A film deposition mold plate for a vacuum sputtering chamber

Abstract

The utility model discloses a kind of film-coated forming plates for vacuum sputtering chamber, including sputtering baffle, the sputtering baffle is located between sputtering target and the workpiece to be coated, sputtering baffle is equipped with the sputtering through-hole of sputtering particle, sputtering baffle adopts split structure, including the forming part with sputtering through-hole and the blocking part for blocking partical. The structure is designed by the split structure of sputtering baffle, and the thermal performance of sputtering baffle is optimized, so that sputtering baffle can more effectively disperse heat, especially keep the stability of forming part along longitudinal direction;Blocking part is equipped with several slits consistent with the longitudinal axis direction of sputtering baffle, and the slit design ensures the stability of forming part along transverse direction;The structure avoids that sputtering baffle appears thermal deformation or thermal damage in long time use process, thereby improve the uniformity and reliability of coating.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating technology, and in particular to a coating forming plate for a vacuum sputtering chamber. Background Technology

[0002] A sputtering target is installed in the vacuum sputtering chamber. Metal or metal compounds sputtered from the target are deposited on the substrate surface to form a film, thus completing the coating. Since the sputtering rate is a function of radius, on a fixed sputtering target, the sputtering rate varies at different radii. This results in thinner coatings at the edges when particles sputtered from different radii reach the substrate. To improve the coating uniformity caused by varying sputtering rates, existing technologies use baffles around the sputtering target to adjust the coating uniformity. The size, shape, and distribution of the sputtering through-holes on the baffles control the number and direction of particles passing through, thereby optimizing the uniformity of the coating thickness distribution and improving coating quality. However, existing baffles are made of solid stainless steel plates. This can lead to warping of the stainless steel plate due to heat during prolonged coating processes, resulting in a decrease in coating uniformity and overall quality. In extreme cases, severe deformation of the steel plate may even cause it to come into contact with moving parts within the vacuum sputtering chamber, causing direct mechanical collisions, leading to mechanical damage and safety hazards. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a coating forming plate for a vacuum sputtering chamber, and optimizes its thermal performance through the split structure design of the sputtering baffle.

[0004] The technical solution of this utility model is as follows: it includes a sputtering baffle, which is located between the sputtering target and the workpiece to be coated. The sputtering baffle is provided with sputtering through holes through which sputtering particles can pass. The sputtering baffle adopts a split structure, including a forming part with sputtering through holes and a blocking part for blocking particles.

[0005] Preferably, the blocking part is provided with a plurality of slits, and the extension direction of the plurality of slits is consistent with the longitudinal axis direction of the sputtering baffle.

[0006] Preferably, the blocking part includes an upper blocking part and a lower blocking part, and the forming part is sandwiched between the upper blocking part and the lower blocking part, and both the upper blocking part and the lower blocking part are provided with a plurality of slits.

[0007] Preferably, the molding part is a split structure, including a first side part and a second side part arranged laterally, and the sputtering through hole is formed by an upper baffle, a lower baffle, the first side part and the second side part.

[0008] Preferably, the sputtering through-hole is a trapezoidal hole, with the smaller end of the trapezoidal hole used for particles in the central region with a higher sputtering rate to pass through, and the larger end used for particles in the edge region with a lower sputtering rate to pass through.

[0009] Preferably, the forming part and the blocking part are assembled in a layered manner and present a clear hierarchical relationship in the vertical direction.

[0010] Preferably, the forming part is assembled higher than the blocking part in the vertical direction.

[0011] The beneficial technical effects of this utility model are: the coating forming plate for the vacuum sputtering chamber achieves uniformity, stability and reliability of the sputtering process and improves the quality and efficiency of coating by optimizing the split structure design of the sputtering baffle, the design of several slits in the blocking part, the layered assembly and position adjustment of the forming part, etc. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is an exploded schematic diagram of this utility model;

[0014] Wherein: 1. Sputter baffle; 11. Forming part; 111. First side part; 112. Second side part; 12. Blocking part; 121. Upper baffle part; 122. Lower baffle part; 2. Sputtering through hole; 3. Slit. Detailed Implementation

[0015] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0016] like Figure 1 and Figure 2 As shown, the present invention provides a coating forming plate for a vacuum sputtering chamber, including a sputtering baffle 1. The sputtering baffle 1 is located between the sputtering target and the workpiece to be coated. The sputtering baffle 1 is provided with sputtering through holes 2 through which sputtering particles can pass. During the vacuum coating process, the size, shape and distribution of the sputtering through holes 2 are used to control the number and direction of particles passing through the sputtering baffle 1, thereby optimizing the uniformity of the coating thickness distribution and improving the coating quality.

