Physical vapor deposition apparatus and magnetron adjustment mechanism thereof

Abstract

The utility model relates to physical vapor deposition equipment and magnetron adjusting mechanism thereof, include: mounting seat, its fixed eccentric part and rotation axis are rotationally connected with rotation axis with rotation axis, magnetron can rotate around rotation axis and change its relative position between mounting seat, revolution axis is fixedly connected with mounting seat and can be driven rotation, mounting seat and magnetron can rotate with revolution axis synchronously, towrope is connected with magnetron, can tow magnetron rotates around rotation axis, makes magnetron close or far from target material center area, elastic reset piece is connected between magnetron and mounting seat, is used for providing elastic reset force opposite with towrope tension direction after magnetron deviates initial position. The utility model can realize the continuous adjustable position of magnetron to satisfy the demand of etching process and film deposition process, and the mechanical structure is simple, and maintenance is convenient.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment, specifically to a physical vapor deposition device and its magnetron adjustment mechanism. Background Technology

[0002] In physical vapor deposition (PVD) processes, the fabrication of the metal barrier layer is a crucial step. This process typically includes deposition and etching. In deposition, to achieve uniform thin film deposition, the magnetron needs to rotate in an outer annular region away from the target center. In etching, to achieve the desired etching effect, the magnetron needs to rotate in an inner annular region closer to the target center. Therefore, the ability of the magnetron assembly to switch positions while rotating is key to achieving a high-quality metal barrier layer.

[0003] However, existing magnetron assemblies have certain limitations in their position switching methods. For example, they employ complex mechanical structures, making the switching process complicated, maintenance difficult, and resulting in poor process stability.

[0004] Therefore, it is necessary to develop a new type of magnetron assembly that can switch the magnetron position more efficiently, accurately, and stably while rotating. Utility Model Content

[0005] Based on this need, this utility model proposes a physical vapor deposition device and its magnetron adjustment mechanism to address the shortcomings of existing technologies.

[0006] The magnetron adjustment mechanism is used to adjust the position of the magnetron, including:

[0007] The mounting base has a fixed rotating shaft, and the eccentric part of the magnetron is rotatably connected to the rotating shaft. The magnetron can rotate around the rotating shaft to change its relative position with the mounting base.

[0008] A revolution axis is fixedly connected to the mounting base and can be driven to rotate, and the mounting base and the magnetron can rotate synchronously with the revolution axis;

[0009] A traction rope, which is connected to the magnetron, is able to pull the magnetron to rotate around the rotation axis, so that the magnetron moves closer to or away from the center of the target.

[0010] An elastic reset element, connected between the magnetron and the mounting base, is used to provide an elastic reset force opposite to the direction of the traction rope tension after the magnetron deviates from its initial position.

[0011] Optionally, the magnetron adjustment mechanism further includes a rotary motor located at the top of the revolution axis and fixedly connected to the revolution axis, for providing driving force for the rotation of the revolution axis.

[0012] Optionally, the magnetron adjustment mechanism further includes: a lifting motor and a lifting rotation shaft;

[0013] The top end of the lifting and rotating shaft is connected to the lifting motor via a bearing, the bottom end is connected to the traction rope, and it is axially movable to the revolution shaft; the lifting and rotating shaft is driven by the lifting motor to move up and down, and rotates synchronously with the revolution shaft.

[0014] Optionally, the magnetron adjustment mechanism further includes a guide wheel assembly located below the revolution axis and between the magnetron. The end of the traction rope not connected to the lifting and rotating shaft extends downward in a vertical direction and is changed to a horizontal direction by the guide wheel assembly before being fixedly connected to the position of the magnetron not connected to the rotation axis.

[0015] Optionally, the traction rope passes through the axis of the revolution axis.

[0016] Optionally, the bottom end of the lifting and rotating shaft extends into the interior of the revolution shaft and is axially movable to the inner surface of the revolution shaft.

[0017] Optionally, the outer surface of the bottom end of the lifting and rotating shaft is connected to the inner surface of the revolution shaft by a sealing ring.

[0018] Optionally, the outer surface of the bottom end of the lifting and rotating shaft is engaged with the inner surface of the revolution shaft.

