A rapid cooling device for epoxy resin production

Abstract

The utility model discloses a kind of quick cooling device for epoxy resin production, including cooling pool, the middle part passage is opened in the middle part of cooling pool, multiple fans are installed in the middle part passage, the inner chamber of cooling pool is provided with mounting plate, pipe joint is installed on the mounting plate, spiral cooling pipe is arranged in the inside of cooling pool, the top end of spiral cooling pipe is connected with pipe joint, and spiral cooling pipe other end is connected with discharge pipe, the lower part of cooling pool is provided with circulating pump. The utility model is scientific and reasonable in structure design, the heat of epoxy resin can be led to the heat dissipation fin of middle part passage under the action of heat conduction block, at this time, the heat dissipation fin can be cooled under the action of fan, and the purpose of resin cooling using double cooling mode is realized.

Description

Technical Field

[0001] This utility model relates to the technical field of epoxy resin cooling equipment, and in particular to a rapid cooling device for epoxy resin production. Background Technology

[0002] Epoxy resin is a high molecular weight polymer with the molecular formula (C11H12O3)n, referring to a class of polymers containing two or more epoxy groups in their molecules. In traditional cooling devices, epoxy resin is typically cooled using a single liquid cooling or air cooling method, such as relying solely on static coolant in a cooling tank for heat exchange. This results in slow cooling rates and heat accumulation in localized areas. Furthermore, some devices lack real-time temperature monitoring and circulating heat dissipation mechanisms, making it impossible to dynamically adjust cooling parameters according to production needs, further limiting the improvement of cooling efficiency. Therefore, we propose a rapid cooling device for epoxy resin production. Utility Model Content

[0003] To address the aforementioned problems, this invention provides a rapid cooling device for epoxy resin production. This invention solves the problems mentioned in the background section.

[0004] This utility model provides the following technical solution: a rapid cooling device for epoxy resin production, comprising a cooling pool, a central channel in the middle of the cooling pool, multiple fans installed in the central channel, an installation plate in the inner cavity of the cooling pool, a pipe joint installed on the installation plate, a spiral cooling pipe inside the cooling pool, the top end of the spiral cooling pipe connected to the pipe joint, and the other end of the spiral cooling pipe connected to a discharge pipe, a circulation pump in the lower part of the cooling pool, a vertically arranged lifting pipe connected to the top of the circulation pump, a nozzle at the end of the lifting pipe, a limiting clamp on the side wall of the spiral cooling pipe, and a heat-conducting block inside the limiting clamp, the heat-conducting block penetrating into the central channel, and several heat dissipation fins in the central channel.

[0005] In the above scheme, the top of the cooling pool is bolted to a top cover.

[0006] In the above scheme, the end of the discharge pipe extends to the outside of the cooling pool, and a discharge valve is provided on the discharge pipe.

[0007] In the above scheme, a temperature sensor is installed inside the cooling pool, and the temperature sensor is connected to the controller via a wire.

[0008] In the above scheme, there is a gap between adjacent heat dissipation fins, and the heat dissipation fins are in close contact with the heat-conducting block.

[0009] In the above scheme, a control switch and a power supply are installed outside the cooling pool.

[0010] In the above scheme, a solenoid valve is installed on the outside of the cooling pool.

[0011] The advantages and beneficial effects of this utility model are as follows: This utility model provides a rapid cooling device for epoxy resin production. By setting a spiral cooling pipe in the cooling tank, the epoxy resin can more effectively exchange heat with the coolant inside the cooling tank during the flow of the epoxy resin in the cooling pipe, which effectively improves the cooling efficiency. By setting a temperature sensor inside the cooling tank, the temperature can be monitored in real time. Under the action of the circulation pump, the liquid can be lifted upward through the riser pipe and sprayed out from the nozzle, thereby maintaining the fluidity of the liquid and further enhancing the heat exchange and cooling effect. Under the action of the heat-conducting block, the heat of the epoxy resin can be drawn out to the heat dissipation fins in the central channel. At this time, the heat dissipation fins can be cooled by the action of the fan, thus realizing the purpose of cooling the resin by using a dual cooling method. Attached Figure Description

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0015] Figure 3 This is a schematic diagram of the outer structure of this utility model.

[0016] In the diagram: 1. Cooling pool; 11. Central channel; 12. Fan; 13. Top cover; 14. Mounting plate; 15. Pipe joint; 16. Spiral cooling pipe; 17. Limiting clamp; 18. Heat-conducting block; 19. Discharge pipe; 2. Discharge valve; 21. Temperature sensor; 22. Circulation pump; 23. Lifting pipe; 24. Nozzle; 25. Heat dissipation fins; 26. Control switch; 27. Power supply; 28. Solenoid valve. Detailed Implementation

[0017] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.

