Electroplating additive electroplating test apparatus

Abstract

The utility model discloses a kind of electroplating additive electroplating test equipment, including electroplating testing device;The electroplating testing device is composed of electroplating cell, fixed mechanism and lifting mechanism, the fixed mechanism is installed in electroplating cell one side, the fixed mechanism one side is equipped with wire, two groups the lifting mechanism is installed in electroplating cell other side, metal pole is installed between each group the lifting mechanism, recess is uniformly provided on the metal pole upper side, the lifting mechanism upper end outside is equipped with conducting mechanism, the electroplating cell bottom end is provided with drain pipe, control valve is installed on the drain pipe upper side.The utility model two groups lifting mechanism when using, can carry out reciprocating test, improve test test, improve test efficiency, while lifting mechanism is elevated, conducting mechanism can control power-off, so that lifting mechanism and metal pole are in electrification state, facilitate staff to carry out feeding, improve the security of feeding.

Description

Technical Field

[0001] This utility model relates to the field of electroplating testing technology, specifically to an electroplating additive testing device. Background Technology

[0002] Electroplating additives are a class of chemical substances added to the electroplating solution during the electroplating process. Although the amount added is usually small, they play a crucial role in the electroplating effect, improving the performance, appearance, and stability of the plating layer. Electroplating additives need to be tested during the production and processing process, and electroplating additive testing equipment is required during the electroplating testing process.

[0003] Chinese Patent No. 202421756744.1 discloses an electroplating testing device, including a test tank for holding electroplating solution and an electroplating fixture, an insoluble anode, and a moving mechanism disposed in the test tank.

[0004] During the use of this utility model, loading and unloading materials takes up a lot of time, which affects the testing time. Utility Model Content

[0005] The purpose of this invention is to provide an electroplating additive testing device to solve the problems raised in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an electroplating additive testing device, comprising an electroplating testing apparatus; the electroplating testing apparatus consists of an electroplating tank, a fixing mechanism, and a lifting mechanism; the fixing mechanism is installed on one side of the electroplating tank, and a wire is installed on one side of the fixing mechanism; two sets of lifting mechanisms are installed on the other side of the electroplating tank, and a metal rod is installed between each set of lifting mechanisms; grooves are evenly arranged on the upper side of the metal rod; a conductive mechanism is installed on the outer side of the upper end of the lifting mechanism; a drain pipe is provided at the bottom of the electroplating tank, and a control valve is installed on the upper side of the drain pipe.

[0007] Preferably, both the fixing mechanism and the lifting mechanism are insulated on the outside.

[0008] Preferably, a display is mounted on the upper side of the controller, and control buttons are mounted on the upper side of the controller at a position next to the display.

[0009] Preferably, the fixing mechanism consists of a fixing frame and a clamping mechanism. The fixing frame is installed on the upper side of one side of the electroplating tank, and the clamping mechanism is evenly installed on one side of the fixing frame.

[0010] Preferably, the clamping mechanism consists of a clamping plate, a threaded cylinder, a threaded rod, and a handle. The handle is installed on one side of the threaded rod, the threaded rod is rotatably installed inside the threaded cylinder, the threaded cylinder is installed on the upper side of the fixed frame, and the clamping plate is rotatably installed on the inner side of the threaded rod.

[0011] Preferably, the lifting mechanism consists of a first telescopic rod and a mounting plate, wherein the first telescopic rod is installed on both sides of the electroplating tank, and the mounting plate is installed on the upper end of the first telescopic rod.

[0012] Preferably, the conductive mechanism consists of a second telescopic rod, a U-shaped frame, a conductive plug, a conductive slot, and a guide mechanism. The guide mechanism is installed between the conductive plug and the mounting plate. The conductive slot is installed on one side of the mounting plate. The conductive plug is pluggable and detachable inside the conductive slot. The second telescopic rod is installed at the rear end of the conductive plug. The second telescopic rod is installed on the upper side of the U-shaped frame. The U-shaped frame is installed on one side of the mounting plate.

[0013] Preferably, the guiding mechanism consists of a guide rod and a through hole, the through hole being disposed on both sides of the conductive plug, the guide rod being mounted on one side of the mounting plate, and the guide rod being slidably mounted inside the through hole.

[0014] Preferably, a power indicator light is provided on the outside of the mounting plate, and the power indicator light is fixedly mounted on the outside of the mounting plate by bolts.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. When the two sets of lifting mechanisms are in use, they can perform reciprocating tests, which improves the testing efficiency. At the same time, when the lifting mechanism is raised, the conductive mechanism can control the power cut-off, so that the lifting mechanism and the metal rod are in a non-energized state, which facilitates the loading and unloading of materials by the staff and improves the safety of loading and unloading.