[0019] Optionally, the mounting base is an elliptical plate, the revolution axis is located on the upper side of the mounting base and close to the center of the target, and the magnetron is located on the lower side of the mounting base and away from the center of the target.

[0020] Optionally, the magnetron adjustment mechanism further includes a connecting component, wherein the magnetron is fixedly connected to the connecting component, and the connecting component is provided with a mounting hole, the mounting hole being rotatably connected to the rotation shaft.

[0021] Optionally, the projection of the mounting hole is located at the off-center portion of the magnetron.

[0022] Optionally, the magnetron adjustment mechanism further includes a control unit, which is signal-connected to both the rotary motor and the lifting motor, for controlling the start and stop of the rotary motor and / or the lifting motor.

[0023] In addition, this utility model also provides a physical vapor deposition apparatus, comprising:

[0024] cavity;

[0025] The target material placed inside the cavity;

[0026] The magnetron adjustment mechanism is disposed in the cavity and located above the target material;

[0027] The magnetron can be pulled by a traction rope to rotate around its own axis, thereby moving the magnetron closer to or further away from the central region of the target material.

[0028] Optionally, the physical vapor deposition apparatus also includes:

[0029] An auxiliary magnetron is fixedly connected to the mounting base of the magnetron adjustment mechanism and is located on opposite sides of the revolution axis.

[0030] This utility model has the following beneficial effects:

[0031] By adjusting the magnetron position via a traction rope, the device achieves continuous adjustability. This design not only meets the diverse needs of etching and thin film deposition processes but also significantly improves equipment performance and ease of operation. For example, in etching processes, the magnetron can be precisely positioned to a specific area of ​​the target material, achieving high-precision etching results. Furthermore, during thin film deposition, continuous adjustment of the magnetron position ensures the uniformity of the sputtering area, thereby improving the quality and consistency of the thin film.

[0032] Traditional magnetron position adjustment methods typically rely on complex mechanical structures, such as crank-connecting rod mechanisms and multi-axis transmission systems. These structures not only increase the size and weight of the equipment but also raise the risk of mechanical failure. This invention employs a traction rope adjustment method, achieving precise movement of the magnetron through simple rope traction, significantly simplifying the mechanical structure. This design reduces the number and complexity of mechanical parts, lowering manufacturing costs and maintenance difficulty. Simultaneously, the simplified mechanical structure reduces the probability of failure due to mechanical wear, extending the equipment's lifespan and reducing maintenance costs.

[0033] Another significant advantage of the traction rope adjustment method is its ease of operation. Compared to complex mechanical transmission systems, traction rope adjustment can be achieved through a simple electric control device. By eliminating complex mechanical transmission components, the device structure of this invention is more compact and occupies less space. Attached Figure Description

[0034] Figure 1 This is a cross-sectional schematic diagram of a magnetron adjustment mechanism according to an embodiment of the present invention;

[0035] Figure 2 This is a perspective view of a magnetron adjustment mechanism according to an embodiment of the present invention;

[0036] Figure 3 This is a bottom view of the magnetron adjustment mechanism according to an embodiment of the present invention;

[0037] Figure 4 This is a schematic diagram showing the connection between the traction rope and the lifting and rotating shaft in one embodiment of the present invention. Detailed Implementation

[0038] The physical vapor deposition apparatus and its magnetron adjustment mechanism proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Magnetron sputtering is a physical vapor deposition process in which a magnetron generates a strong magnetic field, confining electrons near the target surface and prolonging the collision time between electrons and working gas (such as argon) molecules. This results in more gas molecules being ionized, significantly increasing plasma density. High-density plasma generates more sputtered ions, thus improving sputtering efficiency. A fixed magnetron often cannot achieve uniform sputtering of the target. Therefore, it is necessary to control the magnetron to rotate around the target center to control the sputtering area and improve target utilization. Different processes have different sputtering requirements for the target. For example, in etching processes, the magnetron needs to be close to the target center to improve etching efficiency; in thin film deposition processes, the magnetron needs to be kept away from the target center to meet the high-quality requirements of thin film deposition.

