Waterproof LED lamp bead with good sealing performance

Abstract

The utility model discloses a waterproof LED lamp pearl with good sealing, relates to LED lamp pearl technical field, including lamp stand, chip, electrode contact pole and sealing assembly, bowl -shaped groove is accommodated chip on the upper end of lamp stand, and the lower extreme sets up sleeve rim and is in proper order and is connected with contact pole cover, glue seal cover ring and sealing gum, and the end surface of electrode contact pole lower surface is pasted on the upper end surface of sealing gum, and its end surface is equipped with the joint seam convenient for external pin access, and the inner buckle edge buckle pressure sealing gum is arranged to the inboard of glue seal cover ring, and the contact pole of contact pole cover is connected with electrode contact pole, chip is stacked with base, N type semiconductor and P type semiconductor and constitutes, and lamp mirror and heat conduction column are arranged in the lamp stand. The utility model discloses through multilayer sealing design effectively prevents moisture penetration, and the joint seam is in guaranteeing electrical connection while keeping the sealing property, and the heat dissipation fin promotes the heat dissipation efficiency, makes the lamp pearl have excellent waterproof performance and stability, is applicable to high humidity environment.

Description

Technical Field

[0001] This utility model belongs to the field of LED lamp bead technology, and in particular relates to a waterproof LED lamp bead with good sealing performance. Background Technology

[0002] In LED lighting applications, especially in outdoor or humid environments, the sealing reliability of LED chips directly determines their lifespan and safety. Traditional waterproof LED chips often use potting compound to completely encapsulate the chip or use a separate sealing ring structure. The former may lead to difficulties in pin insertion and removal, inconvenient maintenance, and gaps may easily appear due to differences in the coefficients of material expansion under temperature changes. The latter requires high structural precision and is at risk of sealing failure due to assembly deviations. Existing technologies cannot achieve long-term and stable sealing protection of the pin lead-out parts while ensuring convenient electrical connection. Moisture can still easily enter through the interface gaps, causing electrode short circuits or chip corrosion, which restricts the reliable application of LED chips in harsh environments.

[0003] To address these issues, we provide a waterproof LED bead with good sealing properties. Utility Model Content

[0004] The purpose of this utility model is to provide a waterproof LED lamp bead with good sealing performance. By placing the chip inside the lamp holder and placing two electrode contact rods on the lower end face of the lamp holder, the two electrode contact rods are connected to the two electrode pins of the chip. A sleeve is provided at the lower end of the lamp holder, and sealing glue is placed inside the sleeve to seal the two electrode contact rods, preventing the two electrode contact rods from coming into contact with water and causing a short circuit. An insertion seam is opened on the sealing glue. When connected, the two pins are inserted into the insertion seam and connected to the two electrode contact rods respectively.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to a waterproof LED lamp bead with good sealing performance, comprising a lamp holder, a chip, and two electrode contact rods. A bowl-shaped groove is formed on the upper end face of the lamp holder. The chip is set in the inner bottom of the lamp holder, and the two electrodes of the chip penetrate through the bottom surface of the lamp holder. The two electrode contact rods are fixedly set on the lower bottom surface of the lamp holder and are respectively connected to the two electrodes of the chip. A sleeve is fixedly provided on the lower end face of the lamp holder, and an adhesive sealing ring is fixedly fitted inside the sleeve. Sealing adhesive is fixedly fitted inside the adhesive sealing ring. The upper end face of the sealing adhesive is attached to the lower end face of the two electrode contact rods, and a joint seam is passed through the end face of the sealing adhesive.

[0007] A further feature of this invention is that an inner flange is fixed to the lower end face of the inner side wall of the sealing ring, and the inner flange is fastened to the lower end face of the sealing adhesive.

[0008] A further feature of this invention is that a contact rod sleeve is fitted inside the sleeve edge, and a contact rod through hole is opened through the plate surface of the contact rod sleeve. Both electrode contact rods are fitted inside the contact rod through hole. The upper end face of the contact rod sleeve is attached to the lower end face of the lamp holder, and the upper end face of the adhesive sealing ring is attached to the lower end face of the contact rod sleeve.

