Direct-cooling single-system refrigerator
By using a central beam integrated semiconductor module and switching circuit in the refrigerator, combined with a microporous guide plate and reflective film, efficient switching between the hot and cold ends is achieved, solving the problem of low temperature regulation efficiency in the refrigerator compartment of a direct-cooling single-system refrigerator, and improving temperature stability and food preservation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHANGHONG MEILING CO LTD
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-14
Smart Images
Figure CN224498886U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of refrigeration equipment technology, and in particular to a direct-cooling single-system refrigerator. Background Technology
[0002] Refrigerators, as household appliances, are used for food preservation and storage, maintaining a constant temperature environment within a suitable range to optimize preservation. The quality of food preservation depends on stable temperature; fluctuations prevent spoilage, such as bacterial growth in meat or damage to fruits and vegetables. High temperatures exacerbate problems like insufficient cooling in the refrigerator compartment, frequent temperature rebounds during shutdowns, and large temperature fluctuations. Users demand improved temperature stability in the refrigerator compartment to reduce food safety risks.
[0003] The direct-cooling single-system refrigerator prioritizes the cooling needs of the freezer compartment through the refrigerant circulation pipeline, with the compressor and evaporator forming the basic refrigeration structure; to address the overcooling phenomenon in low-temperature environments, a compensating heating wire structure is added to the refrigerator compartment to provide auxiliary heat.
[0004] However, the refrigeration pipes and heating wires are separate structures. At high ambient temperatures, the refrigerant cannot efficiently transfer cold energy to the refrigerator compartment, resulting in insufficient cooling and increased refrigeration energy consumption. At low ambient temperatures, the heating wires can only provide heat in one direction and cannot replenish cold energy in the opposite direction. This separation of cooling and heating functions prevents the refrigerator compartment from switching between heat and cold sources, leading to low temperature regulation efficiency. Utility Model Content
[0005] This application provides a direct-cooling single-system refrigerator to solve the problem of low temperature regulation efficiency.
[0006] This application provides a direct-cooling single-system refrigerator, including:
[0007] The central beam is disposed between the refrigerator compartment and the freezer compartment;
[0008] A semiconductor module is disposed inside the central beam. The semiconductor module includes a cold end and a hot end, wherein the cold end faces the cold compartment and the hot end is disposed inside the insulation foam layer of the central beam.
[0009] The switching circuit is configured to switch the orientation of the cold and hot ends of the semiconductor module.
[0010] By integrating semiconductor modules and switching circuits in the central beam, the direction of switching between the cold and hot ends can be achieved, thereby improving the temperature regulation efficiency.
[0011] In some feasible embodiments, it also includes:
[0012] A microporous flow guide plate is disposed on the side of the semiconductor module facing the cold storage compartment;
[0013] The microporous flow guide plate is provided with a plurality of gradient-distributed micropores. The microporous flow guide plate includes an upper region and a lower region, the upper region facing the hot end and the lower region facing the cold end.
[0014] The microporous baffle plate features a gradient distribution of micropores that guide airflow. The upper region draws in hot air, while the lower region slowly releases cold air, thus improving the heat exchange efficiency of the refrigerator compartment.
[0015] In some feasible embodiments, the edge of the microporous guide plate is provided with a snap-fit protrusion structure;
[0016] The inner liner of the refrigerator compartment is provided with a slot, which is movably connected to the buckle protrusion structure;
[0017] The buckle protrusion is connected to the refrigerator compartment through the slot.
[0018] The buckle protrusions and the slots work together to fix the micro-hole guide plate, preventing vibration displacement and ensuring that the gradient micro-holes are aligned with the cold end for a long time.
[0019] In some feasible embodiments, the micropore density of the upper region is greater than the micropore density of the lower region;
[0020] The hole spacing in the upper region is a first value, and the hole spacing in the lower region is a second value, wherein the second value is a preset multiple of the first value.
[0021] The high-density micropores in the upper region accelerate the intake of hot air, while the low-density micropores in the lower region promote the sinking of cold air, thus enhancing the uniform distribution of temperature.
[0022] In some feasible embodiments, it also includes:
[0023] A reflective film is disposed on the top panel of the refrigerator compartment;
[0024] The reflectivity of the reflective film is greater than a preset value;
[0025] When the cold end is refrigerated, infrared electromagnetic waves are released, and the reflective film reflects the infrared electromagnetic waves to one end of the refrigerator compartment away from the cold end.
