Atom deposition coating with uniform gas plate structure

Abstract

The utility model discloses a kind of gas distribution plate structures for atomic deposition coating, including plate body, the side wall of plate body is connected with gas inlet plate and uniform flow component in proper order, gas inlet plate top surface or bottom surface is provided with gas supply component, several gas guide holes are opened in the vertical direction along it in gas inlet plate inside, several first gas inlets respectively communicated with corresponding gas guide hole are opened in the side wall of gas inlet plate, several first gas outlets respectively communicated with corresponding gas guide hole are opened in the other side wall of gas inlet plate, uniform flow component includes several gas outlet units arranged in proper order, and each gas outlet unit includes gas collection plate and gas outlet plate, and gas collection plate is opened with several gas collection grooves corresponding to gas guide hole.The utility model is slowly diffused to the gas collection groove in gas collection plate by the gas guide hole and several first gas outlets independently arranged on gas inlet plate, so that gas evenly fills entire gas collection groove, and gas in gas collection groove area is evenly flowed out by gas outlet plate, so as to realize the uniform distribution of gas.

Description

Technical Field

[0001] This utility model relates to the field of atomic deposition coating technology, specifically to a gas uniform plate structure for atomic deposition coating. Background Technology

[0002] Atomic Layer Deposition (ALD) is a thin film deposition technique based on self-limiting surface reactions. It achieves atomic-level precision layer-by-layer growth by alternately introducing different precursors. Its core characteristics lie in precise thickness control and excellent conformality, and it is widely used in semiconductor, solar energy, and other fields. The gas inlet device is one of the core components of an ALD equipment, and the gas distribution plate of the gas inlet device is crucial to the deposition effect.

[0003] Traditional ALD (Alternating Current Deposition) gas distribution plates typically employ a simple inlet design. Gas enters through a single inlet, resulting in a limited diffusion path within the plate and hindering uniform gas distribution. For example, some gas distribution plates lack a proper flow distribution structure, leading to higher gas concentrations near the inlet and lower concentrations further away, thus affecting the uniformity of thin film deposition. Furthermore, the spray systems designed by current mainstream ALD manufacturers generally utilize a multi-layered venting plate design. Each plate receives gas through its side or top surface, and the gas then travels through internal channels within each plate before reaching the spray plate. This multi-layered venting plate design restricts the gas flow path design, resulting in short diffusion distances for the reactant gases and making it difficult to achieve uniform distribution throughout the reaction chamber, thereby affecting the consistency of thin film deposition. Utility Model Content

[0004] The purpose of this invention is to provide a gas uniform plate structure for atomic deposition coating, which enables gas to diffuse slowly, fill the entire gas collection tank, and then the gas in the gas collection tank area is uniformly discharged through the gas outlet plate, thereby achieving uniform gas distribution. This solves the problem mentioned in the background art that the gas diffusion path in the gas uniform plate is limited and it is difficult to achieve uniform gas distribution.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A gas equalization plate structure for atomic deposition coating includes a plate body. An air inlet plate and a flow equalization component are sequentially connected to the sidewall of the plate body. An air supply component is provided on the top or bottom surface of the air inlet plate. A plurality of air guide holes are formed in the interior of the air inlet plate along its vertical direction. A plurality of first air inlets are formed on one sidewall of the air inlet plate, which are respectively connected to the corresponding air guide holes. A plurality of first air outlets are formed on the other sidewall of the air inlet plate, which are respectively connected to the corresponding air guide holes. The flow equalization component includes a plurality of air outlet units arranged in sequence. Each air outlet unit includes an air collecting plate and an air outlet plate. The air collecting plate has a plurality of air collecting grooves corresponding to the air guide holes.

[0007] Preferably, the bottom wall of the gas collecting groove is provided with a second air inlet that communicates with the first air outlet, the air outlet plate is embedded at the opening of the gas collecting groove, and the air outlet plate is provided with evenly distributed second air outlets.

[0008] Preferably, the diameter of the second air inlet is smaller than the diameter of the first air outlet.

[0009] Preferably, each of the air outlet units includes a flow equalizer, a first flow equalizer plate, and a second flow equalizer plate. One side wall of the flow equalizer plate has a plurality of spaced and protruding flow guides, and the flow guides have flow equalizer grooves that extend through to the other side wall of the flow equalizer plate.

