MEMS chip, packaging product, and electronic device
By setting DC and AC pins in the MEMS chip and using an electric field to drive the vibration of the sensitive membrane, the dual functions of the MEMS chip as a sensor and speaker are realized, solving the problem of single-function packaged products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GOERTEK MICROELECTRONICS CO LTD
- Filing Date
- 2025-07-29
- Publication Date
- 2026-07-14
AI Technical Summary
Existing MEMS chip packaging products have limited functionality and cannot meet the diverse needs of customers.
In the MEMS chip, the first and second DC pins are connected to the ASIC chip, and the first and second AC pins are connected to the external AC power supply. By changing the electric field force between the two plates, the sensitive membrane is driven to vibrate, thus realizing the speaker function while maintaining the sensor function.
MEMS chips enable both sensor and speaker functions, thus expanding the range of functionalities in packaged products.
Smart Images
Figure CN224493762U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of packaging product technology, and in particular to a MEMS chip, packaging product, and electronic device. Background Technology
[0002] Current packaging products include MEMS chips and ASIC chips electrically connected to MEMS chips. Depending on the function of the MEMS chip, it can realize one of the functions such as sound pressure detection, air pressure detection, and temperature detection. However, the functions are limited and cannot meet the diverse needs of customers. Utility Model Content
[0003] The main purpose of this application is to propose a MEMS chip, a packaged product, and an electronic device, which aims to at least improve the technical problem of the single function of the packaged product.
[0004] To achieve the above objectives, according to some embodiments of this application, this application provides a MEMS chip, including a substrate and a sensitive film and a back electrode plate respectively disposed on the substrate. The sensitive film and the back electrode plate are disposed parallel to each other with a gap between them. The sensitive film is provided with a first DC pin and a first AC pin, and the back electrode plate is provided with a second DC pin and a second AC pin. The first DC pin and the second DC pin are used to connect to an ASIC chip, and the first AC pin and the second AC pin are used to connect to an external AC power supply.
[0005] In some embodiments, the MEMS chip includes a first side and a second side disposed adjacent to each other, the first DC pin and the second DC pin are disposed on the first side of the MEMS chip, and the first AC pin and the second AC pin are disposed on the second side of the MEMS chip.
[0006] In some embodiments, the MEMS chip includes a first side and a third side disposed opposite to each other, the first DC pin and the second DC pin are disposed on the first side of the MEMS chip, and the first AC pin and the second AC pin are disposed on the third side of the MEMS chip.
[0007] According to some embodiments of this application, this application provides a packaged product, including a substrate and a housing covering the substrate. The substrate and the housing form a receiving cavity. An AC power module, an ASIC chip, and the aforementioned MEMS chip are disposed on the substrate. The MEMS chip and the ASIC chip are both disposed within the receiving cavity. A first DC pin and a second DC pin are electrically connected to the ASIC chip. A first AC pin and a second AC pin are electrically connected to the AC power module.
[0008] In some embodiments, the AC power module includes a power supply and a pad assembly, the pad assembly including a first pad and a second pad, the power supply including a positive terminal electrically connected to the first pad and a negative terminal electrically connected to the second pad, the first pad being electrically connected to a first AC pin and the second pad being electrically connected to a second AC pin.
[0009] In some embodiments, the pad assembly and the ASIC chip are respectively disposed on two adjacent sides of the MEMS chip, the first DC pin and the second DC pin are disposed close to the ASIC chip, and the first AC pin and the second AC pin are disposed close to the pad assembly.
[0010] In some embodiments, the pad assembly and the ASIC chip are respectively disposed on opposite sides of the MEMS chip, the first DC pin and the second DC pin are disposed close to the ASIC chip, and the first AC pin and the second AC pin are disposed close to the pad assembly.
[0011] In some embodiments, the first DC pin and the second DC pin are electrically connected to the ASIC chip via a first gold wire, and the first AC pin and the second AC pin are electrically connected to the AC power module via a second gold wire.
[0012] In some embodiments, the AC power module includes a power supply and a pad assembly respectively disposed on the substrate. The pad assembly includes a first pad and a second pad respectively connected to the power supply. The first AC pin and the second AC pin are disposed facing the substrate. The first AC pin is connected to the first pad through a first solder layer, and the second AC pin is connected to the second pad through a second solder layer.
[0013] According to some embodiments of this application, this application provides an electronic device, which includes the packaged product described above.
