Silicon wafer drying device
By placing the air inlet on the top side and the air outlet near the bottom in the silicon wafer drying device, and by adopting a diversion mechanism and heating chamber design, the problems of low drying efficiency and complex structure of traditional devices are solved, achieving efficient and uniform silicon wafer drying, and reducing costs and risks.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI NANYA SCI-TECH CO LTD
- Filing Date
- 2025-07-16
- Publication Date
- 2026-07-14
AI Technical Summary
Traditional silicon wafer drying equipment has low drying efficiency, and the sealing cover is overloaded and has a complex structure, which affects the convenience of operation.
The air inlet is located on the top side of the drying chamber, and the air outlet is near the bottom, so that the drying gas flows from top to bottom. The design of the flow divider and heating chamber improves the uniformity of gas temperature and flow efficiency.
It improves silicon wafer drying efficiency, reduces the time of each drying operation, reduces the number of silicon wafer drying devices on the production line, lowers production costs, and increases the yield of silicon wafers.
Smart Images
Figure CN224498949U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of silicon wafer drying equipment, and in particular to a silicon wafer drying equipment. Background Technology
[0002] Generally, after cleaning, silicon wafers need to be dried to remove moisture from their surface. Traditional drying devices have a drying chamber. During drying, a basket containing the silicon wafers is placed inside the drying chamber, and hot air is supplied. The flow and heat of the hot air remove the moisture from the surface of the silicon wafers. Improving the drying efficiency of these devices is one of the most pressing issues to be addressed. Utility Model Content
[0003] Therefore, it is necessary to provide a silicon wafer drying device that can improve drying efficiency.
[0004] On one hand, this application provides a silicon wafer drying apparatus, characterized in that the silicon wafer drying apparatus includes:
[0005] The chamber has a drying chamber; the drying chamber has at least one air inlet and at least one air outlet; the air inlet is located on the top side of the drying chamber; the air outlet is located near the bottom end of the drying chamber; the side wall of the drying chamber has a drying inlet and a drying outlet.
[0006] Optionally, the drying chamber is provided with a diversion mechanism; the diversion mechanism has a diversion cavity, the diversion cavity has a diversion inlet and a plurality of diversion outlets; each of the diversion inlets is located on the top side of the diversion mechanism and communicates with at least a portion of the air inlets; the diversion outlets are located on the bottom side of the diversion mechanism.
[0007] Optionally, the flow divider cavity is provided with a flow divider baffle to divide the flow divider cavity into multiple flow divider channels.
[0008] Optionally, the top side of the diversion mechanism has a first end and a second end facing away from each other; both the first end and the second end of the top side of the diversion mechanism are provided with the diversion inlet.
[0009] Optionally, the direction from the first end to the second end is defined as the first direction; the diversion baffle extends along the first direction; the diversion outlet is strip-shaped and extends along the first direction.
[0010] Optionally, at least two diversion outlets are provided on the bottom side of at least a portion of the diversion channel.
[0011] Optionally, the bottom side of the diversion outlet of the diversion mechanism is provided with a guide member, the guide member having a guide surface to guide the drying gas to flow to the bottom side of the drying chamber.
[0012] Optionally, the air outlet is located on the side wall of the drying chamber, and the side wall of the drying chamber where the air outlet is located is parallel to the first direction; the air outlet is strip-shaped and extends along the first direction.
[0013] Optionally, the drying chamber has a first sidewall and a second sidewall facing away from each other; both the first sidewall and the second sidewall are provided with the air outlet;
[0014] The housing is further provided with a first heating chamber and a second heating chamber; the first heating chamber and the drying chamber share the first side wall; the second heating chamber and the drying chamber share the second side wall.
[0015] Both the first heating chamber and the second heating chamber are provided with hot air outlets, and the hot air outlets are located at the top of the heating chambers.
[0016] Optionally, the bottom edge of the air outlet is flush with the inner surface of the bottom wall of the drying chamber.
[0017] Optionally, a first diversion mesh plate is horizontally arranged inside the diversion cavity; there is a gap between the first diversion mesh plate and the top wall of the diversion cavity; there is a gap between the first diversion mesh plate and the bottom wall of the diversion cavity; the projection of the first diversion mesh plate on the top wall of the diversion cavity at least completely covers the diversion inlet.
[0018] Optionally, the first diversion mesh plate is parallel to the bottom wall of the diversion cavity.