[0040] To meet the position switching requirements of the magnetron, this invention proposes a magnetron adjustment mechanism. This mechanism can be used in a rotating magnetron system to continuously adjust the radial distance between the magnetron and the target center. Furthermore, the adjustment mechanism has a simple mechanical structure and is easy to maintain. Please refer to [link / reference]. Figures 1 to 3 The adjustment mechanism includes a mounting base 102 and a revolution shaft 104. The mounting base 102 may be elliptical and is fixedly connected to the revolution shaft 104. The mounting base 102 is used to mount the magnetron 106, and the revolution shaft 104 is used to provide rotational power. The revolution shaft 104 can be coaxially arranged with the target material. When the revolution shaft 104 rotates, it can drive the mounting base 102 and the magnetron 106 to rotate synchronously, generating a magnetic field around the target material to confine electron movement, thereby enhancing the plasma concentration in that region and achieving the purpose of ion sputtering.

[0041] To achieve adjustable magnetic field position and intensity, a traction rope 108 is used to connect the magnetron 106, guiding its movement by pulling. Specifically, a rotation shaft 110 is provided on the mounting base 102, and the magnetron 106 is rotatably connected to the rotation shaft 110. One end of the traction rope 108 is connected to the magnetron 106, with a certain distance between its connection point and the rotation shaft 110. The other end of the traction rope 108 can be tensioned, causing the magnetron 106 to rotate around the rotation shaft 110. The traction rope 108 can be selected as a steel wire rope. The magnetron 106 is a non-centrosymmetric shape, with its eccentric position rotatably connected to the rotation shaft 110. During the rotation of the non-centrosymmetric shape around the eccentric position (rotation shaft 110), its attitude is adjusted, thereby adjusting its central position. This allows for a change in the radial distance between the center of the magnetron 106 and the center of the target (i.e., the axis of the revolution axis 104), thereby adjusting the magnetic field distribution of the magnetron 106 near the target. In some embodiments, the revolution axis 104 is located on the central axis of the target, and the magnetron 106 is located away from the center of the target, at the edge of the mounting base 102. When the magnetron 106 rotates about the rotation axis 110, it can switch the distance between the center of the magnetron 106 and the axis of the revolution axis 104 between a first distance and a second distance. For example, in an etching process, the magnetron 106 is pulled to the first distance closest to the axis of the revolution axis 104, and in a thin film deposition process, the magnetron 106 is controlled at the second distance farthest from the axis of the revolution axis.

[0042] Furthermore, the rotation axis 110 and the revolution axis 104 are separated by a certain distance. In some embodiments, the revolution axis 104 is located near one of the foci of the elliptical mounting base 102, while the rotation axis 110 is located near the other foci of the elliptical mounting base 102. To simplify the mechanical structure, the magnetron 106 is located below the mounting base 102, and the revolution axis 104 extends upwards from the mounting base 102. When the magnetron 106 rotates around the rotation axis 110, it avoids interference with the revolution axis 104, thereby achieving adjustable position of the magnetron 106 within a limited space.

[0043] In this text, the magnetron 106 can revolve around the revolution axis 104 following the mounting base 102, and can rotate around the rotation axis 110 to change its relative position with the mounting base 102, thereby adjusting the radial distance between it and the target center. Furthermore, to facilitate the repositioning of the magnetron 106, an elastic repositioning element (not shown in the figure) is connected between the magnetron 106 and the mounting base 102. This element can be a torsion spring, with one end connected to the mounting base 102 and the other end connected to the magnetron 106. It provides an elastic repositioning force opposite to the tension of the traction rope 108 after the magnetron 106 deviates from its initial position. Additionally, the elastic repositioning element, together with the traction rope 108, provides the centripetal force when the magnetron 106 revolves.

[0044] In some embodiments, the revolution shaft 104 may be fixedly connected to a rotary motor 112, which is located at the top of the revolution shaft 104. The drive end of the rotary motor 112 is poweredly connected to the revolution shaft 104 to provide the driving force for the rotation of the revolution shaft 104. Additionally, the adjustment mechanism includes a lifting motor 114 and a lifting rotating shaft 116. The top end of the lifting rotating shaft 116 is connected to the lifting motor 112 via a bearing, the bottom end is connected to the traction rope 108, and it is axially movably connected to the revolution shaft 104. The lifting rotating shaft 116 is driven by the lifting motor 112 to move up and down, and rotates synchronously with the revolution shaft 104. During the rotation with the revolution shaft 104, the lifting motor 112 remains stationary. The bottom end of the lifting rotating shaft 116 extends into the interior of the revolution shaft 104 and is axially movably connected to the inner surface of the revolution shaft 104.

