A pressure sensor
By employing a two-set pad design in the pressure sensor, the risk of short circuits caused by the shared pads between the pin and the wire core is resolved, resulting in a more reliable welding effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG SANHUA COMMERCIAL REFRIGERATION CONTROLS CO LTD SHAOXING CITY
- Filing Date
- 2025-06-24
- Publication Date
- 2026-07-14
AI Technical Summary
In existing pressure sensors, the pin and the wire core share a single solder pad for welding, which results in a long welding time and increases the risk of short circuits in the wire core.
The design employs two sets of pads. The pins are soldered to the first set of pads, and the leads are soldered to the second set of pads. The two sets of pads are located on both sides of the center line of the adapter circuit board, which increases the distance between the soldering positions and reduces the heat impact.
This reduces the risk of short circuits in the leads and improves the reliability and safety of the soldering process.
Smart Images
Figure CN224499741U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sensing technology, specifically to a pressure sensor. Background Technology
[0002] Figure 1 This is a cross-sectional schematic diagram of a pressure sensor, used as a background technology. (For example...) Figure 1 As shown, the pressure sensor includes a main circuit board 01, an adapter circuit board 02, and a lead wire 03. The main circuit board 01 has a pin 011. The lead wire 03 includes a sheath 031, a wire insulation 032, and a wire core 033. The sheath 031 wraps around the wire insulation 032, and the wire insulation 032 wraps around the wire core 033. The adapter circuit board 02 has a solder pad with two holes. The pin 011 passes through one hole, and the wire core 033 passes through the other hole. The pin 011 and the wire core 033 are soldered together to the adapter circuit board 02. In this structure, since the pin 011 and the wire core 033 share a solder pad, the soldering time is relatively long, and there is a risk of burning the wire insulation 032, which increases the risk of short circuit of the wire core 033. Utility Model Content
[0003] The purpose of this application is to provide a pressure sensor, including a main circuit board, an adapter circuit board, and leads. The main circuit board includes pins that extend upward along the longitudinal direction of the pressure sensor. The adapter circuit board is located above the main circuit board and includes a first set of pads and a second set of pads. The adapter circuit board has a center line extending along the length or width direction. The first set of pads is located on one side of the center line, and the second set of pads is located on the other side of the center line. The first set of pads is soldered to the pins, and the second set of pads is soldered to the leads.
[0004] In this application, by setting a first set of pads and a second set of pads on the adapter circuit board, the first set of pads is located on one side of the center line and the second set of pads is located on the other side of the center line. The first set of pads is soldered to the pin and the second set of pads is soldered to the lead. Compared with the prior art, the distance between the soldering position of the pin and the soldering position of the lead is longer. When the first set of pads is soldered to the pin, the thermal impact on the lead is reduced, which helps to reduce the risk of short circuit of the lead. Attached Figure Description
[0005] Figure 1 The diagram shown is a cross-sectional view of a pressure sensor in the background art.
[0006] Figure 2 The figure shown is a cross-sectional schematic diagram of the pressure sensor provided in this application;
[0007] Figure 3As shown Figure 2 Enlarged view of point X in the middle;
[0008] Figure 4a As shown Figure 2 Top view of the intermediate circuit board;
[0009] Figure 4b A top view of another adapter circuit board provided in this application;
[0010] Figure 5 The diagram shown is a state diagram of the adapter circuit board and pins after assembly.
[0011] Figure 6 As shown Figure 2 A three-dimensional structural diagram of the middle shell.
[0012] In the picture:
[0013] 1. Main circuit board; 10. Board body; 11. Pins; 111. Pin tip; 12. Insulating sleeve;
[0014] 2 / 2', Adapter circuit board; A, First group of pads; A1, First pad; A2, Second pad; A3, Third pad; B, Second group of pads; B1, Fourth pad; B2, Fifth pad; B3, Sixth pad; 21, Diode;
[0015] 3. Lead wire; 31. Wire core; 311. Wire end; 32. Wire sheath;
[0016] 4. Outer shell; 41. Cylindrical part; 42. Narrowed part; 421. Straight wall; 422. Curved wall; 43. Isolation part; 431. Horizontal bar; 432. Vertical bar;
[0017] W1, first welding material; W2, second welding material. Detailed Implementation
[0018] The embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the scope of the present invention.
