Aeration device for electroless plating and glass via processing apparatus

Abstract

The utility model relates to glass through hole processing field discloses a kind of inflation device and glass through hole processing equipment for chemical plating, and wherein, the inflation device for chemical plating includes plating bath, air pump, airflow pipeline and air jet pipe, and plating bath is provided with liquid storage cavity, and liquid storage cavity is used to store plating solution;Airflow pipeline is connected with air pump at one end, and other end is inserted into liquid storage cavity;Air jet pipe is located at the bottom surface of liquid storage cavity, and is butt-jointed with airflow pipeline;The end of air jet pipe is rotatably connected with airflow pipeline, and a plurality of gas outlets are provided on air jet pipe along axial direction.By setting rotatable air jet pipe to inflate at appropriate angle, the mobility of plating solution in liquid storage cavity is increased, the contact time of workpiece surface with plating solution is increased, which is conducive to improving the uniformity of plating layer and improving product quality.

Description

Technical Field

[0001] This utility model relates to the field of glass through-hole processing technology, and in particular to an air-filling device and glass through-hole processing equipment for chemical plating. Background Technology

[0002] In through-glass via (TGV) technology, electroless plating is one of the key processes for forming conductive vias, mainly used to deposit metal layers (such as copper, nickel, gold, etc.) on the glass surface. The electroless plating process primarily employs a constant-temperature electroless plating bath. The plating solution is injected into the bath, and a stirring device and an air jet device are used to improve the fluidity of the solution, ensuring continuous contact between the solution and the workpiece, ultimately forming a coating on the tool surface.

[0003] However, the workpiece to be processed usually has several through holes with very small diameters. In existing chemical plating processes, the jetting device generally uses a fixed channel for jetting, with a fixed jetting direction, resulting in a rigid flow path for the plating solution and insufficient fluidity. During repeated use of the plating tank, it is impossible to adjust the contact time and angle between the plating solution and the workpiece surface for workpieces of different sizes, shapes, through hole diameters, and pore densities. This leads to insufficient uniformity of the plating layer on the workpiece surface or within the through holes, resulting in product quality that fails to meet production requirements.

[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an air-filling device and a glass through-hole processing equipment for electroless plating, which aims to solve the problem that the plating solution has insufficient fluidity in the existing electroless plating process, resulting in an inability to meet diverse processing requirements and poor product quality.

[0006] The technical solution of this utility model is as follows:

[0007] An aeration device for electroless plating, comprising:

[0008] A plating tank, wherein a liquid storage chamber is provided on the plating tank for storing plating solution;

[0009] air pump;

[0010] An airflow duct, one end of which is connected to the air pump, and the other end of which extends into the liquid storage chamber;

[0011] An air jet pipe is located on the bottom surface of the liquid storage chamber and is connected to the airflow pipe;

[0012] The jet pipe is rotatably connected to the airflow pipe at its end, and the jet pipe has a plurality of air outlet holes arranged along the axial direction.

[0013] The gas-filling device for electroless plating, wherein the end of the gas flow pipe extends to the bottom of the liquid storage chamber and is provided with a docking channel; the jet pipe is inserted into the docking channel;

[0014] The jet pipe has a protruding locking protrusion, and the docking channel has a circumferentially extending arc-shaped groove on its side wall. The locking protrusion is rotatably installed in the arc-shaped groove.

[0015] The gas-filling device for electroless plating includes multiple jet pipes; the airflow pipeline includes a connecting portion laid flat on the bottom surface of the liquid storage chamber, and several docking channels are staggered on both sides of the connecting portion.

[0016] The gas-filling device for electroless plating, wherein the protrusion is arranged along the line connecting the plurality of the gas outlet holes;

[0017] The arc-shaped groove is located at the top of the docking channel. A first baffle and a second baffle are formed at both ends of the arc-shaped groove, respectively. The angle between the first baffle and the vertical direction is the first included angle, and the angle between the second baffle and the vertical direction is the second included angle.

[0018] Wherein, the first included angle is 5-30°, and the second included angle is 5-30°.

[0019] The gas-filling device for electroless plating is provided with a sealing ring on the gas jet pipe, and the outer circumferential surface of the sealing ring is fitted to the docking channel.

[0020] The gas-filling device for electroless plating, wherein the diameter of the jet pipe is 10-30 mm.

[0021] The gas-filling device for electroless plating, wherein the gas flow pipeline is welded to the inner wall of the plating tank.