[0010] Preferably, the first and second flow equalizers are alternately arranged in the flow equalizer groove, and the edges of the first and second flow equalizers are respectively attached to the groove wall of the flow equalizer groove, and the air outlet plate is embedded at the groove opening of the flow equalizer groove.

[0011] Preferably, the bottom wall of the uniform flow channel is provided with a plurality of third air inlets communicating with the air collection channel, and the diameter of the third air inlets is smaller than the diameter of the second air inlets.

[0012] Preferably, the first uniform flow plate is provided with a first uniform air channel, and the second uniform flow plate is provided with a second uniform air channel. The first uniform air channel and the second uniform air channel have the same aperture, and the number of first uniform air channels is greater than the number of second uniform air channels.

[0013] Preferably, the sidewalls of the first and second flow equalizers are provided with partitions to separate the first and second flow equalizers so that ventilation chambers are formed between adjacent first and second flow equalizers.

[0014] Preferably, the air supply assembly includes a plurality of air distribution blocks connected in sequence. The air distribution blocks are connected to the side wall of the air inlet plate. Each air distribution block has a plurality of air inlet channels along its length direction. The side wall of the air distribution block has a plurality of air outlet channels that are respectively connected to the corresponding air inlet channels. The air outlet channels are connected to the first air inlet hole of the air inlet plate.

[0015] Preferably, the air intake channels of the two air distribution blocks located at the edge of the air intake plate are respectively connected to diffusion tubes.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. Gas is slowly diffused into the gas collection groove of the gas collection plate through the independently set air guide holes and several first air outlet holes on the air inlet plate, so that the gas evenly fills the entire gas collection groove, and the gas in the gas collection groove area is evenly discharged through the air outlet plate, thereby achieving uniform gas distribution.

[0018] 2. The diameter of the second air inlet is smaller than that of the first air outlet, which slows down the gas flow rate and effectively ensures that the gas flows smoothly into the gas collection tank. It is less likely to generate turbulence and is conducive to the gas flowing out evenly to the outside of the gas outlet plate after filling the gas collection tank, thereby ensuring uniform coating thickness.

[0019] 3. The air inlet channels of the two gas equalization blocks located at the edge are respectively connected to the diffusion tubes. The gas supplied from the outside enters the gas equalization block through the diffusion tubes. The air inlet plate can slow down the gas, improve the diffusion effect of the diffusion tubes, and can also equalize the gas flow again in the case of uneven gas concentration near the diffusion holes, so that the gas is evenly distributed in the local area.

[0020] 4. The bottom wall of the uniform flow tank is provided with several third air inlets that communicate with the gas collecting tank. The diameter of the third air inlet is smaller than that of the second air inlet, which can slow down the gas flow rate and effectively ensure that the gas flows smoothly from the gas collecting tank into the uniform flow tank, which is conducive to the gas uniformly filling the uniform flow tank. Attached Figure Description

[0021] Figure 1 This is a perspective view of the gas uniform plate structure for atomic deposition coating according to this utility model;

[0022] Figure 2 This is a perspective view of the gas uniform plate structure for atomic deposition coating of this utility model.

[0023] Figure 3 This is a front view of the gas equalization plate structure for atomic deposition coating according to this utility model;

[0024] Figure 4 for Figure 3 Sectional view of section AA;

[0025] Figure 5 for Figure 4 Enlarged view of point B in the middle;

[0026] Figure 6 Explosion of the gas uniform plate structure for atomic deposition coating of this utility model Figure 1 ;

[0027] Figure 7 for Figure 6 Enlarged view of point C in the middle;

[0028] Figure 8 Explosion of the gas uniform plate structure for atomic deposition coating of this utility model Figure 2 ;

[0029] Figure 9 for Figure 8 Enlarged view at point D;

[0030] Figure 10 This is an exploded view of the air outlet unit of this utility model;

[0031] Figure 11 for Figure 10 Enlarged view of point E in the middle.