[0026] The reflective film reflects the radiation from the cold end to the far end of the cold storage compartment, expanding the coverage of cold air and reducing the temperature difference between the top and bottom.
[0027] In some feasible embodiments, the semiconductor module further includes a semiconductor wafer;
[0028] The cold end and the hot end are heat-conducting plates. One end of the semiconductor chip is connected to the cold end through a heat-conducting medium, and the other end of the semiconductor chip is connected to the hot end through a heat-conducting medium.
[0029] The heat-conducting plate connects the semiconductor chip through a heat-conducting medium, ensuring efficient heat conduction between the cold and hot ends and maintaining the operational stability of the semiconductor module.
[0030] In some feasible embodiments, the switching circuit is an H-bridge circuit;
[0031] The H-bridge circuit includes four switching elements, which are connected in an H-shaped topology.
[0032] The output terminal of the H-bridge circuit is electrically connected to the semiconductor module;
[0033] The H-bridge circuit switches the orientation of the cold and hot ends of the semiconductor module by switching the current direction.
[0034] The H-bridge circuit switches the current direction to change the cold and hot ends, enabling rapid switching between cooling and heating modes.
[0035] In some feasible embodiments, the refrigerator compartment includes a refrigerator liner;
[0036] The cold end is provided with a first through hole, and the cold end is connected to the refrigerator inner liner through the first through hole;
[0037] The hot end is provided with a second through hole, which is connected to the first through hole.
[0038] The through-hole structure connects the cold end, hot end, and refrigerated inner liner, enhancing the mechanical stability of the semiconductor module.
[0039] In some feasible embodiments, a through cavity is provided in the central beam, and the through cavity extends along the separation direction between the refrigerator compartment and the freezer compartment;
[0040] The axial centerline of the semiconductor module coincides with the central axis of the through cavity;
[0041] An insulating foam layer is provided inside the through cavity, and the insulating foam layer covers the hot end.
[0042] The cavity is filled with an insulating foam layer covering the hot end, which isolates the heat transfer between the refrigerator compartment and the freezer compartment and blocks temperature crosstalk.
[0043] In some feasible embodiments, a crossbeam is provided between the refrigerator compartment and the freezer compartment, and a central beam is disposed on the crossbeam. The crossbeam supports the central beam, strengthening the structural rigidity and improving the overall stability of the refrigerator.
[0044] As can be seen from the above technical solutions, this application provides a direct-cooling single-system refrigerator, including a center beam, a semiconductor module, and a switching circuit. The center beam is disposed between the refrigerator compartment and the freezer compartment. The semiconductor module is disposed inside the center beam and includes a cold end and a hot end, wherein the cold end faces the refrigerator compartment, and the hot end is disposed within the insulation layer of the center beam. The switching circuit is configured to switch the orientation of the cold end and the hot end of the semiconductor module. By integrating the semiconductor module and the switching circuit into the center beam, the orientation of the cold end and the hot end can be switched, thereby improving temperature regulation efficiency. Attached Figure Description
[0045] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0046] Figure 1 This is a schematic diagram of the structure of a direct-cooling single-system refrigerator provided in an embodiment of this application;
[0047] Figure 2 This is a schematic diagram of the structure of a semiconductor module provided in an embodiment of this application;
[0048] Figure 3 This is a schematic diagram of the structure of the microporous flow guide plate provided in the embodiments of this application;
[0049] Figure 4 A comparative schematic diagram of the upper and lower regions of the microporous guide plate provided in the embodiments of this application.
[0050] Among them, 100-refrigeration compartment, 200-freezer compartment, 300-semiconductor module, 310-cold end, 320-hot end, 330-micro-perforated guide plate, 340-first through hole, 350-semiconductor chip, 400-evaporator, 510-upper surface of the middle beam, 520-lower surface of the middle beam, and 610-reflective film. Detailed Implementation
[0051] The embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described below do not represent all embodiments consistent with this application. They are merely examples of systems and methods consistent with some aspects of this application as detailed in the claims.
[0052] like Figure 1As shown in the illustration, this application provides a direct-cooling single-system refrigerator. The single-system refrigerator is equipped with an evaporator 400, which is located on the side of the freezer compartment 200. The refrigerator includes a central beam, a semiconductor module 300, and a switching circuit. The central beam is located between the refrigerator compartment 100 and the freezer compartment 200, for example, as a partition structure between the refrigerator compartment 100 and the freezer compartment, used to physically separate the two compartments and provide an installation carrier, and has an internal receiving cavity.
