An automatic tin dipping and testing apparatus

Abstract

The utility model provides a kind of automatic tin dipping and testing device, comprising: rotating mechanism: rotating mechanism is provided with multiple clamping components, each clamping component is provided with the clamping position for clamping the product to be processed;Feeding mechanism: feeding mechanism corresponds one clamping position, to realize the feeding of product to be processed;Tin dipping mechanism: tin dipping mechanism corresponds one clamping position, to dip tin for product to be processed;Testing mechanism: testing mechanism corresponds one clamping position, to test for product to be processed;Discharging mechanism: discharging mechanism corresponds one clamping position, to take down product to be processed;Frame. Feeding mechanism, tin dipping mechanism, testing mechanism and discharging mechanism are arranged around the circumferential side of rotating mechanism, and rotating mechanism is rotatable on frame to drive clamping position to move between feeding mechanism, tin dipping mechanism, testing mechanism and discharging mechanism, tin dipping and testing of product to be processed can be realized on one device, efficiency is improved, and there is no need to set conveying device, cost is saved.

Description

Technical Field

[0001] This utility model belongs to the field of automation technology, and specifically relates to an automatic soldering and testing device. Background Technology

[0002] Currently, the soldering and testing of products often require two separate devices. Transferring the products between these devices often necessitates a conveyor belt or manual placement, wasting time and manpower and increasing costs. Utility Model Content

[0003] To address the aforementioned problems, the primary objective of this invention is to provide a device that simultaneously performs automatic soldering and testing on a single unit, thereby resolving the technical issues of wasted time and manpower and increased costs associated with transferring products between different devices.

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] This utility model provides an automatic soldering and testing device, comprising:

[0006] Rotation mechanism: The rotation mechanism is provided with multiple clamping components, and each clamping component is provided with a clamping position for clamping the product to be processed;

[0007] Feeding mechanism: The feeding mechanism corresponds to a clamping position to realize the feeding of the product to be processed;

[0008] Soldering mechanism: The soldering mechanism corresponds to a clamping position for soldering the product to be processed;

[0009] Testing mechanism: The testing mechanism corresponds to a clamping position for testing the product to be processed;

[0010] Feeding mechanism: The feeding mechanism corresponds to a clamping position to remove the product to be processed;

[0011] frame;

[0012] The feeding mechanism, tinning mechanism, testing mechanism, and unloading mechanism are all mounted on the frame. The feeding mechanism, tinning mechanism, testing mechanism, and unloading mechanism are arranged around the rotating mechanism. The rotating mechanism can rotate on the frame to drive the clamping position to move between the feeding mechanism, tinning mechanism, testing mechanism, and unloading mechanism.

[0013] Compared with the prior art, the beneficial effects of this application are as follows: the feeding mechanism, the soldering mechanism, the testing mechanism and the unloading mechanism are arranged around the circumference of the rotating mechanism, and the rotating mechanism can rotate on the frame to drive the clamping position to move between the feeding mechanism, the soldering mechanism, the testing mechanism and the unloading mechanism. Soldering and testing of the product to be processed can be realized in one device, which improves efficiency and eliminates the need for a conveying device, thus saving costs.

[0014] Furthermore, the automatic soldering and testing device also includes a flux application mechanism, which corresponds to a clamping position for applying flux to the product to be processed.

[0015] Further, the upper flux mechanism includes a flux placement tank, a flux driving cylinder, and a flux placement spoon connected to the flux driving cylinder. The flux placement spoon is correspondingly arranged with the clamping components. The flux driving cylinder is located on the side of the flux placement tank away from the rotating mechanism, and is used to drive the flux placement spoon to move up and down within the flux placement tank, so that the flux placement spoon scoops up the flux in the flux placement tank. When the flux driving cylinder drives the flux placement spoon to move upward until it abuts the clamping components, the solder-coated portion of the product to be processed, held by the clamping components, picks up the flux through the flux placement spoon. After the solder-coated portion of the product to be processed, held by the clamping components, picks up the flux, the flux driving cylinder drives the flux placement spoon to move downward to the initial position. Preferably, three clamping components extend from the clamping surface corresponding to the upper flux mechanism of the rotating mechanism, and three flux placement spoons corresponding to the three clamping components are provided on the flux driving cylinder.