[0014] In the above scheme, a first AC pin is also provided on the sensitive membrane, and a second AC pin is also provided on the back electrode plate. The first AC pin and the second AC pin are used to connect to an external AC power supply. This is equivalent to adding a changing AC electric field to the sensitive membrane and the back electrode plate. By changing the electric field force between the two electrodes, the sensitive membrane is driven to vibrate back and forth. The vibration of the diaphragm compresses the air to generate sound waves, thereby realizing the function of a loudspeaker. Thus, a single MEMS chip can realize two applications: sensor and loudspeaker. As a result, the packaged products made from MEMS chips can also realize both sensor and loudspeaker functions, thus increasing the functional versatility of packaged products.
[0015] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the structure of a MEMS chip according to some embodiments of this application;
[0018] Figure 2 This is another schematic diagram of the structure of a MEMS chip according to some embodiments of this application;
[0019] Figure 3 This is a cross-sectional structural diagram of a MEMS chip according to some embodiments of this application;
[0020] Figure 4 This is a structural schematic diagram of a packaged product according to some embodiments of this application;
[0021] Figure 5 This is another structural schematic diagram of the packaged product for some embodiments of this application.
[0022] Explanation of icon numbers:
[0023] 100. Packaged products;
[0024] 2. MEMS chip; 21. Sensitive membrane; 211. First DC pin; 212. First AC pin; 22. Back electrode plate; 221. Second DC pin; 222. Second AC pin; 23. Substrate; 24. Spacing; 25. Sound inlet; 201. First side; 202. Second side; 203. Third side; 3. ASIC chip; 31. Third pad; 4. Substrate; 5. Housing; 6. Power supply; 7. Pad assembly; 71. First pad; 72. Second pad; 8. First gold wire; 9. Second gold wire.
[0025] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0026] The technical solutions in this embodiment will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0027] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this embodiment are only used to explain the relative positional relationship and movement of each component in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicator will also change accordingly.
[0028] Furthermore, the use of terms such as "first," "second," etc., in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0029] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0030] Furthermore, the technical solutions of the various embodiments of this application can be combined with each other, but only if they are feasible to those skilled in the art. If a combination of technical solutions contradicts each other or cannot be implemented, it should be considered that such a combination does not exist and is not within the scope of protection claimed in this application. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.
[0031] The descriptions of directions such as "up", "down", "front", "back", "left", and "right" in this application are based on the directions shown in the figure and are only used to explain the relative positional relationship between the components in the posture shown in the figure. If the specific posture changes, the directional indication will also change accordingly.
[0032] Therefore, this application proposes a MEMS chip, a packaged product, and an electronic device.
[0033] Reference Figure 1 and Figure 3 According to some embodiments of this application, this application provides a MEMS chip 2, including a substrate 23 and a sensitive film 21 and a back electrode plate 22 respectively disposed on the substrate 23. The sensitive film 21 and the back electrode plate 22 are arranged in parallel with a gap 24 between them. The sensitive film 21 is provided with a first DC pin 211 and a first AC pin 212, and the back electrode plate 22 is provided with a second DC pin 221 and a second AC pin 222. The first DC pin 211 and the second DC pin 221 are used to connect to an ASIC chip 3, and the first AC pin 212 and the second AC pin 222 are used to connect to an external AC power supply 6.
[0034] Regarding the structure of the MEMS chip 2, the substrate 23 generally also has a sound inlet 25, through which sound enters. The sensitive diaphragm 21, also known as the sensing diaphragm or vibrating diaphragm, is disposed on the side of the back plate 22 facing the sound inlet 25. Both the sensitive diaphragm 21 and the back plate 22 are disposed on the substrate 23, arranged in parallel and spaced apart, with a gap 24 between them. The sensitive diaphragm 21 and the back plate 22 are equivalent to the two plates of a capacitor, forming a parallel capacitor. When the MEMS chip 2 is connected to the ASIC chip 3, it is specifically connected to the ASIC chip 3 through the first DC pin 211 and the second DC pin 221. The ASIC chip 3 provides a DC voltage on the two plates. Under the action of external sound pressure, the sensitive diaphragm 21 vibrates and deforms, thereby causing the back plate 22 to generate a changing voltage signal. The ASIC chip 3 receives the differential pressure signal generated by the MEMS chip 2, processes the signal, amplifies it, and outputs it, thus detecting sound and realizing the function of a sound pressure sensor.