[0018] like Figure 1-3As shown, this utility model is a rapid cooling device for epoxy resin production, including a cooling pool 1. A central channel 11 is formed in the middle of the cooling pool 1, and multiple fans 12 are installed within the central channel 11. An mounting plate 14 is provided inside the cooling pool 1, and a pipe connector 15 is installed on the mounting plate 14. Specifically, the pipe connector 15 is connected to a liquid driving mechanism such as an industrial pump, allowing the epoxy resin to flow effectively within a spiral cooling pipe 16. The spiral cooling pipe 16 is arranged inside the cooling pool 1. The top end of the pipe 16 is connected to the pipe joint 15, and the other end of the spiral cooling pipe 16 is connected to the discharge pipe 19. A circulation pump 22 is provided at the bottom of the cooling pool 1. A vertically arranged lifting pipe 23 is connected to the top of the circulation pump 22. A nozzle 24 is provided at the end of the lifting pipe 23. A limiting clamp 17 is provided on the side wall of the spiral cooling pipe 16, and a heat-conducting block 18 is provided inside the limiting clamp 17. The heat-conducting block 18 extends into the middle channel 11, and several heat dissipation fins 25 are provided in the middle channel 11.

[0019] The cooling efficiency is improved by the efficient heat exchange between the spiral cooling pipe 16 and the coolant: The spiral structure of the spiral cooling pipe 16 increases the contact area between the epoxy resin and the coolant, extends the heat exchange path, and allows the resin to release heat more fully during the flow process, thus improving the cooling efficiency compared with the traditional straight pipe cooling pipe.

[0020] The circulating pump 22 and the nozzle 24 work together to maintain the fluidity of the liquid: the circulating pump 22 delivers the coolant at the bottom of the cooling pool 1 to the nozzle 24 through the riser pipe 23, forming a top-down spraying effect, breaking the static stratification of the coolant, promoting the mixing of hot and cold liquids, making the temperature distribution in the cooling pool more uniform, and improving the heat transfer coefficient.

[0021] The heat-conducting block 18 and the heat dissipation fins 25 are combined to achieve dual heat dissipation: the heat-conducting block 18 conducts the heat of the spiral cooling pipe 16 to the heat dissipation fins 25 of the central channel 11, and with the forced air cooling of the fan 12, a dual heat dissipation system of "liquid cooling + air cooling" is formed, which can improve the cooling speed of the resin.

[0022] Temperature sensor 21 is linked with the controller to achieve intelligent temperature control: temperature sensor 21 monitors the temperature in cooling pool 1 in real time and feeds it back to the controller. By adjusting the speed of fan 12 and the power of circulating pump 22, the cooling process is automatically matched to the real-time heat dissipation needs of the resin to avoid overcooling or overheating.

[0023] The bolted connection design of the top cover 13 facilitates maintenance: the removable top cover 13 allows for quick inspection of the internal structure of the cooling pool 1, reducing maintenance costs and downtime.

[0024] Discharge valve 2 precisely controls the discharge rhythm: The discharge valve 2 on the discharge pipe 19 can precisely adjust the resin discharge speed according to the production process to avoid insufficient cooling due to excessive flow rate.

[0025] The spiral structure of the spiral cooling pipe 16 significantly increases the heat exchange area. Combined with the coolant circulation driven by the circulating pump 22, it forms a dynamic heat exchange system, which greatly improves efficiency compared to the traditional static cooling method. The heat conduction block 18 is made of a high thermal conductivity epoxy resin composite material (such as filled with boron nitride particles), which has a high thermal conductivity and ensures that heat is quickly conducted to the heat dissipation fins 25.

[0026] In the above scheme, the top of the cooling pool 1 is connected to a top cover 13 by bolts. The top cover 13 adopts a double-layer sealing design, with an inner layer of rubber sealing ring and an outer layer fastened by bolts, which effectively prevents coolant evaporation and external impurities from entering, while facilitating the disassembly and maintenance of the internal components of the cooling pool 1.

[0027] In the above scheme, the end of the discharge pipe 19 extends to the outside of the cooling pool 1, and a discharge valve 2 is provided on the discharge pipe 19. The discharge valve 2 is a ball valve structure, which can precisely control the discharge flow rate of epoxy resin and adjust it synchronously with the cooling process to ensure that the discharge temperature is stable within the target range.

[0028] In the above scheme, a temperature sensor 21 is installed inside the cooling pool 1, and the temperature sensor 21 is connected to the controller via a wire. The temperature sensor 21 adopts an NTC thermistor with an accuracy of ±0.5℃, and monitors the temperature of the coolant in the cooling pool 1 in real time. The controller automatically adjusts the speed of the fan 12 and the power of the circulation pump 22 according to a preset threshold to achieve closed-loop intelligent temperature control.

[0029] In the above scheme, a gap is provided between adjacent heat dissipation fins 25, and the heat dissipation fins 25 are in close contact with the heat conduction block 18. The heat dissipation fins 25 are made of aluminum, and the gap width is designed to be 5mm to create a turbulent flow effect and enhance the air convection heat dissipation effect. The fins and the heat conduction block 18 are connected by an interference fit, resulting in low contact thermal resistance and ensuring efficient heat transfer.