[0016] Furthermore, the automatic soldering and testing device also includes a cooling mechanism and a deburring mechanism. The cooling mechanism is mounted on the frame and corresponds to a clamping position for cooling and deburring the product to be processed. The cooling mechanism includes a fan, which is correspondingly arranged with the clamping assembly. The deburring mechanism includes a deburring plate and a deburring drive cylinder connected to the deburring plate. Deburring holes are provided on the deburring plate at positions corresponding to the clamping assembly. When the deburring drive cylinder moves the deburring plate upward to abut against the clamping assembly, the solder-coated portion of the product to be processed is inserted into the deburring hole to remove burrs from the solder-coated portion. Preferably, three clamping assemblies extend from the clamping surface corresponding to the cooling mechanism of the rotating mechanism, and three fans corresponding to the three clamping assemblies are provided on the cooling mechanism.

[0017] Furthermore, the automatic soldering and testing device also includes a defective product removal mechanism, which includes a defective product collection box corresponding to the clamping position. The defective product collection box is used to hold products that fail the test by the testing mechanism. When the testing mechanism detects that a product is defective, the clamping assembly releases the product, causing it to fall into the defective product collection box.

[0018] Furthermore, the rotating mechanism includes multiple clamping surfaces symmetrically arranged around its center, each clamping surface having a clamping component extending outwards. After each mechanism is processed, the rotating mechanism rotates by a preset angle, so that each mechanism corresponds to another clamping position. Preferably, the rotating mechanism has eight clamping surfaces, each clamping surface having three clamping components. After each mechanism is processed, the rotating mechanism rotates 45°, so that each mechanism corresponds to another clamping position.

[0019] Further, the feeding mechanism includes a first rotating platform and product mounting components disposed on both sides of the first rotating platform. One side of the first rotating platform corresponds to the clamping surface of the rotating mechanism. The product mounting component has a feeding rod and a mounting base connected to the feeding rod, with each mounting base corresponding to a clamping position. A limiting component corresponding to the product mounting component is disposed above the first rotating platform, and the limiting component is used to determine the spatial position of the mounting base. The feeding rod can be driven to rise and fall by a cylinder or motor. When the feeding rod moves the product to be processed placed on the mounting base upward to abut the limiting component, the corresponding clamping component on the rotating mechanism clamps the product to be processed placed on the mounting base. The product mounting component moves downward to its initial position, and the first rotating platform rotates 360 degrees so that the clamping component can clamp the product to be processed on the other side of the product mounting component. Preferably, three product mounting components are sequentially disposed on one side of the first rotating platform, and three clamping components extend from the clamping surface of the rotating mechanism accordingly. Three product mounting components are positioned at the same horizontal level. When the feeding mechanism is operating, the feeding rods on the three product mounting components simultaneously drive the mounting base upwards until the product to be processed on the mounting base abuts the limiting component. After the three clamping components simultaneously clamp the product to be processed placed on the mounting base, the three product mounting components simultaneously move downwards to their initial positions. The first rotating platform rotates 360 degrees to allow the clamping components to clamp the product to be processed on the other side of the product mounting component.

[0020] Furthermore, the soldering mechanism includes a solder bath, a lifting rod disposed at the bottom of the solder bath, a scraper disposed above the solder bath, an up-and-down drive cylinder connected to the scraper, and a front-and-back drive cylinder connected to the up-and-down drive cylinder. The up-and-down drive cylinder is used to drive the scraper to move up and down, and the front-and-back drive cylinder is used to drive the scraper to move left and right. The lifting rod can move up and down under the drive of a motor or cylinder, thereby driving the solder bath to move up and down. When the soldering mechanism is working, the front-and-back drive cylinder drives the scraper to move towards the rotating mechanism to the position corresponding to the edge of the solder bath. The up-and-down drive cylinder drives the scraper to move towards the solder bath until it contacts the solder surface inside the solder bath. The front-and-back drive cylinder drives the scraper to move away from the rotating mechanism to the other side of the solder bath to scrape off the film on the inner surface of the solder bath. After the up-and-down drive cylinder drives the scraper to move away from the solder bath for a certain distance, the scraper moves away from the rotating mechanism so that the scraper is withdrawn from above the solder bath, avoiding being blocked by the scraper when the lifting rod drives the solder bath to move upward. After the scraper is removed from above the solder bath, the lifting rod moves the solder bath upwards until the solder-coated part of the product to be processed, held by the clamping component, is immersed in the molten solder.