[0022] The gas filling device for electroless plating, wherein the air pump is any one of an electric high-pressure air pump, a hydraulically driven air pump, or a pneumatic booster pump.

[0023] The gas-filling device for electroless plating, wherein the gas flow pipeline is a titanium alloy pipeline.

[0024] This application also discloses a glass through-hole processing apparatus, which includes an air-filling device for electroless plating as described in any of the above.

[0025] Compared with the prior art, the embodiments of this utility model have the following advantages:

[0026] This utility model discloses an air-filling device for electroless plating, used in glass through-hole processes. Before processing, the air jet pipe is rotated to adjust the direction of the air jet orifice. Then, the plating solution is injected into the plating tank. The air pump is started to deliver air from the airflow pipeline to the air jet pipe, and finally, the air is ejected from the air outlet, keeping the plating solution in a flowing state. During processing, the workpiece to be processed is placed in the plating tank. The flowing plating solution continuously contacts the workpiece, automatically depositing metal ions on the surface of the workpiece to form a plating layer. Moreover, for different workpieces, the rotation angle of the air jet pipe can be adjusted according to the shape, size, and other parameters of the workpiece, changing the air outlet direction and thus adjusting the flow path of the plating solution. The change in the angle of contact between the plating solution and the workpiece surface facilitates smoother entry of the plating solution into the through-holes on the workpiece, and further controls the contact time between the plating solution and the workpiece being processed, thereby improving the plating effect, increasing the uniformity of the plating tank, and improving product quality. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the gas-filling device used for chemical plating in this utility model;

[0029] Figure 2 This is an exploded view of the gas-filling device used for chemical plating in this utility model;

[0030] Figure 3 This is a partial structural diagram of the airflow pipeline and jet pipe in this utility model;

[0031] Figure 4 This is a partial axial cross-sectional view of the connecting part in this utility model;

[0032] Figure 5 This is a schematic diagram of the jet pipe in this utility model.

[0033] Among them, 10 is the plating tank; 11 is the liquid storage chamber; 20 is the air pump; 30 is the airflow pipeline; 31 is the docking channel; 32 is the arc-shaped groove; 321 is the first baffle; 322 is the second baffle; 33 is the connecting part; 40 is the jet pipe; 41 is the air outlet; and 42 is the locking protrusion. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0036] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0037] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0038] For ease of description, spatial relational terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relational terms are intended to encompass not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways, and the spatial relational terms used herein will be interpreted accordingly.

[0039] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0040] See Figure 1 and Figure 2 In one embodiment of this utility model application, an air-filling device for electroless plating is disclosed, comprising a plating tank 10, an air pump 20, an airflow pipeline 30, and an air jet pipe 40. The plating tank 10 is provided with a liquid storage chamber 11 for storing plating solution. One end of the airflow pipeline 30 is connected to the air pump 20, and the other end extends into the liquid storage chamber 11. The air jet pipe 40 is disposed on the bottom surface of the liquid storage chamber 11 and is connected to the airflow pipeline 30. The end of the air jet pipe 40 is rotatably connected to the airflow pipeline 30, and a plurality of air outlet holes 41 are provided on the air jet pipe 40 along the axial direction.

[0041] The gas-filling device disclosed in this utility model is used in the glass through-hole process. Before processing, the processing parameters of the workpiece to be processed can be determined based on test results, including the rotation angle of the air jet pipe 40. During the actual processing, the air jet pipe 40 is rotated first to adjust the direction of the air jet hole, and then the plating solution is injected into the plating tank 10. The air pump 20 is started to deliver air from the airflow pipe 30 to the air jet pipe 40, and finally it is sprayed out from the air outlet 41 to keep the plating solution in a flowing state. Finally, the workpiece to be processed is placed into the plating tank 10. The flowing plating solution continuously contacts the workpiece, automatically depositing metal ions on the surface of the workpiece to form a plating layer.

[0042] It should be noted that this embodiment is only an example of the processing flow in one implementation method. In other implementation methods, the processing parameters of the workpiece also include temperature parameters, stirring speed, jet speed, etc. The gas filling device used for chemical plating will also combine stirring structure, jet structure, heating structure and air jet pipe 40, so as to control the flow path, flow speed, temperature, etc. of the plating solution in multiple dimensions during the processing, so that the plating effect is suitable for the workpiece being processed.