[0017] 2. When the lifting mechanism is in use, when the first telescopic rod extends, the mounting plate will be raised, thereby driving the metal rod mounted on the mounting plate to rise; when the first telescopic rod shortens, the mounting plate will descend, and the metal rod will also descend. By adjusting the extension length of the first telescopic rod, the electroplated parts can be inserted into the electroplating tank or the electroplated parts can be taken out.

[0018] 3. The second telescopic rod is telescopic and can adjust the position of the conductive plug to accurately insert it into the conductive slot and realize the circuit conduction. The U-shaped frame provides installation support for the second telescopic rod to ensure its stability of movement. The guide rod and through hole in the guide mechanism cooperate to guide the insertion and removal movement of the conductive plug, prevent the conductive plug from deviating during insertion or removal, and ensure that the conductive plug and the conductive slot can be accurately connected, thereby ensuring that the current can be stably and reliably transmitted to the relevant components in the electroplating tank to provide electrical energy for the electroplating process.

[0019] 4. The power indicator light is connected to the circuit of the conductive mechanism via a wire. When the conductive mechanism is powered on and current flows through the circuit, the power indicator light will light up, thus visually indicating to the operator that the conductive mechanism is currently powered on, meaning that the circuit of the electroplating test equipment is conductive and can be used for normal electroplating testing. When the circuit is disconnected, the power indicator light will turn off, indicating to the operator that the equipment is powered off and that the staff can load and unload materials. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0021] Figure 1 This is a schematic diagram of the structure of this utility model;

[0022] Figure 2 This is a front view structural diagram of the present utility model;

[0023] Figure 3 This is a side view of the structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the conductive mechanism of this utility model.

[0025] In the diagram: 1. Electroplating test device; 2. Electroplating tank; 3. Lifting mechanism; 4. First telescopic rod; 5. Mounting plate; 6. Metal rod; 7. Fixing mechanism; 8. Fixing frame; 9. Clamping mechanism; 10. Threaded cylinder; 11. Control button; 12. Controller; 13. Display; 14. Drain pipe; 15. Wire; 16. Clamping plate; 17. Threaded rod; 18. Handle; 19. Conductive mechanism; 20. U-shaped frame; 21. Guide mechanism; 22. Groove; 23. Guide rod; 24. Through hole; 25. Conductive plug; 26. Conductive slot; 27. Second telescopic rod; 28. Power indicator light. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4In this embodiment of the present invention, an electroplating additive electroplating testing device includes an electroplating testing device 1. The electroplating testing device 1 consists of an electroplating tank 2, a fixing mechanism 7, and a lifting mechanism 3. The fixing mechanism 7 is installed on one side of the electroplating tank 2, and a wire 15 is installed on one side of the fixing mechanism 7. Two sets of lifting mechanisms 3 are installed on the other side of the electroplating tank 2. A metal rod 6 is installed between each set of lifting mechanisms 3. Grooves 22 are evenly arranged on the upper side of the metal rod 6. A conductive mechanism 19 is installed on the outer side of the upper end of the lifting mechanism 3. A drain pipe 14 is provided at the bottom of the electroplating tank 2, and a control valve is installed on the upper side of the drain pipe 14.

[0028] Both the fixing mechanism 7 and the lifting mechanism 3 are insulated on the outside. The insulation of the fixing mechanism 7 and the lifting mechanism 3 is to prevent the operator from accidentally getting electric shock during the electroplating test, and to avoid current leakage. It also ensures that the current can flow in the electroplating tank 2 and related conductive parts according to the preset circuit, so as to ensure the accuracy and safety of the electroplating test.

[0029] A display 13 is mounted on the upper side of the controller 12. Control buttons 11 are mounted on the upper side of the controller 12 to one side of the display 13. The display 13 is used to display various parameters during the electroplating test in real time, such as current intensity, voltage, and electroplating time, so that the operator can intuitively understand the test status. The control buttons 11 are the interface for the operator to interact with the controller 12. By pressing different control buttons 11, instructions are input to the controller 12. The controller 12 performs corresponding control and adjustment on the electroplating test process according to the instructions, such as starting or stopping electroplating, adjusting current and voltage, etc.

