A device for detecting the surface cleanliness of a silicon wafer after photoresist stripping

Abstract

The utility model discloses a photoresist after the silicon wafer surface cleanliness detection device of removing glue, including work table, the rear side top fixed mounting of work table has the supporting plate, and the front side middle part of supporting plate is provided with the mounting frame, and the inner chamber of mounting frame is provided with the fixed component for fixing silicon wafer, and the rear side middle part of supporting plate is provided with the turnover component for overturning mounting frame to the silicon wafer fixed in its inside is turned over, the utility model discloses the setting of turnover component, motor drive drive rod, and then drive mounting frame overturn, realize the silicon wafer and turn over, can more efficient, accurate, can complete the turning operation in short period of time, reduced the time waste in the detection process, improved the overall detection efficiency, especially suitable for the production scene of large -scale silicon wafer detection.

Description

Technical Field

[0001] This utility model relates to the field of surface cleanliness detection technology, specifically a device for detecting the surface cleanliness of silicon wafers after photoresist removal. Background Technology

[0002] In semiconductor device manufacturing, the surface cleanliness of the silicon wafer after photoresist removal directly affects the yield of subsequent processes. Therefore, it is essential to test the surface cleanliness of the silicon wafer after photoresist removal.

[0003] Currently, Chinese patent CN219978113U discloses a single-crystal silicon wafer production testing device, including a testing platform and a laser detector. The upper surface of the testing platform has two sets of slidingly connected clamping plates in the middle, and support frames are connected to the four corners of the upper surface. A top plate is installed between the tops of the four support frames. A data display screen and control panel are connected to the upper surface of the top plate. Vertical plates are provided at both ends of the lower surface of the top plate, and an adjustment assembly is provided between adjacent vertical plates. The adjustment assembly includes a threaded rod with a threaded sleeve threaded onto it. A U-shaped mounting frame is installed at the bottom of the threaded sleeve. Electric telescopic rods are provided on both sides of the U-shaped mounting frame. The bottom ends of the two sets of electric telescopic rods are connected to the outer walls of both sides of the laser detector, respectively. This allows for the detection of different positions on the same side of the single-crystal silicon wafer, achieving omnidirectional testing of the single-crystal silicon wafer and providing more comprehensive test results. Furthermore, it can clamp the position of the single-crystal silicon wafer, preventing positional displacement during testing.

[0004] The aforementioned monocrystalline silicon wafer production and testing device still has some problems in use. After testing one side of the monocrystalline silicon wafer, it is necessary to manually release the clamp on the monocrystalline silicon wafer, flip it over, and clamp it again. The operation is cumbersome, which reduces the testing efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a device for detecting the surface cleanliness of silicon wafers after photoresist removal, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A device for detecting the surface cleanliness of silicon wafers after photoresist removal includes a worktable, a support plate fixedly mounted on the top rear side of the worktable, a mounting frame disposed in the middle front side of the support plate, a fixing component for fixing the silicon wafer disposed in the inner cavity of the mounting frame, a flipping component disposed in the middle rear side of the support plate for flipping the mounting frame to flip the silicon wafer fixed inside, a detection component for detecting the surface cleanliness of the silicon wafer disposed in the upper front side of the support plate, and a moving component for moving the detection component up and down disposed in the upper front side of the worktable.

[0008] As a preferred technical solution, the flipping assembly includes a motor fixedly installed in the middle of the rear side of the support plate, the output shaft of the motor is keyed to a drive rod, and the end of the drive rod passes through the support plate and is fixedly connected to the surface of the mounting frame.

[0009] As a preferred technical solution, the detection component includes a connecting plate disposed on the upper front side of the support plate, a fixing clip fixedly installed at the front end of the connecting plate, a camera installed in the inner cavity of the fixing clip, the lens of the camera being aligned with the silicon wafer, a computer fixedly installed on one side of the support plate, and the output end of the camera being electrically connected to the signal input end of the computer via a wire.