[0043] In summary, the gas-filling device for electroless plating disclosed in this embodiment can adjust the rotation angle of the jet pipe 40 according to parameters such as the shape and size of the workpiece, thereby changing the gas outlet direction of the gas outlet 41 and adjusting the flow path of the plating solution. This facilitates the plating solution to enter the through holes on the workpiece more smoothly and further controls the contact time between the plating solution and the workpiece being processed, thereby improving the plating effect, increasing the uniformity of the plating tank 10, and improving the quality of the product.

[0044] Specifically, the plating tank 10 disclosed in this embodiment includes, but is not limited to, a polypropylene plating tank, a polytetrafluoroethylene plating tank, and a stainless steel (plastic-lined) plating tank. Using a plating tank 10 with good thermal stability and corrosion resistance allows for long-term storage of the plating solution, maintaining stability and extending the service life of the device.

[0045] Specifically, the air pump 20 disclosed in this embodiment is any one of an electric high-pressure air pump, a hydraulically driven air pump, or a pneumatic booster pump. The jet pipe 40 disclosed in this embodiment is located on the bottom surface of the liquid storage chamber 11, at the deepest point of the plating solution. Therefore, a large air pressure is required when jetting. Using a powerful, stable, and safe electric high-pressure air pump, a hydraulically driven air pump, or a pneumatic booster pump is beneficial for improving the safety of the device and extending its service life.

[0046] Specifically, the airflow pipe 30 disclosed in this embodiment is a titanium alloy pipe. The airflow pipe 30 is used to connect the jet pipe 40 and the air pump 20, and is at least partially immersed in the plating solution. Therefore, using a titanium alloy pipe with good corrosion resistance and high structural strength can reduce plating solution contamination, keep the airflow unobstructed, and extend the service life of the device.

[0047] Specifically, in another embodiment of this invention, the airflow pipe 30 is welded to the inner wall of the plating tank 10. In this embodiment, by welding and fixing the airflow pipe 30, displacement caused by changes in internal air pressure during the start-up or shutdown of the air pump 20 is avoided, thus stabilizing the entire device structure, preventing collisions with the workpiece, and further improving the safety of the device.

[0048] like Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, in another embodiment of this application, the end of the airflow pipe 30 extends to the bottom of the liquid storage chamber 11 and is provided with a docking channel 31; the jet pipe 40 is inserted into the docking channel 31; a locking protrusion 42 is provided on the jet pipe 40, and a circumferentially extending arc-shaped groove 32 is provided on the side wall of the docking channel 31, and the locking protrusion 42 is rotatably installed in the arc-shaped groove 32.

[0049] In this embodiment, the airflow pipe 30 extends to the bottom of the liquid storage chamber 11, and the jet pipe 40 is also located at the bottom of the liquid storage chamber 11, so they can be smoothly connected. Moreover, the air outlet 41 can release air upward from the bottom of the liquid storage chamber 11, thereby agitating the plating solution in the entire liquid storage chamber 11 and making the plating solution flow as a whole.

[0050] Specifically, the plating tank 10 can be configured as a cylindrical or square tube. The end of the airflow pipe 30 contacts the bottom surface of the plating tank 10. The jet pipe 40 extends from the edge of the bottom surface of the plating tank 10 to the middle position. Thus, the several air outlets 41 arranged along the axial direction of the jet pipe 40 can take into account both the middle and the edge of the plating tank 10, realize a wide range of air outlets, and make the flow of the plating solution more uniform.

[0051] Specifically, during inflation, the air pressure inside the jet pipe 40 is high. The jet pipe 40 is secured to the airflow pipe 30 by engaging with the arc-shaped groove 32 via the locking protrusion 42, maintaining structural stability. Furthermore, the length of the arc-shaped groove 32 is greater than the length of the locking protrusion 42, thus accommodating the rotational requirements of the jet pipe 40, ensuring its connection to the airflow pipe 30, and allowing the orientation of the air outlet 41 to be changed, increasing operational flexibility.

[0052] Specifically, in another embodiment of this application, the arc-shaped groove 32 can also be replaced by an annular groove to increase the range of motion of the locking protrusion 42, so that the rotation range of the jet pipe 40 is wider, thereby adapting to a variety of processing needs.

[0053] It should be noted that this embodiment only illustrates the snap-fit ​​connection method between the jet pipe 40 and the airflow pipe 30. In actual manufacturing, other connection methods, such as screw connection, can also achieve the technical effects disclosed in this application. As a replacement for this embodiment, they should also be within the protection scope of this application.