[0032] In the diagram: 1. Plate; 2. Air inlet plate; 21. Air guide hole; 22. First air inlet; 23. First air outlet; 3. Air outlet unit; 31. Air collecting plate; 311. Air collecting groove; 312. Second air inlet; 32. Air outlet plate; 321. Second air outlet; 33. Flow equalization plate; 331. Flow guide section; 332. Flow equalization groove; 333. Third air inlet; 34. First flow equalization plate; 35. Second flow equalization plate; 36. Partition block; 4. Air supply assembly; 41. Air equalization block; 411. Air inlet channel; 412. Air outlet channel; 42. Dispersion tube. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figure 1-3 A gas equalization plate structure for atomic deposition coating includes a plate body 1, with an air inlet plate 2 and a flow equalization assembly sequentially connected to the sidewall of the plate body 1. An air supply assembly 4 is disposed on the top or bottom surface of the air inlet plate 2. (See also...) Figure 4-5 The air intake plate 2 has several air guide holes 21 inside along its vertical direction. The air intake plate 2 has several first air intake holes 22 on one side wall that are respectively connected to the corresponding air guide holes 21. The air intake plate 2 has several first air outlet holes 23 on the other side wall that are respectively connected to the corresponding air guide holes 21.

[0035] Please see Figure 4-5 as well as Figure 8-9 The flow equalization component includes several sequentially arranged air outlet units 3. Each air outlet unit 3 includes an air collecting plate 31 and an air outlet plate 32. The air collecting plate 31 has several air collecting grooves 311 corresponding to the air guide holes 21. Please refer to [link to relevant documentation]. Figure 11 Several of the aforementioned gas collection slots 311 are arranged horizontally. Please refer to [link / reference]. Figure 5 The bottom wall of the gas collecting groove 311 is provided with a second air inlet 312 that communicates with the first air outlet 23. The air outlet plate 32 is embedded in the groove opening of the gas collecting groove 311, and the air outlet plate 32 is provided with evenly distributed second air outlets 321.

[0036] This invention uses independently provided air guide holes 21 and several first air outlet holes 23 on the air inlet plate 2 to slowly diffuse gas into the gas collection groove 311 of the gas collection plate 31, so that the gas evenly fills the entire gas collection groove 311, and the gas in the area of ​​the gas collection groove 311 is evenly discharged through the air outlet plate 32, thereby achieving uniform gas distribution. Each air guide hole 21 and each air outlet unit 3 of the air inlet plate 2 is independently provided, so that the gas is discharged through multiple arranged air outlet plates 32, so that the gas flows almost uniformly on the surface of the substrate to be processed, which improves the consistency and uniformity of thin film deposition, and at the same time avoids the reaction of different gases.

[0037] Please see Figure 8 In this embodiment, there are two air intake plates 2, arranged vertically on the side wall of the plate body 1, and two flow equalization components, also arranged vertically on the side wall of the air intake plates 2; please refer to Figure 5 The air collection slots 311 of the upper and lower air collection plates 31 are all connected by pipes. Please refer to [link / reference]. Figure 6-7 In the air intake plate 2, every three air guide holes 21 form a group of air delivery units, and the three air guide holes 21 of the air delivery unit are equally spaced. The number of air guide holes 21 is the same as that of the first air intake holes 22. Each air guide hole 21 is connected to several spaced first air outlet holes 23, so that the gas delivered by the air intake plate 2 to the air collection groove 311 is more uniform, and the gas can fill the entire air collection groove 311.

[0038] Please refer to Figure 5 The diameter of the second air inlet 312 is smaller than that of the first air outlet 23, which slows down the gas flow rate and effectively ensures that the gas flows smoothly into the gas collection groove 311. It is not easy to generate turbulence, which is conducive to the gas flowing out evenly to the outside of the gas outlet plate 32 after filling the gas collection groove 311, thereby ensuring uniform coating thickness.

[0039] Please see Figure 2 as well as Figure 5 The air supply assembly 4 includes several air distribution blocks 41 connected in sequence. Each air distribution block 41 is connected to the side wall of the air inlet plate 2. Each air distribution block 41 has several air inlet channels 411 along its length. The side wall of each air distribution block 41 has several air outlet channels 412, each communicating with a corresponding air inlet channel 411. Each air outlet channel 412 communicates with a first air inlet hole 22 of the air inlet plate 2. The number of air outlet channels 412 is the same as the number of first air inlets 22. In this embodiment, the number of air inlet channels 411 is three, but this invention does not limit the number of air inlet channels 411; the number of air inlet channels 411 can be set according to actual coating requirements.