[0045] In some embodiments, the outer surface of the bottom end of the lifting and rotating shaft 116 and the inner surface of the revolution shaft 104 can be connected by a sealing ring 120. This sealing ring 120 can form a seal in the circumferential direction and allows for axial relative sliding with the outer surface of the lifting and rotating shaft 116, while remaining relatively stationary with respect to the lifting and rotating shaft 116 in the rotational direction. Alternatively, the outer surface of the bottom end of the lifting and rotating shaft 116 can be engaged with the inner surface of the revolution shaft 104. For example, a slot-and-boss engagement structure can be provided between the outer surface of the lifting and rotating shaft 116 and the inner surface of the revolution shaft 104. The slot and bosom can slide axially but remain relatively stationary in the rotational direction.

[0046] In some embodiments, the adjustment mechanism further includes a guide wheel assembly 118, located below the revolution axis 104 and between the magnetron 106. This assembly may consist of two guide wheels with mutually perpendicular rotation axes, including a horizontal guide wheel rotating about a horizontal axis and a vertical guide wheel rotating about a vertical axis. The end of the traction rope 108 not connected to the lifting rotation axis 116 extends downwards in a vertical direction, successively passing over the horizontal guide wheel and the vertical guide wheel. Then, the traction rope 108 becomes horizontal and is fixedly connected to the magnetron 106.

[0047] In some embodiments, the traction rope 108 is movably connected to the lifting and rotating shaft 116. Further, the traction rope 108 passes through the axis of the revolution shaft 104. Figure 4 As shown, a rotatable slider 111 is provided inside the bottom end of the lifting and rotating shaft 116, and the slider 111 is fixedly connected to the traction rope 108. A ball bearing 113 for reducing rotational friction is also provided between the slider 111 and the inner wall of the lifting and rotating shaft 116, and the slider 111 and the lifting and rotating shaft 116 are axially fixed. In other embodiments, the traction rope 108 may also be fixedly connected to the lifting and rotating shaft 116. The revolution shaft 104 can reciprocate, and within its limited rotation range, the traction rope 108 can withstand the corresponding torque. In this document, only some examples are given for illustration; the specific connection method between the traction rope 108 and the lifting and rotating shaft 116 is not limited. In some examples, the traction rope 108 may not pass through the axis of the revolution shaft 104, provided that the traction rope 108 can move vertically and can rotate relatively in the circumferential direction to release the torque of the traction rope 108.

[0048] As an optional example, the adjustment mechanism further includes a connecting component 122 for connecting the magnetron 106 and the mounting base 102. The connecting component 122 and the mounting base 102 are connected by screws, and the connecting component 122 is provided with a mounting hole for connecting the rotation shaft 110. The projection of the mounting hole is located at the eccentric part of the magnetron 106. The connecting component 122 can prevent damage to the overall structure of the magnetron 106 and can extend the distance between the rotation shaft 110 and the center position of the magnetron 106, thereby allowing for more effective control of the distance between the magnetron 106 and the center of the target material when the magnetron 106 rotates around the rotation shaft 110.

[0049] As an optional example, the adjustment mechanism further includes a control unit, which is signal-connected to both the rotary motor 112 and the lifting motor 114, for controlling the start and stop of the rotary motor 112 and / or the lifting motor 114.

[0050] In addition, this utility model also provides a physical vapor deposition apparatus, including: a cavity; a target material disposed in the cavity; and a magnetron adjustment mechanism disposed in the cavity and above the target material; wherein the magnetron 106 can be pulled by a traction rope 108 to rotate around a rotation axis 110, thereby allowing the magnetron 106 to move closer to or away from the central region of the target material.

[0051] Optionally, the physical vapor deposition apparatus further includes an auxiliary magnetron 124, which is fixedly connected to the mounting base 102 of the magnetron adjustment mechanism and is located on opposite sides of the revolution axis 104, respectively, as the magnetron 106. This auxiliary magnetron 124 is used to compensate for insufficient magnetic field generated by the magnetron 106. The auxiliary magnetron 124 is located away from the central region of the target material.