[0021] Furthermore, the testing mechanism includes a set of test pins and a testing host connected to the test pins. The test pin set is correspondingly arranged with respect to the solder-coated portion of the product to be processed. The testing host can be raised and lowered by a motor or cylinder, thereby moving the test pin set upwards to abut against the solder-coated portion of the product to be processed held by the clamping components, so as to measure relevant data of the solder-coated portion through the test pin set. The testing host is a conventional testing structure and will not be described in detail here. Preferably, three clamping components extend from the clamping surface corresponding to the rotating mechanism and the testing mechanism, and the testing mechanism includes three sets of test pins corresponding to the three clamping components.

[0022] Further, the unloading mechanism includes a second rotating platform and product mounting components disposed on both sides of the second rotating platform. One side of the second rotating platform corresponds to the clamping surface of the rotating mechanism. The product mounting component has a unloading rod and a mounting base connected to the unloading rod, with each mounting base corresponding to a clamping position. When the unloading mechanism is working, the unloading rod can be driven to rise and fall by a cylinder or motor, thereby driving the mounting base upward to abut against the product to be processed held by the clamping component. The clamping component releases the product to be processed, and the product to be processed is placed on the mounting base. The unloading rod moves downward to its initial position, and the second rotating platform rotates 360 degrees to allow the product to be processed on the other side to be placed. Preferably, three product mounting components are sequentially disposed on one side of the second rotating platform, and three clamping components extend from the clamping surface of the rotating mechanism. The three product mounting components are located at the same horizontal position. When the unloading mechanism is working, the unloading rods on the three product mounting components simultaneously drive the mounting base upward until they abut against the product to be processed held by the clamping component. The three clamping components simultaneously release the product to be processed, and the product to be processed is placed on the mounting base. The three product mounting parts simultaneously move downward to the initial position, and the second rotating platform rotates 360 degrees to allow the product mounting parts on the other side to place the product to be processed. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the automatic soldering and testing device of this utility model.

[0024] Figure 2 yes Figure 1 Enlarged structural diagram of part A in the middle.

[0025] Figure 3 This is a schematic diagram of the tin-dipping mechanism in the automatic tin-dipping and testing device of this utility model.

[0026] Figure 4 This is a schematic diagram of the flux feeding mechanism in the automatic soldering and testing device of this utility model, omitting the connection structure of the flux driving cylinder and the flux placement spoon. The connection structure is preferably a connecting block or a connecting rod.

[0027] Figure 5 This is a schematic diagram of the hidden components of the flux application mechanism, soldering mechanism, cooling mechanism, deburring mechanism, testing mechanism, and unloading mechanism in the automatic soldering and testing device of this utility model.

[0028] Figure 6 yes Figure 5 Enlarged structural diagram of part B in the middle.

[0029] Figure 7 yes Figure 5 Enlarged structural diagram of section C.

[0030] Figure 8 yes Figure 5 Enlarged structural diagram of part D in the middle.

[0031] Figure 9 yes Figure 5 Enlarged structural diagram of part E in the middle.

[0032] Figure 10 yes Figure 5 Enlarged structural diagram of part F in the middle.

[0033] Figure 11 This is a schematic diagram of the defect removal mechanism in the automatic soldering and testing device of this utility model.

[0034] Figure 12 yes Figure 1 Enlarged structural diagram of the G section.

