Sputtering protection assembly and magnetron sputtering coating cathode device

By designing sputtering protection components to constrain plasma trajectory and control the sputtering direction of energy particles, the problem of uneven plasma distribution in magnetron sputtering was solved, improving film quality and conductivity, and increasing the product yield of heterojunction solar cells.

CN224494305UActive Publication Date: 2026-07-14SUZHOU MAXWELL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU MAXWELL TECH CO LTD
Filing Date
2025-06-23
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

In the production of heterojunction solar cells using traditional magnetron sputtering, the plasma distribution at the edge of the sputtering zone is uneven and the density is low, resulting in poor film quality and affecting the uniformity and conductivity of the TCO film.

Method used

Design a sputtering protection component, including a first protective plate and a second protective plate, with an arc-shaped part and a support part jointly surrounding the target material to form an arc-shaped opening and a semi-enclosed chamber, constraining the plasma trajectory and controlling the sputtering direction of energy particles through the arc-shaped opening.

Benefits of technology

It improves plasma density and film uniformity, enhances the photoelectric conversion efficiency of the substrate, and improves product yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to the field of magnetron sputtering coating technology, and more particularly to a sputtering protection component and a magnetron sputtering coating cathode device. The sputtering protection component includes a first protective plate and a second protective plate. The first protective plate includes a first arc-shaped portion and a first supporting portion connected to each other, and the second protective plate includes a second arc-shaped portion and a second supporting portion connected to each other, with the first and second arc-shaped portions facing each other, and the first and second supporting portions facing each other. At least a portion of the first arc-shaped portion and at least a portion of the second arc-shaped portion together surround the periphery of the target material; an arc-shaped opening is formed between the first and second arc-shaped portions, communicating with a semi-enclosed chamber, so that energy particles generated by the target material can be sputtered onto the substrate. This sputtering protection component can effectively improve film quality, improve film uniformity and conductivity, improve the photoelectric conversion efficiency of the substrate, and improve the substrate yield.
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