[0030] The fixing mechanism 7 consists of a fixing frame 8 and a clamping mechanism 9. The fixing frame 8 is installed on the upper side of one side of the electroplating tank 2, and the clamping mechanism 9 is evenly installed on one side of the fixing frame 8. When the fixing mechanism 7 is in use, the electroplating raw material is introduced into the fixing frame 8, and then the electroplating raw material is clamped and fixed by the clamping mechanism 9.

[0031] The clamping mechanism 9 consists of a clamping plate 16, a threaded cylinder 10, a threaded rod 17, and a handle 18. The handle 18 is installed on one side of the threaded rod 17, which is rotatably installed inside the threaded cylinder 10. The threaded cylinder 10 is installed on the upper side of the fixed frame 8. The clamping plate 16 is rotatably installed inside the threaded rod 17. The handle 18 serves as an operating component, facilitating the operator to apply force. When the handle 18 is rotated, the threaded rod 17 rotates inside the threaded cylinder 10. Since the threaded cylinder 10 is fixed on the fixed frame 8, the threaded rod 17 will have axial displacement. The axial movement of the threaded rod 17 drives the clamping plate 16 to rotate, allowing the clamping plate 16 to tightly fit the surface of the workpiece. By adjusting the number of rotations of the threaded rod 17, the clamping force of the clamping plate 16 on the workpiece can be controlled to adapt to the fixing requirements of electroplating raw materials of different shapes.

[0032] The lifting mechanism 3 consists of a first telescopic rod 4 and a mounting plate 5. The first telescopic rod 4 is installed on both sides of the electroplating tank 2, and the mounting plate 5 is installed on the upper end of the first telescopic rod 4. When the lifting mechanism 3 is in use, when the first telescopic rod 4 extends, the mounting plate 5 is raised, thereby driving the metal rod 6 installed on the mounting plate 5 to rise; when the first telescopic rod 4 shortens, the mounting plate 5 descends, and the metal rod 6 also descends accordingly. By adjusting the extension length of the first telescopic rod 4, the electroplated parts can be inserted into the electroplating tank 2 or the electroplated parts can be extracted.

[0033] The conductive mechanism 19 consists of a second telescopic rod 27, a U-shaped frame 20, a conductive plug 25, a conductive slot 26, and a guide mechanism 21. The guide mechanism 21 is installed between the conductive plug 25 and the mounting plate 5. The conductive slot 26 is installed on one side of the mounting plate 5, and the conductive plug 25 can be plugged into the conductive slot 26. The second telescopic rod 27 is installed at the rear end of the conductive plug 25 and on the upper side of the U-shaped frame 20, which is installed on one side of the mounting plate 5. The second telescopic rod 27 is telescopic and can adjust the position of the conductive plug 25 so that it can be accurately inserted into the conductive slot 26 to achieve circuit conduction. The U-shaped frame 20 provides mounting support for the second telescopic rod 27 to ensure its stability of movement. The guide rod 23 and the through hole 24 in the guide mechanism 21 cooperate to guide the insertion and removal movement of the conductive plug 25, preventing the conductive plug 25 from shifting during insertion or removal, and ensuring that the conductive plug 25 and the conductive slot 26 can be accurately connected. This ensures that the current can be stably and reliably transmitted to the relevant components in the electroplating tank 2, providing electrical energy for the electroplating process.

[0034] The guiding mechanism 21 consists of a guide rod 23 and a through hole 24. The through hole 24 is located on both sides of the conductive plug 25. The guide rod 23 is installed on one side of the mounting plate 5 and is slidably installed inside the through hole 24. The guide rod 23 is fixedly installed on the mounting plate 5, providing a guide track for the movement of the conductive plug 25. When the conductive plug 25 is inserted or removed, the through holes 24 on both sides slide along the guide rod 23. The guide rod 23 restricts the movement direction of the conductive plug 25, so that it can only move in a direction parallel to the guide rod 23. This avoids the conductive plug 25 from tilting or getting stuck due to uneven force, ensuring the smooth docking and separation of the conductive plug 25 and the conductive slot 26, and improving the reliability and stability of the conductive mechanism 19.

[0035] Furthermore, a power indicator light 28 is provided on the outside of the mounting plate 5. The power indicator light 28 is fixedly installed on the outside of the mounting plate 5 with bolts. The power indicator light 28 is connected to the circuit of the conductive mechanism 19 through wires. When the conductive mechanism 19 is powered on and current flows through the circuit, the power indicator light 28 will light up, thus visually indicating to the operator that the conductive mechanism 19 is currently powered on, that is, the circuit of the electroplating test equipment is conductive and can be used for normal electroplating test work; when the circuit is disconnected, the power indicator light 28 will turn off, indicating to the operator that the equipment is in a power-off state and that the staff can load and unload materials.

