An anti-interference electronic component packaging structure

Abstract

The utility model relates to electronic component packaging technical field, and disclose a kind of anti-interference electronic component packaging structure, the upper end surface of bottom plate is equipped with sealing groove, the anti-interference electronic component packaging structure, by rotating knob to make knob drive screw rod rotate, to make screw rod drive limit plate move to inboard in this way, to make the locating rod installed in the inner end surface of limit plate inserts into locating hole, to make locating rod penetrate sealing block and the locating hole on bottom plate to make the stable connection between packaging cover and bottom plate, so it can better make the electronic component in transport encapsulation structure better to protect it, then the outer surface and inner surface of packaging cover are sprayed with polymer thick film, so this can better make the surface of packaging cover form high conductivity barrier, to better prevent the conductive condition between multiple electronic components when electronic component is transported.

Description

Technical Field

[0001] This utility model relates to the field of electronic component packaging technology, specifically to an anti-interference electronic component packaging structure. Background Technology

[0002] Electronic component packaging is a process technology that mainly involves wrapping the chip to prevent it from coming into contact with the outside world and to prevent damage to the chip. Impurities and harmful gases in the air, as well as water vapor, can corrode the delicate circuits on the chip, thereby causing a decline in electrical performance.

[0003] Traditional electronic component packaging structures are relatively simple, with poor structural rigidity and sealing, making them prone to damage during transportation due to collisions. This increases labor costs and may also lead to conduction between electronic components, potentially causing damage during transport. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides an anti-interference electronic component packaging structure to solve the problems mentioned in the background art, such as the relatively simple traditional electronic component packaging structure, poor structural rigidity and sealing, which makes it easy for electronic components to be damaged by collisions during transportation, increasing labor costs, and potentially causing conduction between electronic components, which may lead to damage during transportation.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an anti-interference electronic component packaging structure, including a base plate, a sealing groove formed on the upper surface of the base plate, positioning holes formed on all four ends of the base plate, a packaging cover provided on the upper surface of the base plate, a sealing block fixedly installed at the bottom of the packaging cover, the diameter of the sealing block being equal to the diameter of the sealing groove, positioning holes formed on the sealing block, fixing brackets fixedly installed on all four ends of the packaging cover, a threaded rod rotatably installed in the fixing bracket, a knob fixedly installed on the outer end surface of the threaded rod, anti-slip protrusions provided on the surface of the knob, a limiting plate fixedly installed on the inner end surface of the threaded rod, and a positioning rod fixedly installed on the inner end surface of the limiting plate.

[0006] Using the above technical solution, after the electronic components are placed into the packaging structure, the sealing block installed at the bottom of the packaging cover will be inserted into the sealing groove opened on the base plate, thereby preventing liquid from entering the packaging structure. After the packaging cover is installed on the base plate, the position of the threaded rod on the fixing bracket will correspond to the position of the positioning hole. At the same time, the positioning hole on the sealing block and the positioning hole on the base plate are connected. Then, the operator rotates the knob, which drives the threaded rod to rotate, thereby causing the threaded rod to move the limiting plate inward. This allows the positioning rod installed on the inner end surface of the limiting plate to be inserted into the positioning hole. This allows the positioning rod to pass through the positioning hole on the sealing block and the base plate, thus making a stable connection between the packaging cover and the base plate. This can better protect the electronic components during transportation.

[0007] Preferably, a limiting plate is fixedly installed on the upper surface of the base plate, a moisture-proof pad is provided on the upper surface of the base plate, and an insulating pad is provided on the moisture-proof pad.

[0008] By adopting the above technical solution, the moisture-proof pad set on the base plate can effectively prevent moisture from entering the electronic components during transportation. Furthermore, the moisture-proof pad is equipped with an insulating pad, which can provide insulation for the electronic components during transportation, thereby preventing damage to the electronic components due to static electricity.

[0009] Preferably, a handle is fixedly installed at the top of the encapsulation cover, four sleeves arranged in a rectangular array are fixedly installed inside the encapsulation cover, a spring is fixedly installed inside each of the four sleeves, a connecting rod is movably inserted into each of the four sleeves, a limiting block is fixedly installed at the top of the connecting rod, the other end of the spring installed inside the sleeve is connected to the limiting block, and a mounting plate is fixedly installed at the bottom of the connecting rod, with a sponge pad provided at the bottom of the mounting plate.

[0010] Using the above technical solution, after the electronic components are placed on the insulating pad, the staff installs the encapsulation cover onto the base plate. Then, the sponge pad will come into contact with the electrical components, thus protecting the electronic components during transportation. Since the sponge pad is set on the mounting plate, after the encapsulation cover is installed, the connecting rod will drive the spring to retract, and then the connecting rod will retract into the sleeve, thus providing better protection for the electronic components.

