Substrate support frame and carrier plate for preventing white edge plating
By optimizing the receiving groove and step structure of the support frame, the problem of white edge plating caused by the gap between the support frame and the substrate was solved, which improved the yield rate and battery efficiency of the back contact battery coating.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GOLD STONE (FUJIAN) ENERGY CO LTD
- Filing Date
- 2025-08-05
- Publication Date
- 2026-07-14
AI Technical Summary
The existing support frame design makes it easy to produce white edges around the coating during the coating process, especially in the coating of back contact batteries, which affects the battery conversion efficiency and yield.
The design of the support frame's receiving groove is optimized to reduce the single-sided fault rate to 0.25mm-0.35mm. Horizontally set support steps are adopted and the rounded corners are eliminated. The width of the support steps is 0.8mm-6mm, which increases the contact area between the steps and the substrate and reduces gaps.
It effectively reduces white edges from the coating, improves the yield of back contact battery coating, ensures uniform contact around the substrate, prevents special gases from entering, and reduces the formation of white edges.
Smart Images
Figure CN224494313U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coated support frames, and in particular to a substrate support frame and its carrier plate for preventing white edges from being coated. Background Technology
[0002] The development of high-efficiency solar cells is rapid, with various high-efficiency cell technologies emerging. Back-contact cells currently represent the highest-efficiency solar cell technology available for mass production. In back-contact cells, all electrodes are located on the back side, with the P and N electrodes arranged alternately on the back of the cell. There are no electrodes on the front side, thus eliminating optical losses caused by metal electrode grid lines. This effectively increases the short-circuit current of the cell, significantly improving conversion efficiency. In the coating process for back-contact cells, a support frame is used as a carrier, and various film layers are deposited in the coating equipment.
[0003] In existing support frame designs, to overcome the accuracy issues of automated film loading equipment, the size of the support frame's receiving slot is designed to be larger than the substrate size. This is referred to in the industry as the tolerance rate. The tolerance rate is the difference between the maximum length and width dimensions of the support frame's receiving slot (100) and the length and width dimensions of the substrate. For example... Figure 5 , Figure 6 As shown, the current market standard for support frames typically has a single-sided tolerance of 0.4mm to 0.65mm. The wafer placement step 101 of the receiving slot 100 has a ramp angle of 5.7° to 6.8°, and the four corners of the support frame that contact the silicon wafer are rounded with notches 102. The step depth is 1-1.4mm. Due to the high tolerance of the existing design, gaps are likely to occur between the edge of the support frame and the substrate during coating. Simultaneously, the angle of the wafer placement step causes the substrate and the ramp of the support frame to form a line contact, which can easily lead to gaps. The rounded corners of the support frame effectively increase the gaps between the four corners and the substrate. These factors significantly increase the gaps between the support frame and the substrate. The presence of these gaps can easily lead to circumferential coating. While circumferential coating does not affect the general double-sided coating process, it can cause white edges on the circumferential coating when the coating on the front and back sides of the back-contact battery is inconsistent.
[0004] In the photovoltaic cell coating industry, "white edge" refers to a white mark formed at the corners and edges of the coating support frame when the substrate (surface A) is coated inside the process chamber. This is caused by process gases passing through the gaps between the substrate and the support frame, creating a white mark.
[0005] The appearance of white edges can affect battery conversion efficiency and even damage the battery. During the manufacturing process, white edges are classified into three categories based on severity: severe, minor, and very minor. The definitions of these three categories are explained below:
[0006] Severity: Visible white edges, with a size >200μm, affecting subsequent coating processes and the efficiency of the final battery. Defective product, unusable.
[0007] Slight severity: The white color is barely visible to the naked eye and requires careful inspection. The white edge size is <200μm. It does not affect subsequent coating processes or the final battery efficiency. Qualified product, usable normally.
[0008] Slight severity: The white edge is not visible to the naked eye, but a faint mark can be seen under a microscope. It does not affect subsequent coating processes or the efficiency of the final battery. Qualified product, ready for normal use.
[0009] Therefore, severe white edges around the coating significantly affect the yield of the back contact battery coating, and it is necessary to improve the support frame structure to solve this problem and improve product quality. Utility Model Content
[0010] The purpose of this utility model is to provide a substrate support frame and its carrier plate that prevents white edges from being coated, so as to solve the problem that the existing support frame produces serious white edges when the back contacts the battery film layer, resulting in product defects.