[0019] Figure 2 The figure shown is a cross-sectional schematic diagram of the pressure sensor provided in this application; Figure 3 As shown Figure 2 Enlarged view of point X in the middle; Figure 4a As shown Figure 2 Top view of the intermediate circuit board; Figure 5 The diagram shown is a state diagram of the adapter circuit board and pins after assembly. Figure 6 As shown Figure 2 A three-dimensional structural diagram of the middle shell.
[0020] As shown in the figure, the pressure sensor provided in this application includes a main circuit board 1, an adapter circuit board 2, leads 3, and a housing 4.
[0021] The main circuit board 1 includes a board body 10 and pins 11. The board body 10 is in the shape of a circular plate, and the pins 11 extend upward along the longitudinal direction of the pressure sensor. The pins 11 are arranged approximately perpendicular to the board body 10.
[0022] The adapter circuit board 2 is rectangular and located above the main circuit board 1. The adapter circuit board 2 is parallel to the main circuit board 1. The adapter circuit board 2 includes a first set of pads A and a second set of pads B. The adapter circuit board 2 has a center line L extending along the length or width direction. The first set of pads A is located on one side of the center line L, and the second set of pads B is located on the other side of the center line L. The first set of pads A is soldered to the pin 11, and the second set of pads B is soldered to the lead wire 3.
[0023] This solution adopts a two-set pad design, with the two sets of pads located on both sides of the center line L of the adapter circuit board 2. Compared with the prior art, the distance between the soldering position of the pin 11 and the soldering position of the lead 3 is longer. When the first set of pads A is soldered to the pin 11, the thermal impact on the lead 3 is reduced, which helps to reduce the risk of short circuit of the lead 3.
[0024] Furthermore, such as Figure 4a The first set of pads A includes a first pad A1, a second pad A2, and a third pad A3, which are arranged in a straight line. The aforementioned pin 11 passes through the first pad A1, the second pad A2, and the third pad A3 respectively. The line N connecting the center of the first pad A1, the center of the second pad A2, and the center of the third pad A3 is parallel to the center line L. This arrangement, with the pin 11 arranged in a straight line, facilitates soldering the pin 11 to the first set of pads A.
[0025] Furthermore, the second group of pads B includes the fourth pad B1, the fifth pad B2, and the sixth pad B3, one of which is closer to the first group of pads A than the other two (e.g., ...). Figure 4a (As shown), or two of the fourth pad B1, fifth pad B2, and sixth pad B3 are closer to the first group of pads A than the other. This arrangement makes the arrangement of the second group of pads B different from that of the first group of pads A. In other words, this error-proofing design makes it less prone to errors when soldering the lead 3 to the second group of pads B, and the end position of the lead 3 can be easily adjusted to accommodate the staggered positions of the fourth pad B1, fifth pad B2, and sixth pad B3.
[0026] As one specific implementation method, continue as follows Figure 4a As shown, the fifth pad B2 is located between the fourth pad B1 and the sixth pad B3. The fourth pad B1 is closer to the first group of pads A than the fifth pad B2 and the sixth pad B3. Let d be the shortest distance between the fourth pad B1 and the first group of pads A, and e be the shortest distance between the fourth pad B1 and the fifth pad B2. Then, the shortest distance d between the fourth pad B1 and the first group of pads A is greater than the shortest distance e between the fourth pad B1 and the fifth pad B2. This setting ensures the shortest distance between the first group of pads A and the second group of pads B, thereby reducing the thermal impact on the wire sheath 32 of the lead 3 when the pin 11 is soldered to the first group of pads A, making the wire sheath 32 less prone to damage.
[0027] Continue as Figure 4a As shown, the shortest distance d between the fourth pad B1 and the first set of pads A satisfies: d ≥ 1 mm. If d < 1 mm, the distance between the two sets of pads is too close, and the risk of the wire sheath 32 of the lead 3 being burned is high.
[0028] Figure 4b This is a top view of another adapter circuit board provided in this application. In this embodiment, the shortest distance between the fourth pad B1 and the first group of pads A is defined as D, which satisfies: D≥3mm; the adapter circuit board 2' also includes a diode 21, which is arranged along the extension direction of the center line L, and is located between the first group of pads A and the second group of pads B. By setting the diode 21, the anti-static performance of the adapter circuit board 2' can be improved.