[0035] In the diagram: 1. Rotating mechanism; 2. Feeding mechanism; 3. Soldering mechanism; 4. Testing mechanism; 5. Unloading mechanism; 6. Frame; 101. Clamping assembly; 102. Clamping position; 7. Flux feeding mechanism; 71. Flux placement tank; 72. Flux driving cylinder; 73. Flux placement spoon; 8. Cooling mechanism; 9. Deburring mechanism; 81. Fan; 91. Deburring plate; 92. Deburring driving cylinder; 911. 10. Deburring hole; 11. Defective product removal mechanism; 12. Defective product collection box; 13. Clamping surface; 21. First rotating platform; 22. Product to be processed mounting part; 221. Feeding rod; 222. Mounting base; 31. Solder bath; 32. Lifting rod; 33. Scraper; 34. Up and down drive cylinder; 35. Front and rear drive cylinder; 41. Test probe group; 42. Test host; 51. Second rotating platform; 53. Unloading rod. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0037] To achieve the above objectives, the technical solution of this utility model is as follows:

[0038] See Figures 1-12 As shown, this utility model provides an automatic soldering and testing device, comprising:

[0039] Rotating mechanism 1: The rotating mechanism 1 is provided with a plurality of clamping components 101, and each clamping component 101 is provided with a clamping position 102 for clamping the product to be processed;

[0040] Feeding mechanism 2: Feeding mechanism 2 corresponds to a clamping position 102 to realize the feeding of products to be processed;

[0041] Tinning Mechanism 3: Tinning mechanism 3 corresponds to a clamping position 102 for tinning the product to be processed;

[0042] Test mechanism 4: Test mechanism 4 corresponds to a clamping position 102 for testing the product to be processed;

[0043] Feeding mechanism 5: Feeding mechanism 5 corresponds to a clamping position 102 to remove the product to be processed;

[0044] Rack 6;

[0045] The feeding mechanism 2, the tinning mechanism 3, the testing mechanism 4, and the unloading mechanism 5 are all mounted on the frame 6. These mechanisms are arranged around the rotating mechanism 1, and the rotating mechanism 1 is rotatable on the frame 6 to drive the clamping position 102 to move between the feeding mechanism 2, the tinning mechanism 3, the testing mechanism 4, and the unloading mechanism 5. Preferably, the product to be processed can be a stator; this application does not limit this.

[0046] Compared with the prior art, the beneficial effects of this application are as follows: the feeding mechanism 2, the soldering mechanism 3, the testing mechanism 4 and the unloading mechanism 5 are arranged around the circumference of the rotating mechanism 1, and the rotating mechanism 1 can rotate on the frame 6 to drive the clamping position 102 to move between the feeding mechanism 2, the soldering mechanism 3, the testing mechanism 4 and the unloading mechanism 5. Soldering and testing of the product to be processed can be realized on one device, which improves efficiency and eliminates the need for a conveying device, thus saving costs.

[0047] In this embodiment, the automatic soldering and testing device also includes a fluxing mechanism 7, which corresponds to a clamping position 102 for applying flux to the product to be processed.

[0048] In this embodiment, the upper flux mechanism 7 includes a flux placement tank 71, a flux driving cylinder 72, and a flux placement spoon 73 connected to the flux driving cylinder 72. The flux placement spoon 73 is correspondingly disposed with the clamping assembly 101. The flux driving cylinder 72 is disposed on the side of the flux placement tank 71 away from the rotating mechanism 1, and is used to drive the flux placement spoon 73 to move up and down within the flux placement tank 71, so that the flux placement spoon 73 scoops up the flux in the flux placement tank 71. When the flux driving cylinder 72 drives the flux placement spoon 73 to move upward to abut against the clamping assembly 101, the solder-coated portion of the product to be processed held by the clamping assembly 101 picks up the flux through the flux placement spoon 73. After the solder-coated portion of the product to be processed held by the clamping assembly 101 has picked up the flux, the flux driving cylinder 72 drives the flux placement spoon 73 to move downward to the initial position. Preferably, the rotating mechanism 1 has three clamping components 101 extending from the clamping surface 103 corresponding to the upper flux mechanism 7, and three flux placement spoons 73 corresponding to the three clamping components 101 are provided on the flux driving cylinder 72.