[0011] Preferably, the positioning holes on the four ends of the base plate extend through the sealing groove into the base plate, and the positioning holes on the sealing block are connected after the sealing block is inserted into the sealing groove.

[0012] By adopting the above technical solution, the positioning holes on the four ends of the base plate are connected to the positioning holes on the sealing block, so that the positioning rod can effectively restrict it.

[0013] Preferably, the outer and inner surfaces of the encapsulation cover are coated with a polymer thick film.

[0014] By employing the above technical solution, a polymer thick film is sprayed onto both the outer and inner surfaces of the encapsulation cover, which effectively forms a highly conductive barrier on the surface of the encapsulation cover, thereby effectively preventing conduction between multiple electronic components during transportation.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. This anti-interference electronic component packaging structure, by rotating a knob, causes the threaded rod to rotate, which in turn moves the limiting plate inward. This allows the positioning rod installed on the inner end surface of the limiting plate to insert into the positioning hole. The positioning rod then passes through the positioning hole on the sealing block and the base plate, thus ensuring a stable connection between the packaging cover and the base plate. This provides better protection for the electronic components during transportation. Furthermore, both the outer and inner surfaces of the packaging cover are coated with a thick polymer film, which forms a highly conductive barrier on the surface of the packaging cover, effectively preventing conduction between multiple electronic components during transportation.

[0017] 2. This anti-interference electronic component packaging structure effectively prevents moisture from entering the electronic components during transportation through the moisture-proof pad on the base plate. Furthermore, the moisture-proof pad contains an insulating pad, which provides insulation for the electronic components during transport, preventing damage caused by static electricity. Since the sponge pad is located on the mounting plate, after the packaging cover is installed, the connecting rod will cause the spring to retract, and the connecting rod will then retract into the sleeve, thus providing effective protection for the electronic components. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the anti-interference electronic component packaging structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the exploded structure of the anti-interference electronic component packaging structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the internal three-dimensional structure of the anti-interference electronic component packaging structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the internal structure of the anti-interference electronic component packaging structure of this utility model;

[0022] Figure 5 This utility model Figure 3 Enlarged schematic diagram of the structure at point A in the middle.

[0023] In the diagram: 1. Base plate; 2. Sealing groove; 3. Positioning hole; 4. Encapsulation cover; 5. Sealing block; 6. Fixing bracket; 7. Threaded rod; 8. Knob; 9. Anti-slip protrusion; 10. Limiting plate; 11. Positioning rod; 12. Limiting plate; 13. Moisture-proof pad; 14. Insulating pad; 15. Handle; 16. Sleeve; 17. Spring; 18. Connecting rod; 19. Limiting block; 20. Mounting plate; 21. Sponge pad. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0025] Referring to Figures 1-5, an anti-interference electronic component packaging structure is described. A sealing groove 2 is formed on the upper surface of the base plate 1. Positioning holes 3 are formed on all four ends of the base plate 1. An encapsulation cover 4 is provided on the upper surface of the base plate 1. A sealing block 5 is fixedly installed at the bottom of the encapsulation cover 4. The diameter of the sealing block 5 is equal to the diameter of the sealing groove 2. Positioning holes 3 are formed on the sealing block 5. Fixing brackets 6 are fixedly installed on all four ends of the encapsulation cover 4. A screw-in component is rotatably installed within the fixing bracket 6. The threaded rod 7 has a knob 8 fixedly installed on its outer end surface. The knob 8 has anti-slip protrusions 9 on its surface. The threaded rod 7 has a limiting plate 10 fixedly installed on its inner end surface. The limiting plate 10 has a positioning rod 11 fixedly installed on its inner end surface. The positioning holes 3 opened on the four ends of the base plate 1 all extend through the sealing groove 2 into the base plate 1. After the sealing block 5 is inserted into the sealing groove 2, the positions of the positioning holes 3 opened on it are all connected. The outer and inner surfaces of the encapsulation cover 4 are coated with a polymer thick film.