[0019] Optionally, there may be multiple first diversion mesh plates; the multiple first diversion mesh plates are arranged at intervals along a direction perpendicular to the bottom wall of the diversion cavity.
[0020] Optionally, a second diversion mesh plate is provided inside the diversion cavity; the second diversion mesh plate is attached to the bottom wall of the diversion cavity; the projection of the second diversion mesh plate on the bottom wall of the diversion cavity at least completely covers the diversion outlet.
[0021] Optionally, the diversion cavity is provided with a guide to change the flow direction of the drying gas entering at least part of the diversion inlet; there is a gap between the guide and the top wall of the diversion cavity; there is a gap between the guide and the bottom wall of the diversion cavity; the projection of the guide on the top wall of the diversion cavity covers at least part of the diversion inlet.
[0022] Optionally, the flow guide has a first guide surface and a second guide surface connected together, the end of the first guide surface away from the second guide surface is inclined toward the bottom wall of the flow distribution cavity, and the end of the second guide surface away from the first guide surface is inclined toward the bottom wall of the flow distribution cavity.
[0023] The embodiments provided in this application place the air inlet on the top side of the drying chamber and the air outlet near the bottom of the drying chamber, so that the drying gas entering the drying chamber flows from top to bottom, which can dry silicon wafers in multiple baskets at the same time. The temperature of the drying gas flowing through each basket of silicon wafers is relatively high and the humidity is relatively low, thereby improving the drying efficiency. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the structure of a silicon wafer drying apparatus provided in one embodiment of this application.
[0025] Figure 2 for Figure 1 A schematic diagram of the silicon wafer drying device from another perspective.
[0026] Figure 3 for Figure 2 MM-directed sectional view.
[0027] Figure 4 for Figure 2 NN-direction cross-sectional view.
[0028] Figure 5 for Figure 1 The diagram shows a partial structural schematic of the silicon wafer drying device.
[0029] Figure 6 for Figure 3 A schematic diagram of the middle diversion mechanism.
[0030] Figure 7 for Figure 6 A schematic diagram of the diversion mechanism from another perspective.
[0031] Figure 8 for Figure 7 A magnified view of part P.
[0032] Figure 9 This is a schematic diagram of the diversion mechanism provided in another embodiment of this application.
[0033] Figure 10 for Figure 9 A magnified view of a portion of Q.
[0034] Figure 11 for Figure 9 A magnified view of part M.
[0035] Figure 12 for Figure 9 A partial structural schematic diagram of the diversion mechanism is shown.
[0036] Figure 13 for Figure 12 A magnified view of N in the middle.
[0037] Figure 14 This is a schematic diagram of the diversion mechanism provided in another embodiment of this application.
[0038] Figure 15 for Figure 14 A magnified view of a portion of the image.
[0039] Figure 16 This is a schematic diagram of the diversion mechanism provided in another embodiment of this application.
[0040] Figure 17 for Figure 16 A magnified view of a portion of the S-shape.
[0041] Figure 18 for Figure 16 KK sectional view.
[0042] Explanation of reference numerals in the attached figures
[0043] 110. Housing; 111. Drying chamber; 1111. Air inlet; 1112. Air outlet; 1113. Drying inlet; 1114. Drying outlet; 1115. First side wall; 1116. Second side wall; 112. First heating chamber; 113. Second heating chamber; 114. Hot air outlet; 115. Sealing cover; 120. Diverting mechanism; 121. Diverting chamber; 1211. Diverting inlet; 1212. 122. Diversion outlet; 123. Diversion baffle; 124. Diversion channel; 125. First end; 126. Second end; 127. Guide component; 128. Guide surface; 130. Circulation drive device; 128. First diversion mesh plate; 129. Second diversion mesh plate; 120. Guide component; 1210. First guide surface; 1292. Second guide surface; 1210. Spray pipe; 140. Cylinder; AA. First direction. Detailed Implementation
[0044] To make the technical solution and beneficial effects of this application more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.
[0045] Researchers discovered that in traditional silicon wafer drying equipment, the drying gas flows laterally within the drying chamber. Furthermore, to improve drying efficiency, traditional silicon wafer drying equipment typically places multiple baskets within the drying chamber along the direction of the drying gas flow. The drying gas flows sequentially through these baskets to dry the silicon wafers in each basket individually. To further enhance drying efficiency, the gas entering the drying chamber is heated. However, as the drying gas flows through each basket, its temperature gradually decreases. By the time the drying gas reaches the last basket, its temperature is lower, and the moisture content increases, resulting in poorer drying of the silicon wafers in that basket.