[0049] In this embodiment, the automatic soldering and testing device further includes a cooling mechanism 8 and a deburring mechanism 9. The cooling mechanism 8 is mounted on the frame 6 and corresponds to a clamping position 102 for cooling and deburring the product to be processed. The cooling mechanism 8 includes a fan 81, which is correspondingly arranged with the clamping assembly 101. The deburring mechanism 9 includes a deburring plate 91 and a deburring drive cylinder 92 connected to the deburring plate 91. Deburring holes 911 are provided on the deburring plate 91 at positions corresponding to the clamping assembly 101. When the deburring drive cylinder 92 drives the deburring plate 91 upward to abut against the clamping assembly 101, the soldered portion of the product to be processed is inserted into the deburring hole 911 to remove the burrs from the soldered portion. Preferably, three clamping assemblies 101 extend from the clamping surface 103 corresponding to the cooling mechanism 8 of the rotating mechanism 1, and three fans 81 corresponding to the three clamping assemblies 101 are provided on the cooling mechanism 8.

[0050] In this embodiment, the automatic soldering and testing device further includes a defective product removal mechanism 10. The defective product removal mechanism 10 includes a defective product collection box 11 corresponding to the clamping position 102. The defective product collection box 11 is used to hold products that fail the test by the testing mechanism 4. When the testing mechanism 4 detects that the product to be processed is defective, the clamping assembly 101 releases the clamped product, causing the product to fall into the defective product collection box 11.

[0051] In this embodiment, the rotating mechanism 1 includes a plurality of clamping surfaces 103 symmetrically arranged around its center, and each clamping surface 103 extends a clamping component 101. After each mechanism is processed, the rotating mechanism 1 rotates by a preset angle, so that each mechanism corresponds to another clamping position 102. Preferably, the rotating mechanism 1 is provided with eight clamping surfaces 103, and each clamping surface 103 is provided with three clamping components 101. After each mechanism is processed, the rotating mechanism 1 rotates 45°, so that each mechanism corresponds to another clamping position 102.

[0052] In this embodiment, the feeding mechanism 2 includes a first rotating platform 21 and a product mounting component 22 to be processed disposed on both sides of the first rotating platform 21. One side of the first rotating platform 21 is correspondingly disposed to the clamping surface 103 of the rotating mechanism 1. The product mounting component 22 to be processed has a feeding rod 221 and a mounting base 222 connected to the feeding rod 221. The mounting base 222 corresponds to a clamping position 102. A limiting component corresponding to the product mounting component 22 to be processed is disposed above the first rotating platform 21. The limiting component is used to determine the spatial position of the mounting base 222. The feeding rod 221 can be lifted and lowered by a cylinder or motor. The feeding rod 221 then moves the product to be processed, placed on the mounting base 222, upwards until it abuts the limiting member. At this point, the corresponding clamping component 101 on the rotating mechanism 1 clamps the product to be processed placed on the mounting base 222. The product mounting piece 22 moves downwards to its initial position, and the first rotating platform 21 rotates 360 degrees so that the clamping component 101 can clamp the product to be processed on the other side of the product mounting piece 22. Preferably, three product mounting pieces 22 are sequentially arranged on one side of the first rotating platform 21, and three clamping components 101 extend from the clamping surface 103 of the rotating mechanism 1. The three product mounting pieces 22 are located at the same horizontal position. When the feeding mechanism 2 is working, the feeding rods 221 on the three product mounting pieces 22 simultaneously drive the mounting base 222 upwards until the product to be processed on the mounting base 222 abuts the limiting member. After the three clamping components 101 simultaneously clamp the product to be processed placed on the mounting base 222, the three product mounting parts 22 simultaneously move downward to the initial position, and the first rotating platform 21 rotates 360 degrees so that the clamping components 101 can clamp the product to be processed on the other side of the product mounting part 22.

