Composite photoelectric sensor and electronic device
By soldering the ambient light sensor, LED indicator, and infrared sensor onto the same substrate and encapsulating them with plastic, the problems of low efficiency and high cost in traditional mounting are solved, achieving efficient and low-cost device mounting.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HARBIN HEG TECHNOLOGY DEVELOPMENT LTD CO
- Filing Date
- 2025-09-30
- Publication Date
- 2026-07-14
AI Technical Summary
Traditional methods of mounting ambient light sensors, LED indicators, and infrared sensors onto electrical appliances result in low device mounting efficiency and high costs.
A composite photoelectric sensor is designed, which integrates an ambient light sensor, an LED indicator, and an infrared sensor on the same substrate and encapsulates them with transparent and non-transparent plastic encapsulation to form a composite structure, enabling one-time mounting onto a circuit board.
It improves component placement efficiency, reduces placement costs, and decreases circuit board size and material management costs.
Smart Images
Figure CN224499520U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photoelectric sensing technology, specifically to a composite photoelectric sensor and electronic device. Background Technology
[0002] Traditional appliances such as televisions, air conditioners, and water heaters use at least two of the following: ambient light sensors, LED indicator lights, and infrared sensors. These are typically independent components. Installing them in an appliance requires mounting each component separately onto a circuit board three times before finally attaching the board to the appliance. This process results in low component mounting efficiency and high mounting costs. Utility Model Content
[0003] This application discloses a composite photoelectric sensor and electronic device to solve the problems of low device mounting efficiency and high cost caused by separately mounting ambient light sensors, LED indicator lights and infrared sensors.
[0004] In a first aspect, this application discloses a composite photoelectric sensor, comprising: a substrate; a first device, the first device being soldered onto the substrate, the first device including one of an ambient light sensor, an LED indicator, and an infrared sensor; and a second device, the second device being soldered onto the substrate and disposed at a distance from the first device, the second device including another of the ambient light sensor, the LED indicator, and the infrared sensor.
[0005] In some embodiments of this application, it further includes: a first transparent molding compound, which is fixed on the substrate and encapsulates the first device; and a second transparent molding compound, which is fixed on the substrate and encapsulates the second device.
[0006] In some embodiments of this application, it further includes: a first non-transparent molding compound, which is fixed on the substrate and wraps around and spaces the first transparent molding compound and the second transparent molding compound; and the first non-transparent molding compound includes at least a first opening, which exposes the photosensitive surface of the ambient light sensor or the light-emitting surface of the LED indicator.
[0007] In some embodiments of this application, the materials of the first transparent molding compound and the second transparent molding compound include transparent epoxy resin; the material of the first non-transparent molding compound includes infrared resin.
[0008] In some embodiments of this application, a third device is further included, which is soldered onto the substrate, wherein the first device, the second device, and the third device are respectively the ambient light sensor, the LED indicator and the infrared sensor.
[0009] In some embodiments of this application, the device further includes: a first transparent molding compound, which is fixed on the substrate and encapsulates the first device; a second transparent molding compound, which is fixed on the substrate and encapsulates the second device; and a third transparent molding compound, which is fixed on the substrate and encapsulates the third device.
[0010] In some embodiments of this application, it further includes: a second non-transparent molding compound, which is fixed on the substrate and wraps around and spacees the first transparent molding compound, the second transparent molding compound, and the third transparent molding compound; and the second non-transparent molding compound includes at least a first opening and a second opening, the first opening exposing the photosensitive surface of the ambient light sensor, and the second opening exposing the light-emitting surface of the LED indicator.
[0011] In some embodiments of this application, the materials of the first transparent molding compound, the second transparent molding compound, and the third transparent molding compound include transparent epoxy resin; the material of the second non-transparent molding compound includes infrared resin.
[0012] In some embodiments of this application, the first device, the second device, and the third device are arranged in a line on the substrate.
[0013] Secondly, this application provides an electronic device including a composite photoelectric sensor as described in any of the preceding claims.
[0014] The composite photoelectric sensor and electronic device disclosed in this application, by welding a first device and a second device onto the same substrate, and making the first device one of an ambient light sensor, an LED indicator, and an infrared sensor, and the second device another of an ambient light sensor, an LED indicator, and an infrared sensor, allows at least two of the ambient light sensor, LED indicator, and infrared sensor to be welded onto the same substrate. This enables at least two of the ambient light sensor, LED indicator, and infrared sensor to be mounted onto the circuit board at once by mounting the composite photoelectric sensor onto the circuit board, thereby improving the device mounting efficiency and reducing mounting costs. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.