[0046] Furthermore, in traditional silicon wafer drying equipment, to facilitate compatibility with the preceding slow-lift process, the drying chamber's inlet and outlet are located on the top side of the drying chamber. Specifically, a sealing cover is installed on the top side of the drying chamber to block the drying inlet and outlet during drying. To facilitate the placement of the basket into the drying chamber, the drying inlet and outlet need to be relatively large. Building upon this, if the air inlet for the drying gas is also located on the top side of the chamber, i.e., on the sealing cover, it's understandable that a circulation drive device would be needed at the air inlet to drive the circulation of the drying gas. This would place an excessive load on the sealing cover, making operation inconvenient and complicating the cover's structure.
[0047] Based on this, researchers proposed a silicon wafer drying device in which the drying inlet and outlet are located on the side wall of the drying chamber. The air inlet is located on the top side of the drying chamber, and the air outlet is located near the bottom of the drying chamber, so that the drying gas entering the drying chamber flows from top to bottom. This allows for the simultaneous drying of silicon wafers in multiple baskets. The drying gas flowing through each basket has a higher temperature and lower humidity, thus improving drying efficiency.
[0048] See Figures 1 to 8 An embodiment of this application provides a silicon wafer drying apparatus, comprising: a housing 110, wherein the housing 110 is provided with a drying chamber 111; the drying chamber 111 has at least one air inlet 1111 and at least one air outlet 1112; the air inlet 1111 is located on the top side of the drying chamber 111; the air outlet 1112 is close to the bottom end of the drying chamber 111; and a drying inlet 1113 and a drying outlet 1114 are provided on the side wall of the drying chamber 111.
[0049] The aforementioned silicon wafer drying device, by placing the air inlet 1111 on the top side of the drying chamber 111 and the air outlet 1112 near the bottom of the drying chamber 111, allows the drying gas entering the drying chamber 111 to flow from top to bottom, enabling simultaneous drying of silicon wafers in multiple baskets. The drying gas flowing through each basket has a higher temperature and lower humidity, thus improving drying efficiency.
[0050] Specifically, improving drying efficiency can reduce the time of each drying operation. Furthermore, in some production lines, multiple silicon wafer drying units are continuously installed on the line to ensure drying effectiveness through multiple drying operations. In this application, improving drying efficiency, without changing the time of each drying operation, can also reduce the number of silicon wafer drying units on the production line as needed, thereby lowering production costs.
[0051] It is understood that in this application, the drying inlet 1113 and the drying outlet 1114 are located on the side wall of the drying chamber 111. Therefore, even if the air inlet 1111 is located on the top side of the drying chamber 111, and even if the circulation drive device 130 is installed on the top side, it will not affect the operation of the flower basket entering and exiting.
[0052] In addition, the drying gas flows from top to bottom, and the silicon wafers in the basket are also arranged vertically, so the drying gas can flow more smoothly to the sides of the silicon wafers, which helps to improve drying efficiency.
[0053] Furthermore, the drying gas flows from top to bottom, allowing for simultaneous drying of silicon wafers in multiple baskets. The temperature and humidity of the drying gas flowing to the silicon wafers in each basket are roughly the same, resulting in a relatively uniform drying effect.
[0054] Furthermore, the drying gas flows from top to bottom, and after passing through a basket, it exits through the air outlet 1112, shortening the flow path. The temperature of the drying gas exiting through the air outlet 1112 is increased, thus reducing the energy required to reheat the drying gas and lowering heating costs.
[0055] Furthermore, since the drying gas flows from top to bottom, the lateral force acting on the silicon wafer is smaller, which has less impact on the stability of the silicon wafer, reduces the risk of silicon wafer shaking or even damage, and improves the yield of silicon wafers.
[0056] In this embodiment, a diversion mechanism 120 is provided inside the drying chamber 111; the diversion mechanism 120 has a diversion cavity 121, the diversion cavity 121 has a diversion inlet 1211 and a plurality of diversion outlets 1212; each diversion inlet 1211 is located on the top side of the diversion mechanism 120 and communicates with at least a portion of the air inlet 1111; the diversion outlets 1212 are located on the bottom side of the diversion mechanism 120. The diversion mechanism 120 is disposed inside the drying chamber 111 to disperse the drying gas entering through the air inlet 1111, facilitating the dispersion of the drying gas to different flower baskets.
