A soaking sampling jig for a semiconductor electrostatic chuck

Abstract

The utility model provides a kind of soaking sampling jig of semiconductor electrostatic chuck, including jig main body, jig main body includes a bottom plate in circular, the outer edge of bottom plate is equipped with a baffle, bottom plate and baffle constitute a containing groove with opening upward, seven support points on bottom plate, one of seven support points is located at the center of bottom plate, and the rest six support points are arranged in the outer edge of bottom plate in center support;Four leveling feet are provided at the bottom of bottom plate, and four leveling feet are evenly distributed on bottom plate, leveling foot includes a base, the base is connected with bottom plate by M5 screw, the base is connected with a stabilizing block by a stand, and the stabilizing block is in the form of disc.The utility model places jig on water platform, adjusts leveling foot to keep containing groove horizontal, then pours blank water sample into jig, and electrostatic chuck is placed into jig by upside-down pouring.Compared with prior art, this scheme can soak and sample the whole working surface of component, and the time and solution content are fixed.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, specifically to an immersion sampling fixture for a semiconductor electrostatic chuck. Background Technology

[0002] Due to the process requirements of component cleaning, electrostatic chucks (ESCs) need to sample and analyze the elemental content of the surface. Currently, the sampling methods are usually as follows: (1) using a dropper or pipette to drop a certain amount of acid onto the component, letting it stand for a period of time, then recovering the solution and measuring the solution; (2) using a clean cotton swab to apply water or acid to the component, recovering the cotton swab, and measuring the swab extract. Of the above methods, the first method cannot sample the entire working surface of the component, making it difficult to characterize the overall condition of the working surface of the component, and it is also easy to leave acid marks on the surface of the component after standing extraction, requiring rework; the second method, because it only involves wiping, is affected by the wiping force, resulting in a large sampling error, and because it is an indirect contact, the actual measurement is much smaller than that of the standing method, and it cannot effectively characterize trace metal residues. Utility Model Content

[0003] To address the problems existing in the prior art, this utility model provides an immersion sampling fixture for a semiconductor electrostatic chuck, thereby solving at least one of the aforementioned technical problems.

[0004] The technical solution of this utility model is: a semiconductor electrostatic chuck immersion sampling fixture, comprising a fixture body, characterized in that the fixture body comprises a circular base plate, a baffle is provided on the outer edge of the base plate, the base plate and the baffle form an upward-opening receiving groove, and seven support points on the base plate, one of the seven support points being located at the center of the base plate, and the other six support points being arranged in a centrally opposing manner on the outer edge of the base plate;

[0005] The bottom of the base plate is provided with four leveling feet, which are evenly distributed on the base plate. Each leveling foot includes a base, which is connected to the base plate by an M5 screw. The base is connected to a stabilizing block by a column, and the stabilizing block is disc-shaped.

[0006] This invention involves placing a fixture flat on a horizontal platform, adjusting the leveling feet to ensure the receiving tank is level, then pouring a blank water sample into the fixture, and finally placing an electrostatic chuck upside down inside the fixture. Compared to existing methods, this approach allows for immersion sampling of the entire working surface of the component, with fixed time and solution content, resulting in better reproducibility. The content of each metal element in the blank leaching water sample must be less than 2 ppt.

[0007] Further preferably, the seven support points are located inside the four leveling feet.

[0008] This can improve the overall stability of the fixture body.

[0009] Further preferably, the baffle has a triangular notch at its top edge to facilitate the drainage of spilled liquid.

[0010] Further preferably, the diameter of the base plate is greater than 12 inches.

[0011] Preferably, the fixture body is made of PTFE resin.

[0012] Further preferably, the support point is a cuboid protrusion.

[0013] This allows for better contact with the electrostatic chuck. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a cross-sectional view of the present invention.

[0016] In the diagram: 1. Base plate; 2. Baffle; 3. Support point; 4. Base; 5. Column; 6. Stabilizing block; 7. Notch. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Reference Figures 1-2 As shown, a semiconductor electrostatic chuck immersion sampling fixture includes a fixture body, which includes a circular base plate 1. A baffle 2 is provided on the outer edge of the base plate, and the base plate and the baffle form an upward-opening receiving groove. There are seven support points 3 on the base plate, one of which is located at the center of the base plate, and the other six support points are arranged in a centrally opposed manner on the outer edge of the base plate. The bottom of the base plate is provided with four leveling feet, which are evenly distributed on the base plate. Each leveling foot includes a base 4, which is connected to the base plate by an M5 screw. The base is connected to a stabilizing block 6 through a column 5. The stabilizing block is disc-shaped.

[0019] This invention involves placing a fixture flat on a horizontal platform, adjusting the leveling feet to ensure the receiving tank is level, then pouring a blank water sample into the fixture, and finally placing an electrostatic chuck upside down inside the fixture. Compared to existing methods, this approach allows for immersion sampling of the entire working surface of the component, with fixed time and solution content, resulting in better reproducibility. The content of each metal element in the blank leaching water sample must be less than 2 ppt.

[0020] Further optimization involves placing the seven support points inside the four leveling feet. This improves the overall stability of the fixture body.

[0021] Further preferably, the top edge of the baffle has a triangular notch 7, which allows for easy drainage of spilled liquid.

[0022] Further optimization involves using a base plate with a diameter greater than 12 inches.

[0023] Further preferred, the fixture body is made of PTFE resin.

[0024] Further optimization involves using a cuboid protrusion as the support point, which allows for better contact with the electrostatic chuck.

[0025] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model.

Claims

1. A semiconductor electrostatic chuck immersion sampling fixture, comprising a fixture body, characterized in that, The fixture body includes a circular base plate, and a baffle is provided on the outer edge of the base plate. The base plate and the baffle form an upward-opening receiving groove. There are seven support points on the base plate. One of the seven support points is located at the center of the base plate, and the other six support points are arranged in a centrally opposite manner on the outer edge of the base plate. The bottom of the base plate is provided with four leveling feet, which are evenly distributed on the base plate. Each leveling foot includes a base, which is connected to the base plate by an M5 screw. The base is connected to a stabilizing block by a column, and the stabilizing block is disc-shaped.

2. The immersion sampling fixture for a semiconductor electrostatic chuck according to claim 1, characterized in that, The seven support points are located inside the four leveling feet.

3. The immersion sampling fixture for a semiconductor electrostatic chuck according to claim 1, characterized in that, The top edge of the baffle has a triangular notch.

4. The immersion sampling fixture for a semiconductor electrostatic chuck according to claim 1, characterized in that, The diameter of the base plate is greater than 12 inches.

5. The immersion sampling fixture for a semiconductor electrostatic chuck according to claim 1, characterized in that, The main body of the fixture is made of PTFE resin.

6. The immersion sampling fixture for a semiconductor electrostatic chuck according to claim 1, characterized in that, The support point is a cuboid protrusion.

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