[0016] Figure 1 This is a schematic diagram of the structure of a composite photoelectric sensor disclosed in an embodiment of this application.
[0017] Figure 2 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0018] Figure 3 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0019] Figure 4 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0020] Figure 5 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0021] Figure 6 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0022] Figure 7 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0023] Figure 8 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0024] Figure 9 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application.
[0025] Figure 10 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. Detailed Implementation
[0026] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0027] As an optional implementation of the disclosure in this application, an embodiment of this application discloses a composite photoelectric sensor, such as... Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of a composite photoelectric sensor disclosed in an embodiment of this application. The composite photoelectric sensor includes a substrate 10, a first device 21, and a second device 22.
[0028] The first device 21 is soldered onto the substrate 10, and the second device 22 is soldered onto the substrate 10. The second device 22 is disposed at a distance from the first device 21. The first device 21 includes one of an ambient light sensor, an LED indicator, and an infrared sensor, and the second device 22 includes the other of an ambient light sensor, an LED indicator, and an infrared sensor.
[0029] For example, such as Figure 1 As shown, the first device 21 includes an ambient light sensor, and the second device 22 includes an LED indicator; or, as... Figure 2 As shown, Figure 2 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. The first device 21 includes an ambient light sensor, and the second device 22 includes an infrared sensor; or, as... Figure 3 As shown, Figure 3 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. The first device 21 includes an LED indicator, and the second device 22 includes an infrared sensor. The surface of the infrared sensor can be covered with a shielding cover 20, which can shield the infrared sensor from interference from external electromagnetic signals.
[0030] It is understandable that an ambient light sensor can sense ambient light (such as analog or digital ambient light) and convert the ambient light signal into an electrical signal to perform corresponding control operations based on the electrical signal; an LED indicator, also known as an LED light, can emit light of different brightness or color according to different electrical signals to indicate different operations to the user; an infrared sensor, also known as an infrared receiver, can sense infrared light and convert the infrared light signal into an electrical signal to perform corresponding control operations based on the electrical signal.
[0031] In this embodiment, by welding the first device 21 and the second device 22 onto the same substrate 10, and making the first device 21 one of the ambient light sensor, LED indicator, and infrared sensor, and the second device 22 the other one of the ambient light sensor, LED indicator, and infrared sensor, at least two of the ambient light sensor, LED indicator, and infrared sensor can be welded onto the same substrate 10. Thus, by mounting the composite photoelectric sensor onto the circuit board, at least two of the ambient light sensor, LED indicator, and infrared sensor can be mounted onto the circuit board at once, thereby improving the device mounting efficiency and reducing mounting costs.
[0032] Furthermore, soldering at least two of the ambient light sensor, LED indicator, and infrared sensor onto the same substrate 10 can reduce the size of the circuit board and further reduce costs. In addition, soldering at least two of the ambient light sensor, LED indicator, and infrared sensor onto the same substrate 10 facilitates material management and reduces material management costs.
[0033] It should be noted that the ambient light sensor, LED indicator, and infrared sensor can be soldered onto the substrate 10 by means of die bonding and wire bonding. The substrate 10 can have traces and pads, which can realize the electrical connection of the ambient light sensor, LED indicator, and infrared sensor with other circuit boards or other electronic devices.
[0034] In some embodiments of this application, such as Figure 4 As shown, Figure 4 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. The composite photoelectric sensor also includes a first transparent molding compound 31 and a second transparent molding compound 32. The first transparent molding compound 31 is fixed on the substrate 10 and wraps the first device 21, and the second transparent molding compound 32 is fixed on the substrate 10 and wraps the second device 22.
[0035] The first transparent molding compound 31 and the second transparent molding compound 32 are disposed at intervals on the substrate 10. The materials of the first transparent molding compound 31 and the second transparent molding compound 32 are light-transmitting materials, so that the first transparent molding compound 31 can transmit the light emitted or to be sensed by the first device 21, and the second transparent molding compound 32 can transmit the light emitted or to be sensed by the second device 22.
[0036] Based on this, in some embodiments of this application, such as Figure 5 As shown, Figure 5 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. The composite photoelectric sensor also includes a first non-transparent molding compound 41, which is fixed on the substrate 10 and wraps around and spaced between the first transparent molding compound 31 and the second transparent molding compound 32.