[0057] In addition, due to the setting of the diversion mechanism 120, it is not necessary to set more air inlets 1111 on the top side of the drying chamber 111 to achieve the diversion of drying gas.
[0058] Furthermore, since the diversion mechanism 120 is located inside the drying chamber 111, the risk of drying gas leakage is reduced even if the diversion mechanism 120 is damaged.
[0059] It is understandable that the diversion inlet 1211 is sealed and connected to the air inlet 1111 so that the drying gas entering the air inlet 1111 first flows into the diversion chamber 121.
[0060] In this embodiment, the diversion cavity 121 is provided with a diversion baffle 122 to divide the diversion cavity 121 into multiple diversion channels 123, so that the drying gas can flow more evenly to different flower baskets.
[0061] Specifically, in this embodiment, the top side of the diversion mechanism 120 has a first end 124 and a second end 125 facing away from each other; both the first end 124 and the second end 125 on the top side of the diversion mechanism 120 are provided with the diversion inlet 1211. In this way, the flow velocity of the drying gas in the lateral direction is reduced, allowing the drying gas to flow downward more smoothly.
[0062] The direction from the first end 124 to the second end 125 is defined as the first direction AA. In this embodiment, the diversion baffle 122 extends along the first direction AA; the diversion outlet 1212 is strip-shaped and extends along the first direction AA, so that the drying gas can flow out of the diversion outlet 1212 without changing its direction too much, reducing the turbulence of the drying gas in the diversion cavity 121, and allowing the drying gas to flow more smoothly downwards to the flower basket.
[0063] Furthermore, it is understood that the diversion baffle 122 extends along the first direction AA, therefore the diversion channel 123 extends along the first direction AA. The drying gas flowing from the diversion inlet 1211 into the diversion channel 123 has a horizontal velocity direction approximately along the first direction AA. The diversion outlet 1212 is a strip extending along the first direction AA, and its extension direction is generally consistent with the transverse flow direction of the drying gas, reducing the risk of disturbance of the drying gas at the diversion outlet 1212, making the drying gas flow out of the diversion outlet 1212 more smoothly, and also making the flow direction of the drying gas flowing out of the diversion outlet 1212 closer to the preset flow direction, that is, closer to the depth direction of the drying chamber 111. It is understood that the depth direction of the drying chamber 111 refers to the vertical direction of the silicon wafer drying device during operation.
[0064] In this embodiment, two diversion outlets 1212 are provided on the bottom side of some of the diversion channels 123, so that the drying gas can flow out more smoothly and dispersedly from different diversion outlets 1212, so as to flow more evenly to different flower baskets.
[0065] Specifically, in this embodiment, the bottom side of the diversion channel 123 at both edges is provided with a diversion outlet 1212, and the bottom side of the diversion channel 123 at the middle position is provided with two diversion outlets 1212. It is understood that in other embodiments, the number of diversion outlets in each diversion channel is specifically set according to the size of the diversion conduction, the size of the diversion outlet, and the flow velocity of the drying gas, etc., and is not limited here.
[0066] The bottom side of the diversion outlet 1212 of the diversion mechanism 120 is provided with a guide 126, which has a guide surface 1261 to guide the drying gas to flow to the bottom side of the drying chamber 111.
[0067] Specifically, in this embodiment, the guide surface 1261 is parallel to the depth direction of the drying chamber 111 in order to better guide the drying gas to flow to the bottom side of the drying chamber 111.
[0068] In this embodiment, the guide member 126 is L-shaped, which has a simple structure and is easy to process and fix. It is understood that in other embodiments, the guide member 126 may also be any other regular or irregular shape, which is not limited here.
[0069] In this embodiment, the air outlet 1112 is located on the side wall of the drying chamber 111, and the side wall of the drying chamber 111 with the air outlet 1112 is parallel to the first direction AA. The air outlet 1112 is strip-shaped and extends along the first direction AA, which reduces the disturbance of the drying gas at the air outlet 1112 and makes the drying gas flow out of the air outlet 1112 more smoothly.