[0053] In some embodiments, a crossbeam is provided between the refrigerator compartment 100 and the freezer compartment 200, and a middle beam is provided on the crossbeam. The crossbeam is a horizontal load-bearing structure between the refrigerator compartment 100 and the freezer compartment 200, extending along the width direction of the refrigerator, and is used to support the middle beam. The bottom of the middle beam can be fixedly connected to the upper surface of the crossbeam through a mechanical interface.
[0054] like Figure 2 As shown, a semiconductor module 300 is provided inside the central beam. The semiconductor module 300 includes a cold end 310 and a hot end 320. The cold end 310 faces the cold compartment 100, and the hot end 320 is disposed in the insulation layer of the central beam. The cold end 310 releases cold energy towards the cold compartment 100, and the hot end 320 dissipates heat within the insulation layer of the central beam.
[0055] In some embodiments, the central beam includes an upper surface 510, a lower surface 520, and a through cavity for accommodating the semiconductor module 300 and insulation material. The through cavity extends along the separation direction between the refrigerator compartment 100 and the freezer compartment 200. The axial centerline of the semiconductor module 300 coincides with the central axis of the through cavity, ensuring that the module is centrally located within the cavity with uniform gaps in all directions. An insulation foam layer is provided within the through cavity. The insulation foam layer is a closed-cell polyurethane foam material filled within the through cavity, covering the hot end 320 and sidewalls of the semiconductor module 300 to block the heat transfer path.
[0056] When the hot end 320 of the semiconductor module 300 is working, the heat generated is confined within the cavity by the insulation bubble layer. The heat is conducted through the bubble layer to the outer shell of the central beam, and then dissipated to the external environment through the surface of the shell. When the cold end 310 is working, the cold energy released directly affects the space of the cold storage compartment 100 without any heat leakage interference.
[0057] In some embodiments, the semiconductor module 300 further includes a semiconductor chip 350, which, when energized, has a hot and cold end 320 that switches according to the direction of the current. The semiconductor chip 350 is a Peltier effect thermoelectric conversion device, which, when energized, achieves the function of absorbing heat on one side (cold end 310) and releasing heat on the other side (hot end 320) based on the direction of the current. It has a thickness of 1-3 mm and is covered with an insulating layer.
[0058] The cold end 310 and the hot end 320 are heat-conducting plates. One end of the semiconductor chip 350 is connected to the cold end 310 through a thermally conductive medium, and the other end of the semiconductor chip 350 is connected to the hot end 320 through a thermally conductive medium. The thermally conductive medium is a highly thermally conductive material filling the interface between the semiconductor chip 350 and the heat-conducting plate, used to eliminate contact gap thermal resistance and ensure efficient heat conduction.
[0059] The semiconductor chip 350 is disposed between the cold end 310 and the hot end 320. The heat-conducting plate of the cold end 310 is attached to the surface of the inner liner of the refrigerator compartment 100, and the heat-conducting plate of the hot end 320 is embedded in the central beam insulation layer. The heat-conducting medium fills the microscopic gaps to form a continuous heat conduction path.
[0060] When a forward current is applied to the switching circuit, the cold side of semiconductor chip 350 absorbs heat, and the heat is conducted through the thermal medium to the heat-conducting plate at the cold end 310, reducing the temperature of the cold compartment 100; the hot side releases heat, and the heat is conducted through the thermal medium to the heat-conducting plate at the hot end 320 and dissipated outwards from the center beam. When the current is reversed, the hot and cold functions are interchanged. The thermal medium eliminates interfacial air gaps, improving heat transfer efficiency.
[0061] For example, under high ambient temperature conditions, the forward current causes the cold side of the semiconductor chip 350 to absorb heat, lowering the temperature of the cold-end heatsink 310 to -5°C, where the cold energy is rapidly dissipated through the heat transfer medium. Meanwhile, the temperature of the hot-end heatsink 320 rises to 45°C, and the heat is conducted through the medium to the central beam insulation layer for outward diffusion. By filling the gaps with the heat transfer medium, the interfacial thermal resistance between the semiconductor chip 350 and the heatsink is eliminated, improving the temperature difference conduction efficiency at the hot and cold ends 320. The cold-end heatsink 310 rapidly dissipates cold energy to maintain a low temperature of 100°C in the cold compartment, while the hot-end heatsink 320 efficiently dissipates heat, preventing the semiconductor chip 350 from overheating and failing, thus extending the module's lifespan.