[0029] Continue as Figure 2 , Figure 3 , Figure 5 As shown, the lead wire 3 includes a wire core 31 and a wire sheath 32. In the thickness direction of the adapter circuit board 2, the wire core 31 penetrates the second set of solder pads B. The wire end 311 of the wire core 31 is located below the adapter circuit board 2, and the wire sheath 32 is located above the adapter circuit board 2. The pressure sensor also includes a first welding material W1, which wraps at least part of the wire end 311. That is, the welding position of the wire core 31 and the wire sheath 32 are located on opposite sides of the thickness direction of the adapter circuit board 2. When the wire core 31 is welded, the adapter circuit board 2 can insulate some of the heat, thereby reducing the thermal impact on the wire sheath 32.
[0030] Furthermore, such as Figure 3As shown, in the thickness direction of the adapter circuit board 2, the pin 11 penetrates the first set of pads A, and the tip 111 of the pin 11 is located above the adapter circuit board 2. The pressure sensor also includes a second welding material W2, which covers at least part of the tip 111. The second welding material W2 and the aforementioned first welding material W1 are located on opposite sides of the thickness direction of the adapter circuit board 2. During welding, the first welding material W1 will overflow outward relative to the second set of pads B, and the second welding material W2 will overflow outward relative to the first set of pads A. If the first welding material W1 and the second welding material W2 are located on the same side of the thickness direction of the adapter circuit board 2, due to their close proximity and the fact that the wire core 31 is welded to the second set of pads B first, the welding of the pin 11 to the first set of pads A may affect the first welding material W1, thus affecting the welding quality of the wire core 31 to the second set of pads B.
[0031] Continue as Figure 3 , Figure 5 As shown, the main circuit board 1 also includes an insulating sleeve 12, which is made of plastic. The insulating sleeve 12 is fixed to the main board body 10 by reflow soldering. The insulating sleeve 12 is fitted with a pin 11. The insulating sleeve 12 is located below the adapter circuit board 2. In the longitudinal direction of the pressure sensor, the adapter circuit board 2 contacts the insulating sleeve 12. When assembling the pressure sensor in this embodiment, the lead wire 3 is first soldered to the second set of pads B of the adapter circuit board 2. After soldering, the first set of pads A of the adapter circuit board 2 is then inserted into the pin 11 (e.g., ...). Figure 5 As shown, the adapter circuit board 2 is brought into contact with the insulating sleeve 12. Specifically, the three pins 11 are inserted into the first pad A1, the second pad A2, and the third pad A3, respectively. After insertion, the pins 11 are soldered to the first set of pads A. By setting the insulating sleeve 12, on the one hand, it provides insulation between the pins 11; on the other hand, since the pins 11 are thin and straight, the insulating sleeve 12 can protect the pins 11 from bending under force during assembly, ensuring the reliability of the assembly between the pins 11 and the first set of pads A. Furthermore, the insulating sleeve 12 provides a platform to support the adapter circuit board 2.
[0032] like Figure 2 , Figure 6As shown, the pressure sensor also includes a housing 4, which is made of plastic. The housing 4 includes a cylindrical part 41 and a constricted part 42. The cross-sectional profile of the constricted part 42 is racetrack-shaped, with the plane perpendicular to the longitudinal direction of the pressure sensor as the projection plane. The projection profile of the constricted part 42 on the projection plane is located within the projection profile of the cylindrical part 41 on the projection plane. At least part of the main circuit board 1 is located inside the cylindrical part 41, and the adapter circuit board 2 is located inside the constricted part 42. Furthermore, the outer casing 4 also includes an isolation section 43, which is located inside the constricted section 42. The isolation section 43 includes a horizontal bar 431 and a vertical bar 432. The inner wall of the constricted section 42 includes a straight wall 421 and an arc-shaped wall 422. The horizontal bar 431 extends along the width direction of the constricted section 42 and is connected to the straight wall 421. The vertical bar 432 extends from the horizontal bar 431 toward the arc-shaped wall 422 and there is a distance between the vertical bar 432 and the arc-shaped wall 422. There are several leads 3, and the vertical bar 432 is inserted between each lead 3.