[0053] In this embodiment, the soldering mechanism 3 includes a solder bath 31, a lifting rod 32 disposed at the bottom of the solder bath 31, a scraper 33 disposed above the solder bath 31, an up-and-down driving cylinder 34 connected to the scraper 33, and a front-and-back driving cylinder 35 connected to the up-and-down driving cylinder 34. The up-and-down driving cylinder 34 is used to drive the scraper 33 to move up and down, and the front-and-back driving cylinder 35 is used to drive the scraper 33 to move left and right. The lifting rod 32 can move up and down under the drive of a motor or cylinder, thereby driving the solder bath 31 to move up and down. When the soldering mechanism 3 is working, the front and rear drive cylinders 35 drive the scraper 33 to move towards the rotating mechanism 1 to the position corresponding to the edge of the solder bath 31. The up and down drive cylinders 34 drive the scraper 33 to move towards the solder bath 31 until it contacts the solder surface inside the solder bath 31. The front and rear drive cylinders 35 drive the scraper 33 to move away from the rotating mechanism 1 to the edge of the solder bath 31 on the other side to scrape off the film on the inner surface of the solder bath 31. After the up and down drive cylinders 34 drive the scraper 33 to move away from the solder bath 31 for a certain distance, the scraper 33 moves away from the rotating mechanism 1 so that the scraper 33 is withdrawn from the top of the solder bath 31, so as to avoid the lifting rod 32 being blocked by the scraper 33 when it drives the solder bath 31 to move upward. After the scraper 33 is removed from above the solder bath 31, the lifting rod 32 moves the solder bath 31 upward until the solder-coated part of the product to be processed, held by the clamping assembly 101, is immersed in the molten solder.

[0054] In this embodiment, the testing mechanism 4 includes a test pin group 41 and a testing host 42 connected to the test pins. The test pin group 41 is correspondingly arranged with the solder-coated part of the product to be processed. The testing host 42 can be raised and lowered by a motor or cylinder, thereby moving the test pin group 41 upward to abut against the solder-coated part of the product to be processed held by the clamping assembly 101, so as to measure the relevant data of the solder-coated part through the test pin group 41. The testing host 42 is a conventional testing structure and will not be described in detail here. Preferably, the clamping surface 103 corresponding to the rotating mechanism 1 and the testing mechanism 4 has three clamping assemblies 101 extending out, and the testing mechanism 4 includes three test pin groups 41 corresponding to the three clamping assemblies 101.

[0055] In this embodiment, the unloading mechanism 5 includes a second rotating platform 51 and product mounting components 22 disposed on both sides of the second rotating platform 51. One side of the second rotating platform 51 is correspondingly disposed to the clamping surface 103 of the rotating mechanism 1. The product mounting component 22 has an unloading rod 53 and a mounting base 222 connected to the unloading rod 53. The mounting base 222 corresponds to a clamping position 102. When the unloading mechanism 5 is working, the unloading rod 53 can be driven to rise and fall by a cylinder or motor. The unloading rod 53 then drives the mounting base 222 to move upward to abut against the product to be processed held by the clamping component 101. The clamping component 101 releases the product to be processed, and the product to be processed is placed on the mounting base 222. The unloading rod 53 drives the mounting base 222 to move downward to the initial position. The second rotating platform 51 rotates 360 degrees to allow the product to be processed to be placed on the other side of the product mounting component 22. Preferably, three product mounting pieces 22 are sequentially arranged on one side of the second rotating platform 51, and three clamping components 101 extend from the clamping surface 103 of the rotating mechanism 1. The three product mounting pieces 22 are located at the same horizontal position. When the unloading mechanism 5 is working, the unloading rods 53 on the three product mounting pieces 22 simultaneously drive the mounting base 222 to move upward until they abut against the product to be processed held by the clamping components 101. When the three clamping components 101 simultaneously release the product to be processed, the product to be processed is placed on the mounting base 222, and the three product mounting pieces 22 simultaneously move downward to the initial position. The second rotating platform 51 rotates 360 degrees to allow the product mounting piece 22 on the other side to place the product to be processed.