[0030] In the above scheme, a control switch 26 and a power supply 27 are externally installed on the cooling pool 1. The control switch 26 is integrated into the control panel and can independently control the start and stop of the fan 12, the circulating pump 22, and the temperature sensor 21. The power supply 27 is a 220V / 50Hz standard power supply, providing stable power support.

[0031] In the above scheme, a solenoid valve 28 is installed on the outside of the cooling pool 1. The solenoid valve 28 is connected to an external coolant supply pipeline. When the liquid level in the cooling pool 1 is lower than a preset value, the controller automatically opens the solenoid valve 28 to replenish the coolant, ensuring the continuous and stable operation of the cooling system.

[0032] Working principle:

[0033] This rapid cooling device for epoxy resin production involves injecting epoxy resin into a spiral cooling pipe 16 through a pipe joint 15, allowing it to flow slowly downwards along a spiral path. Coolant (such as water or heat transfer oil) is pre-filled into the cooling pool 1. During the flow, the resin undergoes its first heat exchange with the coolant through the pipe wall, resulting in an initial temperature reduction. After the circulation pump 22 starts, the low-temperature coolant at the bottom of the cooling pool 1 is transported to the nozzle 24 through the riser pipe 23. The coolant is then evenly sprayed from the nozzle 24 onto the upper part of the cooling pool 1, forming a top-down circulating flow. The dynamically flowing coolant makes full contact with the outer wall of the spiral cooling pipe 16, further absorbing heat from the resin and breaking up static stratification, resulting in a more uniform temperature distribution within the cooling pool. The heat-conducting blocks 18 on the outer wall of the spiral cooling pipe 16 continuously absorb heat from the resin and provide secondary heat dissipation through the heat dissipation fins 25 in the central channel 11. A fan 12 blows cold air into the central channel 11, accelerating air convection on the fin surface and quickly carrying the heat out of the device. This dual cooling mechanism of "liquid cooling + air cooling" significantly improves the resin cooling speed compared to a single cooling method. Temperature sensor 21 monitors the coolant temperature in cooling tank 1 in real time and transmits the data to the controller. When the temperature exceeds a preset threshold, the controller automatically increases the speed of fan 12 and the power of circulation pump 22 to enhance the heat dissipation effect; conversely, it reduces energy consumption, realizing intelligent dynamic adjustment of the cooling process. The cooled epoxy resin is discharged through the discharge valve 2 of discharge pipe 19, and the operator can adjust the discharge speed according to production needs. The top cover 13 can be removed at any time for easy cleaning of scale inside cooling tank 1 or replacement of damaged parts, while the solenoid valve 28 ensures that the coolant level is always maintained at the optimal working state.

[0034] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A rapid cooling device for epoxy resin production, comprising a cooling tank (1), characterized in that: The cooling pool (1) has a central channel (11) in the middle, and multiple fans (12) are installed in the central channel (11). The cooling pool (1) has an installation plate (14) in its inner cavity, and a pipe joint (15) is installed on the installation plate (14). The cooling pool (1) has a spiral cooling pipe (16) inside, the top end of the spiral cooling pipe (16) is connected to the pipe joint (15), and the other end of the spiral cooling pipe (16) is connected to a discharge pipe (19). A circulation pump (22) is provided at the bottom of the cooling pool (1). A vertically arranged lift pipe (23) is connected to the top of the circulation pump (22). A nozzle (24) is provided at the end of the lift pipe (23). A limit clamp (17) is provided on the side wall of the spiral cooling pipe (16). A heat-conducting block (18) is provided inside the limit clamp (17). The heat-conducting block (18) extends into the middle channel (11). Several heat dissipation fins (25) are provided in the middle channel (11).

2. The rapid cooling device for epoxy resin production according to claim 1, characterized in that, The top of the cooling pool (1) is bolted to a top cover (13).

3. The rapid cooling device for epoxy resin production according to claim 1, characterized in that, The end of the discharge pipe (19) extends to the outside of the cooling pool (1), and a discharge valve (2) is provided on the discharge pipe (19).

4. The rapid cooling device for epoxy resin production according to claim 1, characterized in that, A temperature sensor (21) is installed inside the cooling pool (1), and the temperature sensor (21) is connected to the controller via a wire.

5. The rapid cooling device for epoxy resin production according to claim 1, characterized in that, A gap is provided between adjacent heat dissipation fins (25), and the heat dissipation fins (25) are in close contact with the heat-conducting block (18).

6. The rapid cooling device for epoxy resin production according to claim 1, characterized in that, The cooling pool (1) is equipped with a control switch (26) and a power supply (27) on its exterior.

7. The rapid cooling device for epoxy resin production according to claim 1, characterized in that, A solenoid valve (28) is provided on the outside of the cooling pool (1).

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