disks 6 of different specifications. Therefore, the upper filling block 41 and the lower filling block 42 can adopt standard specifications and do not need to be manually modified. It is also convenient to replace the upper filling block 41 and the lower filling block 42 in the future.

[0026] The fastening structure 3 includes a positioning post 32 fixedly installed on the opening of the outer shell 1, and a boss 35 fixedly installed on the side of the outer shell 1. A fixed shaft 34 is fixedly installed on the top surface of the boss 35. A rotating shaft 33 is rotatably installed on the fixed shaft 34, and a nut 36 is fixedly installed on the side wall of the inner cavity of the fixed shaft 34. A pressure block 31 is fixedly installed on the upper end of the rotating shaft 33. A fastening screw 37 is threadedly connected to the pressure block 31. The part of the fastening screw 37 that passes through the pressure block 31 can be threadedly connected to the nut 36. The cover plate 2 has an insertion hole that can cooperate with the positioning post 32. There are four positioning posts 32 in total. The rotating shaft 33 has a cavity inside for accommodating the fastening screw 37. The upper end of the rotating shaft 33 has an opening for the fastening screw 37 to pass through, so that after the fastening screw 37 is screwed into the nut 36, the pressure block 31 can be locked, and the cover plate 2 is fixed on the outer shell 1.

[0027] Working principle: The connecting rod 51 and the frame 52 are integrally formed, and the frame 52 can slide into the interior of the outer shell 1 through the connecting rod 51. The connecting seat 54 fixed inside the frame 52 is threadedly connected to the adjusting screw 55. The end of the adjusting screw 55 is fixed to the ball head rod 56. The clamping plate 53 slidably set on the frame 52 fixes the ball seat 57, and the ball head rod 56 is placed inside the ball seat 57 and movably connected to it. Therefore, after rotating the adjusting screw 55, the clamping plate 53 can be pushed to slide on the frame 52. The two clamping plates 53 cooperate with each other to clamp and fix the chip disk 6 inside the frame 52. Then, the upper filling block 41 and the lower filling block 4 are located on the upper and lower parts of the frame 52. Under the cover 2, the gap between the cover plate and the outer shell 1 is filled. Then, the cover plate 2 is spliced ​​onto the opening surface of the outer shell 1 by the positioning post 32 on the outer shell 1. Since the fixed shaft 34 is fixed on the protrusion 35 on the side of the outer shell 1, and the rotating shaft 33 is rotatably connected to the fixed shaft 34, and the pressure block 31 is fixed on the rotating shaft 33, the pressure block 31 is rotated to press the cover plate 2. Then, the fastening screw 37 threadedly connected to the pressure block 31 is rotated so that the fastening screw 37 is screwed into the nut 36 inside the fixed shaft 34. At this time, under the restriction of the fastening screw 37, the pressure block 31 can press the cover plate 2 tightly, and strengthen the connection between the cover plate 2 and the outer shell 1.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip transport shock absorbing device, characterized by, Include: The outer shell (1), and the cover plate (2) for closing the opening surface of the outer shell (1), the inside of the outer shell (1) is provided with inner layer fixed structure (5), and the inner layer fixed structure (5) is clamped and fixed with chip disc (6), the inside of the outer shell (1) is also provided with shock absorbing layer (4) for filling the gap between the inner layer fixed structure (5) and the outer shell (1), and the outer shell (1) is also provided with fastening structure (3) for reinforcing the connection fastening degree between it and the cover plate (2); The shock absorbing layer (4) includes upper filling block (41) and lower filling block (42), the upper filling block (41) is located above the inner layer fixed structure (5), and the lower filling block (42) is located below the inner layer fixed structure (5); The inner layer fixed structure (5) includes connecting rod (51) and frame body (52) integrally formed with connecting rod (51), the frame body (52) is slidably connected with the outer shell (1) through the connecting rod (51), the clamping plate (53) is slidably arranged on the frame body (52), and the connecting seat (54) is fixedly installed in the frame body (52), the adjusting screw (55) is threadedly connected to the connecting seat (54), the ball head rod (56) is fixedly installed on the end of the adjusting screw (55) adjacent to the clamping plate (53), the spherical seat (57) is fixedly installed on the side of the clamping plate (53) adjacent to the adjusting screw (55), and the ball head rod (56) is movably connected with the spherical seat (57).

2. A chip transport shock attenuation device according to claim 1, wherein, The fastening structure (3) includes positioning column (32) fixedly installed on the opening surface of the outer shell (1), and convex seat (35) fixedly installed on the side surface of the outer shell (1), the top surface of the convex seat (35) is fixedly installed with the fixed shaft (34), the rotating shaft (33) is rotatably arranged on the fixed shaft (34), the side wall of the inner cavity of the fixed shaft (34) is fixedly installed with the nut (36), the upper end of the rotating shaft (33) is fixedly installed with the pressing block (31), the fastening screw (37) is threadedly connected to the pressing block (31), and the part of the fastening screw (37) penetrating through the pressing block (31) can be threadedly connected with the nut (36).

3. A chip transport shock attenuation device according to claim 2, wherein, The cover plate (2) is provided with a jack hole matched with the positioning column (32), and the positioning column (32) is provided with four.

4. A chip transport shock absorbing device according to claim 2, wherein The rotating shaft (33) is provided with a cavity for accommodating the fastening screw (37) in the inside, and the upper end of the rotating shaft (33) is provided with an opening for penetrating the fastening screw (37).

5. The chip transport shock attenuation device of claim 1, wherein The lower filling block (42) is provided with a sliding groove for sliding through the connecting rod (51), and the central part of the lower filling block (42) is designed as a hollow.

6. A chip transport shock attenuation device as claimed in claim 1, wherein, The end of the adjusting screw (55) away from the ball head rod (56) is provided with a knob, and the outer surface of the knob is provided with anti-skid lines.

7. The chip transport shock attenuation device of claim 1, wherein The spherical seat (57) is located at the central part of the side of the clamping plate (53), and the central axis of the spherical seat (57), the central axis of the ball head rod (56) and the central axis of the adjusting screw (55) are in coincident state.

8. The chip transport shock attenuation device of claim 1, wherein The connecting seat (54) is designed as a strip structure, and a gap is arranged between the connecting seat (54) and the side wall of the frame body (52) to facilitate the user to rotate the adjusting screw (55).

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