[0070] In this embodiment, the drying chamber 111 has a first sidewall 1115 and a second sidewall 1116 facing away from each other; both the first sidewall 1115 and the second sidewall 1116 are provided with air outlets 1112. This allows the drying gas flowing downwards to the bottom of the drying chamber 111 to partially flow out through the air outlets 1112 on the first sidewall 1115 and partially through the air outlets 1112 on the second sidewall 1116, thus accelerating the outflow speed of the drying gas.
[0071] In addition, in this embodiment, the first sidewall 1115 and the second sidewall 1116 are arranged opposite to each other, so that more of the drying gas near the first sidewall 1115 can flow out through the air outlet 1112 on the first sidewall 1115, and more of the drying gas near the second reserve can flow out through the air outlet 1112 on the second sidewall 1116, thereby reducing the phenomenon of the drying gas being disturbed in the drying chamber 111.
[0072] It is understood that in some other embodiments, the air outlet is not limited to being located on the side wall of the drying chamber, but may also be located on the bottom wall of the drying chamber, or at the junction of the side wall and the bottom wall of the drying chamber, etc.
[0073] In this embodiment, the housing 110 is further provided with a first heating chamber 112 and a second heating chamber 113; the first heating chamber 112 shares the first side wall 1115 with the drying chamber 111; the second heating chamber 113 shares the second side wall 1116 with the drying chamber 111. This reduces the path of the drying gas from the drying chamber 111 to the heating chamber, thus reducing heat loss during the flow of the drying gas.
[0074] In addition, the two heating chambers improve the heating efficiency of the drying gas and thus improve the drying efficiency.
[0075] Furthermore, the first heating chamber 112 shares the first sidewall 1115 with the drying chamber 111, simplifying the structure of the silicon wafer drying device, reducing its cost, facilitating miniaturization, and reducing the space occupied by the device. Similarly, the second heating chamber 113 shares the second sidewall 1116 with the drying chamber 111, simplifying the structure, reducing its cost, facilitating miniaturization, and reducing the space occupied.
[0076] Optionally, the first sidewall 1115 is heat-conducting. Thus, the heat in the first heating chamber 112 can be transferred to the drying chamber 111 through the first sidewall 1115, increasing the temperature of the drying gas in the drying chamber 111 and enhancing the drying effect.
[0077] Optionally, the second sidewall 1116 is heat-conducting. Thus, the heat in the second heating chamber 113 can be transferred to the drying chamber 111 through the second sidewall 1116, increasing the temperature of the drying gas in the drying chamber 111 and enhancing the drying effect.
[0078] In this embodiment, both the first heating chamber 112 and the second heating chamber 113 are provided with hot air outlets 114. The hot air outlets 114 are located at the top of the heating chambers, reducing the change in the flow direction of the drying gas during circulation, allowing the heated drying gas to flow out of the heating chambers more smoothly. Furthermore, the hot air outlets 114 are located at the top of the heating chambers, closer to the air inlet 1111, reducing the flow path of the drying gas and minimizing heat loss during its flow.
[0079] In this embodiment, both the first heating chamber 112 and the second heating chamber 113 have two hot air outlets 114 on their top sides. It is understood that in other embodiments, the number of hot air outlets on the top side of each heating chamber is not limited to two, and can be specifically set as needed.
[0080] In this embodiment, multiple hot air outlets 114 are respectively configured to correspond one-to-one with multiple air inlets 1111, which facilitates the connection between the hot air outlets 114 and the air inlets 1111, and also facilitates the control of the amount of drying gas flowing into each air inlet 1111.
[0081] In this embodiment, the bottom edge of the air outlet 1112 is flush with the inner surface of the bottom wall of the drying chamber 111, which reduces the phenomenon of the drying gas being bounced after flowing to the bottom wall of the drying chamber 111, reduces the flow turbulence of the drying gas on the bottom wall of the drying chamber 111, and facilitates the drying gas to flow out more smoothly through the air outlet 1112.
[0082] Specifically, in this embodiment, a circulation drive device 130 is provided on the top side of the housing 110. The drive inlet of the circulation drive device 130 is connected to the hot air outlet 114, and the drive outlet is connected to the air inlet 1111, so as to drive the circulation of drying gas.
[0083] In this embodiment, both the drying inlet 1113 and the drying outlet 1114 are provided with sealing caps 115. It can be understood that when the flower basket enters or exits the drying chamber 111, the sealing caps 115 at the corresponding drying inlet 1113 or drying outlet 1114 are opened; during drying, the sealing caps 115 at the drying inlet 1113 and drying outlet 1114 are closed.
