A contactless photovoltaic chain dryer air knife

By using a contactless photovoltaic chain drying air knife, the airflow pressure is used to press the silicon wafers, which solves the problems of roller marks and wafer blockage caused by traditional drying air knives, thus improving the power generation efficiency and production stability of silicon wafers.

CN224499011UActive Publication Date: 2026-07-14JIANGSU FULM LASER TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU FULM LASER TECH CO LTD
Filing Date
2025-06-04
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

In existing photovoltaic wet-process chain equipment, the drying air knife traditionally causes roller marks when the pressure bar contacts the silicon wafer during the silicon wafer drying process, which affects cell efficiency and poses a risk of wafer blockage, thus affecting the efficiency of the production line.

Method used

Design a contactless photovoltaic chain drying air knife. By setting multiple sets of air outlets on the bottom surface of the air knife body, the airflow pressure is used to press the silicon wafers, avoiding direct contact. Combined with a height adjustment mechanism and a pressure regulating valve to control the air pressure, the stable delivery of silicon wafers is ensured.

Benefits of technology

This achieves a silicon wafer surface free of roller marks, improving power generation efficiency, enhancing production flow stability, reducing equipment failure losses, and facilitating equipment maintenance.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224499011U_ABST
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Abstract

The utility model discloses a kind of non-contact photovoltaic chain type equipment drying air knife, belong to photovoltaic automation technical field, this one non-contact photovoltaic chain type equipment drying air knife, including a for drying equipment is installed in the fixed seat of photovoltaic chain type wet process equipment, the fixed seat is provided with air knife main body, the bottom surface of the air knife main body one transverse section is equipped with two groups of left and right symmetrical first air outlet and at least one group of second air outlet between two groups of first air outlet, the bottom surface of the air knife main body is widened to sufficiently cover silicon wafer, two groups of first air outlet form pressure on the two sides of silicon wafer. The structural member of drying air knife does not directly contact with silicon wafer, only rely on the pressure of airflow to press silicon wafer, so that the front surface of silicon wafer can be avoided to form roller mark, so that the surface performance of produced silicon wafer is better, and the produced silicon wafer has better power generation efficiency.
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