[0052] In summary, this invention enables continuous adjustment of the magnetron position, thereby meeting the requirements of etching and thin film deposition processes; furthermore, the adjustment method using a traction rope reduces mechanical complexity and thus lowers maintenance difficulty.

[0053] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A magnetron adjustment mechanism for adjusting the position of a magnetron, characterized in that, include: The mounting base has a fixed rotating shaft, and the eccentric part of the magnetron is rotatably connected to the rotating shaft. The magnetron can rotate around the rotating shaft to change its relative position with the mounting base. A revolution axis is fixedly connected to the mounting base and can be driven to rotate, and the mounting base and the magnetron can rotate synchronously with the revolution axis; A traction rope, which is connected to the magnetron, is able to pull the magnetron to rotate around the rotation axis, so that the magnetron moves closer to or away from the center of the target. An elastic reset element, connected between the magnetron and the mounting base, is used to provide an elastic reset force opposite to the direction of the traction rope tension after the magnetron deviates from its initial position.

2. The magnetron adjustment mechanism as described in claim 1, characterized in that, Also includes: A rotary motor, located at the top of the revolution shaft and fixedly connected to the revolution shaft, is used to provide the driving force for the rotation of the revolution shaft.

3. The magnetron adjustment mechanism as described in claim 2, characterized in that, Also includes: Lifting motor and lifting rotating shaft; The top end of the lifting and rotating shaft is connected to the lifting motor via a bearing, the bottom end is connected to the traction rope, and it is axially movable to the revolution shaft; the lifting and rotating shaft is driven by the lifting motor to move up and down, and rotates synchronously with the revolution shaft.

4. The magnetron adjustment mechanism as described in claim 3, characterized in that, It also includes a guide wheel assembly, which is located below the revolution axis and between the magnetron. The end of the traction rope that is not connected to the lifting and rotating shaft extends downward in a vertical direction, and after being changed to a horizontal direction by the guide wheel assembly, it is fixedly connected to the position of the magnetron that is not connected to the rotation axis.

5. The magnetron adjustment mechanism as described in claim 3, characterized in that, The traction rope passes through the axis of the revolution shaft.

6. The magnetron adjustment mechanism as described in claim 3, characterized in that, The bottom end of the lifting and rotating shaft extends into the interior of the revolution shaft and is axially movable to the inner surface of the revolution shaft.

7. The magnetron adjustment mechanism as described in claim 6, characterized in that, The outer surface of the bottom end of the lifting and rotating shaft is connected to the inner surface of the revolution shaft by a sealing ring.

8. The magnetron adjustment mechanism as described in claim 6, characterized in that, The outer surface of the bottom end of the lifting and rotating shaft is engaged with the inner surface of the revolution shaft.

9. The magnetron adjustment mechanism as described in claim 1, characterized in that, The mounting base is an elliptical plate, the revolution axis is located on the upper side of the mounting base and close to the center of the target material, and the magnetron is located on the lower side of the mounting base and away from the center of the target material.

10. The magnetron adjustment mechanism as described in claim 1, characterized in that, Also includes: A connecting component is provided, wherein the magnetron is fixedly connected to the connecting component, and the connecting component is provided with a mounting hole, which is rotatably connected to the rotation shaft.

11. The magnetron adjustment mechanism as described in claim 10, characterized in that, The projection of the mounting hole is located at the off-center part of the magnetron.

12. The magnetron adjustment mechanism as described in claim 3, characterized in that, Also includes: The control unit is signal-connected to both the rotary motor and the lifting motor, and is used to control the start and stop of the rotary motor and / or the lifting motor.

13. A physical vapor deposition apparatus, characterized in that, include: cavity; The target material placed inside the cavity; The magnetron adjustment mechanism as described in any one of claims 1 to 12 is disposed in the cavity and located above the target material; The magnetron can be pulled by a traction rope to rotate around its own axis, thereby moving the magnetron closer to or further away from the central region of the target material.

14. The physical vapor deposition apparatus as described in claim 13, characterized in that, Also includes: An auxiliary magnetron is fixedly connected to the mounting base of the magnetron adjustment mechanism and is located on opposite sides of the revolution axis.

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