[0035] In the above embodiments of this application, a first AC pin 212 is also provided on the sensitive membrane 21, and a second AC pin 222 is also provided on the back electrode plate 22. The first AC pin 212 and the second AC pin 222 are used to be electrically connected to the external AC power supply 6. This is equivalent to adding a changing AC electric field on the sensitive membrane 21 and the back electrode plate 22. By changing the electric field force between the two electrodes, the sensitive membrane 21 is driven to vibrate back and forth. The vibration of the sensitive membrane 21 compresses the air to generate sound waves that radiate outward, thereby realizing the function of a speaker. Thus, a MEMS chip 2 can realize two applications: sensor and speaker functions. Thus, the packaged product 100 made of MEMS chip 2 can also realize two functions: sensor and speaker, thereby improving the functional variety of the packaged product 100.
[0036] Reference Figure 1 and Figure 3In some embodiments, the MEMS chip 2 includes a first side 201 and a second side 202 arranged adjacent to each other, a first DC pin 211 and a second DC pin 221 are disposed on the first side 201 of the MEMS chip 2, and a first AC pin 212 and a second AC pin 222 are disposed on the second side 202 of the MEMS chip 2.
[0037] It should be noted that although the sensitive film 21 and the back electrode plate 22 can be made in a square shape, they are generally circular. The first side 201 and the second side 202 here refer to the case where the outer contour of the substrate 23 is square or roughly square. The first side 201 and the second side 202 of the substrate 23 are equivalent to two adjacent sides of a rectangle. This design has two advantages: First, separating the DC pins (in this application, DC pins include the first DC pin 211 and the second DC pin 221) and the AC pins (in this application, AC pins include the first AC pin 212 and the second AC pin 222) allows them to be used for different components, reducing the possibility of incorrect wiring. Second, placing them on adjacent sides reduces the risk of excessive wiring in a localized area, leading to short circuits due to gold wire bridging.
[0038] Reference Figure 2 and Figure 3 In some embodiments, the MEMS chip 2 includes a first side 201 and a third side 203 disposed opposite to each other. A first DC pin 211 and a second DC pin 221 are disposed on the first side 201 of the MEMS chip 2, and a first AC pin 212 and a second AC pin 222 are disposed on the third side 203 of the MEMS chip 2. In this embodiment, the AC pins and DC pins are disposed on opposite sides, which further separates the DC pins and AC pins, reducing not only the risk of incorrect wiring but also the risk of short circuits caused by gold wires being too close together.
[0039] Reference Figure 4 or Figure 5 According to some embodiments of this application, this application provides a packaged product 100, including a substrate 4 and a housing 5 covering the substrate 4. The substrate 4 and the housing 5 surround and form a receiving cavity. An AC power module, an ASIC chip 3 and the aforementioned MEMS chip 2 are disposed on the substrate 4. The MEMS chip 2 and the ASIC chip 3 are both disposed in the receiving cavity. A first DC pin 211 and a second DC pin 221 are electrically connected to the ASIC chip 3. A first AC pin 212 and a second AC pin 222 are electrically connected to the AC power module.
[0040] The packaged product 100 integrates sensor and speaker functions, enabling two applications in a single package. The substrate 4 can be a printed circuit board (PCB) with pads on its surface and wiring layers electrically connected to the pads inside. A housing 5 covers the substrate 4, forming a cavity in which the MEMS chip 2 and ASIC chip 3 are housed. Specifically, the ASIC chip 3 has two third pads 31 electrically connected to the first DC pin 211 and the second DC pin 221, respectively. The ASIC chip 3 is also electrically connected to the substrate 4, for example, via gold wires. The MEMS chip 2 includes a substrate 23 and a sensitive film 21 and a back electrode plate 22 disposed on the substrate 23. Both the sensitive film 21 and the back electrode plate 22 are disposed on the substrate 23, arranged parallel and spaced apart, with a gap 24 between them. The sensitive film 21 and the back electrode plate 22 are equivalent to the two plates of a capacitor, forming a parallel capacitor. MEMS chip 2 is electrically connected to ASIC chip 3, specifically through the first DC pin 211 and the second DC pin 221. ASIC chip 3 provides DC voltage on two plates. Under external sound pressure, the sensitive diaphragm 21 vibrates and deforms, causing a changing voltage signal on the back plate 22. ASIC chip 3 receives the differential pressure signal generated by MEMS chip 2, processes the signal, amplifies it, and outputs it, thereby detecting sound and realizing the function of a sound pressure sensor.