[0011] To achieve the above objectives, the present invention adopts the following technical solution:
[0012] This utility model discloses a substrate support frame for preventing white edge coating, which includes a support frame body. The support frame body is provided with a plurality of receiving grooves for placing substrates. The single-sided fault tolerance of the receiving groove is 0.25mm-0.35mm. The receiving groove is provided with a support step. The support step is horizontally set and the four corners of the support step are right angles. The width of the support step is 0.8mm-6mm.
[0013] Furthermore, the portion of the receiving groove, except for the supporting steps, is hollowed out.
[0014] Furthermore, the single-sided tolerance of the receiving groove is 0.25mm-0.35mm.
[0015] Furthermore, when the support frame is used as a PVD carrier, the width of the support step is 0.8mm-2mm; when it is used as a CVD carrier, the width of the support step is 2mm-8mm.
[0016] Furthermore, the distance between the upper surface of the supporting step and the upper surface of the supporting frame body is 1.5mm-2mm.
[0017] This utility model also discloses a carrier plate for preventing white edges from being coated, which includes a carrier plate frame and a plurality of sub-carrier plates disposed on the carrier plate frame, wherein the sub-carrier plates are the aforementioned substrate support frame.
[0018] The advantages of this utility model are:
[0019] 1. This utility model sets the single-sided tolerance of the support frame receiving groove from 0.4mm-0.65mm to 0.25mm-0.55mm, and the width of the support step to 0.8mm-6mm. This ensures that when the substrate is placed in the receiving groove, regardless of whether it is placed in the center, the substrate remains in contact with the support step around all four sides without gaps. Secondly, the reduced tolerance decreases the space between the substrate and the receiving groove, thereby reducing the accumulation of special gases around the substrate and preventing special gases from entering the other side of the substrate from the contact point between the substrate and the support step, thus reducing the risk of white edges around the plating. Simultaneously, the accuracy of existing automated wafer loading equipment is constantly improving, and a single-sided tolerance of 0.25mm-0.55mm fully meets the requirements for stable operation of current equipment.
[0020] 2. This utility model replaces the existing sloping support steps with horizontally arranged support steps, changing the contact from line to surface, thus reducing the generation of gaps. With the support steps horizontally arranged, due to the existence of a tolerance, there is clearance between the four corners of the substrate and the perimeter of the receiving groove. Therefore, the four corners of the support steps are right angles, eliminating the need for rounded corners and preventing gaps between the four corners and the substrate. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a front view of this embodiment.
[0023] Figure 2 yes Figure 1 Enlarged 3D view of the cross-section at the top left corner.
[0024] Figure 3 This is a front view of the support steps after they have been widened, as shown in Comparative Example 2.
[0025] Figure 4 yes Figure 3 Enlarged 3D view of the cross-section at the top left corner.
[0026] Figure 5 This is a frontal view of existing technology.
[0027] Figure 6 yes Figure 5 Enlarged 3D view of the cross-section at the top left corner.
[0028] Explanation of key component symbols:
[0029] 1. Main support frame;
[0030] 2. Receiving tank;
[0031] 3. Support steps. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0033] In this utility model, unless otherwise stated, directional terms such as "up," "down," "left," and "right" are generally understood in conjunction with the accompanying drawings and the directions shown in actual applications.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0035] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0036] The endpoints and any values of the ranges disclosed herein are not limited to the precise ranges or values, and should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of the various ranges, the endpoint values of the various ranges and individual point values, and individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein. The terms "optional" and "discretionary" mean that they may or may not be included (or may or may not be present).
[0037] like Figures 1 to 4 As shown, this utility model discloses a substrate support frame for preventing white edge plating, which includes a support frame body 1 and a plurality of receiving grooves 2 for placing substrates on the support frame body 1.
[0038] This invention changes the single-sided fault tolerance rate (the difference between the maximum length and width of the support frame's receiving groove and the length and width of the substrate, which is 0.4-0.65mm) of the existing technology to 0.25mm-0.55mm, preferably 0.25mm-0.35mm, and most preferably 0.3mm.