[0056] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An automatic soldering and testing device, characterized in that, include: Rotation mechanism: The rotation mechanism is provided with multiple clamping components, and each clamping component is provided with a clamping position for clamping the product to be processed; Feeding mechanism: The feeding mechanism corresponds to a clamping position to realize the feeding of the product to be processed; Soldering mechanism: The soldering mechanism corresponds to a clamping position for soldering the product to be processed; Testing mechanism: The testing mechanism corresponds to a clamping position for testing the product to be processed; Feeding mechanism: The feeding mechanism corresponds to a clamping position to remove the product to be processed; frame; The feeding mechanism, tinning mechanism, testing mechanism, and unloading mechanism are all mounted on the frame. The feeding mechanism, tinning mechanism, testing mechanism, and unloading mechanism are arranged around the rotating mechanism. The rotating mechanism can rotate on the frame to drive the clamping position to move between the feeding mechanism, tinning mechanism, testing mechanism, and unloading mechanism.

2. The automatic soldering and testing apparatus according to claim 1, characterized in that, The automatic soldering and testing device also includes a flux application mechanism, which corresponds to a clamping position for applying flux to the product to be processed.

3. The automatic soldering and testing apparatus according to claim 2, characterized in that, The upper flux mechanism includes a flux placement tank, a flux driving cylinder, and a flux placement spoon connected to the flux driving cylinder. The flux placement spoon is correspondingly arranged with the clamping assembly. The flux driving cylinder is located on the side of the flux placement tank away from the rotating mechanism and is used to drive the flux placement spoon to move up and down in the flux placement tank so that the flux placement spoon can scoop up the flux in the flux placement tank.

4. The automatic soldering and testing apparatus according to claim 1, characterized in that, The automatic soldering and testing device also includes a cooling mechanism and a deburring mechanism. The cooling mechanism is mounted on the frame and corresponds to a clamping position to cool and deburr the product to be processed. The cooling mechanism includes a fan. The deburring mechanism includes a deburring plate and a deburring drive cylinder connected to the deburring plate. Deburring holes are provided on the deburring plate at positions corresponding to the clamping components.

5. The automatic soldering and testing apparatus according to claim 1, characterized in that, The automatic soldering and testing device also includes a defect removal mechanism, which includes a defect collection box corresponding to the clamping position. The defect collection box is used to hold products that fail the test by the testing mechanism.

6. The automatic soldering and testing apparatus according to any one of claims 1-5, characterized in that, The rotating mechanism includes multiple clamping surfaces symmetrically arranged along the center of the rotating mechanism, and each clamping surface has a clamping component extending out.

7. The automatic soldering and testing apparatus according to claim 6, characterized in that, The feeding mechanism includes a first rotating platform and a product mounting component to be processed disposed on both sides of the first rotating platform. One side of the first rotating platform is corresponding to the clamping surface of the rotating mechanism. The product mounting component to be processed has a feeding rod and a mounting base connected to the feeding rod. The mounting base corresponds to a clamping position. A limiting component corresponding to the product mounting component to be processed is disposed above the first rotating platform. The limiting component is used to determine the spatial position of the mounting base.

8. The automatic soldering and testing apparatus according to any one of claims 1-5, characterized in that, The soldering mechanism includes a solder bath, a lifting rod at the bottom of the solder bath, a scraper above the solder bath, an up-and-down drive cylinder connected to the scraper, and a front-and-back drive cylinder connected to the up-and-down drive cylinder. The up-and-down drive cylinder is used to drive the scraper to move up and down, and the front-and-back drive cylinder is used to drive the scraper to move left and right.

9. The automatic soldering and testing apparatus according to any one of claims 1-5, characterized in that, The testing mechanism includes a set of test probes and a testing host connected to the test probes. The set of test probes is set to correspond to the soldering part of the product to be processed.

10. The automatic soldering and testing apparatus according to any one of claims 1-5, characterized in that, The unloading mechanism includes a second rotating platform and a product mounting component to be processed disposed on both sides of the second rotating platform. One side of the second rotating platform is corresponding to the clamping surface of the rotating mechanism. The product mounting component to be processed has an unloading rod and a mounting base connected to the unloading rod. The mounting base corresponds to a clamping position.

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