[0062] The switching circuit is configured to switch the orientation of the cold end 310 and the hot end 320 of the semiconductor module 300. The switching circuit is a circuit topology that switches the orientation of the semiconductor module 300 for both hot and cold functions by changing the direction of current flow.
[0063] In some embodiments, the switching circuit is an H-bridge circuit; the H-bridge circuit includes four switching elements, which are connected in an H-shaped topology; the output terminal of the H-bridge circuit is electrically connected to the semiconductor module 300; the H-bridge circuit switches the orientation of the cold end 310 and the hot end 320 of the semiconductor module 300 by switching the current direction.
[0064] The H-bridge circuit is a circuit topology consisting of four switching elements. The output is connected to the electrodes of the semiconductor module 300, and the current direction is switched by changing the switching state. Its printed circuit board is integrated inside the central beam, reducing wire length. The switching elements are semiconductor devices that control current flow, including MOSFETs or IGBTs. The gate receives the drive signal, and the source or drain forms the current path. The four elements are divided into two pairs of arms, forming an H-shaped current channel. In the H-shaped topology, the switching elements are arranged in an H-shape, with the left upper and lower switches forming the first bridge arm, and the right upper and lower switches forming the second bridge arm. The semiconductor module 300 is connected between the midpoints of the left and right bridge arms.
[0065] The H-bridge circuit printed circuit board is housed within the central beam cavity, with four switching elements soldered in an H-shaped topology. The first and fourth switches are connected in series to form the left bridge arm, and the second and third switches are connected in series to form the right bridge arm. The positive and negative electrodes of the semiconductor module 300 are connected to the midpoint output terminals of the left and right bridge arms, respectively. The drive signal lines are led from the controller to the switch gates.
[0066] When the first and fourth switches are on, current flows from the positive terminal, through the first switch, the positive terminal of semiconductor module 300, the negative terminal of the module, the fourth switch, and back to the negative terminal, forming a forward current path, resulting in cooling at the cold end 310. When the second and third switches are on, current flows from the positive terminal, through the second switch, the negative terminal of semiconductor module 300, back to the positive terminal of the module, the third switch, and back to the negative terminal, forming a reverse current path, resulting in heating at the hot end 320. The on / off state of the switches is controlled by a drive signal.
[0067] For example, when the cold compartment 100 needs to be cooled, the controller sends a high-level drive signal to the first and fourth switch gates, which conduct to form a forward current, and the cold end 310 of the semiconductor module 300 absorbs heat and cools down. When overcooling needs to be prevented, the controller sends a high-level signal to the second and third switch gates, which conduct to form a reverse current, and the hot end 320 of the module releases heat and heats up.
[0068] The H-shaped topology switch layout enables rapid current switching of the semiconductor module at 300°C, and improves the response speed of function switching between hot and cold ends at 320°C. Four switching elements are directly integrated inside the central beam, shortening the power loop and reducing losses. The physical topology avoids the wear and tear of mechanical contacts in traditional relays, extending circuit life.
[0069] When the refrigerator is powered on, the switching circuit changes the direction of the output current. If the current flows from the positive terminal to the first electrode of the semiconductor module 300, the cold end 310 absorbs heat to cool the refrigerator compartment 100. If the current flows in the opposite direction, the hot end 320 releases heat to supplement the temperature rise of the refrigerator compartment 100. The cold end 310 acts directly on the refrigerator compartment 100 space through thermal radiation and natural convection, while the heat from the hot end 320 is blocked by the central beam insulation layer and diffuses to the external environment.
[0070] For example, in high ambient temperature scenarios, the switching circuit outputs a forward current to cool the cold end 310, thus lowering the temperature of the refrigerator compartment 100; in low ambient temperature scenarios, the switching circuit outputs a reverse current to heat the hot end 320, preventing the refrigerator compartment 100 from becoming too cold. The entire process relies on the physical thermoelectric conversion characteristics of the semiconductor module 300, without the need for a compressor to intervene in refrigerator temperature regulation.