[0039] The receiving groove 2 is provided with a supporting step 3. In this invention, the sloping supporting step 101 is replaced with a horizontally arranged supporting step 3, and the four corners of the supporting step 3 are right angles. The width B of the supporting step 3 is 0.8mm-6mm. When the supporting frame is used as a PVD carrier, the width B of the supporting step 3 is 0.8mm-2mm, preferably 0.8mm; when used as a CVD carrier, the width B of the supporting step 3 is 2mm-8mm, preferably 5mm.
[0040] In order to improve heating efficiency, the portion of the receiving groove 2, except for the supporting step 3, is hollow.
[0041] In order to reduce the amount of special gas circling the substrate during plating, the step depth C (i.e., the distance between the upper surface of the support step 3 and the upper surface of the support frame body 1) of the prior art of 1-1.4 mm is increased to 1.5 mm-2 mm, preferably 1.9 mm.
[0042] Example:
[0043] In this embodiment, the supporting step 3 is horizontally positioned with a 0° slope, right angles at its four corners, a width B of 5mm, a depth C of accommodating groove 2 of 1.9mm, and a single-sided tolerance of 0.3mm. The accommodating groove 2, except for the supporting step 3, is hollowed out.
[0044] Comparative Example 1:
[0045] The single-sided tolerance of the receiving groove 2 is 0.55 mm. Other parameters are consistent with the embodiment.
[0046] Comparative Example 2:
[0047] like Figure 3 , 4 As shown, the width B of the support step 3 is 10mm, and other parameters are the same as in the embodiment.
[0048] Comparative Example 3:
[0049] The depth C of the receiving groove 2 is 1.6 mm, and other parameters are the same as in the embodiment.
[0050] Table 1 compares the white edge plating of different support frame sizes and structures in the embodiments, existing support frames, Comparative Examples 1, 2, and 3. Referring to Table 1, it can be seen that changing the slope of the support step 3 from a sloped design to a horizontal one, and eliminating the corner avoidance of the support step 3, reduces the gap between the substrate and the support frame, playing a crucial role in avoiding severe white edge plating and improving yield. Excessive width of the support step 3 can also cause severe white edge plating, reducing yield. The single-sided tolerance and the depth of the receiving groove 2 have relatively small impacts. Increasing the single-sided tolerance and decreasing the depth of the receiving groove 2 will increase the number of slight or very slight white edges, but have little or no impact on yield.
[0051] This embodiment also discloses a carrier plate for preventing white edges from being coated, which includes a carrier plate frame and a plurality of sub-carrier plates disposed on the carrier plate frame, wherein the sub-carrier plates are the aforementioned substrate support frames.
[0052]
[0053] In summary, this utility model reduces the amount of white edges on the substrate by changing the support step structure of the support frame and the structure and size of the receiving groove, thus avoiding severe white edges and improving the yield of the back contact battery coating.
[0054] The preferred embodiments of this utility model have been described in detail above; however, this utility model is not limited thereto. Within the scope of the technical concept of this utility model, various simple modifications can be made to the technical solution of this utility model, including combining the various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed by this utility model and are all within the protection scope of this utility model.
Claims
1. A substrate support frame for preventing white edge plating, comprising a support frame body, wherein the support frame body is provided with a plurality of receiving slots for placing substrates, characterized in that: The single-sided tolerance of the receiving groove is 0.25mm-0.55mm. The receiving groove is provided with a support step, which is horizontal and has right angles at the four corners. The width of the support step is 0.8mm-6mm.
2. The substrate support frame for preventing white edge coating according to claim 1, characterized in that: The receiving groove is hollowed out except for the supporting steps.
3. The substrate support frame for preventing white edge plating according to claim 1, characterized in that: The single-sided tolerance of the receiving groove is 0.25mm-0.35mm.
4. The substrate support frame for preventing white edge coating according to claim 1, characterized in that: When the support frame is used as a PVD carrier, the width of the support step is 0.8mm-2mm; when used as a CVD carrier, the width of the support step is 2mm-8mm.
5. The substrate support frame for preventing white edge coating according to claim 1, characterized in that: The distance between the upper surface of the support step and the upper surface of the support frame body is 1.5mm-2mm.
6. A carrier board for preventing white edges from being coated, characterized in that: It includes a carrier frame and a plurality of subcarriers disposed on the carrier frame, wherein the subcarriers are the substrate support frames as described in any one of claims 1 to 4.