[0054] For example Figure 2 and Figure 3 As shown, in another embodiment of this application, the jet pipe 40 is provided with multiple jet pipes; the airflow pipe 30 includes a connecting portion 33 laid flat on the bottom surface of the liquid storage chamber 11, and a plurality of docking channels 31 are staggered on both sides of the connecting portion 33.

[0055] In this embodiment, the end of the airflow pipe 30 is fixed to the bottom surface of the liquid storage chamber 11 and is elongated. Therefore, multiple docking channels 31 can be opened on both sides to increase the docking positions of the jet pipes 40. By arranging multiple jet pipes 40, the multiple jet pipes 40 are symmetrically arranged on both sides of the connecting part 33, covering the bottom surface of the liquid storage chamber 11, increasing the air outlet positions, further agitating the plating solution, improving the fluidity of the plating solution, so as to improve the processing quality and enhance the uniformity of the plating layer.

[0056] Specifically, in this embodiment, the docking channels 31 on both sides of the connecting part 33 are staggered, so the jet pipes 40 on both sides are staggered, and the air outlet position is more evenly distributed.

[0057] like Figure 5As shown, in another embodiment of this application, the locking protrusion 42 is disclosed to be disposed along the line connecting the plurality of air outlets 41. In this embodiment, by arranging the locking protrusion 42 and the air outlets 41 collinearly, the orientation of the air outlets 41 can be limited by limiting the locking protrusion 42.

[0058] like Figure 4 As shown, the arc-shaped groove 32 is located at the top of the docking channel 31. A first baffle 321 and a second baffle 322 are formed at both ends of the arc-shaped groove 32. The angle between the first baffle 321 and the vertical direction is the first included angle, and the angle between the second baffle 322 and the vertical direction is the second included angle. The first included angle is 5-30°, and the second included angle is 5-30°.

[0059] In this embodiment, the arc-shaped groove 32 is located at the top of the docking channel 31. When the jet pipe 40 does not need to be rotated during use, the locking protrusion 42 is in the vertical direction, and the air outlet 41 also emits air vertically upwards. When adjustment is required according to processing needs, the locking protrusion 42 is rotated, moving between the first baffle 321 and the second baffle 322. The adjustable angle is the sum of the first included angle and the second included angle, which is within ±5-30° centered on the vertical direction. In other words, the adjustment range of the air outlet 41 is within ±5-30° centered on the vertical direction.

[0060] Specifically, during adjustment, the angle between the orientation of the air outlet 41 and the vertical direction can be measured using a protractor. Within the adjustable range, the angle of the jet pipe 40 can be adjusted arbitrarily, making it flexible to use.

[0061] Specifically, if the first and second included angles are less than 5°, the range is too small, the orientation of the air outlet 41 will not change significantly, the adjustment flexibility will be insufficient, and it will not meet the processing requirements; if the first and second included angles are greater than 30°, the adjustment range is too large, which may easily lead to a slow flow of plating solution directly above the air jet pipe 40. Therefore, in this embodiment, by reasonably setting the range of the first and second included angles, the rotation operation of the air jet pipe 40 can balance flexibility and practicality.

[0062] Specifically, as another embodiment of this application, a sealing ring is disclosed on the jet pipe 40, and the outer peripheral surface of the sealing ring fits against the docking channel 31. By setting the sealing ring, the airtightness of the connection is increased, preventing air leakage at the connection between the jet pipe 40 and the airflow pipe 30, stabilizing the air pressure at the air outlet 41, and improving the control accuracy of the device.

[0063] Specifically, impurities and precipitates are generated during continuous use of the gas-filling device used for electroless plating. As another embodiment of this application, the diameter of the jet pipe 40 is disclosed to be 10-30 mm. By setting the diameter of the jet pipe 40 to be greater than 10 mm, the vent 41 is positioned away from the bottom surface of the liquid storage chamber 11, thereby reducing the rapid pushing of impurities or precipitates towards the workpiece, improving plating quality, and avoiding damage to the workpiece surface. Simultaneously, the jet pipe 40 should not be too thick when positioned on the bottom surface of the liquid storage chamber 11; a jet pipe 40 with a diameter greater than 30 mm requires higher air pressure, and the air pressure control of the vent 41 is unstable.