[0010] As a preferred technical solution, a controller is installed on the rear side of the support plate, the signal input terminal of the motor is electrically connected to the signal output terminal of the controller through a wire, and the signal input terminal of the controller is electrically connected to the signal output terminal of the computer through a wire.

[0011] As a preferred technical solution, the moving component includes a square groove formed on the upper front side of the support plate and arranged along its height. A lead screw is rotatably connected to the inner cavity of the square groove. The end of the lead screw passes through the square groove upward and extends to the upper part of the support plate. A nut seat is threadedly connected to the surface of the lead screw located inside the square groove. The end of the connecting plate is fixedly connected to the surface of the nut seat. Guide components are provided on both sides of the connecting plate to guide the connecting plate and prevent it from shaking during movement.

[0012] As a preferred technical solution, the guide assembly includes limiting holes opened on the upper front side of the support plate and located on both sides of the square groove. A U-shaped frame is provided on the rear side of the support plate. The two ends of the U-shaped frame pass through the corresponding limiting holes, and the inner sides of the two ends of the U-shaped frame passing through the limiting holes are fixedly connected to the corresponding side surfaces of the connecting plate.

[0013] As a preferred technical solution, the end of the U-shaped frame is threadedly connected to a fixing screw, and the end thread of the fixing screw passes through the U-shaped frame and abuts against the surface of the support plate.

[0014] As a preferred technical solution, the fixing component includes two sets of clamping plates disposed inside the mounting frame. Each set of clamping plates has a limiting groove that extends along its length and is used to limit the edge of the silicon wafer in the middle of its opposite side. The middle of the opposite sides of the two sets of clamping plates protrudes to the corresponding side, so that the middle of the opposite sides of the two sets of clamping plates is arc-shaped. The right side of the mounting frame is provided with a fixing member for fixing the clamping plate located on the right side. The left side of the mounting frame is provided with an elastic pushing member that pushes the clamping plate located on the left side to the right and cooperates with the clamping plate on the right side to fix the silicon wafer.

[0015] The elastic pusher includes circular rods fixedly installed at both ends of the outer side of the clamping plate on the left side. The ends of the two sets of circular rods extend to the left and penetrate the surface of the mounting frame. The ends of the circular rods located outside the mounting frame are fixedly connected to a limiting plate. The surface of the circular rods located inside the mounting frame is fitted with a spring. The two ends of the spring contact the inner left wall of the mounting frame and the left surface of the clamping plate, respectively.

[0016] The fastener includes a hand-tightening bolt threaded to the right end surface of the mounting frame. The end of the hand-tightening bolt is threaded through the mounting frame and fixedly connected to a connecting rod. A connecting groove corresponding to the connecting rod is opened in the middle of the right side of the clamping plate located on the right side. The connecting rod is rotatably inserted into the inner cavity of the connecting groove. Guide rods are fixedly connected to both ends of the right side of the clamping plate located on the right side. The ends of the two sets of guide rods pass through the mounting frame to the right and extend to the right side of the mounting frame.

[0017] As a preferred technical solution, the top rear side of the mounting frame is provided with a groove that extends along its length. The inner cavity of the groove is provided with scale lines. A sliding sleeve is slidably connected to the inner rear wall of the mounting frame. The sliding sleeve is U-shaped, and its upper and lower ends are slidably connected to the upper and lower rear surfaces of the mounting frame, respectively. The end of the sliding sleeve is pointed, and the pointed end points to the scale lines in the groove.

[0018] As a preferred technical solution, a limiting ring is fixedly installed in the middle of the rear side of the mounting frame, and the limiting ring is rotatably connected to the front surface of the support plate.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. This utility model, through the setting of the flipping component, uses a motor to drive the drive rod, which in turn drives the mounting frame to flip, thereby realizing the flipping of the silicon wafer. This makes it more efficient and accurate, and can complete the flipping operation in a short time, reducing the time wasted in the inspection process and improving the overall inspection efficiency. It is especially suitable for large-scale silicon wafer inspection production scenarios.