[0037] The first non-transparent molding compound 41 is made of a non-transparent material. Furthermore, the first non-transparent molding compound 41 can not only enclose the first transparent molding compound 31 and the enclosed first device 21, but also enclose the second transparent molding compound 32 and the enclosed second device 22. It can also separate the first transparent molding compound 31 and the second transparent molding compound 32 to block light from the first device 21 and the second device 22, thus preventing light interference between them.
[0038] In some embodiments of this application, the first transparent molding compound 31 and the second transparent molding compound 32 are made of transparent epoxy resin, and the first non-transparent molding compound 41 is made of infrared resin. The characteristic of infrared resin is that it can transmit infrared light with wavelengths greater than 820nm and block light with wavelengths less than 820nm, thus improving the anti-light interference capability of the infrared sensor. Of course, this application is not limited to this; in other embodiments, the first transparent molding compound 31 and the second transparent molding compound 32 can be made of other light-transmitting materials, and the first non-transparent molding compound 41 can be made of other non-light-transmitting materials.
[0039] Based on this, in some embodiments of this application, the first non-transparent molding compound 41 includes at least a first opening 411. In some embodiments of this application, such as... Figure 5 As shown, when the material of the first non-transparent molding compound 41 is infrared resin material, the first non-transparent molding compound 41 only includes a first opening 411, which exposes the photosensitive surface of the first device 21, such as an ambient light sensor.
[0040] Of course, this application is not limited to this; in other embodiments, such as Figure 6 As shown, Figure 6 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. When the material of the first non-transparent plastic encapsulation 41 is infrared resin material, the first non-transparent plastic encapsulation 41 only includes a first opening 411, which exposes the light-emitting surface of the first device 21, such as an LED indicator.
[0041] In other embodiments, such as Figure 7 As shown, Figure 7 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. When the material of the first non-transparent plastic encapsulation 41 is other non-transparent materials, the first non-transparent plastic encapsulation 41 includes a first opening 411 and a second opening 412. The first opening 411 exposes the photosensitive surface of the first device 21, such as an ambient light sensor, and the second opening 412 exposes the light-emitting surface of the second device 22, such as an LED indicator.
[0042] In some embodiments of this application, such as Figure 8 As shown, Figure 8 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. The composite photoelectric sensor also includes a third device 23, which is soldered onto the substrate 10. The first device 21, the second device 22, and the third device 23 are respectively an ambient light sensor, an LED indicator, and an infrared sensor.
[0043] In some embodiments of this application, such as Figure 9 As shown, Figure 9This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. The composite photoelectric sensor also includes a first transparent molding compound 31, a second transparent molding compound 32, and a third transparent molding compound 33. The first transparent molding compound 31 is fixed on the substrate 10 and wraps the first device 21. The second transparent molding compound 32 is fixed on the substrate 10 and wraps the second device 22. The third transparent molding compound 33 is fixed on the substrate 10 and wraps the third device 23.
[0044] Similarly, the first transparent molding compound 31, the second transparent molding compound 32, and the third transparent molding compound 33 are spaced apart on the substrate 10, and the materials of the first transparent molding compound 31, the second transparent molding compound 32, and the third transparent molding compound 33 are light-transmitting materials, so that the first transparent molding compound 31 can transmit the light emitted or sensed by the first device 21, the second transparent molding compound 32 can transmit the light emitted or sensed by the second device 22, and the third transparent molding compound 33 can transmit the light emitted or sensed by the third device 23.
[0045] In some embodiments of this application, such as Figure 10 As shown, Figure 10 This is a schematic diagram of another composite photoelectric sensor disclosed in an embodiment of this application. The composite photoelectric sensor also includes a second non-transparent molding compound 42, which is fixed on the substrate 10 and wraps around and spacees the first transparent molding compound 31, the second transparent molding compound 32 and the third transparent molding compound 33.
[0046] Similarly, the material of the second non-transparent molding compound 42 is a non-transparent material. Furthermore, the second non-transparent molding compound 42 can not only enclose the first transparent molding compound 31 and the first device 21 it encloses, the second transparent molding compound 32 and the second device 22 it encloses, and the third transparent molding compound 33 and the third device 23 it encloses, but can also separate any two of the first transparent molding compound 31, the second transparent molding compound 32, and the third transparent molding compound 33 to block the light between any two of the first device 21, the second device 22, and the third device 23, so as to prevent the light from the first device 21, the second device 22, and the third device 23 from interfering with each other.