[0009] A further feature of this invention is that the lower end face of the electrode contact rod is provided with an internal threaded channel.

[0010] A further configuration of this invention is that the chip includes a base, an N-type semiconductor, and a P-type semiconductor. The base is fixedly attached to the inner bottom surface of the lamp holder, the N-type semiconductor is fixedly attached to the upper surface of the base, and the P-type semiconductor is fixedly attached to the upper surface of the N-type semiconductor. An electrode channel is formed through the surface of the N-type semiconductor, and two electrode channels are formed through the surface of the base. An electrode pin fixed at the lower end of the P-type semiconductor passes through the electrode channels on the N-type semiconductor and the base, and an electrode pin fixed at the lower end of the N-type semiconductor passes through the electrode channels on the surface of the base.

[0011] A further feature of this invention is that an injection hole is provided through the bottom surface of the lamp holder.

[0012] A further feature of this invention is that a lamp mirror is fixedly sleeved on the upper end of the lamp holder, and a heat-conducting column is fixedly provided on the lower end surface of the lamp mirror, with the lower end surface of the heat-conducting column fixedly attached to the upper end surface of the P-type semiconductor.

[0013] A further feature of this invention is that a set of heat dissipation fins are fixedly arranged in a circumferential array on the outer side wall of the upper end face of the lamp holder.

[0014] This utility model has the following beneficial effects:

[0015] 1. This utility model eliminates the traditional welding step by setting a sealing adhesive inside the sleeve and using the insertion seam on the sealing adhesive for external pins to be inserted to connect with the electrode contact rod. This effectively avoids the thermal damage that the high temperature generated by welding may cause to the internal chip and packaging structure of the lamp bead. At the same time, it simplifies the installation process and improves the reliability and lifespan of the lamp bead.

[0016] 2. This utility model, by setting the sealing ring and its lower inner edge, together with the contact rod sleeve and sealing adhesive, forms a multi-layer composite sealing structure at the bottom of the lamp holder. It can physically and tightly wrap the electrode contact rod and block its passage path, significantly enhancing the sealing performance of the bottom of the lamp bead, effectively preventing moisture from entering from the joint of the electrode contact rod, thereby greatly improving the waterproof and moisture-proof ability of the lamp bead and its working stability in harsh environments. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a side cross-sectional view of a waterproof LED bead with good sealing properties.

[0019] Figure 2 This is an exploded view of the lamp holder and sealing adhesive.

[0020] Figure 3 This is a schematic diagram of the chip structure.

[0021] Figure 4 This is a schematic diagram of the chip and lamp holder.

[0022] Figure 5 This is an exploded view of the lamp holder and the lamp mirror.

[0023] The attached diagram lists the components represented by each number as follows:

[0024] 1-Lamp holder, 101-Flange, 101a-Glue sealing ring, 101a-1-Inner flange, 101b-Sealing glue, 101b-1-Insertion seam, 101c-Contact rod sleeve, 101c-1-Contact rod through hole, 102-Glue injection hole, 103-Lamp lens, 103a-Heat conduction column, 104-Heat dissipation fin, 2-Chip, 201-Base, 202-N-type semiconductor, 203-P-type semiconductor, 3-Electrode contact rod. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. Example

[0026] Please see Figures 1 to 5 This utility model is a waterproof LED lamp bead with good sealing performance, including lamp holder 1, chip 2 and electrode contact rod 3;

[0027] The lamp holder 1 is a cylindrical shell made of high-temperature resistant engineering plastic. A bowl-shaped groove is opened on the upper surface of the lamp holder 1, and the chip 2 is fixedly set at the bottom of the groove.

[0028] There are two electrode contact rods 3, which are made of copper alloy and are fixedly installed on the bottom surface of the lamp holder 1. The two electrode contact rods 3 are respectively connected to the two electrode pins of the chip 2.