[0021] 2. Through the setting of the controller, the computer sends instructions to the controller according to the detection results, and the controller then controls the operation of the motor according to the instructions, so that the flipping operation of the silicon wafer can be automatically performed according to the detection requirements, reducing manual intervention, improving the automation level and detection efficiency of the detection process, and also reducing the impact of human factors on the detection results.

[0022] 3. Through the setting of the fixing components, the limiting groove and arc design of the clamping plate can closely fit the edge of the silicon wafer, effectively restricting the position of the silicon wafer and preventing the silicon wafer from shifting during the detection or flipping process. At the same time, the cooperation of the elastic pushing component and the fixing component can automatically adjust the position of the clamping plate according to the size of the silicon wafer, so as to achieve stable fixing of silicon wafers of different sizes and improve the versatility of the equipment. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the device for detecting the cleanliness of silicon wafer surfaces after photoresist removal according to this utility model.

[0024] Figure 2 This is a schematic diagram of the silicon wafer surface cleanliness detection device after photoresist removal, from another perspective.

[0025] Figure 3 This is a schematic diagram of the mounting frame of this utility model;

[0026] Figure 4 This is a schematic diagram of the connecting groove of this utility model.

[0027] In the picture:

[0028] 100. Workbench; 101. Support plate; 102. Square groove; 103. Limiting hole;

[0029] 200. Computer; 201. Camera; 202. Nut seat; 203. Lead screw; 204. Connecting plate; 205. U-shaped bracket; 206. Fixing clip; 207. Fixing screw; 208. Controller;

[0030] 300. Mounting frame; 301. Clamping plate; 302. Limiting ring; 303. Motor; 304. Groove; 305. Scale line; 306. Sliding sleeve; 307. Drive rod; 308. Limiting groove; 309. Connecting groove;

[0031] 400. Hand-tightened bolt; 401. Guide rod; 402. Connecting rod;

[0032] 500, Spring; 501, Limiting plate; 502, Circular rod. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figure 1-4 This embodiment provides a device for detecting the surface cleanliness of silicon wafers after photoresist removal, including a worktable 100. A support plate 101 is fixedly installed on the top rear side of the worktable 100. A mounting frame 300 is provided in the middle front side of the support plate 101. A fixing component for fixing the silicon wafer is provided in the inner cavity of the mounting frame 300. A flipping component for flipping the mounting frame 300 to flip the silicon wafer fixed inside is provided in the middle rear side of the support plate 101. A detection component for detecting the surface cleanliness of the silicon wafer is provided in the upper front side of the support plate 101. A moving component for moving the detection component up and down is provided in the upper front side of the worktable 100.

[0035] The flipping assembly includes a motor 303 fixedly installed in the middle of the rear side of the support plate 101. The output shaft of the motor 303 is keyed to a drive rod 307. The end of the drive rod 307 passes through the support plate 101 and is fixedly connected to the surface of the mounting frame 300. With the flipping assembly, the motor 303 drives the drive rod 307, thereby causing the mounting frame 300 to flip, thus enabling the silicon wafer to be flipped. This is more efficient and accurate, and the flipping operation can be completed in a short time, reducing the time wasted in the inspection process and improving the overall inspection efficiency. It is especially suitable for large-scale silicon wafer inspection production scenarios.

[0036] Among them, motor 303 is a servo motor, and its specific working principle is a well-known technical means, so it will not be elaborated on here.

[0037] The detection component includes a connecting plate 204 located on the upper front side of a support plate 101. A fixing clip 206 is fixedly installed at the front end of the connecting plate 204, and a camera 201 is installed inside the fixing clip 206. The lens of the camera 201 is aimed at the silicon wafer. A computer 200 is fixedly installed on one side of the support plate 101. The output end of the camera 201 is electrically connected to the signal input end of the computer 200 via a wire. By configuring the detection component and using the fixing clip 206 to mount the camera 201, the camera 201 can be stably aimed at the silicon wafer, ensuring that the captured image of the silicon wafer surface is clear and accurate. This avoids inaccurate image acquisition due to camera 201 shaking or positional deviation, which could affect the judgment of the cleanliness of the silicon wafer surface. The camera 201 is electrically connected to the computer 200, and the image signal captured by the camera 201 can be quickly transmitted to the computer 200 for processing. The computer 200 has powerful data processing capabilities and can use various image processing algorithms and preset detection standards to analyze the image, quickly and accurately judging the cleanliness of the silicon wafer surface, thus improving the accuracy and efficiency of the detection.