[0084] In this embodiment, the silicon wafer drying device also includes a cylinder 140, which drives the movement of the sealing cover 115 to open or close the sealing cover 115.
[0085] Optionally, when the silicon wafer drying device provided in this application is applied on a production line, lifting devices are respectively installed on both sides of the silicon wafer drying device to drive the lifting of the basket, so that the basket can enter the drying chamber through the drying inlet and leave the drying chamber through the drying outlet.
[0086] See Figures 9 to 13An embodiment of this application provides a diversion mechanism 120, in which a first diversion mesh plate 127 is horizontally disposed within a diversion cavity 121; there is a gap between the first diversion mesh plate 127 and the top wall of the diversion cavity 121; there is also a gap between the first diversion mesh plate 127 and the bottom wall of the diversion cavity 121; the projection of the first diversion mesh plate 127 onto the top wall of the diversion cavity 121 at least completely covers the diversion inlet 1211. Therefore, when drying gas flows into the diversion cavity 121 through the diversion inlet 1211, it flows towards the first diversion mesh plate 127. The first diversion mesh plate 127 has multiple perforated structures, through which the drying gas is diverted, making the drying gas flowing to the bottom side of the first diversion mesh plate 127 more dispersed, thereby making the drying gas flowing into the drying chamber more evenly dispersed, thus improving the consistency of the drying effect on silicon wafers at different locations.
[0087] In addition, the first diversion mesh plate 127 can divert the drying gas before it flows to the diversion outlet 1212. Therefore, even if the diversion inlet 1211 is located on the top side of the partial diversion outlet 1212, the drying gas can be prevented from flowing directly to the partial diversion outlet 1212, thus avoiding the phenomenon of drying gas concentration at the partial diversion outlet 1212.
[0088] In this embodiment, the first diversion mesh plate 127 is parallel to the bottom wall of the diversion cavity 121, which reduces the phenomenon of gas drying gas being disordered on the bottom side of the first diversion mesh plate 127.
[0089] It should be noted that, with Figure 13 From this perspective, the side wall of the diversion outlet 1212 is partially obscured by the first diversion mesh plate 127. To clearly identify the location of the diversion outlet 1212, the side wall of the diversion outlet 1212 is marked with a dashed line. Additionally, it can be understood that... Figure 12 The schematic diagram is to hide the top wall of the diversion mechanism 120 so as to clearly show the top view of the first diversion mesh plate 127.
[0090] Optionally, the first diversion mesh plate 127 is fixedly connected to the side wall of the diversion cavity 121 or integrally formed, without specific limitation here.
[0091] Optionally, the first diversion mesh plate 127 is sealed to the side wall of the diversion cavity 121 to prevent the drying gas from flowing through the space between the first diversion mesh plate 127 and the side wall of the diversion cavity 121 to the bottom wall of the diversion cavity 121.
[0092] Optionally, in some other embodiments, there are multiple first diversion mesh plates; the multiple first diversion mesh plates are arranged at intervals along a direction perpendicular to the bottom wall of the diversion cavity to divert the drying gas multiple times, so that the drying gas flowing out from different diversion outlets is more uniform.
[0093] See Figure 14 and Figure 15 The diversion mechanism 120 provided in one embodiment of this application is related to... Figure 9 Unlike the diversion mechanism 120 shown, the diversion cavity 121 is provided with a second diversion mesh plate 128; the second diversion mesh plate 128 is attached to the bottom wall of the diversion cavity 121; the projection of the second diversion mesh plate 128 on the bottom wall of the diversion cavity 121 completely covers the bottom wall of the diversion cavity 121, so the projection of the second diversion mesh plate 128 on the bottom wall of the diversion cavity 121 completely covers the diversion outlet 1212. Through the setting of the second diversion mesh plate 128, part of the drying gas flowing to the vicinity of the diversion outlet 1212 is blocked by the second diversion mesh plate 128, which increases the gas pressure in the diversion cavity 121, increases the speed at which the drying gas flows out of the diversion outlet 1212, and improves the drying effect.
[0094] In some other embodiments, the projection of the second diversion mesh plate 128 on the bottom wall of the diversion cavity 121 at least completely covers the diversion outlet 1212.
[0095] It should be noted that the perforation density and size of the second diversion mesh plate 128 may be the same as or not exactly the same as the perforation density and size of the first diversion mesh plate 127.