[0041] In addition, a first AC pin 212 is provided on the sensitive membrane 21, and a second AC pin 222 is provided on the back electrode plate 22. The first AC pin 212 and the second AC pin 222 are used to electrically connect to the AC power module. This is equivalent to adding a changing AC electric field to the sensitive membrane 21 and the back electrode plate 22. By changing the electric field force between the two electrodes, the sensitive membrane 21 is driven to vibrate back and forth. The vibration of the sensitive membrane 21 compresses the air to generate sound waves, thereby realizing the function of a speaker. Thus, a single MEMS chip 2 can realize two applications: sensor and speaker functions. Therefore, the packaged product 100 made of MEMS chip 2 can also realize two functions: sensor and speaker, thus increasing the functional variety of the packaged product 100.
[0042] Reference Figure 4 or Figure 5 In some embodiments, the AC power module includes a power supply 6 and a pad assembly 7. The pad assembly 7 includes a first pad 71 and a second pad 72. The power supply 6 includes a positive terminal electrically connected to the first pad 71 and a negative terminal electrically connected to the second pad 72. The first pad 71 is electrically connected to a first AC pin 212, and the second pad 72 is electrically connected to a second AC pin 222.
[0043] The first pad 71 is electrically connected to the first AC pin 212, and the second pad 72 is electrically connected to the second AC pin 222. The first pad 71 and the second pad 72 can be designed close to the first AC pin 212 and the second AC pin 222, while the larger power supply 6 can be designed in the empty space of the substrate 4. The power supply 6 is electrically connected to the first pad 71 and the second pad 72 through the wiring layer inside the substrate 4. This helps to make full use of the empty space of the substrate 4 and reduce the size of the packaged product 100.
[0044] Reference Figure 4 In some embodiments, the pad assembly 7 and the ASIC chip 3 are respectively disposed on adjacent sides of the MEMS chip 2, the first DC pin 211 and the second DC pin 221 are disposed close to the ASIC chip 3, and the first AC pin 212 and the second AC pin 222 are disposed close to the pad assembly 7.
[0045] The adjacent two sides here can be the first side 201 and the second side 202 of the MEMS chip 2, respectively. Placing the ASIC chip 3 and the pad assembly 7 on the adjacent two sides of the MEMS chip 2 allows for a more compact arrangement of the three components on the substrate 4. Specifically, the substrate 4 can include mutually perpendicular length and width directions. The ASIC chip 3 and MEMS chip 2 can be arranged along the length direction, and the MEMS chip 2 and the smaller pad assembly 7 can be arranged along the width direction. This makes the overall structure of the packaged product 100 more compact, which helps to reduce the size of the packaged product 100. Placing the first DC pin 211 and the second DC pin 221 close to the ASIC chip 3, and the first AC pin 212 and the second AC pin 222 close to the pad assembly 7, facilitates their connection. For example, when connecting via gold wire, the required gold wire length can be reduced. Furthermore, separating the DC and AC pins for different components reduces the possibility of incorrect wiring; and placing them on different sides reduces the risk of excessive wiring in certain areas, leading to short circuits due to gold wire overlap.
[0046] Reference Figure 5 In some embodiments, the pad assembly 7 and the ASIC chip 3 are respectively disposed on opposite sides of the MEMS chip 2, the first DC pin 211 and the second DC pin 221 are disposed close to the ASIC chip 3, and the first AC pin 212 and the second AC pin 222 are disposed close to the pad assembly 7.
[0047] In this embodiment, the opposite sides can be the first side 201 and the third side 203 of the MEMS chip 2, respectively. The pad assembly 7, the MEMS chip 2, and the ASIC chip 3 are arranged in the same direction, specifically along the length of the substrate 4. This helps to reduce the width of the packaged product 100, which is suitable for packaged products 100 that require a small width. In addition, placing the AC pins and DC pins on opposite sides, and separating them further, not only reduces the risk of incorrect wiring, but also further reduces the risk of short circuits caused by gold wires being too close together.
[0048] Reference Figure 4 or Figure 5 In some embodiments, the first DC pin 211 and the second DC pin 221 are electrically connected to the ASIC chip 3 via the first gold wire 8, and the first AC pin 212 and the second AC pin 222 are electrically connected to the AC power module via the second gold wire 9. Specifically, the first DC pin 211 is connected to the ASIC chip 3 via the first gold wire 8, and the second DC pin 221 is connected to the ASIC chip 3 via another first gold wire 8. Similarly, the first AC pin 212 is connected to the AC power module via the second gold wire 9, and the second AC pin 222 is connected to the AC power module via another second gold wire 9. It should be noted that the first gold wire 8 and the second gold wire 9 are essentially both gold wires; they are used for easy differentiation in naming and serve the purpose of electrical connection. Using gold wire for connection is a simple and convenient manufacturing process.