[0029] A sleeve 101 is fixedly provided on the lower end face of the lamp holder 1. A sealing ring 101a is fixedly sleeved inside the sleeve 101. A sealing adhesive 101b is fixedly sleeved inside the sealing ring 101a. The upper end face of the sealing adhesive 101b is attached to the lower end face of the two electrode contact rods 3. A joint seam 101b-1 runs through the end face of the sealing adhesive 101b.

[0030] Specifically, chip 2 includes a base 201, an N-type semiconductor 202, and a P-type semiconductor 203; the base 201 is a ceramic substrate, which is fixedly attached to the inner bottom surface of the lamp holder 1 by thermally conductive adhesive; the N-type semiconductor 202 and the P-type semiconductor 203 are stacked sequentially on the upper surface of the base 201 by eutectic bonding process to form the LED chip core.

[0031] Furthermore, a 0.5mm diameter injection hole 102 is formed through the center of the bottom surface of the lamp holder 1 for injecting encapsulating adhesive; a lamp lens 103 is fixedly sleeved on the upper end of the lamp holder 1. The lamp lens 103 is a convex lens structure made of high light transmittance silicone material. A heat-conducting pillar 103a with a diameter of 1mm is fixed on its lower end surface. The lower surface of the heat-conducting pillar 103a is directly attached to the upper surface of the P-type semiconductor 203 to achieve efficient heat conduction.

[0032] Furthermore, a set of heat dissipation fins 104 are fixed in a circumferential array on the outer side wall of the upper end face of the lamp holder 1 to enhance heat dissipation efficiency.

[0033] Furthermore, an inner buckle 101a-1 is fixed to the lower end face of the inner wall of the sealing ring 101a, and the inner buckle 101a-1 is fastened to the lower end face of the sealing adhesive 101b, thereby fixing the sealing adhesive 101b.

[0034] Furthermore, a contact rod sleeve 101c is fitted inside the sleeve 101. A contact rod through hole 101c-1 is opened through the plate surface of the contact rod sleeve 101c. Both electrode contact rods 3 are fitted inside the contact rod through hole 101c-1. The upper end face of the contact rod sleeve 101c is attached to the lower end face of the lamp holder 1. The upper end face of the adhesive sealing ring 101a is attached to the lower end face of the contact rod sleeve 101c.

[0035] The operation process in this embodiment is as follows:

[0036] During production and assembly, the substrate 201, N-type semiconductor 202, and P-type semiconductor 203 of chip 2 are first stacked and spliced ​​sequentially, and then fixed by thermoforming. Hot-melt epoxy resin is injected into the electrode channels of the substrate 201 and the N-type semiconductor 202 to form preliminary insulation.

[0037] The assembled chip 2 is installed onto the inner bottom surface of the lamp holder 1, so that the electrode leads at the lower ends of the N-type semiconductor 202 and the P-type semiconductor 203 pass through the electrode channels on the bottom surface of the lamp holder 1. Two electrode contacts 3 are fixedly mounted on the lower end surface of the lamp holder 1 using a reflow soldering process and are electrically connected to the two electrode leads respectively.

[0038] The lamp lens 103 is pressed into the upper end of the lamp holder 1, so that the heat-conducting pillar 103a is in close contact with the upper surface of the P-type semiconductor 203. Transparent epoxy encapsulant is injected through the injection hole 102 to fill the internal space of the lamp holder 1, and after curing, a protective layer is formed.

[0039] Finally, insert the contact rod sleeve 101c into the sleeve edge 101, so that the contact rod through hole 101c-1 fits over the outside of the two electrode contact rods 3. Press the sealing adhesive 101b into the sealing ring 101a, and then insert the assembled sealing ring 101a into the sleeve edge 101, ensuring that the upper end face of the sealing adhesive 101b is tightly attached to the lower end face of the electrode contact rod 3, and lock the sealing adhesive 101b with the inner buckle edge 101a-1;

[0040] In use, insert the two external leads into the insertion joint 101b-1 of the sealing adhesive 101b until they contact the threaded channel at the lower end of the electrode contact rod 3, and tighten them to achieve a reliable electrical connection. After the leads are inserted, the insertion joint 101b-1 tightly wraps around the lead surface by elastic deformation, forming a radial seal;

[0041] When powered on, chip 2 emits light, and heat is conducted through heat-conducting pillar 103a to lamp mirror 103 and heat dissipation fins 104. When the LED bead is in a humid environment, the sealing adhesive 101b and sealing ring 101a form a multi-layer sealing barrier, effectively preventing moisture from penetrating along the electrode contact rod 3 and avoiding electrode short circuits.