[0071] The 300 semiconductor module with 320-degree switching between hot and cold ends resolves the technical contradiction of insufficient cooling in single-system refrigerators at high ambient temperatures and excessive cooling at low ambient temperatures, eliminating the defect that traditional compensating heating wires cannot supplement the cooling capacity.
[0072] like Figure 3 As shown, in some embodiments, the method further includes a microporous flow guide plate 330, which is a metal plate structure disposed on the side of the semiconductor module 300 facing the refrigerator compartment 100. The surface is provided with a microporous array to guide the airflow movement in the refrigerator compartment 100. The material can be a thermally conductive metal, which conducts the temperature of the cold end 310 of the semiconductor module 300 through physical contact.
[0073] The microporous guide plate 330 is provided with multiple gradient-distributed micropores. The micropores are non-uniformly arranged on the surface of the guide plate. The pores have the same diameter but different densities, forming airflow regulation functional zones.
[0074] like Figure 4 As shown, the microporous guide plate 330 includes an upper region and a lower region. The upper region faces the hot end 320, and the lower region faces the cold end 310. With the center of the guide plate as the boundary, the part closer to the hot end 320 is the upper region, and the part closer to the cold end 310 is the lower region. The difference in micropore density between the two regions enables the accelerated intake of hot air and the slow release of cold air.
[0075] Figure 4 In the diagram, 4a represents the upper region and 4b represents the lower region. In some embodiments, the micropore density of the upper region is greater than that of the lower region. The pore spacing of the upper region is a first value, and the pore spacing of the lower region is a second value. The second value is a preset multiple of the first value, forming a density gradient ratio.
[0076] The preset multiplier can be 2. For example, with a first-value aperture spacing of 3mm, there are approximately 11 micropores per square centimeter in the upper region; with a second-value aperture spacing of 6mm, there are approximately 2.8 micropores per square centimeter in the lower region. Hot air is rapidly cooled through the dense apertures in the upper region, while cold air is slowly released and sinks through the sparse apertures in the lower region.
[0077] The upper region has micropores evenly distributed according to a first-value pore spacing, while the lower region has micropores distributed according to a second-value pore spacing, with the second value being a preset multiple of the first value. The high-density micropores in the upper region shorten the airflow path and accelerate the intake of hot air; the low-density micropores in the lower region lengthen the diffusion path of cold air and increase residence time. The preset pore spacing multiple establishes a quantitative density gradient, with the smaller pore spacing in the upper region improving heat exchange efficiency and the larger pore spacing in the lower region promoting uniform diffusion of cold air. The physical parameters match the airflow dynamics requirements of the 100-degree cold storage compartment.
[0078] The microporous flow guide plate 330 is mounted on the surface of the cold end 310 of the semiconductor module 300, and its planar extension direction is parallel to the space of the cold storage compartment 100. The upper region of the flow guide plate corresponds to the projected position of the hot end 320 of the semiconductor module 300, with densely distributed micropores; the lower region corresponds to the projected position of the cold end 310, with sparsely distributed micropores. The overall thickness of the flow guide plate is uniform, and the micropores penetrate the plate to form airflow channels.
[0079] When the cold end 310 of the semiconductor module 300 is cooled, the temperature of the guide plate decreases. Hot air inside the cold compartment 100 rises to the top due to density difference and is rapidly drawn into the surface of the guide plate through the dense micropores in the upper region; cold air, due to its increased density, sinks and is slowly released into the lower middle part of the cold compartment 100 through the sparse micropores in the lower region. The high-density micropores in the upper region improve heat exchange efficiency, while the low-density micropores in the lower region prolong the residence time of cold air.
[0080] For example, when the temperature at the top of the cold storage compartment 100 is high, hot air is quickly drawn in by the dense micropores at the top, and after contacting the low-temperature guide plate, the heat energy is conducted to the semiconductor module 300; the cooled air is slowly released through the sparse micropores at the bottom, avoiding direct cold air blowing and causing local overcooling.
[0081] By employing gradient micropores, the refrigerator compartment 100 achieves self-organized airflow circulation by utilizing natural air convection. The dense micropores in the upper region accelerate the replacement of hot air at the top, solving the problem of heat accumulation at the top of traditional refrigerators; the sparse micropores in the lower region promote the uniform diffusion of cold air, eliminating the temperature difference between the upper and lower layers of the refrigerator compartment 100. The air guide plate is in direct contact with the cold end 310 of the semiconductor module 300, improving temperature uniformity without the need for additional energy consumption.
