A kind of heat insulation foamed silica gel sleeve for semiconductor equipment pipeline
By designing a thermal insulation foamed silicone sleeve for semiconductor equipment pipelines, thermal insulation is achieved using the foamed silicone body and fastening components, solving the pipeline blockage problem caused by precipitated particles during semiconductor material transportation, and ensuring transportation stability and safety.
CN224497982UActive Publication Date: 2026-07-14ZHENFU SEMICONDUCTOR MATERIALS (ZHEJIANG) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHENFU SEMICONDUCTOR MATERIALS (ZHEJIANG) CO LTD
- Filing Date
- 2025-09-19
- Publication Date
- 2026-07-14
Smart Images
Figure CN224497982U_ABST
Abstract
The utility model discloses a kind of heat-insulating foamed silica gel sleeve for semiconductor equipment pipeline, including foamed silica gel body being sleeved in the outside of pipeline, further including half-open protective shell, the protective shell is the first skin shell and second skin shell of relatively arranged, the first skin shell and second skin shell are respectively provided with the cavity for placing foamed silica gel body, buckle is provided between the first skin shell and second skin shell, the first skin shell or second skin shell is provided with wire harness cover. The utility model uses, internal certain stable temperature is reached, semiconductor material is not easy to appear in the conveying process Particle, long time use is not easy to cause the blockage of pipeline.
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