[0036] The working principle and usage process of this utility model are as follows: When the electroplating testing device 1 is working, the fixing mechanism 7 is used to fix the electroplating raw materials, and the raw materials are connected to an external power source or other testing equipment through the wire 15 to form a current path. The lifting mechanism 3 can adjust the height of the metal rod 6. The groove 22 on the metal rod 6 is used to hang the electroplated parts. The conductive mechanism 19 can realize the conduction of current and transmit the power energy of the power source to the electroplated parts. When the two sets of lifting mechanisms 3 are in use, they can perform reciprocating tests to improve the testing efficiency. At the same time, when the lifting mechanism 3 is raised, the conductive mechanism 19 can control the power cut-off, so that the lifting mechanism 3 and the metal rod 6 are in a non-energized state, which facilitates the loading and unloading of materials by the staff and improves the safety of loading and unloading.

[0037] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An electroplating additive testing device, comprising an electroplating testing apparatus (1); characterized in that: The electroplating test device (1) consists of an electroplating tank (2), a fixing mechanism (7), and a lifting mechanism (3). The fixing mechanism (7) is installed on one side of the electroplating tank (2), and a wire (15) is installed on one side of the fixing mechanism (7). Two sets of lifting mechanisms (3) are installed on the other side of the electroplating tank (2). A metal rod (6) is installed between each set of lifting mechanisms (3). Grooves (22) are evenly arranged on the upper side of the metal rod (6). A conductive mechanism (19) is installed on the outer side of the upper end of the lifting mechanism (3). A drain pipe (14) is provided at the bottom of the electroplating tank (2). A control valve is installed on the upper side of the drain pipe (14). A controller (12) is installed on one side of the electroplating tank (2).

2. The electroplating additive testing equipment according to claim 1, characterized in that: Both the fixing mechanism (7) and the lifting mechanism (3) are insulated on the outside.

3. The electroplating additive testing equipment according to claim 1, characterized in that: A display (13) is mounted on the upper side of the controller (12), and a control button (11) is mounted on the upper side of the controller (12) on one side of the display (13).

4. The electroplating additive testing equipment according to claim 1, characterized in that: The fixing mechanism (7) consists of a fixing frame (8) and a clamping mechanism (9). The fixing frame (8) is installed on the upper side of one side of the electroplating tank (2), and the clamping mechanism (9) is evenly installed on one side of the fixing frame (8).

5. The electroplating additive testing equipment according to claim 4, characterized in that: The clamping mechanism (9) consists of a clamping plate (16), a threaded cylinder (10), a threaded rod (17), and a handle (18). The handle (18) is installed on one side of the threaded rod (17), the threaded rod (17) is rotatably installed inside the threaded cylinder (10), the threaded cylinder (10) is installed on the upper side of the fixing frame (8), and the clamping plate (16) is rotatably installed on the inner side of the threaded rod (17).

6. The electroplating additive testing equipment according to claim 1, characterized in that: The lifting mechanism (3) consists of a first telescopic rod (4) and a mounting plate (5). The first telescopic rod (4) is installed on both sides of the electroplating tank (2), and the mounting plate (5) is installed on the upper end of the first telescopic rod (4).

7. The electroplating additive testing equipment according to claim 6, characterized in that: The conductive mechanism (19) consists of a second telescopic rod (27), a U-shaped frame (20), a conductive plug (25), a conductive slot (26), and a guide mechanism (21). The guide mechanism (21) is installed between the conductive plug (25) and the mounting plate (5). The conductive slot (26) is installed on one side of the mounting plate (5). The conductive plug (25) is pluggable and detachable inside the conductive slot (26). The second telescopic rod (27) is installed at the rear end of the conductive plug (25). The second telescopic rod (27) is installed on the upper side of the U-shaped frame (20). The U-shaped frame (20) is installed on one side of the mounting plate (5).

8. The electroplating additive testing equipment according to claim 7, characterized in that: The guiding mechanism (21) consists of a guide rod (23) and a through hole (24). The through hole (24) is located on both sides of the conductive plug (25). The guide rod (23) is installed on one side of the mounting plate (5) and is slidably installed inside the through hole (24).

9. The electroplating additive testing equipment according to claim 8, characterized in that: A power indicator light (28) is provided on the outside of the mounting plate (5), and the power indicator light (28) is fixedly installed on the outside of the mounting plate (5) by bolts.

Images