Gas uniform flow structure of large chamber PECVD

Abstract

The utility model relates to PECVD equipment field discloses a gas uniform flow structure of big chamber PECVD, including cavity, cavity top is provided with middle air inlet hole group, four around air inlet hole group and RPS air inlet hole group. Four around air inlet hole group sets up in four corner regions of air distribution box, and four around air inlet hole group below is provided with laminar flow board. The laminar flow board is circular ring sector, and its center is the center point of air distribution box upper surface. The edge of laminar flow board close to air distribution box center is higher than the edge close to air distribution box four corners, and is inclined setting. Middle air inlet hole group sets up in the center of air distribution box, and the below of middle air inlet hole group is provided with the uniform flow board, is provided with a plurality of uniform flow holes on the uniform flow board. RPS air inlet hole group is located in the both sides of middle air inlet hole group, and RPS air inlet hole group below is provided with air baffle. The utility model increases the corresponding function baffle below air inlet hole group to change the gas flow direction, shorten the uniform flow time and effect, and the film coating uniformity of big chamber single board silicon wafer, RPS cleaning uniformity is greatly improved.

Images