[0042] This embodiment achieves reliable waterproofing of the electrode contact area through a composite sealing structure of sleeve, sealing ring and elastic sealing adhesive. The plug joint design ensures convenient connection of external pins and ensures sealing performance. The combination of heat-conducting pillar and heat dissipation fins optimizes heat dissipation efficiency and extends the life of the LED.

[0043] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A waterproof LED bead with good sealing performance, comprising a lamp holder (1), a chip (2), and two electrode contacts (3), characterized in that: The lamp holder (1) has a bowl-shaped groove on its upper surface. The chip (2) is located at the bottom of the lamp holder (1). The two electrodes of the chip (2) penetrate the bottom surface of the lamp holder (1). The two electrode contact rods (3) are fixedly located on the bottom surface of the lamp holder (1) and are respectively connected to the two electrodes of the chip (2). The lower surface of the lamp holder (1) is fixedly provided with a sleeve (101). A sealing ring (101a) is fixedly sleeved in the sleeve (101). A sealing glue (101b) is fixedly sleeved in the sealing ring (101a). The upper surface of the sealing glue (101b) is attached to the lower surface of the two electrode contact rods (3). A joint seam (101b-1) is passed through the end surface of the sealing glue (101b).

2. The waterproof LED bead with good sealing performance according to claim 1, characterized in that: The inner sidewall of the sealing ring (101a) is fixed with an inner buckle (101a-1), which is fastened to the lower end face of the sealing adhesive (101b).

3. The waterproof LED bead with good sealing performance according to claim 2, characterized in that: The sleeve (101) is fitted with a contact rod sleeve (101c). A contact rod through hole (101c-1) is opened through the plate surface of the contact rod sleeve (101c). The two electrode contact rods (3) are fitted into the contact rod through hole (101c-1). The upper end face of the contact rod sleeve (101c) is attached to the lower end face of the lamp holder (1). The upper end face of the sealing ring (101a) is attached to the lower end face of the contact rod sleeve (101c).

4. A waterproof LED bead with good sealing performance according to claim 3, characterized in that: The lower end face of the electrode contact rod (3) is provided with an internal threaded channel.

5. A waterproof LED bead with good sealing performance according to claim 1, characterized in that: The chip (2) includes a base (201), an N-type semiconductor (202), and a P-type semiconductor (203). The base (201) is fixedly attached to the inner bottom surface of the lamp holder (1). The N-type semiconductor (202) is fixedly attached to the upper surface of the base (201). The P-type semiconductor (203) is fixedly attached to the upper surface of the N-type semiconductor (202). An electrode channel is formed through the plate surface of the N-type semiconductor (202). Two electrode channels are formed through the plate surface of the base (201). The electrode pins fixed at the lower end of the P-type semiconductor (203) pass through the electrode channels on the N-type semiconductor (202) and the base (201). The electrode pins fixed at the lower end of the N-type semiconductor (202) pass through the electrode channels on the plate surface of the base (201).

6. A waterproof LED bead with good sealing performance according to claim 5, characterized in that: The bottom surface of the lamp holder (1) is provided with a glue injection hole (102).

7. A waterproof LED bead with good sealing performance according to claim 6, characterized in that: The lamp holder (1) is fixedly fitted with a lamp mirror (103) at its upper end. A heat-conducting column (103a) is fixedly provided on the lower end surface of the lamp mirror (103). The lower end surface of the heat-conducting column (103a) is fixedly attached to the upper end surface of the P-type semiconductor (203).

8. A waterproof LED bead with good sealing performance according to claim 7, characterized in that: A set of heat dissipation fins (104) are fixedly arranged in a circumferential array on the outer side wall of the upper end face of the lamp holder (1).

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