[0038] The support plate 101 is equipped with a controller 208. The signal input terminal of the motor 303 is electrically connected to the signal output terminal of the controller 208 via a wire. The signal input terminal of the controller 208 is electrically connected to the signal output terminal of the computer 200 via a wire. Through the settings of the controller 208, the computer 200 sends instructions to the controller 208 according to the detection results. The controller 208 then controls the operation of the motor 303 according to the instructions, so that the flipping operation of the silicon wafer can be automatically performed according to the detection requirements, reducing manual intervention, improving the automation level and detection efficiency of the detection process, and also reducing the impact of human factors on the detection results.

[0039] Among them, controller 208 can be a DSP controller, and its specific model can be, but is not limited to, TMS320F2812.

[0040] Among them, camera 201 is either a line scan camera or an area scan camera. Meanwhile, computer 200 integrates an image recognition module that can process the photos transmitted back by camera 201.

[0041] First, the computer 200 performs preprocessing operations such as grayscale conversion, noise reduction, and filtering on the acquired raw images to improve image quality and reduce noise interference, providing a good foundation for subsequent feature extraction and analysis. For example, the median filtering algorithm can effectively remove salt-and-pepper noise in the image while preserving the edge information of the image.

[0042] Subsequently, feature information of the silicon wafer surface, such as the shape, size, position, and gray value of impurities, is extracted through algorithms such as edge detection, morphological operations, and texture analysis. For example, the Canny edge detection algorithm can accurately detect the edges of impurities, and then the edges are optimized through morphological dilation and erosion operations to further determine the outline of the impurities.

[0043] At this point, the extracted features are compared and matched with a pre-established impurity model or standard template. Using classification algorithms in machine learning, such as support vector machines and decision trees, it is determined whether impurities exist on the silicon wafer surface and the type and severity of the impurities. At the same time, deep learning models, such as convolutional neural networks, can be used to automatically learn the features of the silicon wafer surface image to achieve accurate identification and classification of impurities.

[0044] The movable component includes a square groove 102 located on the upper front side of the support plate 101 and extending along its height. A lead screw 203 is rotatably connected to the inner cavity of the square groove 102. The end of the lead screw 203 extends upward through the square groove 102 and reaches the upper part of the support plate 101. A nut seat 202 is threadedly connected to the surface of the lead screw 203 located inside the square groove 102. The end of the connecting plate 204 is fixedly connected to the surface of the nut seat 202. Guide components are provided on both sides of the connecting plate 204 to guide the connecting plate 204 and prevent it from shaking during movement. By setting up the movable component, rotating the lead screw 203 can achieve precise up and down movement. This allows the height of the detection component to be flexibly adjusted according to the different thicknesses, placement positions, and detection requirements of the silicon wafer, ensuring that the camera 201 can always accurately align with the surface of the silicon wafer for detection, thus improving the versatility and adaptability of the equipment.

[0045] The guide assembly includes limiting holes 103 located on the upper front side of the support plate 101 and on both sides of the square groove 102. A U-shaped frame 205 is provided on the rear side of the support plate 101. The two ends of the U-shaped frame 205 pass through the corresponding limiting holes 103. The inner sides of the two ends of the U-shaped frame 205 passing through the limiting holes 103 are fixedly connected to the corresponding side surfaces of the connecting plate 204. Through the setting of the guide assembly, the two ends of the U-shaped frame 205 pass through the limiting holes 103 and are fixed on the connecting plate 204, forming a double guide structure for the connecting plate 204. This enhances the stability and reliability of the guide, better limits the offset and shaking of the connecting plate 204 during movement, ensures that the detection component always moves up and down along the predetermined trajectory, and improves the operating accuracy of the equipment.