[0082] In some embodiments, the refrigerator compartment 100 includes a refrigerator liner, which is the inner shell of the refrigerator compartment 100, used to hold food and provide a heat insulation barrier, and the semiconductor module 300 can be connected to the refrigerator liner through through holes or snap-fit protrusions.
[0083] In some embodiments where the connection is via a through hole, the cold end 310 is provided with a first through hole 340, which is a through hole formed in the heat-conducting plate of the cold end 310, used to pass through a fastener to connect the cold end 310 to the refrigerator liner. The hot end 320 is provided with a second through hole, which is a through hole formed in the heat-conducting plate of the hot end 320, and is coaxially aligned with the first through hole 340, used to connect the hot end 320 and the cold end 310 through the same fastener.
[0084] Mounting holes are provided in the thick-walled area of the refrigerator liner. The cold end 310 heat-conducting plate is attached to the outer surface of the refrigerator liner, and the diameter of its first through hole 340 matches the standard fastener size; the hot end 320 heat-conducting plate is attached to the outer surface of the cold end 310 heat-conducting plate, and the second through hole is coaxially aligned with the first through hole 340. The fastener passes through the second through hole of the hot end 320 and the first through hole 340 of the cold end 310 in sequence, and is finally screwed into the screw hole of the refrigerator liner to form a three-layer connection.
[0085] In some embodiments, when connected via a snap-fit protrusion structure, the edge of the microporous guide plate 330 is provided with a snap-fit protrusion structure. The snap-fit protrusion structure is a protruding geometry on the edge of the microporous guide plate 330, including a sloping guide portion and a vertical locking portion, for mechanical interlocking with the slot, and the height and width match the slot size.
[0086] The inner surface of the refrigerator compartment 100 is provided with a slot, which is a groove structure on the surface of the inner liner of the refrigerator compartment 100, including an inlet ramp and a locking plane. The slot is movably connected to the buckle protrusion structure. By deforming to accommodate the buckle protrusion structure, it is fixed. The buckle protrusion structure can move vertically within the slot, but its horizontal movement is restricted by the locking part, forming a one-way disassembly and anti-loosening structure. The buckle protrusion is connected to the refrigerator compartment 100 through the slot.
[0087] During installation, the beveled surface of the buckle protrusion contacts the guide groove, and the vertical downward pressure of the guide plate causes the inner liner material to elastically deform. After the locking part passes the locking plane of the groove, the inner liner springs back to form a mechanical interlock.
[0088] In some embodiments, a reflective film 610 is further included, which is disposed on the top plate of the refrigerator compartment 100. For example, it is a layered structure attached to the top plate of the refrigerator compartment 100, including a substrate and a high-reflectivity metal coating, used to change the propagation direction of electromagnetic waves. The reflectivity of the reflective film 610 is greater than a preset value, wherein the preset value can be 85%, to ensure that most of the radiated energy is directionally reflected.
[0089] When the cold end 310 is cooling, it releases infrared electromagnetic waves. The reflective film 610 reflects these infrared electromagnetic waves to the end of the refrigerator compartment 100 furthest from the cold end 310. When the cold end 310 is cooling, it releases infrared radiation with a wavelength of 8-14 μm. The metal layer of the reflective film 610 changes its propagation path and refracts it into the space at the far end of the refrigerator compartment 100.
[0090] When the cold end 310 of the semiconductor module 300 is cooled, its surface temperature decreases, releasing infrared electromagnetic waves. These radiation waves propagate through the air in the cold storage compartment 100, and upon contact with the metal coating of the reflective film 610, are refracted towards the bottom of the cold storage compartment 100 according to the principle that the angle of incidence equals the angle of reflection. The reflective film 610 provides full coverage, ensuring no blind spots for radiation escape.
[0091] For example, when the cold end 310 is centrally cooled, infrared radiation reaches the top plate reflective film 610 directly. The metal coating reflects the radiation to the lower shelf area of the refrigerator compartment 100, which acts on the surface of fruits and vegetables to reduce the rate of molecular thermal motion. The reflection path extends the effective distance of cold radiation, covering corners that are difficult for traditional refrigerators to reach.
[0092] The directional reflection of infrared electromagnetic waves eliminates the 100° vertical temperature gradient in the refrigerator compartment, solving the structural defects of traditional refrigerators where the top is too cold and the bottom is too hot.