[0040] Please refer to Figure 2The air intake channels 411 of the two gas equalization blocks 41 located at the edge of the air intake plate 2 are respectively connected to the diffusion tubes 42. The gas supplied from the outside enters the gas equalization block 41 through the diffusion tubes 42. The air intake plate 2 can decelerate the gas, improve the diffusion effect of the diffusion tubes 42, and can also equalize the gas flow again in the case of uneven gas concentration near the diffusion holes, so that the gas is evenly distributed in the local area.

[0041] Please see Figure 5 as well as Figure 9-11 Each of the aforementioned air outlet units 3 includes a flow equalization plate 33, a first flow equalization vane 34, and a second flow equalization vane 35. One side wall of the flow equalization plate 33 has a plurality of spaced-apart and protruding flow guides 331. Each flow guide 331 has a flow equalization groove 332 extending through to the other side wall of the flow equalization plate 33. The first flow equalization vane 34 and the second flow equalization vane 35 are alternately and spaced within the flow equalization groove 332, and the edges of the first flow equalization vane 34 and the second flow equalization vane 35 are respectively attached to the groove wall of the flow equalization groove 332. (See also...) Figure 11 The air outlet plate 32 is embedded in the slot of the flow equalization groove 332. (See also...) Figure 5 The bottom wall of the uniform flow channel 332 is provided with several third air inlets 333 that communicate with the gas collecting channel 311. The diameter of the third air inlets 333 is smaller than that of the second air inlets 312, which can slow down the gas flow rate and effectively ensure that the gas flows smoothly from the gas collecting channel 311 into the uniform flow channel 332, which is conducive to the gas uniformly filling the uniform flow channel 332. In this embodiment, there are two first uniform flow vanes 34 and two second uniform flow vanes 35.

[0042] In this embodiment, please refer to Figure 11 The flow equalization plate 33 has an installation groove on its side wall that surrounds the opening of the flow equalization groove 332, and the air outlet plate 32 is embedded in the installation groove. The installation groove has a sealing groove, and a sealing ring is embedded in the sealing groove to prevent gas from leaking out from the connection between the flow equalization plate 33 and the air outlet plate 32.

[0043] Please see Figure 11 The first uniform flow plate 34 is provided with a first uniform gas channel, and the second uniform flow plate 35 is provided with a second uniform gas channel. The number of the first uniform gas channels and the number of the second uniform gas channels are different. In this embodiment, the first and second uniform gas channels have the same aperture, and the number of the first uniform gas channels is greater than the number of the second uniform gas channels. This slows down the gas flow velocity through the first uniform flow plate 34 and the second uniform flow plate 35, and also effectively ensures that the gas flows out smoothly and uniformly, improving the consistency and uniformity of thin film deposition. Please refer to... Figure 5 as well as Figure 11The sidewalls of the first flow equalizer 34 and the second flow equalizer 35 are provided with partitions 36 to separate the first flow equalizer 34 and the second flow equalizer 35 so that a ventilation chamber is formed between adjacent first flow equalizers 34 and second flow equalizers 35, which can also slow down the gas and facilitate the uniform flow of gas.

[0044] The working principle of this novel gas uniform plate structure for atomic deposition coating is as follows:

[0045] Please see Figure 5 as well as Figure 9-11 Gas flows from the diffusion tube 42 into each air inlet channel 411 of the gas equalization block 41, and from each air inlet channel 411 of the gas equalization block 41 into the first air inlet hole 22 of the air inlet plate 2 through the several air outlet channels 412 corresponding to each air inlet channel 411. The gas continues to move forward in the air inlet plate 2, flows from the first air inlet hole 22 into the guide hole 21, and flows into the gas collection groove 311 through the several first air outlet holes 23 and the second air inlet holes 312 corresponding to each guide hole 21. During this process, the gas flow rate slows down, which allows the gas to fill the gas collection groove 311. 11; The gas in the gas collecting groove 311 flows into each uniform flow groove 332 from the third air inlet 333, and passes through the first uniform flow channel of the first uniform flow plate 34 and the second uniform flow channel of the second uniform flow plate 35 in sequence. The gas flow rate is further slowed down, and finally flows out uniformly from the second air outlet 321 of the corresponding air outlet plate 32. This helps to provide more stable and consistent reaction conditions for thin film deposition, so that the reaction can be carried out more fully and uniformly, reducing defects and non-uniformity in the thin film, and improving the quality and performance of the thin film.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A gas uniform plate structure for atomic deposition coating, comprising a plate body (1), characterized in that: The sidewall of the plate (1) is connected to an air inlet plate (2) and a flow equalization component in sequence. An air supply component (4) is provided on the top or bottom surface of the air inlet plate (2). The air inlet plate (2) has several air guide holes (21) in the vertical direction. The sidewall of the air inlet plate (2) has several first air inlets (22) that are respectively connected to the corresponding air guide holes (21). The other sidewall of the air inlet plate (2) has several first air outlet holes (23) that are respectively connected to the corresponding air guide holes (21). The flow equalization component includes several air outlet units (3) arranged in sequence. Each air outlet unit (3) includes an air collecting plate (31) and an air outlet plate (32). The air collecting plate (31) has several air collecting grooves (311) corresponding to the air guide holes (21).

2. The gas uniform plate structure for atomic deposition coating according to claim 1, characterized in that: The bottom wall of the gas collecting groove (311) is provided with a second air inlet (312) that communicates with the first air outlet (23). The air outlet plate (32) is embedded in the groove opening of the gas collecting groove (311). The air outlet plate (32) is provided with evenly distributed second air outlets (321).

3. The gas uniform plate structure for atomic deposition coating according to claim 2, characterized in that: The diameter of the second air inlet (312) is smaller than the diameter of the first air outlet (23).

4. The gas uniform plate structure for atomic deposition coating according to claim 2, characterized in that: Each of the above-mentioned air outlet units (3) includes a flow equalization plate (33), a first flow equalization plate (34) and a second flow equalization plate (35). The flow equalization plate (33) has a plurality of spaced and protruding flow guides (331) on one side wall. The flow guides (331) have flow equalization grooves (332) that penetrate to the other side wall of the flow equalization plate (33).

5. The gas uniform plate structure for atomic deposition coating according to claim 4, characterized in that: The first flow equalizer (34) and the second flow equalizer (35) are alternately arranged in the flow equalizer (332), and the edges of the first flow equalizer (34) and the second flow equalizer (35) are respectively attached to the wall of the flow equalizer (332). The air outlet plate (32) is embedded in the opening of the flow equalizer (332).

6. The gas uniform plate structure for atomic deposition coating according to claim 5, characterized in that: The bottom wall of the uniform flow channel (332) is provided with a plurality of third air inlets (333) that communicate with the gas collection channel (311). The diameter of the third air inlet (333) is smaller than the diameter of the second air inlet (312).

7. The gas uniform plate structure for atomic deposition coating according to claim 5, characterized in that: The first uniform flow plate (34) is provided with a first uniform flow channel, and the second uniform flow plate (35) is provided with a second uniform flow channel. The first uniform flow channel and the second uniform flow channel have the same aperture, and the number of the first uniform flow channel is greater than the number of the second uniform flow channel.

8. The gas uniform plate structure for atomic deposition coating according to claim 7, characterized in that: The sidewalls of the first flow equalizer (34) and the second flow equalizer (35) are provided with partitions (36) to separate the first flow equalizer (34) and the second flow equalizer (35) so that a ventilation chamber is formed between adjacent first flow equalizers (34) and second flow equalizers (35).

9. The gas uniform plate structure for atomic deposition coating according to any one of claims 1-8, characterized in that: The air supply assembly (4) includes several air distribution blocks (41) connected in sequence. The air distribution blocks (41) are connected to the side wall of the air inlet plate (2). Each air distribution block (41) has several air inlet channels (411) along its length. The side wall of the air distribution block (41) has several air outlet channels (412) that are respectively connected to the corresponding air inlet channels (411). The air outlet channels (412) are connected to the first air inlet hole (22) of the air inlet plate (2).

10. The gas uniform plate structure for atomic deposition coating according to claim 9, characterized in that: The air intake channels (411) of the two air distribution blocks (41) located at the edge of the air intake plate (2) are respectively connected to the diffusion tubes (42).

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