[0046] The end of the U-shaped frame 205 is threadedly connected to a fixing screw 207. The end thread of the fixing screw 207 passes through the U-shaped frame 205 and abuts against the surface of the support plate 101. By setting the fixing screw 207, the U-shaped frame 205 can be fixed on the support plate 101 to prevent the position of the U-shaped frame 205 from changing due to vibration or other reasons during equipment operation.

[0047] The fixing component includes two sets of clamping plates 301 disposed inside the mounting frame 300. Each set of clamping plates 301 has a limiting groove 308 that is set along the length and used to limit the edge of the silicon wafer in the middle of its opposite side. The middle of the opposite side of the two sets of clamping plates 301 protrudes to the corresponding side, so that the middle of the opposite side of the two sets of clamping plates 301 is arc-shaped. The right side of the mounting frame 300 is provided with a fixing member for fixing the clamping plate 301 located on the right side. The left side of the mounting frame 300 is provided with an elastic pushing member that pushes the clamping plate 301 located on the left side to the right and cooperates with the clamping plate 301 on the right side to fix the silicon wafer.

[0048] The elastic pusher includes two circular rods 502 fixedly installed on the outer ends of the clamping plate 301 on the left side. The ends of the two sets of circular rods 502 extend to the left and penetrate the surface of the mounting frame 300. The ends of the circular rods 502 located on the outer side of the mounting frame 300 are fixedly connected to the limiting plate 501. The surface of the circular rods 502 located inside the mounting frame 300 is fitted with a spring 500. The two ends of the spring 500 contact the inner left wall of the mounting frame 300 and the left surface of the clamping plate 301, respectively.

[0049] The fixing components include a hand-tightening bolt 400 threadedly connected to the right end surface of the mounting frame 300. The end of the hand-tightening bolt 400 is threaded through the mounting frame 300 and fixedly connected to a connecting rod 402. A connecting groove 309 corresponding to the connecting rod 402 is opened in the middle of the right side of the clamping plate 301 located on the right side. The connecting rod 402 is rotatably inserted into the inner cavity of the connecting groove 309. Guide rods 401 are fixedly connected to both ends of the right side of the clamping plate 301 located on the right side. The ends of the two sets of guide rods 401 pass through the mounting frame 300 to the right side of the mounting frame 300 respectively. Through the setting of the fixing components, the limiting groove 308 and the arc design of the clamping plate 301 can closely fit the edge of the silicon wafer, effectively limiting the position of the silicon wafer and preventing the silicon wafer from shifting during the inspection or flipping process. At the same time, the cooperation of the elastic pusher and the fixing components can automatically adjust the position of the clamping plate 301 according to the size of the silicon wafer, realize the stable fixing of silicon wafers of different sizes, and improve the versatility of the equipment.

[0050] The connecting rod 402 has a T-shaped cross-section.

[0051] The mounting frame 300 has a groove 304 extending along its length on the top rear side. The groove 304 has a scale line 305 inside. A sliding sleeve 306 is slidably connected to the inner rear wall of the mounting frame 300. The sliding sleeve 306 is U-shaped. The upper and lower ends of the sliding sleeve 306 are slidably connected to the upper and lower rear surfaces of the mounting frame 300, respectively. The end of the sliding sleeve 306 is pointed and the tip points to the scale line 305 inside the groove 304. By observing the scale line 305 pointed to by the tip of the sliding sleeve 306 during the movement of the right clamp 301, the movement distance of the right clamp 301 can be intuitively understood.

[0052] Among them, a limiting ring 302 is fixedly installed in the middle of the rear side of the mounting frame 300. The limiting ring 302 is rotatably connected to the front surface of the support plate 101. Through the setting of the limiting ring 302, the limiting ring 302 is rotatably connected to the front surface of the support plate 101, which provides stable support for the flipping of the mounting frame 300, and at the same time reduces the friction during the flipping process, making the mounting frame 300 flipping more smoothly.