[0033] Specifically, in this embodiment, there are three leads 3 and two vertical supports 432. The two vertical supports 432 can isolate the three leads 3. By setting the vertical supports 432 to isolate the leads 3, even if the wire sheath 32 on each lead 3 is damaged due to heat, the risk of short circuit between the leads 3 can be reduced through isolation.
[0034] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0035] The above examples illustrate the principles and implementation methods of this utility model. The descriptions of these embodiments are merely for the purpose of aiding understanding this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of this utility model.
Claims
1. A pressure sensor, characterized in that, include: The system comprises a main circuit board, an adapter circuit board, and leads. The main circuit board includes pins that extend upward along the longitudinal direction of the pressure sensor. The adapter circuit board is located above the main circuit board and includes a first set of pads and a second set of pads. The adapter circuit board has a center line extending along either the length or width direction. The first set of pads is located on one side of the center line, and the second set of pads is located on the other side of the center line. The first set of pads is soldered to the pins, and the second set of pads is soldered to the leads.
2. The pressure sensor according to claim 1, characterized in that: The first set of pads includes a first pad, a second pad, and a third pad, which are arranged in a straight line. The pins pass through the first pad, the second pad, and the third pad, respectively.
3. The pressure sensor according to claim 1, characterized in that: The first group of pads includes a first pad, a second pad, and a third pad. The line connecting the center of the first pad, the center of the second pad, and the center of the third pad is parallel to the center line. The second group of pads includes a fourth pad, a fifth pad, and a sixth pad. One of the fourth pad, the fifth pad, and the sixth pad is closer to the first group of pads than the other two, or two of the fourth pad, the fifth pad, and the sixth pad are closer to the first group of pads than the other one.
4. The pressure sensor according to claim 3, characterized in that: The fifth pad is located between the fourth pad and the sixth pad. The fourth pad is closer to the first group of pads than the fifth pad and the sixth pad. The shortest distance between the fourth pad and the first group of pads is greater than the shortest distance between the fourth pad and the fifth pad.
5. The pressure sensor according to claim 4, characterized in that: If the shortest distance between the fourth pad and the first group of pads is defined as d, then d ≥ 1 mm is satisfied.
6. The pressure sensor according to claim 4, characterized in that: The shortest distance between the fourth pad and the first group of pads is defined as D, which satisfies: D≥3mm; the adapter circuit board also includes a diode, which is arranged along the extension direction of the center line and is located between the first group of pads and the second group of pads.
7. The pressure sensor according to any one of claims 1-6, characterized in that: The lead wire includes a wire core and a wire sheath. In the thickness direction of the adapter circuit board, the wire core passes through the second set of pads. The wire end of the wire core is located below the adapter circuit board, and the wire sheath is located above the adapter circuit board. The pressure sensor also includes a first welding material that wraps at least a portion of the wire end.
8. The pressure sensor according to any one of claims 1-6, characterized in that: In the thickness direction of the adapter circuit board, the pin passes through the first set of pads, and the tip of the pin is located above the adapter circuit board; The pressure sensor also includes a second welding material that covers at least a portion of the needle.
9. The pressure sensor according to claim 8, characterized in that: The main circuit board also includes an insulating sleeve made of plastic. The insulating sleeve covers the pin and is located below the adapter circuit board. The adapter circuit board is in contact with the insulating sleeve in the longitudinal direction of the pressure sensor.
10. The pressure sensor according to any one of claims 1-6, characterized in that: The device also includes a housing comprising a cylindrical portion and a constricted portion, with a plane perpendicular to the longitudinal direction of the pressure sensor as the projection plane. The projection outline of the constricted portion on the projection plane lies within the projection outline of the cylindrical portion on the projection plane. At least a portion of the main circuit board is located within the cylindrical portion, and the adapter circuit board is located within the constricted portion. The housing also includes an isolation portion located within the constricted portion. The isolation portion includes a horizontal bar and a vertical bar. The inner wall of the constricted portion includes a straight wall and an arc-shaped wall. The horizontal bar extends along the width direction of the constricted portion and is connected to the straight wall. The vertical bar extends from the horizontal bar toward the arc-shaped wall. The device has several leads, and the vertical bar is inserted between each of the leads.