[0093] As can be seen from the above technical solution, this application provides a direct-cooling single-system refrigerator, including a center beam, a semiconductor module 300, and a switching circuit. The center beam is disposed between the refrigerator compartment 100 and the freezer compartment 200. The semiconductor module 300 is disposed inside the center beam and includes a cold end 310 and a hot end 320, wherein the cold end 310 faces the refrigerator compartment 100, and the hot end 320 is disposed within the insulation layer of the center beam. The switching circuit is configured to switch the orientation of the cold end 310 and the hot end 320 of the semiconductor module 300. By integrating the semiconductor module 300 and the switching circuit in the center beam, the orientation of the cold end 310 and the hot end 320 can be switched, thereby improving temperature regulation efficiency.
[0094] Similar parts between the embodiments provided in this application can be referred to mutually. The specific implementation methods provided above are only a few examples under the overall concept of this application and do not constitute a limitation on the scope of protection of this application. For those skilled in the art, any other implementation methods extended from the solution of this application without creative effort shall fall within the scope of protection of this application.
Claims
1. A direct-cooling single-system refrigerator, characterized in that, include: The central beam is disposed between the refrigerator compartment and the freezer compartment; A semiconductor module is disposed inside the central beam. The semiconductor module includes a cold end and a hot end, wherein the cold end faces the cold compartment and the hot end is disposed inside the insulation foam layer of the central beam. The switching circuit is configured to switch the orientation of the cold and hot ends of the semiconductor module.
2. The direct-cooling single-system refrigerator according to claim 1, characterized in that, Also includes: A microporous flow guide plate is disposed on the side of the semiconductor module facing the cold storage compartment; The microporous flow guide plate is provided with a plurality of gradient-distributed micropores. The microporous flow guide plate includes an upper region and a lower region, the upper region facing the hot end and the lower region facing the cold end.
3. The direct-cooling single-system refrigerator according to claim 2, characterized in that, The edge of the microporous guide plate is provided with a snap-fit protrusion structure; The inner liner of the refrigerator compartment is provided with a slot, which is movably connected to the buckle protrusion structure; The buckle protrusion is connected to the refrigerator compartment through the slot.
4. The direct-cooling single-system refrigerator according to claim 2, characterized in that, The micropore density in the upper region is greater than that in the lower region; The hole spacing in the upper region is a first value, and the hole spacing in the lower region is a second value, wherein the second value is a preset multiple of the first value.
5. The direct-cooling single-system refrigerator according to claim 1, characterized in that, Also includes: A reflective film is disposed on the top panel of the refrigerator compartment; The reflectivity of the reflective film is greater than a preset value; When the cold end is refrigerated, infrared electromagnetic waves are released, and the reflective film reflects the infrared electromagnetic waves to one end of the refrigerator compartment away from the cold end.
6. The direct-cooling single-system refrigerator according to claim 1, characterized in that, The semiconductor module also includes a semiconductor chip; The cold end and the hot end are heat-conducting plates. One end of the semiconductor chip is connected to the cold end through a heat-conducting medium, and the other end of the semiconductor chip is connected to the hot end through a heat-conducting medium.
7. The direct-cooling single-system refrigerator according to claim 1, characterized in that, The switching circuit is an H-bridge circuit; The H-bridge circuit includes four switching elements, which are connected in an H-shaped topology. The output terminal of the H-bridge circuit is electrically connected to the semiconductor module; The H-bridge circuit switches the orientation of the cold and hot ends of the semiconductor module by switching the current direction.
8. The direct-cooling single-system refrigerator according to claim 1, characterized in that, The refrigerator compartment includes a refrigerator liner; The cold end is provided with a first through hole, and the cold end is connected to the refrigerator inner liner through the first through hole; The hot end is provided with a second through hole, which is connected to the first through hole.
9. The direct-cooling single-system refrigerator according to claim 1, characterized in that, A through cavity is provided inside the central beam, and the through cavity extends along the separation direction between the refrigerator compartment and the freezer compartment; The axial centerline of the semiconductor module coincides with the central axis of the through cavity; An insulating foam layer is provided inside the through cavity, and the insulating foam layer covers the hot end.
10. The direct-cooling single-system refrigerator according to claim 1, characterized in that, A crossbeam is provided between the refrigerator compartment and the freezer compartment, and the middle beam is provided on the crossbeam.