[0053] Working principle;

[0054] First, push the left clamp 301 outward to move it away from the right clamp 301 and compress the spring 500. Then, remove the silicon wafer so that the edge of the silicon wafer after removing the photoresist is in the limiting groove 308 on the surface of the right clamp 301. At this time, slowly release the left clamp 301 so that the limiting groove 308 on the surface of the left clamp 301 engages with the edge of the silicon wafer and is fixed under the push of the spring 500.

[0055] Then, the lens of camera 201 is aimed at the silicon wafer and takes an image of the silicon wafer surface. The image signal is transmitted to computer 200 fixed on one side of support plate 101 via wire. Computer 200 analyzes and processes the image transmitted by camera 201 according to preset standards to determine the cleanliness of silicon wafer surface. When the determination is completed, the staff can view the detection result of silicon wafer surface cleanliness on computer 200. At the same time, computer 200 sends a signal to controller 208.

[0056] Subsequently, the controller 208 controls the motor 303 installed in the middle of the rear side of the support plate 101 to start. The output shaft of the motor 303 drives the key-connected drive rod 307 to rotate. When the drive rod 307 rotates, it drives the mounting frame 300 to flip together, thereby easily realizing the flipping operation of the silicon wafer fixed in the mounting frame 300, which facilitates the subsequent inspection of the other side of the silicon wafer.

[0057] Furthermore, when testing another type of silicon wafer, the hand-tightening bolt 400 is rotated to move the end of the hand-tightening bolt 400, and the clamping plate 301 on the right side is moved through the connecting rod 402. During the movement, the scale line 305 pointed to by the tip of the sliding sleeve 306 can be observed to intuitively understand the movement distance of the clamping plate 301 on the right side.

[0058] At this point, loosen the fixing screw 207, and then rotate the lead screw 203. When the lead screw 203 is rotated, the nut seat 202 will move up and down along the thread direction of the lead screw 203, thereby driving the connecting plate 204 and the detection component installed on the connecting plate 204 to move up and down synchronously. The height of the detection component can be flexibly adjusted according to the actual position of the silicon wafer. When the adjustment is completed, tighten the fixing screw 207 so that its end abuts against the surface of the support plate 101 to fix the detection component.

[0059] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for detecting the surface cleanliness of a silicon wafer after photoresist removal, characterized in that, The system includes a workbench (100), a support plate (101) fixedly mounted on the rear top of the workbench (100), a mounting frame (300) provided in the middle of the front side of the support plate (101), a fixing component for fixing silicon wafers provided in the inner cavity of the mounting frame (300), a flipping component for flipping the mounting frame (300) to flip the silicon wafers fixed inside it in the middle of the rear side of the support plate (101), a detection component for detecting the surface cleanliness of silicon wafers provided in the upper front side of the support plate (101), and a moving component for moving the detection component up and down in the upper front side of the workbench (100). The flipping assembly includes a motor (303) fixedly installed in the middle of the rear side of the support plate (101). The output shaft of the motor (303) is keyed to a drive rod (307). The end of the drive rod (307) passes through the support plate (101) and is fixedly connected to the surface of the mounting frame (300). The detection component includes a connecting plate (204) disposed on the upper front side of the support plate (101). A fixing clip (206) is fixedly installed on the front end of the connecting plate (204). A camera (201) is installed in the inner cavity of the fixing clip (206). The lens of the camera (201) is aligned with the silicon wafer. A computer (200) is fixedly installed on one side of the support plate (101). The output end of the camera (201) is electrically connected to the signal input end of the computer (200) through a wire.

2. The device for detecting the surface cleanliness of a silicon wafer after photoresist removal according to claim 1, characterized in that: A controller (208) is installed on the rear side of the support plate (101). The signal input terminal of the motor (303) is electrically connected to the signal output terminal of the controller (208) through a wire. The signal input terminal of the controller (208) is electrically connected to the signal output terminal of the computer (200) through a wire.