[0047] In some embodiments of this application, the materials of the first transparent molding compound 31, the second transparent molding compound 32, and the third transparent molding compound 33 include transparent epoxy resin, and the material of the second non-transparent molding compound 42 includes infrared resin. Of course, this application is not limited to this; in other embodiments, the materials of the first transparent molding compound 31, the second transparent molding compound 32, and the third transparent molding compound 33 may also be other light-transmitting materials, and the material of the second non-transparent molding compound 42 may also be other non-light-transmitting materials.
[0048] Based on this, in some embodiments of this application, the second non-transparent molding compound 42 includes at least a first opening 411 and a second opening 412. In some embodiments of this application, such as... Figure 10 As shown, when the material of the second non-transparent molding compound 42 is infrared resin material, the second non-transparent molding compound 42 only includes a first opening 411 and a second opening 412. The first opening 411 exposes the photosensitive surface of the first device 21, such as an ambient light sensor, and the second opening 412 exposes the light-emitting surface of the second device 22, such as an LED indicator.
[0049] Of course, this application is not limited to this. In other embodiments, when the material of the second non-transparent molding is other non-transparent materials, the second non-transparent molding includes a first opening, a second opening and a third opening. The first opening exposes the photosensitive surface of a first device, such as an ambient light sensor, the second opening exposes the light-emitting surface of a second device, such as an LED indicator, and the third opening exposes the photosensitive surface of a third device, such as an infrared sensor.
[0050] In some embodiments of this application, such as Figures 8 to 10 As shown, the first device 21, the second device 22, and the third device 23 are arranged in a line on the substrate 10. Of course, this application is not limited to this. In other embodiments, the first device 21, the second device 22, and the third device 23 are also arranged in a triangular pattern on the substrate 10, which will not be described in detail here.
[0051] As another optional implementation of the disclosure in this application, embodiments of this application also disclose an electronic device, which includes the composite photoelectric sensor disclosed in any of the above embodiments, and the electronic device includes electrical appliances such as mobile phones, computers, and refrigerators.
[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0053] The above embodiments are merely illustrative of several implementation methods described in detail, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this specification, and these all fall within the scope of protection of this specification. Therefore, the scope of protection of this patent should be determined by the appended claims.
Claims
1. A composite photoelectric sensor, characterized in that, include: substrate; A first device, which is soldered onto the substrate, includes one of an ambient light sensor, an LED indicator, and an infrared sensor. The second device is soldered onto the substrate and is spaced apart from the first device. The second device includes one of the ambient light sensor, the LED indicator, and the infrared sensor.
2. The composite photoelectric sensor according to claim 1, characterized in that, Also includes: A first transparent molding compound, which is fixed to the substrate and encapsulates the first device; The second transparent molding compound is fixed on the substrate and encapsulates the second device.
3. The composite photoelectric sensor according to claim 2, characterized in that, Also includes: A first non-transparent molding compound is fixed on the substrate and wraps around and spaces the first transparent molding compound and the second transparent molding compound; Furthermore, the first non-transparent molding includes at least a first opening that exposes the photosensitive surface of the ambient light sensor or the light-emitting surface of the LED indicator.
4. The composite photoelectric sensor according to claim 3, characterized in that, The first and second transparent molding compounds are made of transparent epoxy resin; the first non-transparent molding compound is made of infrared resin.
5. The composite photoelectric sensor according to claim 1, characterized in that, Also includes: The third device is soldered onto the substrate, and the first device, the second device, and the third device are respectively the ambient light sensor, the LED indicator and the infrared sensor.
6. The composite photoelectric sensor according to claim 5, characterized in that, Also includes: A first transparent molding compound, which is fixed to the substrate and encapsulates the first device; A second transparent molding compound is fixed to the substrate and encapsulates the second device. A third transparent molding compound is fixed to the substrate and encapsulates the third device.
7. The composite photoelectric sensor according to claim 6, characterized in that, Also includes: A second non-transparent molding compound is fixed to the substrate and wraps around and spaces the first transparent molding compound, the second transparent molding compound, and the third transparent molding compound; Furthermore, the second non-transparent molding includes at least a first opening and a second opening, the first opening exposing the photosensitive surface of the ambient light sensor and the second opening exposing the light-emitting surface of the LED indicator.
8. The composite photoelectric sensor according to claim 7, characterized in that, The first, second, and third transparent molding compounds are made of transparent epoxy resin; the second non-transparent molding compound is made of infrared resin.
9. The composite photoelectric sensor according to claim 5, characterized in that, The first device, the second device, and the third device are arranged in a line on the substrate.
10. An electronic device, characterized in that, Including the composite photoelectric sensor as described in any one of claims 1-9.