[0049] Reference Figure 4 or Figure 5 In some embodiments, the AC power module includes a power supply 6 and a pad assembly 7 respectively disposed on the substrate 4. The pad assembly 7 includes a first pad 71 and a second pad 72 respectively connected to the power supply 6. A first AC pin 212 and a second AC pin 222 are disposed facing the substrate 4. The first AC pin 212 is connected to the first pad 71 through a first solder layer, and the second AC pin 222 is connected to the second pad 72 through a second solder layer.
[0050] This embodiment eliminates the first gold wire 8 between the pad assembly 7 and the first AC pin 212 and the second AC pin 222. Instead, the first pad 71 and the second pad 72 are positioned on the side of the MEMS chip 2 facing the substrate 4, and can be directly connected via a solder layer. It should be noted that both the first and second solder layers are formed of solder. The first AC pin 212 and the first pad 71 are directly soldered together, and the second AC pin 222 and the second pad 72 are also directly soldered together, eliminating the need for a gold wire and reducing manufacturing costs.
[0051] According to some embodiments of this application, this application provides an electronic device, which includes the above-described packaged product 100. The electronic device may be a smartphone, wristband, watch, iPad, or earphones, etc. Since the electronic device includes all the technical solutions of any embodiment of the above-described packaged product 100, it possesses at least all the beneficial effects brought by all the above-described technical solutions, which will not be elaborated upon here.
[0052] The above description is merely an optional embodiment of this application and does not limit the scope of protection of this application. Any equivalent structural transformations made based on the content of this application's specification and drawings under the concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of this application.
Claims
1. A MEMS chip, characterized in that, The device includes a substrate and a sensitive membrane and a back electrode plate respectively disposed on the substrate. The sensitive membrane and the back electrode plate are arranged parallel to each other with a gap between them. The sensitive membrane is provided with a first DC pin and a first AC pin, and the back electrode plate is provided with a second DC pin and a second AC pin. The first DC pin and the second DC pin are used to connect to an ASIC chip, and the first AC pin and the second AC pin are used to connect to an external AC power supply.
2. The MEMS chip according to claim 1, characterized in that, The MEMS chip includes a first side and a second side arranged adjacent to each other. The first DC pin and the second DC pin are disposed on the first side of the MEMS chip, and the first AC pin and the second AC pin are disposed on the second side of the MEMS chip.
3. The MEMS chip according to claim 1, characterized in that, The MEMS chip includes a first side and a third side disposed opposite to each other. The first DC pin and the second DC pin are disposed on the first side of the MEMS chip, and the first AC pin and the second AC pin are disposed on the third side of the MEMS chip.
4. A packaged product, characterized in that, The device includes a substrate and a housing covering the substrate. The substrate and the housing form a receiving cavity. An AC power module, an ASIC chip, and a MEMS chip as described in claim 1 are disposed on the substrate. The MEMS chip and the ASIC chip are both disposed within the receiving cavity. The first DC pin and the second DC pin are electrically connected to the ASIC chip. The first AC pin and the second AC pin are electrically connected to the AC power module.
5. The packaged product according to claim 4, characterized in that, The AC power module includes a power supply and a pad assembly. The pad assembly includes a first pad and a second pad. The power supply includes a positive terminal electrically connected to the first pad and a negative terminal electrically connected to the second pad. The first pad is electrically connected to the first AC pin, and the second pad is electrically connected to the second AC pin.
6. The packaged product according to claim 5, characterized in that, The pad assembly and the ASIC chip are respectively disposed on two adjacent sides of the MEMS chip, with the first DC pin and the second DC pin disposed close to the ASIC chip, and the first AC pin and the second AC pin disposed close to the pad assembly.
7. The packaged product according to claim 5, characterized in that, The pad assembly and the ASIC chip are respectively disposed on opposite sides of the MEMS chip, with the first DC pin and the second DC pin disposed close to the ASIC chip, and the first AC pin and the second AC pin disposed close to the pad assembly.
8. The packaged product according to claim 4, characterized in that, The first DC pin and the second DC pin are electrically connected to the ASIC chip via a first gold wire, and the first AC pin and the second AC pin are electrically connected to the AC power module via a second gold wire.
9. The packaged product according to claim 4, characterized in that, The AC power module includes a power supply and a pad assembly respectively disposed on the substrate. The pad assembly includes a first pad and a second pad respectively connected to the power supply. The first AC pin and the second AC pin are disposed facing the substrate. The first AC pin is connected to the first pad through a first solder layer, and the second AC pin is connected to the second pad through a second solder layer.
10. An electronic device, characterized in that, The electronic device includes the packaged product according to any one of claims 4 to 9.