[0026] Working principle: After the electronic components are placed into the packaging structure, the sealing block 5 installed at the bottom of the packaging cover 4 will insert into the sealing groove 2 opened on the base plate 1, thereby preventing liquid from entering the packaging structure. After the packaging cover 4 is installed on the base plate 1, the position of the threaded rod 7 on the fixing bracket 6 will correspond to the position of the positioning hole 3. At the same time, the positioning hole 3 on the sealing block 5 and the positioning hole 3 on the base plate 1 are connected. Then, the operator rotates the knob 8, which drives the threaded rod 7 to rotate, thereby causing the threaded rod 7 to move the limiting plate 10 inward. The positioning rod 11 installed on the inner end surface of the limiting plate 10 is inserted into the positioning hole 3, so that the positioning rod 11 passes through the positioning hole 3 on the sealing block 5 and the base plate 1, thereby making a stable connection between the encapsulation cover 4 and the base plate 1. This can better protect the electronic components during transportation. Then, the outer and inner surfaces of the encapsulation cover 4 are coated with a polymer thick film, which can better form a highly conductive barrier on the surface of the encapsulation cover 4, thereby better preventing conduction between multiple electronic components during transportation. Example 2

[0027] Referring to Figures 1-5, an anti-interference electronic component packaging structure is described. A limiting plate 12 is fixedly installed on the upper surface of the base plate 1. A moisture-proof pad 13 is provided on the upper surface of the base plate 1. An insulating pad 14 is provided on the moisture-proof pad 13. A handle 15 is fixedly installed on the top of the packaging cover 4. Four sleeves 16 arranged in a rectangular array are fixedly installed inside the packaging cover 4. A spring 17 is fixedly installed inside each of the four sleeves 16. A connecting rod 18 is movably inserted into each of the four sleeves 16. A limiting block 19 is fixedly installed at the top of the connecting rod 18. The other end of the spring 17 installed inside the sleeve 16 is connected to the limiting block 19. A mounting plate 20 is fixedly installed at the bottom of the connecting rod 18. A sponge pad 21 is provided at the bottom of the mounting plate 20.

[0028] Working principle: The moisture-proof pad 13 set on the base plate 1 can effectively prevent moisture from entering the electronic components during transportation. Then, the insulating pad 14 set on the moisture-proof pad 13 can provide insulation for the electronic components during transportation, thereby preventing damage to the electronic components due to static electricity. After the electronic components are placed on the insulating pad 14, the staff will install the encapsulation cover 4 on the base plate 1. Then, the sponge pad 21 will come into contact with the electronic components, thereby protecting the electronic components during transportation. Since the sponge pad 21 is set on the mounting plate 20, after the encapsulation cover 4 is installed, the connecting rod 18 will drive the spring 17 to retract. Then, the connecting rod 18 will retract into the sleeve 16, thereby effectively protecting the electronic components.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An anti-interference electronic component packaging structure, comprising a base plate (1), characterized in that: A sealing groove (2) is provided on the upper surface of the base plate (1). A positioning hole (3) is provided on all four ends of the base plate (1). A sealing cover (4) is provided on the upper surface of the base plate (1). A sealing block (5) is fixedly installed at the bottom of the sealing cover (4). The diameter of the sealing block (5) is equal to the diameter of the sealing groove (2). A positioning hole (3) is provided on the sealing block (5). A fixing frame (6) is fixedly installed on all four ends of the sealing cover (4). A threaded rod (7) is installed in the fixing frame (6) in a threaded rotation. A knob (8) is fixedly installed on the outer end surface of the threaded rod (7). An anti-slip protrusion (9) is provided on the surface of the knob (8). A limiting plate (10) is fixedly installed on the inner end surface of the threaded rod (7). A positioning rod (11) is fixedly installed on the inner end surface of the limiting plate (10).

2. The anti-interference electronic component packaging structure according to claim 1, characterized in that: A limiting plate (12) is fixedly installed on the upper surface of the base plate (1), a moisture-proof pad (13) is provided on the upper surface of the base plate (1), and an insulating pad (14) is provided on the moisture-proof pad (13).

3. The anti-interference electronic component packaging structure according to claim 1, characterized in that: A handle (15) is fixedly installed at the top of the encapsulation cover (4). Four sleeves (16) arranged in a rectangular array are fixedly installed inside the encapsulation cover (4). A spring (17) is fixedly installed inside each of the four sleeves (16). A connecting rod (18) is movably inserted into each of the four sleeves (16). A limiting block (19) is fixedly installed at the top of the connecting rod (18). The other end of the spring (17) installed inside the sleeve (16) is connected to the limiting block (19). A mounting plate (20) is fixedly installed at the bottom of the connecting rod (18). A sponge pad (21) is provided at the bottom of the mounting plate (20).

4. The anti-interference electronic component packaging structure according to claim 1, characterized in that: The positioning holes (3) on the four ends of the base plate (1) all extend through the sealing groove (2) into the base plate (1). After the sealing block (5) is inserted into the sealing groove (2), the positioning holes (3) on it are all connected.

5. The anti-interference electronic component packaging structure according to claim 1, characterized in that: The outer and inner surfaces of the encapsulation cover (4) are coated with a polymer thick film.

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