[0017] In this embodiment, the sputtering baffle 1 is made of stainless steel. During the long-term coating process, uneven thermal expansion of the stainless steel plate can cause internal stress. When the stress exceeds the yield strength of the stainless steel plate, the plate deforms and warps, thereby reducing the uniformity and overall quality of the coating. To reduce the stress and warping caused by heat, the sputtering baffle 1 is provided with slits 3. These slits 3 provide space for the sputtering baffle 1 to expand when it undergoes thermal expansion.

[0018] Furthermore, the sputtering baffle 1 is assembled and includes a forming part 11 with sputtering through holes 2 and a blocking part 12 with several slits 3. When the sputtering baffle 1 is heated, the forming part 11 and the blocking part 12 each have their own independent thermal expansion space, thereby reducing the deformation caused by the restriction of thermal expansion.

[0019] Furthermore, the molding part 11 and the blocking part 12 are assembled in a layered manner and present a clear hierarchical relationship in the vertical direction. In this embodiment, the molding part 11 is assembled at a position slightly higher than the blocking part 12 in the vertical direction. Through the layered connection between the molding part 11 and the blocking part 12, stress can be transferred and dispersed between different layers.

[0020] Furthermore, the blocking part 12 includes an upper blocking part 121 and a lower blocking part 122, and the forming part 11 is sandwiched between the upper blocking part 121 and the lower blocking part 122. Both the upper blocking part 121 and the lower blocking part 122 are provided with a plurality of slits 3.

[0021] In this embodiment, the extension direction of the plurality of slits 3 is consistent with the longitudinal axis direction of the sputtering baffle 1, so as to effectively cut off the stress transmission path in the lateral direction of the upper baffle 121 and the lower baffle 122, thereby reducing the lateral deformation of the upper baffle 121 and the lower baffle 122, and thus maintaining the stability of the forming part 11 in the lateral direction. At the same time, the longitudinal mating gaps at the joints between the forming part 11 and the upper baffle 121 and the lower baffle 122 respectively also maintain the stability of the forming part 11 in the longitudinal direction.

[0022] Furthermore, the molding part 11 also adopts a split structure design, including a first side part 111 and a second side part 112 arranged laterally, and the sputtering through hole 2 is formed by the upper stop part 121, the lower stop part 122, the first side part 111 and the second side part 112.

[0023] Since the sputtering rate is a function of the radius, on a fixed sputtering target, the sputtering rate varies at different radii. This results in particles sputtered from different radii reaching the substrate with excessively thin coatings in the edge regions. To improve the coating uniformity caused by varying sputtering rates, in this embodiment, the sputtering via 2 is a trapezoidal hole. The smaller end of the trapezoidal hole is used for particles from the central region with a higher sputtering rate, while the larger end is used for particles from the edge region with a lower sputtering rate. This ensures a more uniform particle flux when particles sputtered from different radii reach the substrate after passing through the trapezoidal hole, thereby improving the coating uniformity on the substrate surface.

[0024] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A coating forming plate for a vacuum sputtering chamber, characterized in that: It includes a sputtering baffle (1), which is located between the sputtering target and the workpiece to be coated. The sputtering baffle (1) is provided with a sputtering through hole (2) through which sputtering particles can pass. The sputtering baffle (1) adopts a split structure, including a forming part (11) with a sputtering through hole (2) and a blocking part (12) for blocking particles.

2. The coating forming plate for a vacuum sputtering chamber according to claim 1, characterized in that: The blocking part (12) is provided with a plurality of slits (3), and the extension direction of the plurality of slits (3) is consistent with the longitudinal axis direction of the sputtering baffle (1).

3. The coating forming plate for a vacuum sputtering chamber according to claim 1, characterized in that: The blocking part (12) includes an upper blocking part (121) and a lower blocking part (122), and the forming part (11) is sandwiched between the upper blocking part (121) and the lower blocking part (122). Both the upper blocking part (121) and the lower blocking part (122) are provided with a number of slits (3).

4. A coating forming plate for a vacuum sputtering chamber according to claim 1, characterized in that: The forming part (11) is a split structure, including a first side part (111) and a second side part (112) arranged laterally. The sputtering through hole (2) is formed by the upper baffle (121), the lower baffle (122), the first side part (111) and the second side part (112).

5. A coating forming plate for a vacuum sputtering chamber according to claim 1, characterized in that: The sputtering through-hole (2) is a trapezoidal hole. The smaller end of the trapezoidal hole is used to allow particles in the central region with a higher sputtering rate to pass through, while the larger end is used to allow particles in the edge region with a lower sputtering rate to pass through.

6. A coating forming plate for a vacuum sputtering chamber according to claim 1, characterized in that: The forming part (11) and the blocking part (12) are assembled in a layered manner and present a clear hierarchical relationship in the vertical direction.

7. A coating forming plate for a vacuum sputtering chamber according to claim 6, characterized in that: The forming part (11) is assembled above the blocking part (12) in the vertical direction.

Images