3. The device for detecting the surface cleanliness of a silicon wafer after photoresist removal according to claim 2, characterized in that: The moving component includes a square groove (102) formed on the upper front side of the support plate (101) and arranged along its height. A lead screw (203) is rotatably connected to the inner cavity of the square groove (102). The end of the lead screw (203) extends upward through the square groove (102) and to the upper part of the support plate (101). A nut seat (202) is threadedly connected to the surface of the lead screw (203) located inside the square groove (102). The end of the connecting plate (204) is fixedly connected to the surface of the nut seat (202). Guide components are provided on both sides of the connecting plate (204) to guide the connecting plate (204) and prevent it from shaking during movement.

4. The device for detecting the surface cleanliness of a silicon wafer after photoresist removal according to claim 3, characterized in that: The guide assembly includes limiting holes (103) opened on the upper front side of the support plate (101) and located on both sides of the square groove (102). A U-shaped frame (205) is provided on the rear side of the support plate (101). The two ends of the U-shaped frame (205) pass through the corresponding limiting holes (103) respectively. The inner sides of the two ends of the U-shaped frame (205) passing through the limiting holes (103) are fixedly connected to the corresponding side surfaces of the connecting plate (204).

5. The device for detecting the surface cleanliness of a silicon wafer after photoresist removal according to claim 4, characterized in that: The end of the U-shaped frame (205) is threadedly connected to a fixing screw (207), the end of which is threaded through the U-shaped frame (205) and abuts against the surface of the support plate (101).

6. The device for detecting the surface cleanliness of a silicon wafer after photoresist removal according to claim 1, characterized in that: The fixing component includes two sets of clamping plates (301) disposed inside the mounting frame (300). Each set of clamping plates (301) has a limiting groove (308) that is set along its length and used to limit the edge of the silicon wafer in the middle of its opposite side. The middle of the opposite side of the two sets of clamping plates (301) protrudes to the corresponding side, so that the middle of the opposite side of the two sets of clamping plates (301) is arc-shaped. The right side of the mounting frame (300) is provided with a fixing member for fixing the clamping plate (301) located on the right side. The left side of the mounting frame (300) is provided with an elastic pushing member that pushes the clamping plate (301) located on the left side to the right and cooperates with the clamping plate (301) on the right side to fix the silicon wafer. The elastic pusher includes two circular rods (502) fixedly installed at both ends of the outer side of the clamp (301) on the left side. The ends of the two sets of circular rods (502) extend to the left and penetrate the surface of the mounting frame (300). The ends of the circular rods (502) located outside the mounting frame (300) are fixedly connected to a limiting plate (501). The surface of the circular rods (502) located inside the mounting frame (300) is fitted with a spring (500). The two ends of the spring (500) contact the left inner wall of the mounting frame (300) and the left surface of the clamp (301) respectively. The fastener includes a hand-tightening bolt (400) threaded to the right end surface of the mounting frame (300). The end of the hand-tightening bolt (400) is threaded through the mounting frame (300) and fixedly connected to a connecting rod (402). The right side of the clamping plate (301) located on the right side has a connecting groove (309) corresponding to the connecting rod (402) in the middle of the right side. The connecting rod (402) is rotatably inserted into the inner cavity of the connecting groove (309). Both ends of the right side of the clamping plate (301) located on the right side are fixedly connected to guide rods (401). The ends of the two sets of guide rods (401) respectively penetrate the mounting frame (300) to the right and extend to the right side of the mounting frame (300).

7. The device for detecting the surface cleanliness of a silicon wafer after photoresist removal according to claim 6, characterized in that: The mounting frame (300) has a groove (304) on its rear top side that extends along its length. The inner cavity of the groove (304) is provided with a scale line (305). A sliding sleeve (306) is slidably connected to the rear inner wall of the mounting frame (300). The sliding sleeve (306) is U-shaped. The upper and lower ends of the sliding sleeve (306) are slidably connected to the upper and lower rear surfaces of the mounting frame (300), respectively. The end of the sliding sleeve (306) is pointed and the tip points to the scale line (305) in the groove (304).

8. The device for detecting the surface cleanliness of a silicon wafer after photoresist removal according to claim 7, characterized in that: A limiting ring (302) is fixedly installed in the middle of the rear side of the mounting frame (300), and the limiting ring (302) is rotatably connected to the front surface of the support plate (101).

Images