[0096] In this embodiment, the distance between the first diversion mesh plate 127 and the bottom wall of the diversion cavity 121 is equal to the distance between the first diversion mesh plate 127 and the top wall of the diversion cavity 121. It is understood that in some other embodiments, the first diversion mesh plate 127 may be disposed closer to the bottom wall or top wall of the diversion cavity 121.
[0097] See Figures 16 to 18 An embodiment of this application provides a diversion mechanism 120, in which a guide member 129 is provided in the diversion cavity 121 to change the flow direction of at least a portion of the drying gas entering through the diversion inlet 1211. There is a gap between the guide member 129 and the top wall of the diversion cavity 121; there is also a gap between the guide member 129 and the bottom wall of the diversion cavity 121. The projection of the guide member 129 on the top wall of the diversion cavity 121 covers a portion of the diversion inlet 1211. Therefore, at least a portion of the drying gas flowing into the diversion cavity 121 from the diversion inlet 1211 changes direction after reaching the guide member 129, increasing the lateral flow velocity and allowing the drying gas to flow more quickly and evenly into the diversion cavity 121, resulting in lower gas pressure at different locations within the diversion cavity 121. In addition, it is understandable that the horizontally flowing drying gas will also increase the horizontal flow speed of at least some of the drying gas that continues to enter through the diversion inlet 1211, so that the drying gas can flow more evenly into the diversion chamber 121, and the pressure difference at different positions of the diversion chamber 121 is smaller.
[0098] Furthermore, due to the arrangement of the guide member 129, some of the diversion outlets 1212 can be located on the bottom side of the diversion inlet 1211, thereby improving the uniformity and extent of the distribution of the diversion outlets 1212 on the bottom wall of the diversion cavity 121.
[0099] Specifically, in this embodiment, the guide member 129 has a first guide surface 1291 and a second guide surface 1292 connected together. The end of the first guide surface 1291 away from the second guide surface 1292 is inclined toward the bottom wall of the diversion cavity 121, and the end of the second guide surface 1292 away from the first guide surface 1291 is inclined toward the bottom wall of the diversion cavity 121. This allows the drying gas flowing to the guide member 129 to have both a lateral flow velocity and a vertical flow velocity, so that the drying gas can flow out more smoothly from the diversion outlet 1212. In addition, the first guide surface 1291 and the second guide surface 1292 can guide the drying gas flowing to the guide member 129 to disperse to both sides, so that the drying gas can fill the diversion cavity 121 more evenly, and the pressure difference at different positions in the diversion cavity 121 is smaller.
[0100] In this embodiment, relative to the bottom wall of the diversion cavity 121, both the first guide surface 1291 and the second guide surface 1292 are planar, with the same inclination angle and the same length along the inclination direction. Optionally, the included angle between the first guide surface 1291 and the second guide surface 1292 is in the range of 60° to 150°.
[0101] It is understood that in other embodiments, the first guide surface 1291 and the second guide surface 1292 may also be non-planar surfaces such as curved surfaces or folded surfaces, and the inclination angles and lengths along the inclination direction may also be different, depending on the distribution and size of the guide member 129, etc., and are not specifically limited here. Similarly, the included angle between the first guide surface 1291 and the second guide surface 1292 is not limited to the range of 60° to 150°, and may be less than 60° or greater than 150°.
[0102] In addition, it is understood that in some other embodiments, a flow guide, a first flow divider plate and a second flow divider plate may be provided simultaneously in the flow divider cavity.
[0103] In this embodiment, a spray pipe 1210 is also provided inside the diversion cavity 121. The liquid sprayed from the spray pipe 1210 can then be used to clean the diversion cavity 121.
[0104] In this embodiment, the spray pipe 1210 is located close to the side wall of the diversion chamber 121 to reduce the impact on the flow of the drying gas.
[0105] In this application, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this application.
[0106] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" may explicitly include at least one of those features. In this application, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.
[0107] In this application, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0108] In this application, unless otherwise expressly defined, the terms "above," "on top of," "over," "above," "below," "below," "below," or "below" for "first feature over second feature" can refer to the first and second features being in direct contact, or to the first and second features being in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" for "first feature over second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature over second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.
[0109] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.
Claims
1. A silicon wafer drying apparatus, characterized in that, The silicon wafer drying device includes: The chamber has a drying chamber; the drying chamber has at least one air inlet and at least one air outlet; the air inlet is located on the top side of the drying chamber; the air outlet is located near the bottom end of the drying chamber; the side wall of the drying chamber has a drying inlet and a drying outlet.