[0064] Specifically, in this embodiment, the arc-shaped groove 32 of the docking channel 31 is set at the top of the docking channel 31, and the rotation range of the air outlet 41 is set to 5-30°. This can further prevent air from being sprayed onto the bottom surface of the liquid storage chamber 11, thereby reducing the liquid flow speed near the bottom surface of the liquid storage chamber 11 and reducing the fluidity of impurities.

[0065] As another embodiment of this application, a glass through-hole processing apparatus is also disclosed, which includes an air-filling device for electroless plating as described in any of the above.

[0066] In summary, this application discloses an aeration device for electroless plating, comprising a plating tank 10, an air pump 20, an airflow pipeline 30, and an air jet pipe 40. The plating tank 10 has a liquid storage chamber 11 for storing the plating solution. One end of the airflow pipeline 30 is connected to the air pump 20, and the other end extends into the liquid storage chamber 11. The air jet pipe 40 is located on the bottom surface of the liquid storage chamber 11 and is connected to the airflow pipeline 30. The end of the air jet pipe 40 is rotatably connected to the airflow pipeline 30, and the air jet pipe 40 has several air outlets 41 arranged axially. For different workpieces, the rotation angle of the air jet pipe 40 can be adjusted according to the shape, size, and other parameters of the workpiece, changing the air outlet direction of the air outlets 41. This adjusts the flow path of the plating solution, facilitating smoother entry of the plating solution into the through-holes on the workpiece, further controlling the contact time between the plating solution and the currently processed workpiece, thereby improving the plating effect, increasing the uniformity of the plating tank 10, and improving product quality.

[0067] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0068] It should be noted that this utility model uses an inflator for electroless plating and a glass through-hole processing equipment as examples to introduce the specific structure and working principle of this utility model. However, the application of this utility model is not limited to inflators for electroless plating and glass through-hole processing equipment, and can also be applied to the production and use of other similar workpieces.

[0069] It should be understood that this invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this invention is limited only by the appended claims.

[0070] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An aeration device for electroless plating, characterized in that, include: A plating tank, wherein a liquid storage chamber is provided on the plating tank for storing plating solution; air pump; An airflow duct, one end of which is connected to the air pump, and the other end of which extends into the liquid storage chamber; An air jet pipe is located on the bottom surface of the liquid storage chamber and is connected to the airflow pipe; The jet pipe is rotatably connected to the airflow pipe at its end, and the jet pipe has a plurality of air outlet holes arranged along the axial direction.

2. The gas-filling device for electroless plating according to claim 1, characterized in that, The end of the airflow pipe extends to the bottom of the liquid storage chamber and is provided with a docking channel; the jet pipe is inserted into the docking channel; The jet pipe has a protruding locking protrusion, and the docking channel has a circumferentially extending arc-shaped groove on its side wall. The locking protrusion is rotatably installed in the arc-shaped groove.

3. The gas-filling device for electroless plating according to claim 2, characterized in that, The jet pipe is provided in multiple ways; the airflow pipeline includes a connecting part laid flat on the bottom surface of the liquid storage chamber, and several docking channels are staggered on both sides of the connecting part.

4. The gas-filling device for electroless plating according to claim 2 or 3, characterized in that, The protrusion is positioned along the line connecting the plurality of air outlets; The arc-shaped groove is located at the top of the docking channel. A first baffle and a second baffle are formed at both ends of the arc-shaped groove, respectively. The angle between the first baffle and the vertical direction is the first included angle, and the angle between the second baffle and the vertical direction is the second included angle. Wherein, the first included angle is 5-30°, and the second included angle is 5-30°.

5. The gas-filling device for electroless plating according to claim 2, characterized in that, A sealing ring is fitted onto the jet pipe, and the outer circumferential surface of the sealing ring fits into the docking channel.

6. The gas-filling device for electroless plating according to claim 1, characterized in that, The diameter of the jet pipe is 10-30 mm.

7. The gas-filling device for electroless plating according to claim 1, characterized in that, The airflow pipe is welded to the inner wall of the plating tank.

8. The gas-filling device for electroless plating according to claim 1, characterized in that, The air pump can be any one of an electric high-pressure air pump, a hydraulically driven air pump, or a pneumatic booster pump.

9. The gas-filling device for electroless plating according to claim 1, characterized in that, The airflow pipeline is a titanium alloy pipeline.

10. A glass through-hole processing device, characterized in that, Includes the gas-filling device for electroless plating as described in any one of claims 1 to 9.

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