2. The silicon wafer drying apparatus according to claim 1, characterized in that, The drying chamber is provided with a flow diversion mechanism; the flow diversion mechanism has a flow diversion cavity, the flow diversion cavity has a flow diversion inlet and multiple flow diversion outlets; each flow diversion inlet is located on the top side of the flow diversion mechanism and is connected to at least a portion of the air inlet; the flow diversion outlets are located on the bottom side of the flow diversion mechanism.
3. The silicon wafer drying apparatus according to claim 2, characterized in that, The flow divider is provided with a flow divider plate to divide the flow divider into multiple flow divider channels.
4. The silicon wafer drying apparatus according to claim 3, characterized in that, The top side of the diversion mechanism has a first end and a second end facing away from each other; both the first end and the second end of the top side of the diversion mechanism are provided with the diversion inlet.
5. The silicon wafer drying apparatus according to claim 4, characterized in that, The direction from the first end to the second end is defined as the first direction; the diversion baffle extends along the first direction; the diversion outlet is strip-shaped and extends along the first direction.
6. The silicon wafer drying apparatus according to claim 5, characterized in that, At least two diversion outlets are provided on the bottom side of at least part of the diversion channel.
7. The silicon wafer drying apparatus according to any one of claims 2 to 6, characterized in that, The bottom side of the diversion outlet of the diversion mechanism is provided with a guide member, which has a guide surface to guide the drying gas to flow to the bottom side of the drying chamber.
8. The silicon wafer drying apparatus according to claim 5 or 6, characterized in that, The air outlet is located on the side wall of the drying chamber, and the side wall of the drying chamber where the air outlet is located is parallel to the first direction; the air outlet is strip-shaped and extends along the first direction.
9. The silicon wafer drying apparatus according to claim 8, characterized in that, The drying chamber has a first sidewall and a second sidewall facing away from each other; the air outlet is provided on both the first sidewall and the second sidewall. The housing is further provided with a first heating chamber and a second heating chamber; the first heating chamber and the drying chamber share the first side wall; the second heating chamber and the drying chamber share the second side wall. Both the first heating chamber and the second heating chamber are provided with hot air outlets, and the hot air outlets are located at the top of the heating chambers.
10. The silicon wafer drying apparatus according to claim 8, characterized in that, The bottom edge of the air outlet is flush with the inner surface of the bottom wall of the drying chamber.
11. The silicon wafer drying apparatus according to claim 2, characterized in that, A first diversion mesh plate is horizontally arranged inside the diversion cavity; there is a gap between the first diversion mesh plate and the top wall of the diversion cavity; there is a gap between the first diversion mesh plate and the bottom wall of the diversion cavity; the projection of the first diversion mesh plate on the top wall of the diversion cavity at least completely covers the diversion inlet.
12. The silicon wafer drying apparatus according to claim 11, characterized in that, The first diversion mesh plate is parallel to the bottom wall of the diversion cavity.
13. The silicon wafer drying apparatus according to claim 12, characterized in that, The number of the first diversion mesh plates is multiple; the multiple first diversion mesh plates are arranged at intervals along a direction perpendicular to the bottom wall of the diversion cavity.
14. The silicon wafer drying apparatus according to any one of claims 11 to 13, characterized in that, The flow diversion cavity is provided with a second flow diversion mesh plate; the second flow diversion mesh plate is attached to the bottom wall of the flow diversion cavity; the projection of the second flow diversion mesh plate on the bottom wall of the flow diversion cavity at least completely covers the flow diversion outlet.
15. The silicon wafer drying apparatus according to claim 2, characterized in that, The diversion cavity is provided with a guide to change the flow direction of the drying gas entering at least part of the diversion inlet; there is a gap between the guide and the top wall of the diversion cavity; there is a gap between the guide and the bottom wall of the diversion cavity; the projection of the guide on the top wall of the diversion cavity covers at least part of the diversion inlet.
16. The silicon wafer drying apparatus according to claim 15, characterized in that, The flow guide has a first guide surface and a second guide surface connected together. The end of the first guide surface away from the second guide surface is inclined toward the bottom wall of the flow distribution cavity, and the end of the second guide surface away from the first guide surface is inclined toward the bottom wall of the flow distribution cavity.